Etching device and etching equipment
By setting a blocking ring in the etching apparatus and using a push rod to drive it to switch between different working positions, the wafer edge is protected, the problem of excessive etching at the wafer edge is solved, and a uniform etching effect is achieved.
Patent Information
- Application Number
- CN202422609033.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-28
- Publication Date
- 2025-12-05
- Estimated Expiration
- 2034-10-28
AI Technical Summary
In existing plasma etching equipment, wafer edges are prone to over-etching, which leads to microcracks in the lattice arrangement of the substrate and cavity contamination, affecting etching uniformity.
A blocking ring is set in the etching apparatus. The blocking ring is driven to the first working position by the push rod to form a loading gap with the wafer placement stage. After the robot places the wafer, the push rod lowers the blocking ring to the second working position to block the edge of the wafer and prevent over-etching.
It effectively prevents excessive etching at the wafer edges, ensures etching effect, avoids lattice microcracks and cavity contamination, and improves etching uniformity.
Smart Images
Figure CN223638323U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to etching technical field, specifically, relate to a kind of etching device and etching equipment. BACKGROUND
[0002] The plasma etching process is to form an electric field by applying high-frequency power to an upper electrode and a lower electrode arranged at a predetermined interval inside a sealed chamber, and to form a plasma state by activating a reaction gas supplied to the inside of the chamber through the electric field, and then to etch a substrate (such as a wafer / glass, etc.) placed on a wafer placement platform with ions in the plasma state. Since the plasma is formed by applying high-frequency power, the electric field formation area on the wafer placement flat upper portion is expanded to the edge area outside the area where the substrate is located, i.e., the electric field range is expanded, which easily leads to excessive etching of the edge of the substrate, affects the lattice arrangement of the substrate, causes hidden cracks, and ionizes the adhesive layer in the substrate, causing contamination of the chamber, which further affects the etch uniformity of the plasma etching equipment. SUMMARY
[0003] The utility model aims to provide an etching device and equipment that can protect and block the edge of the wafer during etching, avoid excessive etching of the wafer edge, and thus ensure the etching effect.
[0004] The embodiments of the utility model can be implemented as follows:
[0005] In a first aspect, the utility model provides an etching device, which includes a base, a wafer placement platform and a blocking ring. The base is provided with a bearing accommodating groove. The wafer placement platform is accommodated in the bearing accommodating groove and forms a bearing platform with the base for bearing a wafer. The blocking ring is arranged on the base and connected to the base by a jack. The jack is arranged at intervals with the wafer placement platform. The jack is used to lift the blocking ring to a first working position, so as to form a gap between the blocking ring and the wafer placement platform for loading a wafer. The jack is also used to lower the blocking ring to a second working position, so as to press and shield the edge of the wafer.
[0006] In an optional embodiment, the blocking ring is in the shape of a circular ring, and the inner diameter of the blocking ring is smaller than the diameter of the bearing platform.
[0007] In an optional embodiment, the jack is two, and the two jacks are arranged on both sides of the bearing accommodating groove, and the distance between the two jacks is greater than the width of the bearing platform.
[0008] In an optional embodiment, a bottom side surface of the blocking ring is provided with a buffer layer for abutting against an edge position of the wafer.
[0009] In an optional embodiment, a driving member is arranged in the base, a jacking hole is arranged on the base and located at both sides of the bearing accommodating groove, a jack rod is movably arranged in the jacking hole and in transmission connection with the driving member, and the driving member is used to drive the jack rod to move up and down.
[0010] In an optional embodiment, the wafer placing table is provided with a suction assembly for suctioning the wafer on the bearing table surface.
[0011] In an optional embodiment, the bearing table surface is provided with a placing groove, the suction assembly comprises a coil, the coil is accommodated in the placing groove, and the coil is used to electrostatically suction the wafer through the bearing table surface.
[0012] In an optional embodiment, the base is further provided with a clearance groove concentrically arranged with the bearing accommodating groove, the clearance groove is sized to be adapted to the size of the wafer, the bearing accommodating groove is arranged on a bottom wall of the clearance groove and forms a stepped surface at an edge, and the stepped surface and an upper surface of the wafer placing table jointly constitute the bearing table surface.
[0013] In an optional embodiment, the base is further provided with an air extraction hole, the air extraction hole is arranged around the clearance groove and penetrates through the base.
[0014] In a second aspect, the utility model provides a kind of etching equipment, including reaction chamber and the etching device of any one of the preceding embodiment, the base is arranged on the bottom wall of the reaction chamber.
[0015] The etching device and the etching equipment provided in the embodiments of the utility model have the following beneficial effects:
[0016] The etching device and the etching equipment provided in the embodiments of the utility model are characterized in that a bearing accommodating groove is arranged on the base, a wafer placing table is accommodated in the bearing accommodating groove and can form a bearing table surface, a blocking ring is arranged on the base and connected to the base by a jack rod, the jack rod is spaced apart from the wafer placing table, and the blocking ring is driven to a first working position or a second working position, when the jack rod jacks up the blocking ring to the first working position, the blocking ring is spaced apart from the wafer placing table in the vertical direction to form a gap for loading the wafer, the wafer is loaded into the gap from outside by a robot and placed on the wafer placing table, then the blocking ring is lowered to the second working position by the jack rod, so that the blocking ring is pressed and shields the edge position of the wafer, and then etching action is performed, due to the shielding and protection of the blocking ring, the excessive etching of the edge of the wafer is effectively prevented, and the etching effect is ensured. Attached Figure Description
[0017] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0018] Figure 1 This is a schematic diagram of the etching apparatus provided in this embodiment with the blocking ring in the first working position;
[0019] Figure 2 This is a schematic diagram of the etching apparatus provided in this embodiment with the blocking ring in the second working position;
[0020] Figure 3 for Figure 1 A schematic diagram of the central base;
[0021] Figure 4 This is a schematic diagram of the etching apparatus provided in this embodiment;
[0022] Figure 5 for Figure 1 A schematic diagram of the structure of the wafer placement stage.
[0023] icon:
[0024] 100 - Etching device; 110 - Base; 111 - Supporting and receiving groove; 113 - Displacement groove; 115 - Evacuation hole; 130 - Wafer placement stage; 150 - Barrier ring; 151 - Top rod; 153 - Buffer layer; 170 - Adsorption assembly; 171 - Placement groove. Detailed Implementation
[0025] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.
[0026] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.
[0027] It should be noted that like reference numerals and letters refer to like items in the several views, and once an item is defined in one view, it should not require further defining and explaining in the subsequent views.
[0028] In the description of the utility model, it needs to be explained that if the terms "upper", "lower", "inner", "outer" and the like indicate the orientation or position relationship based on the orientation or position relationship shown in the drawings, or the orientation or position relationship commonly used when the utility model product is used, it is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the indicated device or element must have a specific orientation, be constructed and operated in a specific orientation, therefore, it cannot be understood as a limitation on the utility model.
[0029] In addition, if the terms "first", "second" and the like are used only to distinguish the description, and cannot be understood as indicating or implying relative importance.
[0030] It should be noted that the features in the embodiments of the utility model can be combined with each other without conflict.
[0031] Referring to Figures 1 to 5 The utility model embodiment provides a kind of etching device 100, it can protect the edge of wafer in etching process and block, avoid wafer edge excessive etching, to guarantee etching effect in turn, can be fixed to wafer simultaneously, guarantee the fixed effect of wafer, and extract the waste gas generated around wafer when etching.
[0032] The etching device 100 provided in the embodiment includes a base 110, a wafer placement table 130, and a blocking ring 150. The base 110 is provided with a bearing accommodating groove 111. The wafer placement table 130 is accommodated in the bearing accommodating groove 111 and forms a bearing table surface for bearing the wafer together with the base 110. The blocking ring 150 is arranged on the base 110 and connected to the base 110 through a top rod 151. The top rod 151 is arranged apart from the wafer placement table 130. The top rod 151 is used to lift the blocking ring 150 to a first working position, so as to form a gap between the blocking ring 150 and the wafer placement table 130 for loading the wafer. The top rod 151 is also used to lower the blocking ring 150 to a second working position, so as to press and shield the edge position of the wafer.
[0033] In the embodiment, the carrier accommodating groove 111 is arranged on the base 110, the wafer placing table 130 is accommodated in the carrier accommodating groove 111 and can form a carrier table surface, the blocking ring 150 is arranged on the base 110 and is connected to the base 110 through the jacks 151, the jacks 151 are spaced apart from the wafer placing table 130, and the jacks 151 are used to drive the blocking ring 150 to the first working position or the second working position. When the jacks 151 lift the blocking ring 150 to the first working position, the blocking ring 150 is spaced apart from the wafer placing table 130 in the vertical direction to form a gap for loading the wafer, the wafer is loaded into the gap from the outside by the robot and is placed on the wafer placing table 130, then the jacks 151 lower the blocking ring 150 to the second working position, so that the blocking ring 150 is pressed and shields the edge position of the wafer, and then etching is performed. Due to the shielding and protection of the blocking ring 150, the over-etching of the edge of the wafer can be effectively prevented, and the etching effect is ensured.
[0034] It should be noted that, here, the blocking ring 150 is in the first working position, which means that the blocking ring 150 is located at the limit position of lifting, and the blocking ring 150 is in the second working position, which means that the blocking ring 150 is located at the limit position of lowering. The jacks 151 can drive the blocking ring 150 to switch back and forth between the first working position and the second working position, so as to realize the placing of the wafer and the etching action.
[0035] In the embodiment, the blocking ring 150 is in the form of a circular ring, and the inner diameter of the blocking ring 150 is smaller than the diameter of the carrier table surface. Specifically, the shape and size of the carrier table surface are matched with the shape and size of the wafer, the inner diameter of the blocking ring 150 is smaller than the diameter of the wafer, and the blocking ring 150 can be arranged concentrically with the carrier table surface, so that the blocking ring 150 can be accurately pressed on the edge position of the wafer when the blocking ring 150 is in the second working position, and the protection effect is realized.
[0036] In the embodiment, the jacks 151 are two, and the two jacks 151 are arranged on the two sides of the carrier accommodating groove 111, and the distance between the two jacks 151 is greater than the width of the carrier table surface. Specifically, the distance between the two jacks 151 is greater than the diameter of the wafer, so that the wafer can be smoothly placed on the wafer placing table 130 by the robot.
[0037] It should be noted that, during the pressing process of the blocking ring 150, the jacks 151 are always spaced apart from the wafer, and the bottom end surface of the blocking ring 150 is pressed on the edge of the wafer.
[0038] In the embodiment, the bottom side surface of the blocking ring 150 is provided with a buffer layer 153, which is used to resist the edge position of the wafer. Specifically, the buffer layer 153 can be a silica gel layer, which can play a buffering role to avoid the wafer edge from being cracked by the wafer being pressed by the blocking ring 150. At the same time, the blocking ring 150 can be a carbon ring or a graphite ring, which has low density, good thermal insulation and high strength.
[0039] In the embodiment, the base 110 is provided with a driving member (not shown), and the base 110 is provided with a jacking hole located on both sides of the bearing accommodating groove 111. The jack 151 is movably arranged in the jacking hole and is in transmission connection with the driving member. The driving member is used to drive the jack 151 to move up and down. Specifically, the driving member can be a pneumatic cylinder which is in transmission connection with the jack 151, so as to drive the jack 151 and the blocking ring 150 to move up and down.
[0040] Further, the wafer placing table 130 is provided with a suction assembly 170, which is used to suck the wafer on the bearing table. Specifically, the suction assembly 170 is embedded in the wafer placing table 130 and can suck the bottom side surface of the wafer, so that the wafer can be fixed on the bearing table.
[0041] In the embodiment, the bearing table is provided with a placing groove 171, and the suction assembly 170 includes a coil which is accommodated in the placing groove 171 and is used to electrostatically adsorb the wafer through the bearing table. Specifically, the coil is connected with an external power supply, and the coil can form adsorption static electricity to adsorb the wafer by electrostatic adsorption. Of course, in other preferable embodiments of the utility model, the suction assembly 170 can also include a vacuum adsorber, for example, an air extractor, which can firmly adsorb the wafer on the bearing table.
[0042] In the embodiment, the base 110 is further provided with a giving slot 113 which is concentrically arranged with the bearing accommodating groove 111. The size of the giving slot 113 is adapted to the size of the wafer. The bearing accommodating groove 111 is arranged on the bottom wall of the giving slot 113 and forms a stepped surface at the edge. The stepped surface and the upper surface of the wafer placing table 130 jointly constitute a bearing table. Specifically, the stepped surface is flush with the upper surface of the wafer placing table 130. During the wafer placing process, the wafer can be placed on the stepped surface, and the blocking ring 150 partially overlaps the stepped surface in the vertical direction, so as to shield and protect the edge of the wafer.
[0043] In the embodiment, the base 110 is further provided with an air extraction hole 115 which is arranged around the giving slot 113 and penetrates through the base 110. Specifically, the bottom side of the base 110 is further provided with a vacuum pump which is communicated with the plurality of air extraction holes 115. Through the plurality of air extraction holes 115, the waste gas generated during the etching of the wafer can be extracted, so as to avoid affecting the etching process.
[0044] The utility model discloses an etching device and etching equipment, and the etching device comprises a reaction chamber and the etching device 100 of preceding, etching device 100, including base 110, wafer placement platform 130 and blocking ring 150, be provided with the bearing accommodating groove 111 on base 110, and wafer placement platform 130 is accommodated in bearing accommodating groove 111, and with base 110 jointly form the bearing mesa for bearing wafer, blocking ring 150 is set up on base 110, and is connected to base 110 through jib 151, and jib 151 is spaced apart from wafer placement platform 130, and jib 151 is used to lift blocking ring 150 to first working position, to make blocking ring 150 and wafer placement platform 130 form the clearance for the wafer loading between, and jib 151 is also used to reduce blocking ring 150 to second working position, to make blocking ring 150 press fit and shield in the edge position of wafer. Base 110 is set up on the bottom wall of reaction chamber.
[0045] In the embodiment, the ionization device is also provided in the reaction chamber, and the basic structure and ionization principle can refer to the existing etching equipment, which will not be described here.
[0046] In summary, the utility model discloses an etching device 100 and etching equipment, and the bearing accommodating groove 111 is set up on base 110, and wafer placement platform 130 is accommodated in the bearing accommodating groove 111, and can form the bearing mesa, and blocking ring 150 is set up on base 110, and is connected to base 110 through jib 151, and jib 151 is spaced apart from wafer placement platform 130, and is used to drive blocking ring 150 to first working position or second working position, when jib 151 lifts blocking ring 150 to first working position, blocking ring 150 and wafer placement platform 130 are spaced apart in vertical direction and form the clearance for the wafer loading, utilize manipulator and place wafer on wafer placement platform 130 from the outside in the clearance, then utilize jib 151 and reduce blocking ring 150 to second working position, so that blocking ring 150 press fit and shield the edge position of wafer, then carry out etching action, due to the shielding and protection of blocking ring 150, can effectively prevent the excessive etching of wafer edge, and then guarantee etching effect.
[0047] The above is only the specific implementation of the utility model, but the protection scope of the utility model is not limited to this, any skilled person in the art can easily think of the change or replacement within the technical range disclosed by the utility model, and all should be covered in the protection scope of the utility model.
Claims
1. An etching apparatus characterized by comprising: The device comprises a base, a wafer placing table and a blocking ring, the base is provided with a bearing accommodating groove, the wafer placing table is accommodated in the bearing accommodating groove and forms a bearing table surface for bearing a wafer together with the base, the blocking ring is arranged on the base and connected to the base through a lifting rod, the lifting rod is arranged apart from the wafer placing table, the lifting rod is used to lift the blocking ring to a first working position to form a gap between the blocking ring and the wafer placing table for loading the wafer, and the lifting rod is also used to lower the blocking ring to a second working position to press and shield the edge position of the wafer; A buffer layer is arranged on the bottom surface of the blocking ring, the buffer layer is a silica gel layer and used to abut against the edge position of the wafer; The base is further provided with a clearance groove concentrically arranged with the bearing accommodating groove, the clearance groove is sized to be adapted to the size of the wafer, the bearing accommodating groove is arranged on the bottom wall of the clearance groove and forms a stepped surface at the edge, and the stepped surface and the upper surface of the wafer placing table jointly constitute the bearing table surface; the base is further provided with a plurality of air extraction holes, the air extraction holes are arranged around the clearance groove and penetrate through the base, and the bottom side of the base is further provided with a vacuum pump, the vacuum pump is communicated to the plurality of air extraction holes, and the exhaust gas generated by etching around the wafer is extracted through the plurality of air extraction holes.
2. The etching apparatus of claim 1, wherein The blocking ring is in the shape of a ring, and the inner diameter of the blocking ring is smaller than the diameter of the bearing table surface.
3. The etching apparatus of claim 2, wherein The lifting rod is two, the two lifting rods are arranged on the two sides of the bearing accommodating groove respectively, and the distance between the two lifting rods is greater than the width of the bearing table surface.
4. The etching apparatus of claim 1, wherein The base is provided with a lifting hole on the base, the lifting hole is located on the two sides of the bearing accommodating groove, the lifting rod is movably arranged in the lifting hole and in transmission connection with the driving member, and the driving member is used to drive the lifting rod to move up and down.
5. The etching apparatus of claim 1, wherein The wafer placing table is provided with an adsorption assembly, and the adsorption assembly is used to adsorb the wafer on the bearing table surface.
6. The etching apparatus of claim 5, wherein The bearing table surface is provided with a placing groove, the adsorption assembly comprises a coil, the coil is accommodated in the placing groove and used to electrostatically adsorb the wafer through the bearing table surface.
7. An etching apparatus, characterized by, The device comprises a reaction chamber and the etching device as claimed in any one of claims 1-6, and the base is arranged on the bottom wall of the reaction chamber.