Power electronic component and system

Abstract

A power electronic component and a system are provided. The power electronic component includes: a housing having a recess; a cover configured to be in a first state and a second state; the at least one power semiconductor module and the heat sink are arranged inside the housing, and in a first state, the cover covers the recess, and in a second state, the cover provides an opening to the recess.

Description

Technical Field

[0001] This disclosure relates to a power electronic component and a system. Background Technology

[0002] Typically, bonding wires connect terminal leads to semiconductor chips. In the presence of large short-circuit currents, the bonding wires vaporize, leading to severe arcing within the typical semiconductor chip package and potentially causing an explosion. Utility Model Content

[0003] The objective of this disclosure is to provide a power electronic component with improved protection. Further embodiments relate to a system including such a power electronic component.

[0004] This is achieved through the subject matter of the independent claims. Further embodiments will be apparent from the dependent claims and the following description.

[0005] A power electronic component is described. The term "power" herein and hereinafter refers, for example, to a power semiconductor chip particularly included in the power electronic component, which is adapted to handle voltages greater than 100V and / or currents greater than 10A, with exemplary voltages up to 10kV and currents up to 10kA.

[0006] According to an embodiment, the power electronic component includes a housing with recesses. The housing exemplarily defines a cavity. The housing is exemplarily configured to house elements of the power electronic component. In particular, at least some or all of the elements of the power electronic component are arranged within the cavity. For example, the housing is configured to provide structural support for at least some of the elements. In particular, at least some of the elements are mechanically fixed to the housing.

[0007] For example, the housing includes a housing wall. In particular, the recess extends completely through the housing wall. The recess, for example, provides a through-hole to the cavity.

[0008] The housing may be made of materials such as metals (e.g., steel, aluminum and / or copper), composites and / or plastics.

[0009] According to an embodiment, the power electronic component includes a cover configured to be in a first state and a second state. The first state and the second state differ from each other, particularly regarding the arrangement of the cover relative to a recess. Exemplarily, configuring the cover to be in the first state and the second state means that the cover is movable, particularly depending on a failure event. Specifically, the cover can be moved from the first state to the second state.

[0010] The cover may be made of materials such as metals (e.g., aluminum and / or copper), composites, and / or plastics. The cover may be made of the same material as the housing, or the cover may be made of a different material than the housing.

[0011] According to an embodiment, the power electronic component includes at least one power semiconductor module. The power semiconductor module includes, for example, at least one power semiconductor chip. Exemplarily, the power semiconductor chip is connected to wiring, which includes, for example, at least one bonding wire.

[0012] Power semiconductor chips include, for example, semiconductor materials such as at least one of silicon (Si), silicon carbide (SiC), and gallium nitride (GaN). Power semiconductor chips are, for example, power diodes and / or power metal-insulating semiconductor field-effect transistors (MISFETs for short). The term MISFET should also include MOSFETs, which have an oxide as an insulating material at the gate. Power semiconductor chips can also be insulated-gate bipolar transistors (IGBTs).

[0013] A power semiconductor chip exemplarily includes, for example, a carrier on which the power semiconductor chip is disposed. Exemplarily, the carrier includes a printed circuit board and / or a lead frame, the printed circuit board and / or the lead frame including a plurality of signal lines. Exemplarily, wiring connects the printed circuit board and / or the lead frame to the power semiconductor chip. In particular, the carrier includes an electrically insulating substrate, the electrically insulating substrate including an insulating sheet, the insulating sheet including ceramic or resin.

[0014] According to an embodiment, the power electronic component includes a heat sink. A power semiconductor module is exemplarily disposed on the heat sink. Specifically, a carrier is disposed on the heat sink. The heat sink includes, for example, fins and / or other structures configured to increase surface area and, in particular, improve cooling efficiency. The heat sink is exemplarily configured to absorb and dissipate heat from the power semiconductor chip.

[0015] If the power electronic components include more than one power semiconductor module, these power semiconductor modules are arranged on a heat sink. In particular, the heat sink is a common heat sink for these power semiconductor modules.

[0016] According to an embodiment of the power electronic component, at least one power semiconductor module and a heat sink are arranged inside the housing. Specifically, the power semiconductor module and the heat sink are components of the power electronic component. The power semiconductor module and the heat sink are specifically arranged within a cavity.

[0017] For example, the heat sink is mechanically fixed to the housing, and the power semiconductor module is arranged on the heat sink.

[0018] According to an embodiment of the power electronic component, in a first state, the cover covers the recess, and in a second state, the cover provides an opening to the recess. Specifically, when the cover is in the first state, the housing and the cover completely surround the cavity, and therefore surround the element. When the cover is in the second state, it does not completely cover the cavity, and therefore does not completely cover the element, such that the opening and the recess provide through-holes to the cavity.

[0019] If the power semiconductor module is in a normal state, such as when no failure event has occurred, the cover is in a first state and covers the recess, particularly completely covering it. If the power semiconductor module is in a failure state, such as when a failure event has occurred, the cover is in a second state and does not cover the recess, particularly not completely covering it, to provide an opening to the cavity. Exemplarily, the cover is configured to be in either the first or second state depending on the pressure in the cavity. During a failure event, the pressure in the cavity may, exemplarily, increase by at least one or at least two orders of magnitude.

[0020] Exemplarily, wiring and / or portions of the power semiconductor chip in a power semiconductor module vaporize during a failure event. Specifically, the failure event exemplarily results in an explosion, which includes hot plasma and debris caused by vaporization. A failure event is a characteristic of, for example, a short-circuit event (e.g., a short-circuit event of an electronic component in a power semiconductor module). In particular, if the hot plasma and / or debris are not contained, the hot plasma can cause catastrophic damage.

[0021] In summary, the power electronic components advantageously utilize a movable cover. During a failure event, when the cover is in a first state, the thermal plasma increases the pressure within the cavity. Due to the increased pressure, the cover moves to a second state to provide an opening. Advantageously, the thermal plasma can escape from the cavity through this opening. By providing space for the explosion to expand, the pressure increase within the cavity is minimal, and therefore the housing does not need to be extremely robust. Thus, the housing can be implemented in a particularly cost-effective manner.

[0022] Advantageously, the use of such movable covers results in a less complex and inexpensive design. Furthermore, there are no additional drawbacks. Movable covers can be advantageously combined with other protective measures. Additionally and advantageously, the floor space is not increased.

[0023] According to another embodiment of the power electronic component, the cover and housing in the first state completely surround at least one power semiconductor module and heat sink. Specifically, the cover and housing in the first state three-dimensionally surround at least one power semiconductor module and heat sink in space.

[0024] Advantageously, in the first state, the components inside the cavity are protected from environmental influences, particularly from moisture and dust.

[0025] According to another embodiment of the power electronic component, in a second state, the main surface of the cover extends at an angle to the main surface of the housing, thereby defining a predetermined angle between the main surface of the housing and the main surface of the cover. Exemplarily, the main surface of the housing is formed by a side surface of the housing disposed at a first side of the housing. The main surface of the cover is exemplaryly directly connected to the side surface at the first side.

[0026] The cover exemplarily includes a first end region and a second end region opposite the first end region. The cover, for example, is directly connected to the end region of the main surface via the first end region.

[0027] In the second state, the main surface of the cover extends, for example, at an angle to the main surface of the housing. Exemplarily, in the first state, the main surface of the cover extends perpendicular to the main surface of the housing.

[0028] In the first state, the angle enclosed by the main surfaces of the housing and the cover is approximately 90°. In the second state, the predetermined angle enclosed by the main surfaces of the housing and the cover is greater than 90° and / or less than 180°. The angles defined herein and hereinafter refer to the angles between the main surfaces facing each other, and particularly the angles between the main surfaces facing the cavity.

[0029] According to another embodiment of the power electronic component, the size of the opening depends on a predetermined angle. Exemplarily, an additional main surface of the housing is formed by an additional side surface of the housing, which is disposed on a second side of the housing. The second side is specifically opposite to the first side.

[0030] In both the first and second states, a first end region of the main surface of the cover is, for example, directly connected to an end region of the main surface of the housing. In the first state, a second end region of the main surface of the cover is, for example, directly connected to another end region of another main surface of the housing, thereby covering the recess. Exemplarily, in the second state, a second end region of the main surface of the cover is, for example, spaced apart from another end region of another main surface of the housing, thereby forming an opening.

[0031] In the second state, the opening extends, for example, from another end region of the other main surface to a second end region of the main surface of the cover, thereby traversing the main extension plane. The main extension plane of the opening extends obliquely to the main surface of the housing, the other main surface of the housing, and / or the main surface of the cover.

[0032] Specifically, in the second state, the distance between the other end region of the additional main surface and the second end region of the main surface of the cover defines the size of the opening. Specifically, this distance increases for an increased predetermined angle.

[0033] According to another embodiment of the power electronic component, the predetermined angle is between at least 95° and at most 175°. In particular, the predetermined angle is defined between the main surfaces facing each other, especially between the main surfaces facing the cavity.

[0034] According to another embodiment of the power electronic component, the cover is connected to the housing via at least one connecting element. Exemplarily, the connecting element is mechanically secured to the housing and the cover.

[0035] The connecting element is configured, for example, to be flexible. "Flexible" here means that the connecting element is configured to have a different form in a first state compared to a second state. For example, the connecting element is without tension in the first state and under tension in the second state. Alternatively, the connecting element is configured to be rigid. "Rigid" here means that the connecting element is configured to have the same form in the first state compared to the second state. For example, the opening depends on the length of the connecting element.

[0036] The connecting element can be a strip. The materials of the connecting element include, for example, metals, plastics, fabrics, and / or composite materials.

[0037] According to another embodiment of the power electronic component, the predetermined angle depends on the length of the connecting element. The length of the connecting element is specifically defined between the connection points of the connecting element at the housing and the cover. In particular, for increased length, the predetermined angle increases.

[0038] According to another embodiment of the power electronic component, the cover is attached to the housing via a hinge. Exemplarily, a first end region of the main surface of the cover is directly connected to an end region of the main surface of the housing in a first state and is connected to an end region of the main surface of the housing via a hinge in a second state.

[0039] Specifically, the hinge is configured as a direct connection between the main surface of the cover and the main surface of the housing. Exemplarily, the hinge is configured as a pivot between the main surface of the cover and the main surface of the housing.

[0040] For example, the hinge's rotation range is unrestricted. If the hinge's rotation range is unrestricted, the cover is connected to the housing via a connecting element.

[0041] Alternatively, the hinge's range of rotation is limited. If the hinge's range of rotation is limited, the cover is connected to the housing via a connecting element or not. Exemplarily, the predetermined angle depends on the range of rotation of the connecting element. The range of rotation specifically corresponds to the predetermined angle.

[0042] According to another embodiment of the power electronic component, the cover in the first state is attached to the housing via an attachment element. The attachment element can be a mechanical element, such as a screw, clamp, and / or rivet. The attachment element is configured to mechanically secure the cover to the recess in the first state. Specifically, in the first state, the attachment element provides a mechanically stable connection between the cover and the housing.

[0043] According to another embodiment of the power electronic component, the critical strength of the attachment element is less than the critical strength of the material of the hinge and / or connecting element. Exemplarily, the attachment element is the weakest part of the housing and cover.

[0044] Specifically, the critical strength of the attachment element is less than the explosive force. Critical strength is, for example, the characteristic of the force that causes the attachment element to break. Therefore, advantageously, the explosion causes the attachment element to break, but not the connection between the cover and the housing (i.e., the hinge), allowing the cover to be moved to the second state.

[0045] According to another embodiment of the power electronics component, the opening is covered by a mesh. The main extending plane of the mesh extends substantially parallel to the main extending plane of the opening, for example. "Substantially" here means that the main extending plane of the opening and the main extending plane of the mesh enclose an angle of at most 5°, particularly at most 1°.

[0046] The mesh is exemplarily connected to a second end region of the main surface of the cover and another end region of the other main surface of the housing, particularly for the first and second states. In the first state, the mesh is, for example, without tension. Specifically, in the first state, the mesh is arranged within the cavity. In the second state, the mesh is, for example, under tension. Specifically, the mesh extends along the opening, particularly extending completely.

[0047] Exemplarily, in the second state, the housing, cover, and mesh completely surround at least one power semiconductor module and heat sink. Specifically, the housing, cover, and mesh define an additional cavity. The components of the power electronic parts are specifically arranged entirely within this additional cavity.

[0048] The mesh exemplarily includes a mesh of interwoven fibers forming a mesh structure. At least some or all of the fibers possess the characteristic of forming an interconnected network with a pattern having uniform or non-uniform spacing. The network is a mesh structure. The mesh structure can be a regular mesh with uniform spacing or an irregular mesh with non-uniform spacing.

[0049] Mesh structures can be represented by polygonal meshes, such as triangular, quadrilateral, or hexagonal meshes. Specifically, fibers are arranged along the grid lines of the polygonal mesh to form the mesh structure.

[0050] For example, the fiber includes at least one metallic material. For example, the metallic material includes stainless steel, aluminum, copper, nickel, titanium, gold, silver and / or alloys thereof.

[0051] Advantageously, during a failure event, the hot plasma advantageously passes through the mesh, which is configured to filter debris and cool the hot plasma. The mesh's trapping of debris advantageously prevents damage to other nearby power electronic components. Additionally, the mesh's large surface area advantageously slows down the hot plasma and facilitates efficient cooling.

[0052] According to another embodiment, the at least one power semiconductor module is arranged on a heat sink.

[0053] According to another embodiment, the at least one power semiconductor module is connected to a first busbar on the side facing the cover. The first busbar is, for example, arranged between the cover and the power semiconductor module. The first busbar exemplarily provides electrical interconnection for the power semiconductor module.

[0054] According to another embodiment, the at least one power semiconductor module is connected to a second bus on the side facing away from the cover. The power semiconductor module is, for example, disposed between the first bus and the second bus. The second bus exemplarily provides additional electrical interconnections for the power semiconductor module.

[0055] According to another embodiment, the second bus is connected to at least one capacitor. Specifically, the capacitor is connected to the second bus on the side facing away from the cover. The second bus exemplarily provides additional electrical interconnection between the power semiconductor module and the capacitor.

[0056] According to another embodiment, the power electronic component includes at least one power semiconductor bridge, which includes at least one power semiconductor module. Exemplarily, each power semiconductor module includes a plurality of semiconductor chips arranged in a full-bridge configuration and / or a half-bridge configuration. Each power semiconductor module is connected, for example, to a first bus and / or a second bus.

[0057] According to another embodiment, the power semiconductor module includes at least one insulated-gate bipolar transistor (IGBT). Specifically, the at least one power semiconductor chip of the power semiconductor module is an IGBT.

[0058] According to another embodiment, the power semiconductor bridges are connected in parallel. Specifically, the power semiconductor bridges are connected in parallel via a first bus and a second bus.

[0059] Another embodiment relates to a system that specifically includes power electronic components as described above. Therefore, the features described in connection with the system also apply to the power electronic components, and vice versa.

[0060] According to an embodiment, the system includes at least two power electronic components. At least one of these two power electronic components is the power electronic component described above.

[0061] For example, power electronic components are stacked on top of each other along a stacking direction. For example, the stacking direction is parallel to the main extension plane of the cover. For example, the side surfaces of directly adjacent power electronic components are stacked on top of each other.

[0062] For example, each of the covers of the power electronic components stacked on top of each other does not face the adjacent power electronic component. Therefore, advantageously, if a power electronic component fails, another power electronic component is protected from the impact of explosive debris.

[0063] According to another embodiment of the system, an opening in one of the power electronic components has a normal that does not overlap with another power electronic component. Exemplarily, this normal extends perpendicular to the main extension plane of the opening.

[0064] Exemplarily, at least two power electronic components may be arranged adjacent to each other and spaced apart from each other in a lateral direction. The cover in the second state is specifically configured to deflect the hot plasma into a safe region depending on a predetermined angle, particularly along the normal. Specifically, this safe region overlaps with the normal. Exemplarily, the power electronic components are not included in this safe region.

[0065] Advantageously, if the power electronic component fails and explodes, the explosion causes the cover to move to a second state, and the cover in the second state deflects the hot plasma and / or debris to a safe area, thus protecting another power electronic component.

[0066] For example, stacked power electronic components form a set of power electronic components. The system may include at least two sets of power electronic components, which are arranged, for example, adjacent to each other and spaced apart from each other in a lateral direction.

[0067] For example, all power electronic components have covers as described above. Attached Figure Description

[0068] The accompanying drawings are included to provide further understanding. In the drawings, elements with the same structure and / or function may be referred to by the same reference numerals. It will be understood that the embodiments shown in the drawings are illustrative representations and are not necessarily drawn to scale.

[0069] Figure 1 and Figure 2 Each shows a schematic diagram of a power electronic component according to an exemplary embodiment.

[0070] Figure 3 A schematic diagram of a system according to an exemplary embodiment is shown. Detailed Implementation

[0071] according to Figure 1 An exemplary embodiment of the power electronic component 1 includes a housing 2. The housing has a main surface, specifically corresponding to the side surface of the housing 2. The main surface of the housing 2 is formed by a first side surface of the housing 2 disposed on a first side of the housing 2, and another main surface of the housing 2 is formed by a second side surface of the housing 2 disposed on a second side of the housing 2.

[0072] The first and second side surfaces are connected by an additional outer surface that extends perpendicularly to the main extension plane of these side surfaces (e.g., in a vertical direction). The housing 2 has a recess 3 opposite to the additional outer surface.

[0073] The housing 2 defines a cavity in which the power electronic components 1 are arranged. The recess 3 provides a through-hole to the cavity.

[0074] Furthermore, the power electronic component 1 has a cover 4 that covers the recess 3 in a first state. In the first state, the cover 4 completely covers the recess 3. The housing 2 and the cover 4 in the first state define a cavity. In particular, the housing 2 and the cover 4 three-dimensionally (i.e., in the lateral and vertical directions) surround at least some or all of the components of the power electronic component 1.

[0075] The cover 4 is attached to the housing 2 via a hinge 5. In the first state, the main surface of the cover 4 is directly connected to the main surface of the housing 2, particularly the first side surface, via the hinge 5.

[0076] The power electronic component 1 includes power semiconductor modules 7 (four power semiconductor modules 7 in this embodiment). The power semiconductor modules 7 are arranged on a heat sink 8, and particularly on a common heat sink 8 for the power semiconductor modules 7.

[0077] Additionally, the power electronic component 1 includes capacitors 11 (four capacitors 11 in this embodiment), a first busbar 9, and a second busbar 10. The first busbar 9 is arranged on a first side facing the cover 4. The capacitors 11 and the second busbar 10 are arranged on a second side away from the cover 4. Each power semiconductor module 7 includes power semiconductor chips arranged in a bridge topology. Therefore, each power semiconductor module 7 can be a power semiconductor bridge. The power semiconductor modules 7 are connected in parallel, particularly via the first busbar 9 and the second busbar 10.

[0078] At least some or all of the power semiconductor chips in a power semiconductor module 7 are exemplary formed of IGBTs.

[0079] The first busbar 9 is arranged between the power semiconductor module 7 and the cover 4. The second busbar 10 is arranged between the power semiconductor module 7 and the capacitor 11. Specifically, the capacitor 11, the first busbar 9, the second busbar 10, and the heat sink 8 are each mechanically fixed to the housing 2.

[0080] exist Figure 1 In the middle, the power electronic component 1 is in a normal state, for example, when no failure event occurs, so that the cover 4 covers the recess 3.

[0081] exist Figure 2 In this case, the power electronic component 1 is in a failed state, for example, when a failure event occurs. When a failure event occurs, the pressure in the cavity increases and causes the cover 4 to rotate to provide an opening 6 to reach the recess 3.

[0082] In the second state, the main surface of the cover 4 extends inclinedly to the main surface of the housing 2, particularly the first side surface, thereby defining a predetermined angle between the main surface of the housing 2 and the main surface of the cover 4. Due to the inclined arrangement of the cover 4, an opening 6 is formed between the cover 4 and the other main surface, particularly the second side surface. Thus, the size of the opening 6 depends on the predetermined angle.

[0083] If the power semiconductor module 7 is in a failed state, an opening 6 is provided, and the hot plasma can escape from the cavity through the recess 3 and the opening 6. By providing space for the explosion to expand, the pressure increase in the cavity is advantageously minimized.

[0084] The opening 6 can be further covered by the mesh 13, in particular completely covered. Therefore, the hot plasma can be effectively cooled down, and debris can be filtered by the mesh 13.

[0085] according to Figure 3In an exemplary embodiment, system 12 includes two sets of power electronic components 1, which are arranged laterally adjacent to each other and spaced apart from each other in the lateral direction. Each set includes power electronic components 1 stacked on top of each other in the vertical direction.

[0086] In addition, at least some or all of the power electronic components 1 in at least some or all of the groups are provided with a cover 4.

[0087] In the event of a failure in one of the power electronic components 1, the explosion, including thermal plasma and debris (indicated by arrows), is deflected by the cover 4 in the second state, thereby protecting the other power electronic converters.

[0088] Specifically, opening 6 extends along the main extension plane between another main surface, particularly the second side surface, and cover 4. The normal (indicated by dashed lines) extends perpendicularly to the main extension plane of opening 6. A predetermined angle is set such that the normal does not overlap with other power electronic components 1.

[0089] The exemplary embodiments in the accompanying drawings, and in particular the features of the exemplary embodiments, can be combined with each other.

[0090] Figure Labels

[0091] 1 Power Electronic Components

[0092] 2. Shell

[0093] 3 concavity

[0094] 4. Covering components

[0095] 5. Hinges

[0096] 6 Openings

[0097] 7 Power Semiconductor Module

[0098] 8 Radiators

[0099] 9 First busbar

[0100] 10 Second busbar

[0101] 11 Capacitors

[0102] 12 systems

[0103] 13. Mesh

Claims

1. A power electronic component (1), characterized in that, include: - Housing (2), the housing having a recess (3). - Cover (4) is configured to be in a first state and a second state. - At least one power semiconductor module (7). - Radiator (8), wherein, - The at least one power semiconductor module (7) and the heat sink (8) are arranged inside the housing (2), and - In the first state, the cover (4) covers the recess (3), and in the second state, the cover (4) provides an opening (6) to the recess (3).

2. The power electronic component (1) according to claim 1, characterized in that, - The cover (4) and the housing (2) in the first state completely surround the at least one power semiconductor module (7) and the heat sink (8).

3. The power electronic component (1) according to claim 1, characterized in that, - In the second state, the main surface of the cover (4) extends inclined to the main surface of the housing (2), thereby defining a predetermined angle between the main surface of the housing (2) and the main surface of the cover (4). - The size of the opening (6) depends on the predetermined angle.

4. The power electronic component (1) according to claim 3, characterized in that, - The predetermined angle is between at least 5° and at most 85°.

5. The power electronic component (1) according to claim 3, characterized in that, - The cover (4) is connected to the housing (2) by at least one connecting element, and - The predetermined angle depends on the length of the connecting element.

6. The power electronic component (1) according to claim 5, characterized in that, - The cover (4) is attached to the housing (2) by a hinge (5).

7. The power electronic component (1) according to claim 6, characterized in that, - The cover (4) in the first state is attached to the housing (2) by an attachment element, and - The critical strength of the attachment element is less than the critical strength of the material of the hinge (5) and / or the connecting element.

8. The power electronic component (1) according to any one of claims 1 to 5, characterized in that, - The opening (6) is covered by a mesh (13).

9. The power electronic component (1) according to any one of claims 1 to 5, characterized in that, - The at least one power semiconductor module (7) is arranged on the heat sink (8).

10. The power electronic component (1) according to any one of claims 1 to 5, characterized in that, - The at least one power semiconductor module (7) is connected to the first busbar (9) on the side facing the cover (4).

11. The power electronic component (1) according to any one of claims 1 to 5, characterized in that, - The at least one power semiconductor module (7) is connected to the second busbar (10) on the side opposite to the cover (4), and - The second bus (10) is connected to at least one capacitor (11).

12. The power electronic component (1) according to any one of claims 1 to 5, characterized in that, - The power electronic component (1) includes at least one power semiconductor bridge, - The power semiconductor bridge includes at least one power semiconductor module (7), and - The power semiconductor module (7) includes at least one insulated gate bipolar transistor (IGBT).

13. The power electronic component (1) according to claim 12, characterized in that, - The power semiconductor bridges are connected in parallel.

14. A system (12), characterized in that, include: - At least two power electronic components (1) according to any one of claims 1 to 13.

15. The system (12) according to claim 14, characterized in that, - The opening (6) of one of the power electronic components (1) has a normal line, and the normal line does not overlap with the other power electronic component (1).

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