Electroplating layer with multiple plating layers on nickel bottom, terminal and electronic interface

Abstract

The utility model discloses a nickel bottom multi-plating electroplated coating, a terminal and an electronic interface, comprising an electroplated base material, the top of the electroplated base material is fixedly provided with a nickel metal layer, the thickness of the nickel metal layer can be 1-4 microns, the top of the nickel metal layer is fixedly provided with a nickel tungsten layer, the top of the nickel tungsten layer is fixedly provided with a nickel phosphorus layer, and the nickel phosphorus layer is fixedly provided with a nickel phosphorus layer. And the thickness of the nickel-tungsten layer and the nickel-phosphorus layer can be 0.5-5 microns. According to the nickel-bottom multi-plating electroplating coating, the terminal and the electronic interface, in the daily use process, the nickel metal layer is electroplated on the surface of the electroplating base material, the thickness of the nickel metal layer is preferably 1-4 microns, the flatness of the base material can be adjusted, and the nickel metal layer has good adhesive force with the electroplating base material; the corrosion resistance, the oxidation resistance and the flatness of the terminal can be improved, and the high temperature resistance and the wear resistance of the terminal are enhanced.

Description

TECHNICAL FIELD

[0001] The utility model relates to electroplating technical field, concretely is a kind of nickel bottom multi-plating layer's electroplating plating layer, terminal and electronic interface. BACKGROUND

[0002] Electroplating is the process of plating a thin layer of other metal or alloy on the surface of certain metal by electrolysis principle, is the process of making the surface of metal or other material parts adhere to a layer of metal film by electrolysis, to prevent metal oxidation (such as rust), improve wear resistance, electrical conductivity, reflectivity, corrosion resistance (copper sulfate, etc.) and enhance the aesthetic effect, thus needing a kind of nickel bottom multi-plating layer's electroplating plating layer, terminal and electronic interface.

[0003] When the operator carries out protection work to terminal and electronic interface, the surface of the terminal and electronic interface is often electroplated with electroplating layer, but the existing electroplating layer cannot adjust the flatness of base material, and the high-temperature resistance and wear resistance are poor, and the electroplating layer is single, the protection effect of the electroplating layer is poor, and the practicability is reduced. UTILITY MODEL CONTENT

[0004] The utility model discloses a kind of nickel bottom multi-plating layer's electroplating plating layer, terminal and electronic interface, to solve the operator in the protection work of terminal and electronic interface in the above background art, the surface of the terminal and electronic interface is often electroplated with electroplating layer, but the existing electroplating layer cannot adjust the flatness of base material, and the high-temperature resistance and wear resistance are poor, and the electroplating layer is single, the protection effect of the electroplating layer is poor, and the practicability is reduced.

[0005] To achieve the above object, the utility model provides the following technical scheme: a kind of nickel bottom multi-plating layer's electroplating plating layer, including electroplating base material, the top of the electroplating base material is fixedly installed with nickel metal layer, the thickness of the nickel metal layer can be 1-4 microns, the top of the nickel metal layer is fixedly installed with nickel tungsten layer, the top of the nickel tungsten layer is fixedly installed with nickel phosphorus layer, and the thickness of nickel tungsten layer and nickel phosphorus layer can be 0.5-5 microns.

[0006] Preferably, the top of the nickel phosphorus layer 4 is fixedly installed with gold layer, and the top of the gold layer is fixedly installed with palladium layer.

[0007] Preferably, the top of the palladium layer is fixedly installed with gold palladium alloy layer, and the thickness of gold layer, palladium layer and gold palladium alloy layer can be 0.025-0.2 microns.

[0008] Preferably, the top of the gold palladium alloy layer is fixedly installed with rhodium metal layer, and the top of the rhodium metal layer is fixedly installed with rhodium alloy layer, and the thickness of rhodium metal layer and rhodium alloy layer can be 0.125-3 microns.

[0009] Preferably, a terminal is electroplated with the electroplating plating layer of any one of claims 1 to 4 on its surface.

[0010] Preferably, an electronic interface comprises the terminal of claim 5.

[0011] Compared with the prior art, the utility model has the beneficial effects that:

[0012] The nickel-based multi-layer electroplated layer, the terminal and the electronic interface, in the process of daily use, the nickel metal layer is electroplated on the surface of the electroplating base material, and the thickness is preferably 1-4 microns, the base material flatness can be adjusted, and the electroplating base material has good adhesion, the nickel tungsten layer and the nickel phosphorus layer are electroplated on the electroplating base material, the corrosion resistance, the oxidation resistance and the flatness of the terminal can be improved, and the high temperature resistance and wear resistance are enhanced.

[0013] The nickel-based multi-layer electroplated layer, the terminal and the electronic interface, in the process of daily use, the gold layer, the palladium layer and the gold-palladium alloy layer are intermediate bonding layers, which are plated on the surfaces of the nickel tungsten layer and the nickel phosphorus layer, and can reduce the internal stress of the rhodium metal layer and the rhodium alloy layer, the rhodium metal layer and the rhodium alloy layer can improve the surface hardness, wear resistance, corrosion resistance and plug resistance of the terminal, and further improve the protection of the electroplated layer. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 It is a front view of the utility model;

[0015] Figure 2 It is a front view of the utility model;

[0016] Figure 3 It is a front view of the utility model; Figure 2 It is a local enlarged view of A in the middle;

[0017] Figure 4 It is a front view of the utility model;

[0018] Figure 5 It is a front view of the utility model; Figure 4 It is a local enlarged view of B in the middle;

[0019] Figure 6 It is a structure schematic view of one side of the electroplating base material of the utility model;

[0020] Figure 7 It is a structure schematic view of one end of the electroplating base material of the utility model;

[0021] Figure 8 It is a bottom view of the utility model.

[0022] In the drawing: 1, electroplating base material; 2, nickel metal layer; 3, nickel tungsten layer; 4, nickel phosphorus layer; 5, gold layer; 6, palladium layer; 7, gold-palladium alloy layer; 8, rhodium metal layer; 9, rhodium alloy layer. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the present application.

[0024] Please refer to Figures 1-8The utility model provides a technical scheme: a kind of nickel bottom multi-plating layer's electroplating plating layer, terminal and electronic interface, including electroplating base material 1, the top of electroplating base material 1 is fixedly installed with nickel metal layer 2, nickel is a kind of hard and has ductility and has ferromagnetic metal, its main function includes preventing corrosion, increasing wear resistance, improving luster and aesthetic property, nickel metal layer 2 has very high stability in air, can resist corrosion of atmosphere, alkali and certain acid, because nickel has very strong passivation ability, can rapidly generate a very thin passivation film on surface, in addition, electroplated nickel layer is higher in hardness, can improve the wear resistance of product surface, commonly used in printing industry and chemical equipment, nickel metal layer 2 also has good polishing performance, after polishing, mirror-like luster can be obtained, and long-term keep its luster in atmosphere, nickel metal layer 2 is usually used as the barrier layer of copper layer and gold layer, prevents gold copper mutual diffusion, and improves the mechanical strength of gold layer, the thickness of nickel metal layer 2 can be 1-4 microns, nickel tungsten layer 3 is fixedly installed on the top of nickel metal layer 2, the main function of nickel tungsten layer 3 includes increasing hardness, improving heat resistance, improving conductivity and increasing aesthetic degree, because the hardness of tungsten is very high, plating tungsten can significantly increase the hardness and wear resistance of material, thereby improving the compression resistance, wear resistance and corrosion resistance of material, the melting point of tungsten is very high, plating tungsten can improve the high-temperature resistance of material, so that it can work in high-temperature environment, tungsten has good conductivity, plating tungsten can improve the conductivity of material, tungsten metal color is bright, has metallic texture, can increase the aesthetic degree and artistic sense of material, nickel phosphorus layer 4 is fixedly installed on the top of nickel tungsten layer 3, the main function of nickel phosphorus layer 4 includes improving the hardness, corrosion resistance and wear resistance of metal surface, and also can improve other physical and chemical properties of metal surface, it can form a high-hardness protective layer on the surface of base material, significantly improve the hardness of base material, this high-hardness protective layer can effectively resist wear and scratch, prolong the service life of metal element, have excellent corrosion resistance, can also form a tight protective layer on the surface of base material, prevent oxidation and corrosion, thereby protect base material from environmental factors, also can significantly improve the wear resistance of base material, so that base material surface is more durable, reduce the performance decline due to wear, and can improve other physical and chemical properties of base material surface, such as conductivity, electromagnetic property, heat resistance etc., and the thickness of nickel tungsten layer 3 and nickel phosphorus layer 4 is 0.5-5 microns, the top of the nickel-phosphorus layer 4 is fixedly installed with a gold layer 5, which improves the corrosion resistance, electrical conductivity, decorative properties and oxidation resistance of the substrate, etc. Firstly, the gold layer 5 can effectively protect the electroplated substrate 1 from corrosion and prolong its service life. Secondly, gold is a good conductor, and the gold layer 5 can improve the electrical conductivity of the material, making it more suitable for the manufacture of electronic components. In addition, the gold layer 5 can also improve the decorative properties of the material, making its surface present a golden luster and increasing its aesthetic appeal. The gold layer 5 also exhibits good high-temperature resistance in high-temperature environments. Moreover, the top of the gold layer 5 is fixedly installed with a palladium layer 6, which mainly functions to improve the corrosion resistance, wear resistance, oxidation resistance and electrical conductivity of the metal. Palladium is a noble metal with good corrosion resistance. By plating palladium on the surface of the substrate, the corrosion resistance of the substrate can be significantly improved, making it less prone to rust and corrosion in harsh environments, thereby prolonging the service life of the substrate. Palladium also has a certain hardness and wear resistance, which can effectively reduce the degree of wear on the surface of the substrate. It also has good oxidation resistance, which can prevent the surface of the substrate from oxidizing and discoloring. Palladium is an excellent conductive metal that can improve the electrical conductivity of the substrate.

[0025] The top of the palladium layer 6 is fixedly installed with a gold-palladium alloy layer 7, and the thickness of the gold layer 5, the palladium layer 6 and the gold-palladium alloy layer 7 is 0.025-0.2 microns. The gold layer 5, the palladium layer 6 and the gold-palladium alloy layer 7 are intermediate bonding layers that can reduce the internal stress between them and the rhodium metal layer 8 and the rhodium alloy layer 9. The gold-palladium alloy layer 7 has good electrical conductivity, which can reduce contact resistance and improve signal transmission. It also has higher strength and wear resistance, which can provide better corrosion resistance. At the same time, palladium dissolves during the chemical plating process, exposing the underlying chemical nickel layer and forming a good nickel-tin alloy, thereby enhancing wear resistance. This structure enables the gold-palladium alloy plating layer to maintain high wear resistance during long-term use. The top of the gold-palladium alloy layer 7 is fixedly installed with a rhodium metal layer 8, which has extremely high chemical stability and corrosion resistance, providing excellent wear resistance and corrosion resistance in various environments. It can significantly improve the gloss of the metal surface, making it look brighter and more beautiful. It also has good electrical conductivity and light reflection ability. Moreover, the top of the rhodium metal layer 8 is fixedly installed with a rhodium alloy layer 9, and the thickness of the rhodium metal layer 8 and the rhodium alloy layer 9 is 0.125-3 microns. The main functions of the rhodium alloy layer 9 include improving electrical conductivity, enhancing wear resistance and oxidation resistance, and improving the reliability and service life of the product.

[0026] Working principle: first nickel metal layer 2 is electroplated on the surface of electroplating base material 1, and the thickness is preferably 1-4 microns, which can adjust the flatness of the base material, has better adhesion with the electroplating base material 1, and the nickel tungsten layer 3 and the nickel phosphorus layer 4 are electroplated on the electroplating base material 1, which can improve the corrosion resistance, oxidation resistance and flatness of the terminal, and enhance the high temperature resistance and wear resistance, second, the gold layer 5, the palladium layer 6 and the gold palladium alloy layer 7 are the intermediate bonding layer, which is plated on the surface of the nickel tungsten layer 3 and the nickel phosphorus layer 4, which can reduce the internal stress of the rhodium metal layer 8 and the rhodium alloy layer 9, and the rhodium metal layer 8 and the rhodium alloy layer 9 can improve the surface hardness, wear resistance, corrosion resistance and plug resistance of the terminal.

[0027] Although the embodiments of the utility model have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and spirits of the utility model, and the scope of the utility model is defined by the appended claims and their equivalents.

Claims

1. An electroplated multi-coating of a nickel base, comprising an electroplated base material (1), characterized in that: The top of the electroplating base material (1) is fixedly installed with a nickel metal layer (2), the thickness of the nickel metal layer (2) can be 1-4 microns, the top of the nickel metal layer (2) is fixedly installed with a nickel tungsten layer (3), the top of the nickel tungsten layer (3) is fixedly installed with a nickel phosphorus layer (4), and the thickness of the nickel tungsten layer (3) and the nickel phosphorus layer (4) can be 0.5-5 microns.

2. The electroplated multi-plating layer on a nickel base according to claim 1, characterized in that: The top of the nickel phosphorus layer (4) is fixedly installed with a gold layer (5), and the top of the gold layer (5) is fixedly installed with a palladium layer (6).

3. The electroplated multi-plating layer on a nickel base according to claim 2, characterized in that: The top of the palladium layer (6) is fixedly installed with a gold palladium alloy layer (7), and the thickness of the gold layer (5), the palladium layer (6) and the gold palladium alloy layer (7) can be 0.025-0.2 microns.

4. The electroplated multi-plating layer on a nickel base according to claim 3, characterized in that: The top of the gold palladium alloy layer (7) is fixedly installed with a rhodium metal layer (8), and the top of the rhodium metal layer (8) is fixedly installed with a rhodium alloy layer (9), and the thickness of the rhodium metal layer (8) and the rhodium alloy layer (9) can be 0.125-3 microns.

5. A terminal characterized by: The surface is electroplated with the electroplating coating of any one of claims 1-4.

6. An electronic interface, characterized by: The terminal comprises the terminal of claim 5. The terminal comprises the terminal of claim 5.

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