Solar wing substrate with high conduction performance

Abstract

The utility model provides a solar wing substrate with high conduction performance, which comprises a substrate body and a metal embedded part, the substrate body comprises a honeycomb structure and a skin covering the surface of the honeycomb structure, and the metal embedded part is embedded in the honeycomb structure; a copper wire is wound on the metal embedded part, one end of the copper wire is wound and fixed on the metal embedded part, and the other end of the copper wire extends in the direction far away from the metal embedded part until the copper wire is connected with the honeycomb structure. According to the utility model, the metal embedded part and the honeycomb are connected through the copper wire, so that the conduction performance between the embedded parts is improved, and the problem of poor contact or large conduction resistance between the solar wing substrate indirect embedded part and other embedded parts is fundamentally solved; the problem that the solar wing substrates need to be repaired repeatedly in the later period due to the fact that the grounding embedded parts are not conducted or the conduction performance is poor is solved.

Description

Technical Field

[0001] This utility model relates to the field of electrical installation, specifically to a solar panel substrate with high conductivity. Background Technology

[0002] The grounding metal embedded parts of solar panel substrates used in aerospace and other fields have high requirements for the conductivity of other embedded parts. Typically, the honeycomb and the metal embedded parts are connected by upper and lower carbon fiber skins, and the metal embedded parts are in contact with the honeycomb. The honeycomb edges are relatively sharp and can directly contact the skin.

[0003] Foam is used to fill the space between the grounding metal embedding and the honeycomb structure. During the curing process, the foam expands, which may cause the grounding metal embedding and the honeycomb structure to lose contact. This can lead to poor contact between the grounding metal embedding and other embedding components, resulting in high conductivity or no conductivity at all. The usual solution is to use conductive adhesive for repair. However, since conductive adhesive is a mixture of adhesive and silver powder, its conductivity is greatly affected by environmental changes. Therefore, the conductivity of the solar panel substrate repaired using this method is unstable, and repairs are frequent, time-consuming, and labor-intensive. Utility Model Content

[0004] In view of the deficiencies in the prior art, the purpose of this utility model is to provide a solar panel substrate with high conductivity.

[0005] The high conductivity solar panel substrate provided by this utility model includes a substrate body and a metal embedded part. The substrate body includes a honeycomb structure and a skin covering the surface of the honeycomb structure. The metal embedded part is embedded in the honeycomb structure.

[0006] The metal embedded part is wound with copper wire. One end of the copper wire is wound around and fixed to the metal embedded part, and the other end of the copper wire extends away from the metal embedded part until it is connected to the honeycomb structure.

[0007] Preferably, the space between the metal embedded part and the honeycomb structure is filled with expanding foam, and the other end of the copper wire passes through the expanding foam and overlaps with the honeycomb structure.

[0008] Preferably, an insulating adhesive is provided between the skin and the honeycomb structure.

[0009] Preferably, the copper wire is uniformly wound around the metal embedded part along the axial direction of the metal embedded part.

[0010] Preferably, the metal embedded part is divided into a winding section and a reserved section along the axial direction, the copper wire is wound on the winding section, and no copper wire is wound on the reserved section.

[0011] Preferably, the metal embedded part includes an unloading embedded part, a cable embedded part, and a grounding embedded part;

[0012] The unloading embedded part, cable embedded part, and grounding embedded part are all connected to the honeycomb structure by copper wire to form an integral conductor.

[0013] Preferably, the honeycomb structure comprises an aluminum honeycomb structure, and the skin comprises a carbon fiber skin.

[0014] Preferably, the substrate body is further provided with a pressing point countersunk hole embedded part;

[0015] Preferably, a plurality of hinge embeddings are installed at the edge of the substrate body, and the substrate body is hinged to an external mechanism through the hinge embeddings.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] This utility model has a simple structure and uses copper wire to connect the metal embedded parts to the honeycomb structure, which improves the conductivity between embedded parts. It fundamentally solves the problem of poor contact or high conductivity resistance between embedded parts and other embedded parts in the solar panel substrate, and avoids the problem of repeated repairs required later due to non-conductivity or poor conductivity of the grounding embedded parts between solar panel substrates. Attached Figure Description

[0018] Other features, objects, and advantages of this invention will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0019] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0020] Figure 2 for Figure 1 A magnified view of a portion of region I;

[0021] Figure 3 for Figure 1 A cross-sectional view of the central I zone from the perspective of angle AA.

[0022] The diagram shows:

[0023] Detailed Implementation

[0024] The present invention will now be described in detail with reference to specific embodiments. These embodiments will help those skilled in the art to further understand the present invention, but do not limit the present invention in any way. It should be noted that those skilled in the art can make several changes and improvements without departing from the concept of the present invention. These all fall within the protection scope of the present invention.

[0025] This utility model discloses a solar panel substrate with high conductivity. By embedding copper wires inside the honeycomb structure and connecting the two ends of the copper wires to the metal embedded parts and the honeycomb structure respectively, the conductivity between the embedded parts is effectively improved, fundamentally solving the problem of poor contact or high conductivity resistance between the embedded parts and other embedded parts in the solar panel substrate.

[0026] The high conductivity solar panel substrate provided by this utility model includes a substrate body and a metal embedded part. The substrate body includes a honeycomb structure 6 and a skin 7 covering the surface of the honeycomb structure 6. The metal embedded part is embedded in the honeycomb structure 6. A copper wire 8 is wound on the metal embedded part. One end of the copper wire 8 is wound and fixed on the metal embedded part, and the other end of the copper wire 8 extends away from the metal embedded part until it is connected to the honeycomb structure 6.

[0027] Preferably, the metal embedded part includes an unloading embedded part 1, a cable embedded part 2, and a grounding embedded part 3; the unloading embedded part 1, the cable embedded part 2, and the grounding embedded part 3 are distributed at different locations on the substrate body, and are all connected to the honeycomb structure 6 by copper wire 8 to form an integral conductor. The unloading embedded part 1 is used to connect with an external hoisting mechanism and can conduct static electricity generated by the external mechanism; the cable embedded part 2 is used to fix the cable; and the grounding embedded part 3 is used to conduct the static electricity of the entire solar panel substrate to the grounding electrode.

[0028] like Figure 3 As shown, the space between the grounding embedded part 3 and the honeycomb structure 6 is filled with expanding foam 5. The other end of the copper wire 8 passes through the expanding foam 5 and overlaps with the honeycomb structure 6. The built-in copper wire 8 effectively solves the problem of the grounding embedded part 3 and the honeycomb structure 6 not contacting each other due to the expanding foam, thus affecting the overall conductivity. Preferably, the head of the grounding embedded part 3 extends out of the honeycomb structure 6, wherein the lower surface of the head of the grounding embedded part 3 is bonded to the skin 7, and the skin 7 is bonded to the honeycomb structure 6, both with insulating adhesive.

[0029] The copper wire 8 is uniformly wound around the metal embedded part along its axial direction. The metal embedded part is divided into a winding section and a reserved section along its axial direction. The copper wire 8 is wound on the winding section, and no copper wire 8 is wound on the reserved section. The honeycomb structure 6 includes an aluminum honeycomb structure, and the skin 7 includes a carbon fiber skin.

[0030] Preferably, the substrate body is further provided with a pressing point countersunk hole embedded part 4, and a plurality of hinge embedded parts 9 are installed at the edge of the substrate body, and the substrate body is hinged to an external mechanism through the hinge embedded parts 9.

[0031] This invention involves wrapping copper wire 8 around the grounding embedded part 3, the unloading embedded part 1, and the cable embedded part 2, and then passing through the foam filling area to contact the honeycomb structure 6. This allows each component to form an integral conductor with the honeycomb structure 6 and the skin 7, ensuring conductivity between the components. Compared to bonding without wrapping copper wire, bonding the embedded part with copper wire ensures that the conductivity resistance between the components on the substrate remains stable within 50Ω. The feasibility of this method has been verified through multiple projects, including tilted star substrates.

[0032] Example 1

[0033] This embodiment discloses a high conductivity solar panel substrate, such as... Figure 1 As shown, the substrate includes a substrate body with four pressing point countersunk hole embedded parts 4, four unloading embedded parts 1 on the left and right sides of the substrate body, four grounding embedded parts 3 on the front or rear face of the substrate body, three cable embedded parts 2 on the lower side of the substrate body, and two hinge embedded parts 9 on the upper and lower sides of the substrate body. The metal embedded parts include the grounding embedded parts 3, the cable embedded parts 2, and the unloading embedded parts 1, all of which are connected to the honeycomb structure 6 by copper wires 8 to achieve high conductivity.

[0034] Example 2

[0035] This embodiment discloses a specific method for manufacturing the aforementioned high-conductivity solar panel substrate, including the following steps:

[0036] 1) Copper wire preparation: Prepare copper wire 8 of appropriate length according to the size of the metal embedded part (the diameter of copper wire 8 is 0.1~0.5mm).

[0037] 2) Winding copper wire 8 around the metal embedded part: Wrap the copper wire 8 evenly around the metal embedded part (2 to 3 turns) and leave a section unwound;

[0038] 3) Overlap: Overlap the reserved section of copper wire 8 onto the honeycomb structure 6;

[0039] 4) Co-curing: After the metal embedded part is wrapped with copper wire 8, it is co-cured with the honeycomb structure 6 and skin 7 to form a solid shape.

[0040] After the metal embedded part in Example 1 was wrapped with copper wire 8 and co-cured with the solar panel substrate, a resistance test was performed. The measured resistance value was 15.1Ω. After curing without copper wire with the solar panel substrate, a resistance test was performed. The measured resistance value was 130.3Ω. By comparing the measured resistances, it can be clearly seen that the conduction resistance between the solar panel substrates is reduced after adding copper wire to the metal embedded part. Therefore, it can be concluded that adding copper wire to the metal embedded part can improve the conduction performance between the solar panel substrates.

[0041] In the description of this application, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0042] The specific embodiments of this utility model have been described above. It should be understood that this utility model is not limited to the specific embodiments described above, and those skilled in the art can make various changes or modifications within the scope of the claims, which do not affect the substantive content of this utility model. Unless otherwise specified, the embodiments and features described in this application can be arbitrarily combined with each other.

Claims

1. A solar panel substrate with high conductivity, characterized in that, It includes a substrate body and a metal embedded part. The substrate body includes a honeycomb structure (6) and a skin (7) covering the surface of the honeycomb structure (6). The metal embedded part is embedded in the honeycomb structure (6). The metal embedded part is wrapped with copper wire (8), one end of the copper wire (8) is wrapped and fixed on the metal embedded part, and the other end of the copper wire (8) extends away from the metal embedded part until it is connected to the honeycomb structure (6).

2. The high conductivity solar panel substrate according to claim 1, characterized in that, The space between the metal embedded part and the honeycomb structure (6) is filled with expanding foam (5), and the other end of the copper wire (8) passes through the expanding foam (5) and overlaps with the honeycomb structure (6).

3. The high conductivity solar panel substrate according to claim 1, characterized in that, An insulating adhesive is provided between the skin (7) and the honeycomb structure (6).

4. The high conductivity solar panel substrate according to claim 1, characterized in that, The copper wire (8) is uniformly wound around the metal embedded part along the axial direction of the metal embedded part.

5. The high conductivity solar panel substrate according to claim 1, characterized in that, The metal embedded part is divided into a winding section and a reserved section along the axial direction. The copper wire (8) is wound on the winding section, and the reserved section is not wound with copper wire (8).

6. The high conductivity solar panel substrate according to claim 1, characterized in that, The metal embedded parts include unloading embedded parts (1), cable embedded parts (2) and grounding embedded parts (3); The unloading embedded part (1), the cable embedded part (2) and the grounding embedded part (3) are all connected to the honeycomb structure (6) by copper wire (8) to form an integral conductor.

7. The high conductivity solar panel substrate according to claim 1, characterized in that, The honeycomb structure (6) includes an aluminum honeycomb structure, and the skin (7) includes a carbon fiber skin.

8. The high conductivity solar panel substrate according to claim 1, characterized in that, The substrate body is also provided with multiple pressing point countersunk hole embedded parts (4).

9. The high conductivity solar panel substrate according to claim 1, characterized in that, Multiple hinge embedments (9) are installed at the edge of the substrate body, and the substrate body is hinged to the external mechanism through the hinge embedments (9).

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