Semiconductor packaging and transferring material box

Abstract

The utility model relates to the technical field of transfer material boxes, in particular to a semiconductor packaging transfer material box which comprises a flat plate, two fixing frames are symmetrically and fixedly installed on the outer wall of one side of the flat plate, non-slip mats are arranged on the sides, close to each other, of the two fixing frames, and the same supporting plate is arranged on the outer walls of the sides, close to each other, of the two fixing frames. The outer walls of the sides, close to each other, of the two fixing frames are provided with the same pressing plate in a sliding mode, and the pressing plate is provided with a limiting mechanism. According to the utility model, the defects in the prior art are overcome, the two pressing plates are pressed to be close to each other under the matching action of the insertion rod and the like, the pressing plate can be driven to move downwards and press the upper surface of a semi-finished semiconductor product, and then the two pressing plates are loosened, so that the semi-finished semiconductor product can be fixed under the automatic reset action of the two reset springs. And the two insertion rods are driven to be away from each other and inserted into the anti-skid pad, so that the pressing plate can be fixed and limited, and the mounting and fixing effect on the semi-finished semiconductor product is improved.

Description

Technical Field

[0001] This utility model relates to the field of transfer box technology, specifically a semiconductor packaging transfer box. Background Technology

[0002] In the semiconductor packaging process, from the immersion tin process to the shearing process, a material box is required for transfer. Usually, the semiconductor wafers with lead frames are manually placed into the material box, and then the material box is transported to the shearing process position. The operator performs a second placement of the wafers to meet the machine requirements and then sends them to the processing equipment for processing.

[0003] A search revealed a Chinese patent application with publication number CN210805724U, which discloses a semiconductor immersion tin shearing and packaging transfer box, including a box body, a limiting base plate, and a spring clip; the box body is formed by cold stamping sheet metal, and the two sides are symmetrically designed with guide grooves.

[0004] The semiconductor immersion tin cutting and packaging transfer box in the aforementioned patent has the following shortcomings: Although the device can achieve seamless connection between the immersion tin and cutting processes after modification, reducing the risk of quality abnormalities (fingerprints, plating damage, deformation), the spring clamp of the device fixes the internal semiconductor semi-finished products by clamping the end face of the arc spring with the guide groove of the box body. Due to the limited contact area between the end face of the arc spring and the guide groove, the fixation is not reliable and is prone to loosening. In addition, the number of semiconductors stored on the box body of the device is limited, which makes it inconvenient to place in large batches, thus leading to inconvenience in processing and transportation and affecting processing efficiency. Utility Model Content

[0005] The purpose of this invention is to solve or at least alleviate the problem that the number of semiconductors stored on the main body of the material box of the device in the prior art is limited, which makes it inconvenient to place them in large quantities, thus causing inconvenience in processing and transportation and affecting processing efficiency.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a semiconductor packaging transfer box, comprising a flat plate, wherein two fixing brackets are symmetrically fixedly installed on one outer wall of the flat plate, and anti-slip pads are provided on the side of the two fixing brackets that are close to each other. The outer wall of the side of the two fixing brackets that are close to each other is provided with the same support plate, and the outer wall of the side of the two fixing brackets that are close to each other is slidably installed with the same pressure plate, and the pressure plate is provided with a limiting mechanism.

[0007] The limiting mechanism includes a pressing plate, which is slidably mounted on the top outer wall of the pressure plate. A sliding column is fixedly mounted on one side outer wall of the pressing plate. A fixing plate is fixedly mounted on the top outer wall of the pressure plate. An abutment plate is fixedly mounted on one end of the sliding column. A plug rod is fixedly mounted on one side outer wall of the abutment plate. A return spring is sleeved on the sliding column. The two ends of the return spring are respectively fixedly mounted on the outer walls of the fixing plate and the abutment plate that are close to each other.

[0008] By using the above technical solution, pressing the two pressing plates together will drive the pressure plate to move downwards and press it onto the upper surface of the semiconductor semi-finished product. Then, releasing the two pressing plates will cause the two insertion rods to move away from each other and insert into the anti-slip pad under the automatic reset action of the two reset springs. This will complete the fixing and limiting of the pressure plate and improve the installation and fixing effect of the semiconductor semi-finished product.

[0009] Optionally, a sliding hole is provided on one side of the outer wall of the fixing plate, and the sliding column is slidably installed in the sliding hole.

[0010] By adopting the above technical solution, the sliding column can be slidably installed inside by setting a sliding hole, thereby playing an auxiliary role in installation.

[0011] Optionally, one end of the insertion rod is tapered, and the tapered end of the insertion rod contacts the anti-slip pad.

[0012] By adopting the above technical solution, one end of the insertion rod is set to be tapered, and the tapered end of the insertion rod contacts the anti-slip pad, thereby facilitating contact with the anti-slip pad and improving the installation and fixing effect.

[0013] Optionally, an elongated groove is provided on one outer wall of the plate, and an elongated block is slidably installed in the elongated groove, the elongated block being fixedly connected to the pressure plate.

[0014] By adopting the above technical solution, the installation and movement of the pressure plate are facilitated by setting elongated grooves and elongated blocks.

[0015] Optionally, support plates are fixedly installed on both outer walls of the flat plate, telescopic rods are fixedly installed on both support plates, top plates are fixedly installed on both telescopic rods, and baffles are fixedly installed on both outer walls of the two top plates.

[0016] By adopting the above technical solution, the position of the top plate can be adjusted by setting up telescopic rods.

[0017] Optionally, one of the telescopic rods has a threaded hole on one side of its outer surface, and a fixing bolt is screwed into the threaded hole.

[0018] By adopting the above technical solution, the top plate is moved downward to make contact and press with the semiconductor semi-finished product placed again. This allows the fixing bolts to be rotated to fix the telescopic rod in place, thereby allowing more semiconductor semi-finished products to be placed on the plate. It also improves the installation and fixing effect of the semiconductor semi-finished products, and allows the plates to be stacked, thus improving the efficiency of semiconductor semi-finished product transportation.

[0019] Optionally, mounting blocks are fixedly installed on the outer walls of the two mounting brackets that are close to each other. Positioning grooves are provided on the top outer walls of the two mounting blocks. Positioning blocks are slidably installed in the two positioning grooves. The two positioning blocks are fixedly installed with the tray.

[0020] By adopting the above technical solution, positioning grooves and positioning blocks are set to facilitate the installation and use of the tray.

[0021] Compared with the prior art, the beneficial effects of this utility model are:

[0022] (1) In this utility model, the two pressing plates are pressed together by the cooperation of the insert rods, which can drive the pressing plate to move downward and press the pressing plate on the upper surface of the semiconductor semi-finished product. Then, the two pressing plates are released, and the two insert rods are driven away from each other by the automatic reset action of the two reset springs and inserted into the anti-slip pad. This can complete the fixed limit of the pressing plate and improve the installation and fixing effect of the semiconductor semi-finished product.

[0023] (2) In this utility model, with the cooperation of the top plate, etc., the semiconductor semi-finished products are stacked again on the fixed semiconductor semi-finished products, and then the top plate is rotated and moved downward so that the top plate contacts and presses the semiconductor semi-finished products placed again. Thus, the fixing bolts can be rotated to fix and position the telescopic rod, thereby allowing more semiconductor semi-finished products to be placed on the plate, and further improving the installation and fixing effect of the semiconductor semi-finished products. The plate can also be stacked, improving the efficiency of semiconductor semi-finished product transportation. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0025] Figure 2 This is a schematic diagram of the pressing plate structure of this utility model;

[0026] Figure 3 This is a schematic diagram of the insertion rod structure of this utility model;

[0027] Figure 4 This is a schematic diagram of the mounting block structure of this utility model.

[0028] In the diagram: 1. Flat plate; 2. Support plate; 3. Telescopic rod; 4. Top plate; 5. Baffle; 6. Support plate; 7. Mounting block; 8. Fixing frame; 9. Anti-slip pad; 10. Threaded hole; 11. Fixing bolt; 12. Long groove; 13. Long block; 14. Pressure plate; 15. Pressing plate; 16. Fixing plate; 17. Sliding hole; 18. Sliding column; 19. Return spring; 20. Abutment plate; 21. Insert rod; 22. Positioning groove; 23. Positioning block. Detailed Implementation

[0029] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0030] Please see Figure 1-4 A semiconductor packaging transfer box includes a flat plate 1. Two fixing brackets 8 are symmetrically fixedly installed on one outer wall of the flat plate 1. The fixing brackets 8 form a sliding groove to facilitate installation. Anti-slip pads 9 are provided on the side of the two fixing brackets 8 that are close to each other, which can assist in installation. The outer wall of the side of the two fixing brackets 8 that is close to each other is provided with the same support plate 6. The same pressure plate 14 is slidably installed on the outer wall of the side of the two fixing brackets 8 that is close to each other. The pressure plate 14 is provided with a limiting mechanism. The limiting mechanism can limit and fix the pressure plate 14.

[0031] The limiting mechanism includes a pressing plate 15, which is slidably mounted on the top outer wall of the pressure plate 14. A sliding column 18 is fixedly mounted on one side outer wall of the pressing plate 15. A fixing plate 16 is fixedly mounted on the top outer wall of the pressure plate 14. An abutment plate 20 is fixedly mounted on one end of the sliding column 18. A plug rod 21 is fixedly mounted on one side outer wall of the abutment plate 20. The plug rod 21 can play an auxiliary positioning role. A return spring 19 is sleeved on the sliding column 18. The two ends of the return spring 19 are respectively fixedly mounted on the outer walls of the fixing plate 16 and the abutment plate 20 that are close to each other.

[0032] In use, by pressing the two pressing plates 15 together, the pressure plate 14 can be driven to move downward and press the pressure plate 14 onto the upper surface of the semiconductor semi-finished product. Then, by releasing the two pressing plates 15, the two return springs 19 will automatically reset and drive the two insert rods 21 away from each other and insert them into the anti-slip pad 9, thereby completing the fixed limit of the pressure plate 14 and improving the installation and fixing effect of the semiconductor semi-finished product.

[0033] For details, please refer to Figure 2-3 A sliding hole 17 is provided on one outer wall of the fixing plate 16, and the sliding column 18 is slidably installed in the sliding hole 17. By providing the sliding hole 17, the sliding column 18 can be slidably installed inside, thereby assisting in the installation.

[0034] For details, please refer to Figure 3 One end of the insertion rod 21 is tapered, and the tapered end of the insertion rod 21 contacts the anti-slip pad 9. By setting one end of the insertion rod 21 to be tapered, and the tapered end of the insertion rod 21 contacts the anti-slip pad 9, it is easier to make contact with the anti-slip pad 9, thereby improving the installation and fixing effect.

[0035] For details, please refer to Figure 2 An elongated groove 12 is provided on one outer wall of the plate 1, and an elongated block 13 is slidably installed in the elongated groove 12. The elongated block 13 is fixedly connected to the pressure plate 14. The elongated groove 12 and the elongated block 13 facilitate the installation and movement of the pressure plate 14.

[0036] For details, please refer to Figure 1-2 Support plates 2 are fixedly installed on both outer walls of the flat plate 1. Telescopic rods 3 are fixedly installed on both support plates 2. Top plates 4 are fixedly installed on both telescopic rods 3. Baffles 5 are fixedly installed on both outer walls of the two top plates 4. The position of the top plates 4 can be adjusted by setting the telescopic rods 3.

[0037] For details, please refer to Figure 1-2 One of the telescopic rods 3 has a threaded hole 10 on one outer surface, and a fixing bolt 11 is screwed into the threaded hole 10. By moving the top plate 4 downward, the top plate 4 comes into contact with and presses against the semiconductor semi-finished product that is placed again, thereby rotating the fixing bolt 11 to fix and position the telescopic rod 2. This allows more semiconductor semi-finished products to be placed on the plate 1, and also further improves the installation and fixing effect of the semiconductor semi-finished products. It also allows the plate 1 to be stacked, improving the efficiency of semiconductor semi-finished product transportation.

[0038] For details, please refer to Figure 1-4 Two mounting brackets 8 are fixedly installed on the outer walls of their adjacent sides, with mounting blocks 7 fixedly installed on the top outer walls of each mounting block 7. Positioning grooves 22 are provided on the top outer walls of each mounting block 7, and positioning blocks 23 are slidably installed within each positioning groove 22. Both positioning blocks 23 are fixedly installed to the tray 6. The positioning grooves 22 and positioning blocks 23 facilitate the installation and use of the tray 6.

[0039] Working principle: When in use, first place the semiconductor semi-finished product after tinning and drying onto the tray 6. Then, press the two pressing plates 15 together. At this time, the pressure plate 14 can be driven to move downward and press the pressure plate 14 onto the upper surface of the semiconductor semi-finished product. Then release the two pressing plates 15. Under the automatic reset action of the two reset springs 19, the two insertion rods 21 will move away from each other and be inserted into the anti-slip pad 9. This can complete the fixed limit of the pressure plate 14 and improve the installation and fixing effect of the semiconductor semi-finished product.

[0040] Then, stack more semiconductor semi-finished products on top of the fixed semiconductor semi-finished products, and then move the top plate 4 downward so that the top plate 4 contacts and presses against the newly placed semiconductor semi-finished products. This allows the fixing bolt 11 to be rotated to fix and position the telescopic rod 2, thereby allowing more semiconductor semi-finished products to be placed on the plate 1. This also further improves the installation and fixing effect of the semiconductor semi-finished products, and allows the plate 1 to be stacked, improving the efficiency of semiconductor semi-finished product transportation.

[0041] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A semiconductor packaging transfer box, comprising a flat plate (1), characterized in that: Two fixed brackets (8) are symmetrically fixedly installed on one side of the outer wall of the plate (1). Anti-slip pads (9) are provided on the side of the two fixed brackets (8) that are close to each other. The same support plate (6) is provided on the outer wall of the side of the two fixed brackets (8) that are close to each other. The same pressure plate (14) is slidably installed on the outer wall of the side of the two fixed brackets (8) that are close to each other. The pressure plate (14) is provided with a limiting mechanism. The limiting mechanism includes a pressing plate (15), which is slidably mounted on the top outer wall of the pressure plate (14). A sliding column (18) is fixedly mounted on one side outer wall of the pressing plate (15). A fixing plate (16) is fixedly mounted on the top outer wall of the pressure plate (14). An abutment plate (20) is fixedly mounted on one end of the sliding column (18). A plug rod (21) is fixedly mounted on one side outer wall of the abutment plate (20). A return spring (19) is sleeved on the sliding column (18). The two ends of the return spring (19) are respectively fixedly mounted on the outer walls of the fixing plate (16) and the abutment plate (20) that are close to each other.

2. The semiconductor packaging transfer box according to claim 1, characterized in that: A sliding hole (17) is provided on one side of the outer wall of the fixing plate (16), and the sliding column (18) is slidably installed in the sliding hole (17).

3. A semiconductor packaging transfer box according to claim 2, characterized in that: One end of the insertion rod (21) is tapered, and the tapered end of the insertion rod (21) is in contact with the anti-slip pad (9).

4. A semiconductor packaging transfer box according to claim 1, characterized in that: An elongated groove (12) is provided on one side of the outer wall of the plate (1), and an elongated block (13) is slidably installed in the elongated groove (12). The elongated block (13) is fixedly connected to the pressure plate (14).

5. A semiconductor packaging transfer box according to claim 1, characterized in that: Support plates (2) are fixedly installed on both outer walls of the flat plate (1), telescopic rods (3) are fixedly installed on both support plates (2), top plates (4) are fixedly installed on both telescopic rods (3), and baffles (5) are fixedly installed on both outer walls of the two top plates (4).

6. A semiconductor packaging transfer box according to claim 5, characterized in that: One of the telescopic rods (3) has a threaded hole (10) on one side of its outer surface, and a fixing bolt (11) is screwed into the threaded hole (10).

7. A semiconductor packaging transfer box according to claim 1, characterized in that: Mounting blocks (7) are fixedly installed on the outer walls of the two mounting brackets (8) that are close to each other. Positioning grooves (22) are opened on the top outer walls of the two mounting blocks (7). Positioning blocks (23) are slidably installed in the two positioning grooves (22). The two positioning blocks (23) are fixedly installed with the support plate (6).

Images