Packaging tube shell of semiconductor laser
By employing an adjustable ventilation structure and a breathable membrane in the semiconductor laser package, the problems of insufficient heat dissipation and sealing are solved, resulting in better heat dissipation performance and packaging stability, and extending the lifespan of the laser.
Patent Information
- Application Number
- CN202422663392.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-01
- Publication Date
- 2025-12-05
- Estimated Expiration
- 2034-11-01
AI Technical Summary
Existing semiconductor laser packaging shells are inadequate in terms of heat dissipation, sealing, and mechanical strength, which may lead to problems such as overheating, moisture damage, or stress damage after prolonged operation, affecting their working efficiency and lifespan.
The encapsulated casing with an adjustable ventilation structure controls ventilation and sealing by adjusting the position of the spacer baffles. Combined with a breathable membrane and heat dissipation fins, it achieves good heat dissipation and prevents dust and water vapor from entering.
It improves the heat dissipation and lifespan of semiconductor lasers, while maintaining the sealing of the package to prevent the ingress of external substances and enhancing the mechanical strength of the package.
Smart Images
Figure CN223638784U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of semiconductor laser package, specifically is a kind of semiconductor laser's package tube shell. BACKGROUND
[0002] As an important component of modern optoelectronic devices, the performance and life of semiconductor laser largely depend on the design and quality of the package shell. During production, the semiconductor chip needs to be packaged and connected with the tube shell body, so that the position of the semiconductor chip in the tube shell body is fixed, and the semiconductor chip is protected to prevent the precise semiconductor chip from being damaged during transportation and work.
[0003] The existing semiconductor laser package shell has deficiencies in heat dissipation performance, sealing and mechanical strength, which can cause overheating, moisture or stress damage of the laser after long-term work, thereby affecting its working efficiency and life. Therefore, we need to propose a semiconductor laser package tube shell. SUMMARY
[0004] The utility model aims at providing a kind of semiconductor laser's package tube shell, adopt adjustable ventilation structure, the vent area of semiconductor laser package shell body is adjusted, to improve the heat dissipation effect of semiconductor laser chip, dust and water vapor can be prevented from entering at the same time, improve the service life of semiconductor laser chip, to solve the problems raised in the above background.
[0005] To achieve the above purpose, the utility model provides the following technical scheme: a kind of semiconductor laser's package tube shell, including shell, the top of the shell is fixedly connected with cover, the upper surface of the cover is equipped with air passage, the bottom of the air passage is equipped with multiple groups of connecting grooves communicated with shell inner cavity, the air passage inner cavity is slidably provided with interval baffle, the upper surface of the interval baffle is equipped with rectangular groove communicated with multiple groups of connecting grooves, and the air-permeable film is arranged in each rectangular groove, and the upper surface of the interval baffle is fixedly connected with sliding button at one end.
[0006] Preferably, the shell is provided with a plurality of heat dissipation fins on one side, and the plurality of heat dissipation fins are arranged at equal intervals and in parallel, and a plurality of pins are arranged through the side adjacent to the plurality of heat dissipation fins.
[0007] Preferably, the shell and the plurality of heat dissipation fins are fixedly connected with mounting plates at the lower ends of the two sides adjacent to the plurality of heat dissipation fins, and the upper surface of the mounting plate is provided with two groups of mounting holes.
[0008] Preferably, the air-permeable groove is provided with limiting grooves on both sides, and the spacer baffle is fixedly connected with limiting strips slidingly arranged in the limiting grooves.
[0009] Preferably, the air-permeable groove is further provided with clamping blocks on both sides, and the spacer baffle is provided with clamping grooves for clamping the clamping blocks, and the clamping grooves are provided with protrusions in an interference fit with the clamping blocks.
[0010] Preferably, the length of the air-permeable groove is greater than the length of the spacer baffle, and a plurality of the connecting grooves are arranged at equal intervals.
[0011] Compared with the prior art, the air-permeable groove is provided with limiting grooves on both sides, and the spacer baffle is fixedly connected with limiting strips slidingly arranged in the limiting grooves.
[0012] The utility model discloses a cover, air-permeable groove, spacer baffle, air-permeable membrane and radiating fin cooperate, through the sliding button, the position of the spacer baffle is adjusted conveniently, thereby the rectangular groove is communicated with the connecting groove conveniently, and good ventilation and heat dissipation are carried out conveniently, and under the action of the air-permeable membrane, the dust outside can be prevented from entering the shell, and under the cooperation of the plurality of radiating fins, the good heat dissipation effect of the semiconductor laser in the shell after packaging is achieved. BRIEF DESCRIPTION OF DRAWINGS
[0013] Fig. 1 It is the whole structure schematic diagram of the utility model;
[0014] Fig. 2 It is the cover structure schematic diagram of the utility model;
[0015] Fig. 3 It is the spacer baffle structure schematic diagram of the utility model.
[0016] In the drawing: 1, shell;2, cover;3, air-permeable groove;31, limiting groove;32, connecting groove;33, clamping block;4, radiating fin;5, sliding button;6, spacer baffle;61, rectangular groove;62, limiting strip;63, clamping groove;64, protrusion;7, mounting plate;8, pin;9, mounting hole;10, air-permeable membrane. DETAILED DESCRIPTION
[0017] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the utility model.
[0018] Please refer to Figs. 1-3The utility model provides a technical scheme: a kind of packaging tube shell of semiconductor laser, including shell 1, the top of shell 1 is fixedly connected with cover 2, the upper surface of cover 2 is equipped with breathable slot 3, breathable slot 3 bottom is equipped with multiple groups of connecting grooves 32 being communicated with the inner cavity of shell 1, slidingly set with interval baffle 6 in the inner cavity of breathable slot 3, the upper surface of interval baffle 6 is equipped with rectangular groove 61 being communicated with multiple groups of connecting grooves 32, and breathable film 10 is arranged in each rectangular groove 61, and one end of the upper surface of interval baffle 6 is fixedly connected with sliding button 5.
[0019] The side of shell 1 is provided with multiple groups of heat dissipation fins 4, and the multiple groups of heat dissipation fins 4 are arranged at equal intervals and are arranged in parallel.
[0020] The side of shell 1 adjacent to the multiple groups of heat dissipation fins 4 is provided with multiple groups of pins 8 in a penetrating manner, and the heat dissipation fins 4 are made of high-thermal-conductivity material.
[0021] The lower ends of the two sides of shell 1 adjacent to the multiple groups of heat dissipation fins 4 are fixedly connected with mounting plates 7, and the upper surface of each mounting plate 7 is provided with two groups of mounting holes 9.
[0022] The other two sides of the inner cavity of breathable slot 3 are fixedly connected with clamping blocks 33, and the other two sides of interval baffle 6 are provided with clamping grooves 63 for inserting the clamping blocks 33.
[0023] The length of breathable slot 3 is greater than the length of interval baffle 6, and the multiple groups of connecting grooves 32 are arranged at equal intervals, so that interval baffle 6 can move in breathable slot 3, and the overlapping area of connecting grooves 32 and rectangular grooves 61 can be adjusted conveniently.
[0024] In use, the position of the interval baffle 6 is moved by sliding the button 5, the interval baffle 6 is slid along the air-permeable groove 3, the rectangular groove 61 on the interval baffle 6 is communicated with the connecting groove 32, the range of communication is adjusted to ventilate and dissipate heat in the shell 1, dust and water vapor from the outside are prevented from entering the shell 1 through the air-permeable film 10 when ventilating, the interval baffle 6 is reset when it is inconvenient to ventilate and dissipate heat, the sealing effect of the shell 1 is ensured, the shell 1 is cooled by the multiple sets of cooling fins 4, the cooling effect of the shell 1 is improved, and the cooling effect of the semiconductor laser is further improved.
[0025] Although the embodiments of the present application have been shown and described, it should be understood by those ordinary skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present application, and the scope of the present application is defined by the appended claims and their equivalents.
Claims
1. A package for a semiconductor laser, comprising a housing (1), characterized in that: The top of the shell (1) is fixedly connected with a cover (2), the upper surface of the cover (2) is provided with a ventilation groove (3), the bottom of the ventilation groove (3) is provided with a plurality of groups of connecting grooves (32) in communication with the inner cavity of the shell (1), the inner cavity of the ventilation groove (3) is slidably provided with a spacing baffle (6), the upper surface of the spacing baffle (6) is provided with a rectangular groove (61) in communication with the plurality of groups of connecting grooves (32), the rectangular groove (61) is provided with a ventilation film (10), and one end of the upper surface of the spacing baffle (6) is fixedly connected with a sliding button (5).
2. A package for a semiconductor laser as defined in claim 1, wherein: A plurality of groups of heat dissipation fins (4) are arranged on one side of the shell (1), the plurality of groups of heat dissipation fins (4) are arranged at equal intervals, and the plurality of groups of heat dissipation fins (4) are arranged in parallel, a plurality of groups of pins (8) are arranged through the side of the shell (1) adjacent to the plurality of groups of heat dissipation fins (4).
3. A package for a semiconductor laser as defined in claim 2, wherein: The lower end of the side of the shell (1) adjacent to the plurality of groups of heat dissipation fins (4) is fixedly connected with a mounting plate (7), and the upper surface of the mounting plate (7) is provided with two groups of mounting holes (9).
4. The packaging housing of a semiconductor laser according to claim 1, characterized in that: The two sides of the inner cavity of the ventilation groove (3) are provided with limiting grooves (31), and the lower end of the two sides of the spacing baffle (6) is fixedly connected with a limiting strip (62) slidably arranged in the limiting groove (31).
5. A package for a semiconductor laser as defined in claim 4, wherein: The other two sides of the inner cavity of the ventilation groove (3) are fixedly connected with clamping blocks (33), the other two sides of the spacing baffle (6) are provided with clamping grooves (63) for inserting the clamping blocks (33), and the two sides of the inner cavity of the clamping groove (63) are provided with protrusions (64) in interference fit with the clamping blocks (33).
6. The package of a semiconductor laser according to claim 1, wherein: The length of the ventilation groove (3) is greater than the length of the spacing baffle (6), and the plurality of groups of connecting grooves (32) are arranged at equal intervals.