High-voltage insulation packaging tool

Abstract

The utility model provides a high-voltage insulation packaging tool comprising a circuit board glue sealing container, the circuit board glue sealing container is internally provided with a containing cavity matched with a circuit board glue sealing block in shape, and the outer wall of the circuit board glue sealing container is provided with a glue injection hole communicated with the containing cavity; the protection blocks are arranged corresponding to a welding opening in the circuit board, the protection blocks are embedded in the containing cavity, a sealing face is arranged on the side, close to the circuit board, of each protection block, the sealing faces are connected with the circuit board in an attached mode, protection cavities used for containing the welding openings are formed in the sealing faces, and the protection blocks are arranged on the two opposite sides of the circuit board. The high-voltage insulation packaging tool provided by the utility model solves the technical problem that the welding port of the circuit board cannot be effectively welded after being etched by the packaging glue in the prior art.

Description

Technical Field

[0001] This utility model relates to the field of packaging tooling technology, specifically to a high-voltage insulating packaging tooling. Background Technology

[0002] In electronic devices, insulating encapsulation is an important process primarily used to protect electronic components and integrated circuits. It involves wrapping an electronic component or the entire circuit board with an insulating material to prevent damage to the internal circuitry from external environmental factors such as moisture, dust, and chemicals. It also provides mechanical protection against physical damage. Furthermore, insulating encapsulation can improve electrical performance, such as reducing signal interference and improving thermal management. Using adhesives for encapsulation is a common method that can provide a variety of protective functions.

[0003] In the prior art, packaging fixtures are usually used to package circuit boards. However, after the packaging fixtures are packaged, the solder joints of the circuit board are often covered with glue. In subsequent production or assembly processes, the solder joints cannot be effectively soldered after being corroded by the packaging glue. The glue needs to be cleaned before the subsequent production or assembly process can be completed, which affects the production efficiency and assembly efficiency of the circuit board.

[0004] Therefore, existing technologies need further development. Utility Model Content

[0005] The purpose of this invention is to overcome the above-mentioned technical deficiencies and provide a high-voltage insulating packaging tool to solve the technical problem that the solder joints of circuit boards cannot be effectively soldered after being eroded by the packaging adhesive in related technologies.

[0006] To achieve the above technical objectives, the present invention adopts the following technical solution: a high-voltage insulation packaging fixture is provided, comprising: a circuit board encapsulation container, wherein the circuit board encapsulation container is provided with a receiving cavity matching the shape of the circuit board encapsulation block, and an injection hole communicating with the receiving cavity is opened on the outer wall of the circuit board encapsulation container; a protective block, wherein the protective block is provided corresponding to the solder joint on the circuit board, the protective block is embedded in the receiving cavity, and a sealing surface is provided on the side of the protective block near the circuit board, the sealing surface is in close contact with the circuit board, and a protective cavity for receiving the solder joint is opened on the sealing surface, wherein protective blocks are provided on opposite sides of the circuit board.

[0007] Furthermore, the protective block includes a limiting part protruding from the outer wall of the circuit board encapsulation container, the bottom surface of which abuts against the outer wall of the circuit board encapsulation container to limit the protective block.

[0008] Furthermore, the circuit board encapsulation container includes: an encapsulation cap and an encapsulation base disposed opposite to each other, the encapsulation cap having a first receiving cavity and the encapsulation base having a second receiving cavity, the first receiving cavity and the second receiving cavity together forming a receiving cavity; and a first fastener, the first fastener being connected to the encapsulation cap and the encapsulation base respectively, so as to fix the encapsulation cap and the encapsulation base together.

[0009] Furthermore, a release module is provided inside the sealing cap, and the release module is embedded in the first demolding groove located in the first receiving cavity. The side of the release module near the circuit board sealing block abuts against the circuit board sealing block, and the release module is connected to the sealing cap by a second fastener; and / or, a release module is provided inside the sealing base, and the release module is embedded in the second demolding groove located in the second receiving cavity. The side of the release module near the circuit board sealing block abuts against the circuit board sealing block, and the release module is connected to the sealing base by a second fastener.

[0010] Furthermore, the high-voltage insulation encapsulation fixture includes: a demolding pusher block, which has a first through hole; a third fastener, one end of which is threadedly connected to the sealing cap or sealing base, and the other end of which passes through the first through hole and abuts against the demolding pusher block; and a push rod, which is slidably connected to the sealing cap or sealing base, one end of which abuts against the demolding pusher block, and the other end of which abuts against the demolding module.

[0011] Furthermore, the demolding push block is provided with a positioning groove, which contains at least part of the push rod.

[0012] Furthermore, there are two push rods, which are located on both sides of the third fastener.

[0013] Furthermore, the circuit board encapsulation container includes: a first connecting hole, which is formed on the encapsulation base; a second connecting hole, which is formed on the encapsulation base and communicates with the first connecting hole; a third connecting hole, which is formed on the encapsulation cover corresponding to the second connecting hole; and a fourth fastener, which is movably disposed relative to the first and second connecting holes, and is threadedly connected to the third connecting hole after passing through the first and second connecting holes.

[0014] Furthermore, the circuit board encapsulation container includes positioning stages for supporting the circuit board. Multiple positioning stages are provided, protruding along the periphery of the receiving cavity within the first and second receiving cavities.

[0015] Furthermore, the circuit board encapsulation container includes a first sealing ring, and a sealing groove is formed in the first or second demolding groove for accommodating the first sealing ring.

[0016] Beneficial effects:

[0017] 1. By setting a protective block, one side of the protective block faces the receiving cavity, and the other side of the protective block wraps the solder joint in the protective cavity. It is connected to the circuit board through the sealing surface to prevent the glue from leaking into the protective cavity, thereby isolating the glue from the solder joint and preventing the glue from corroding the solder joint during the glue injection process. This solves the technical problem in related technologies that the solder joint of the circuit board cannot be effectively soldered after being corroded by the encapsulation glue.

[0018] 2. By setting up a demolding module and a demolding pusher, rotating the third fastener can drive the demolding pusher to move. While the demolding pusher moves, it pushes the ejector rod to move, thereby pushing the demolding module to move, so that the circuit board encapsulation block can be demolded from the first or second receiving cavity. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of the high-voltage insulating packaging tool used in this embodiment of the utility model;

[0020] Figure 2 This is an exploded view of the high-voltage insulating packaging tooling used in this embodiment of the utility model;

[0021] Figure 3 This is a schematic diagram of the structure of the protective block of the high-voltage insulating packaging tool used in this embodiment of the utility model;

[0022] Figure 4 This is a schematic diagram of the structure of the second demolding groove of the high-voltage insulating packaging tooling used in this embodiment of the utility model;

[0023] Figure 5 This is a schematic diagram of the cavity structure of the high-voltage insulating packaging tool used in this embodiment of the utility model;

[0024] Figure 6 This is a schematic diagram of the structure of the fourth fastener of the high-voltage insulating packaging tooling used in this embodiment of the utility model.

[0025] The above figures include the following reference numerals:

[0026] 10. Circuit board; 101. Solder joint; 11. Receiving cavity; 12. Injection hole; 2. Protective block; 21. Sealing surface; 22. Protective cavity; 23. Limiting part; 31. Sealing cap; 311. First receiving cavity; 32. Sealing base; 321. Second receiving cavity; 322. Second demolding groove; 33. First fastener; 4. Demolding module; 41. Second fastener; 5. Demolding push block; 51. First through hole; 52. Third fastener; 53. Push rod; 54. Positioning groove; 61. First connecting hole; 62. Second connecting hole; 63. Third connecting hole; 64. Fourth fastener; 7. Positioning platform; 8. First sealing ring; 81. Sealing groove. Detailed Implementation

[0027] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of protection of the present application.

[0028] According to an embodiment of this utility model, a high-voltage insulating packaging fixture is provided. Please refer to [link / reference]. Figures 1 to 6 The circuit board encapsulation container includes: a circuit board encapsulation container with a cavity 11 that matches the shape of the circuit board encapsulation block; an injection hole 12 that communicates with the cavity 11 on the outer wall of the circuit board encapsulation container; and a protective block 2, which is correspondingly provided with a solder joint 101 on the circuit board 10. The protective block 2 is embedded in the cavity 11. A sealing surface 21 is provided on the side of the protective block 2 closest to the circuit board 10. The sealing surface 21 is in close contact with the circuit board 10. A protective cavity 22 for accommodating the solder joint 101 is provided on the sealing surface 21. The circuit board 10 has protective blocks 2 on both opposite sides.

[0029] By setting up a protective block 2, one side of the protective block 2 faces the receiving cavity 11, and the other side of the protective block 2 wraps the solder joint 101 in the protective cavity 22. It is connected to the circuit board 10 through the sealing surface 21, preventing glue from leaking into the protective cavity 22, thereby isolating the glue from the solder joint 101 and preventing the glue from corroding the solder joint 101 during the glue injection process. This solves the technical problem in the related technology that the solder joint of the circuit board cannot be effectively soldered after being corroded by the encapsulation glue.

[0030] It is understandable that the position and number of the protective block 2 are determined by the position and number of the solder joint 101, and the volume and width of the protective cavity 22 are also determined by the size of the solder joint 101. The shape of the protective block 2 matches the shape of the circuit board encapsulation block and the shape of the receiving cavity 11.

[0031] In some embodiments, the glue injection hole 12 is provided on the side of the circuit board 10 where the solder joint 101 is provided, thereby reducing the chance of making holes or grooves in the circuit board encapsulation container, increasing the sealing performance of the circuit board encapsulation container, and preventing glue leakage.

[0032] For example, in some embodiments, the circuit board has two solder joints 101 on the same side, and the circuit board is an irregularly shaped circuit board with a straight edge and a curved edge on opposite sides. The glue injection hole 12 is correspondingly provided on the side of the circuit board with two solder joints 101. The protective block 2 includes a straight edge protective block and a curved edge protective block corresponding to the straight edge and the curved edge, respectively, and the glue injection hole 12 is formed between the straight edge protective block and the curved edge protective block.

[0033] In some embodiments, when the circuit board is a single-layer current board, protective blocks 2 are provided on both opposite sides of the single-layer circuit board 10.

[0034] In some embodiments, when the circuit board is a multilayer circuit board, protective blocks 2 are provided on opposite sides of each layer of the circuit board 10 according to the distribution of the solder joints 101, for example, see [reference needed]. Figure 3 The circuit board is a double-layer circuit board, and the two protective blocks 2 between the two layers of the circuit board are connected to form a single filler block, which facilitates assembly.

[0035] In the high-voltage insulating packaging fixture of this embodiment, see... Figure 1 The protective block 2 includes a limiting part 23 protruding from the outer wall of the circuit board encapsulation container. The bottom surface of the limiting part 23 abuts against the outer wall of the circuit board encapsulation container to limit the protective block 2. This design prevents the protective block 2 from being improperly installed and prevents it from shifting during the encapsulation process.

[0036] In the high-voltage insulating packaging fixture of this embodiment, see... Figure 1-2 The circuit board encapsulation container includes: an encapsulation cap 31 and an encapsulation base 32 disposed opposite to each other. The encapsulation cap 31 has a first receiving cavity 311, and the encapsulation base 32 has a second receiving cavity 321. The first receiving cavity 311 and the second receiving cavity 321 together form a receiving cavity 11. A first fastener 33 is connected to the encapsulation cap 31 and the encapsulation base 32 respectively, so as to fix the encapsulation cap 31 and the encapsulation base 32. Through the above configuration, during the encapsulation process, the encapsulation cap 31 and the encapsulation base 32 are fixed by the first fastener 33.

[0037] In the high-voltage insulating packaging fixture of this embodiment, see... Figure 2 A release module 4 is provided inside the sealing cap 31. The release module 4 is embedded in the first demolding groove located in the first receiving cavity 311. The side of the release module 4 near the circuit board sealing block abuts against the circuit board sealing block. The release module 4 is connected to the sealing cap 31 by a second fastener 41. Alternatively, a release module 4 is provided inside the sealing base 32. The release module 4 is embedded in the second demolding groove 322 located in the second receiving cavity 321. The side of the release module 4 near the circuit board sealing block abuts against the circuit board sealing block. The release module 4 is connected to the sealing base 32 by a second fastener 41. By pushing the release module 4, the circuit board sealing block can be indirectly pushed, causing the circuit board sealing block to be demolded from the first receiving cavity 311 or the second receiving cavity 321.

[0038] In the high-voltage insulating packaging fixture of this embodiment, see... Figure 2The high-voltage insulation encapsulation fixture includes: a demolding pusher 5, which has a first through hole 51; a third fastener 52, one end of which is threadedly connected to the sealing cap 31 or the sealing base 32, and the other end of which passes through the first through hole 51 and abuts against the demolding pusher 5; and a push rod 53, which is slidably connected to the sealing cap 31 or the sealing base 32, one end of which abuts against the demolding pusher 5, and the other end of which abuts against the demolding module 4. By rotating the third fastener 52, the demolding pusher 5 can be moved. As the demolding pusher 5 moves, the push rod 53 is pushed to move, thereby pushing the demolding module 4 to move, so that the circuit board sealing block is demolded from the first receiving cavity 311 or the second receiving cavity 321.

[0039] In the high-voltage insulating packaging fixture of this embodiment, see... Figure 1 The demolding push block 5 has a positioning groove 54, which accommodates at least part of the push rod 53. This positions the push rod 53 to prevent it from sliding and losing its pushing force.

[0040] In the high-voltage insulating packaging fixture of this embodiment, see... Figure 2 The push rod 53 comprises two rods, which are located on both sides of the third fastener 52. This arrangement ensures that the release module 4 is subjected to uniform force, thus allowing it to be pushed stably.

[0041] In the high-voltage insulating packaging fixture of this embodiment, see... Figure 6 The circuit board encapsulation container includes: a first connecting hole 61, which is formed on the encapsulation base 32; a second connecting hole 62, which is formed on the encapsulation base 32 and communicates with the first connecting hole 61; a third connecting hole 63, which is formed on the encapsulation cover 31 corresponding to the second connecting hole 62; and a fourth fastener 64, which is movably disposed relative to the first connecting hole 61 and the second connecting hole 62, and is threadedly connected to the third connecting hole 63 after passing through the first connecting hole 61 and the second connecting hole 62. Through the above arrangement, by rotating the fourth fastener 64, a demolding gap is created between the encapsulation base 32 and the encapsulation cover 31, thereby completing the mold opening process.

[0042] Specifically, the first connecting hole 61 is a countersunk hole, the second connecting hole 62 is a thread clearance hole, the third connecting hole 63 is a threaded hole, and the fourth fastener 64 is a screw.

[0043] Understandably, depending on the demolding status of the circuit board encapsulation block, the demolding module 4 can be pushed from either the encapsulation cover 31 or the encapsulation base 32. That is, when the circuit board encapsulation block is stuck on the encapsulation cover 31, a demolding pusher 5 and a third fastener 52 can be installed on one side of the encapsulation cover 31, and the second fastener 41 that fixes the demolding module 4 on one side of the encapsulation cover 31 can be removed, thereby pushing the demolding module 4 on one side of the encapsulation cover 31; that is, when the circuit board encapsulation block is stuck on the encapsulation base 32, a demolding pusher 5 and a third fastener 52 can be installed on one side of the encapsulation base 32, and the second fastener 41 that fixes the demolding module 4 on one side of the encapsulation base 32 can be removed, thereby pushing the demolding module 4 on one side of the encapsulation base 32.

[0044] In the high-voltage insulating packaging fixture of this embodiment, see... Figure 4 The circuit board sealing container includes a positioning platform 7, which is used to support the circuit board 10. The positioning platform 7 includes multiple platforms, which protrude along the periphery of the receiving cavity 11 and are disposed in the first receiving cavity 311 and the second receiving cavity 321.

[0045] In the high-voltage insulating packaging fixture of this embodiment, see... Figure 5 The circuit board encapsulation container includes a first sealing ring 8, and a sealing groove 81 is formed in a first or second demolding groove 322 to accommodate the first sealing ring 8. This design increases the sealing performance of the circuit board encapsulation container and prevents adhesive leakage.

[0046] In some embodiments, an additional second sealing ring may be provided between the sealing cap 31 and the sealing base 32 as needed to further improve the sealing performance of the circuit board sealing container.

[0047] In some embodiments, the installation and use of the high-voltage insulating packaging fixture is as follows:

[0048] Step 1: Install the top rod 53 and the first sealing ring 8 into the corresponding positions of the sealing cap 31 and the sealing base 32;

[0049] Step 2: Install the detachable module 4 into the corresponding positions of the sealing cap 31 and the sealing base 32;

[0050] Step 3: Install the second fastener 41 into the corresponding positions of the sealing cap 31 and the sealing base 32 to fix the detachable module 4 installed in step 2;

[0051] Step 4: Install each protective block 2 into the corresponding position on the sealing cap 31, sealing base 32, or circuit board 10;

[0052] Step 5: Install the circuit board 10 into the second receiving cavity 321 of the sealing base 32, install the second sealing ring into the mounting groove on the sealing base 32, and fasten the sealing cover 31.

[0053] Step 6: Install the first fastener 33 into the corresponding position of the sealing cap 31, and fix the sealing base 32 to the sealing cap 31;

[0054] Step 7: Inject the prepared epoxy resin solution into the tooling assembled in Step 6;

[0055] Step 8: Cur at room temperature for 24 hours;

[0056] Step 9: Remove the first fastener 33;

[0057] Step 10: Install the fourth fastener 64, rotate the fourth fastener 64 to create a demolding gap between the sealing cap 31 and the sealing base 32, and realize the mold opening;

[0058] Step 11: Remove the second fastener 41 used to secure the release module 4 in the sealing base 32;

[0059] Step 12: Install the demolding push block 5 and the third fastener 52 on one side of the sealing base 32;

[0060] Step 13: Tighten the third fastener 52, push the release module 4 to release the circuit board sealant block from the second receiving cavity 321, and then remove the circuit board sealant block from between the sealant cover 31 and the sealant base 32 to complete the encapsulation of the irregular circuit board.

[0061] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0062] Optionally, specific examples in this embodiment can refer to the examples described in the above embodiments, and will not be repeated here.

[0063] The sequence numbers of the embodiments in this application are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments.

[0064] In the above embodiments of this application, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0065] The above description is only a preferred embodiment of this application. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of this application, and these improvements and modifications should also be considered within the scope of protection of this application.

Claims

1. A high-voltage insulating packaging fixture, characterized in that, include: A circuit board sealing container, wherein a receiving cavity (11) matching the shape of the circuit board sealing block is provided inside the circuit board sealing container, and an injection hole (12) communicating with the receiving cavity (11) is provided on the outer wall of the circuit board sealing container. A protective block (2) is provided corresponding to the solder joint (101) on the circuit board (10). The protective block (2) is embedded in the receiving cavity (11). A sealing surface (21) is provided on the side of the protective block (2) close to the circuit board (10). The sealing surface (21) is in close contact with the circuit board (10). A protective cavity (22) for accommodating the solder joint (101) is provided on the sealing surface (21). The protective block (2) is provided on both opposite sides of the circuit board (10).

2. The high-voltage insulating packaging fixture according to claim 1, characterized in that, The protective block (2) includes a limiting part (23) protruding from the outer wall of the circuit board sealing container. The bottom surface of the limiting part (23) abuts against the outer wall of the circuit board sealing container to limit the protective block (2).

3. The high-voltage insulating packaging fixture according to claim 1, characterized in that, The circuit board encapsulation container includes: A sealing cap (31) and a sealing base (32) are arranged opposite to each other. The sealing cap (31) has a first receiving cavity (311) and the sealing base (32) has a second receiving cavity (321). The first receiving cavity (311) and the second receiving cavity (321) together enclose the receiving cavity (11). The first fastener (33) is connected to the sealing cap (31) and the sealing base (32) respectively, so that the sealing cap (31) and the sealing base (32) are fixedly connected.

4. The high-voltage insulating packaging fixture according to claim 3, characterized in that, A release module (4) is provided inside the sealing cap (31). The release module (4) is embedded in the first release groove located in the first receiving cavity (311). The side of the release module (4) near the circuit board sealing block abuts against the circuit board sealing block. The release module (4) is connected to the sealing cap (31) by a second fastener (41); and / or, The sealing base (32) is provided with a release module (4). The release module (4) is embedded in the second release groove (322) located in the second receiving cavity (321). The side of the release module (4) close to the circuit board sealing block abuts against the circuit board sealing block. The release module (4) is connected to the sealing base (32) by a second fastener (41).

5. The high-voltage insulating packaging fixture according to claim 4, characterized in that, The high-voltage insulating packaging fixture includes: Demolding push block (5), the demolding push block (5) is provided with a first through hole (51); The third fastener (52) has one end threadedly connected to the sealing cap (31) or the sealing base (32), and the other end of the third fastener (52) passes through the first through hole (51) and abuts against the demolding push block (5). The push rod (53) is slidably connected to the sealing cap (31) or the sealing base (32). One end of the push rod (53) abuts against the demolding push block (5), and the other end of the push rod (53) abuts against the demolding module (4).

6. The high-voltage insulating packaging fixture according to claim 5, characterized in that, The demolding push block (5) is provided with a positioning groove (54), and the positioning groove (54) contains at least part of the push rod (53).

7. The high-voltage insulating packaging fixture according to claim 5, characterized in that, The top rod (53) includes two, and the two top rods (53) are located on both sides of the third fastener (52).

8. The high-voltage insulating packaging fixture according to claim 3, characterized in that, The circuit board encapsulation container includes: The first connecting hole (61) is formed on the sealing base (32); The second connecting hole (62) is formed on the sealing base (32) and communicates with the first connecting hole (61); The third connecting hole (63) is provided on the sealing cap (31) corresponding to the second connecting hole (62); The fourth fastener (64) is movably disposed relative to the first connecting hole (61) and the second connecting hole (62), and the fourth fastener (64) passes through the first connecting hole (61) and the second connecting hole (62) and is threadedly connected to the third connecting hole (63).

9. The high-voltage insulating packaging fixture according to claim 3, characterized in that, The circuit board sealing container includes a positioning platform (7) for supporting the circuit board (10). The positioning platform (7) includes multiple platforms, which protrude along the periphery of the receiving cavity (11) and are disposed within the first receiving cavity (311) and the second receiving cavity (321).

10. The high-voltage insulating packaging fixture according to claim 4, characterized in that, The circuit board sealing container includes a first sealing ring (8), and a sealing groove (81) is provided in the first demolding groove or the second demolding groove (322), the sealing groove (81) being used to accommodate the first sealing ring (8).

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