COB substrate and LED

Abstract

The utility model discloses a COB (Chip On Board) substrate and an LED (Light Emitting Diode), and relates to the field of light emitting devices, a substrate layer comprises an upper substrate and a lower substrate which are stacked up and down, the upper substrate is provided with at least one through hole in the bottom surface area of a bowl cup, and the lower end of the through hole leads to the upper surface of the lower substrate to form a concave lamp position for placing at least one LED chip. The upper substrate and the lower substrate are preferably made of mirror surface aluminum plates. Therefore, the position of the LED chip is lower than that of a traditional mirror surface aluminum COB substrate, a lower box dam (namely a white ring) and less fluorescent glue can be used under the condition that the gold wire is not exposed, and the thickness of the COB substrate is thinner, so that the temperature of the glue surface is reduced, and the heat dissipation is better. Moreover, heat generated by the LED chips and the fluorescent powder can be dissipated from the bottom through the lower substrate and can also be dissipated from the lower substrate in the horizontal direction, the heat dissipation ways are further increased, and the heat dissipation effect and the light reflection effect are good.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of light emitting device, concretely to a COB substrate and LED. BACKGROUND

[0002] With the wide application of LED in the application market, the application environment is more complex, rigorous and changeable, and the requirement for the light source is also higher and higher, needing higher brightness, higher power density, higher light efficiency, better heat dissipation, better light color, better voltage resistance and the like. The structure of the present stage LED light source product has basically been fixed, whether it is SMD or COB product, the changeable space in structure and use material is gradually reduced, and the improvement in the aspect of fluorescent powder and wafer is mainly focused on. The improvement speed in the aspect of support or substrate has gradually slowed down, and the improvement proportion in the aspect of heat dissipation capacity and light color is very low. The patent mainly carries out composite design to the COB substrate, and improves the heat dissipation capacity of the light source. SUMMARY

[0003] The utility model discloses a COB substrate and LED, which aims to overcome the above-mentioned problems existing in the prior art.

[0004] To achieve the above-mentioned purpose, the utility model provides the following technical scheme:

[0005] A COB substrate sequentially comprises a substrate layer and a bonding layer from bottom to top, the bonding layer is composed of a heat-conducting insulating layer and a circuit layer on the heat-conducting insulating layer, a hollow part is arranged in the middle of the bonding layer, the lower end of the hollow part leads to the substrate layer, forming a bowl cup with the substrate layer as the bottom surface, the substrate layer comprises an upper substrate and a lower substrate stacked up and down, at least one through hole is arranged in the bottom surface area of the bowl cup, the lower end of the through hole leads to the upper surface of the lower substrate, forming a concave lamp site for placing at least one LED chip.

[0006] Further, the thickness of the upper substrate is 0.25mm to 0.35mm.

[0007] Further, the side wall of the through hole is spaced apart from the LED chip placed therein, and the projection area of the through hole is less than 2 times the total projection area of the LED chip placed therein.

[0008] Further, the side wall of the through hole is spaced apart from the LED chip placed therein by more than 0.20mm.

[0009] Further, the side wall of the through hole is inclined outward from bottom to top.

[0010] Further, the lower substrate and the upper substrate are mirror aluminum plates or ceramic plates.

[0011] Further, the lower substrate and the upper substrate are both mirror surface aluminum plates.

[0012] An LED, comprising the COB substrate as described in any one of the above, at least one LED chip is placed in each concave lamp position, and the bowl cup is filled with a fluorescent glue layer.

[0013] Compared with the prior art, the LED has the advantages that:

[0014] Firstly, the substrate layer comprises an upper substrate and a lower substrate stacked one above the other, the upper substrate is provided with at least one through hole in the bottom surface area of the bowl cup, the lower end of the through hole leads to the upper surface of the lower substrate, and the through hole forms a concave lamp position for placing at least one LED chip.

[0015] Secondly, the lower substrate and the upper substrate are both mirror surface aluminum plates, the reflection area of light is large, and the reflectivity is high, so that the brightness of the LED product is improved. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 Fig. 4 is a plan view of the COB substrate in the utility model.

[0017] Figure 2 Fig. 5 is a plan view of the upper substrate in the utility model.

[0018] Figure 3 Fig. 6 is a sectional view of the COB substrate along direction A-A in the utility model. Figure 1

[0019] Fig. 7 is a plan view of the LED in the utility model. Figure 4

[0020] Fig. 8 is a sectional view of the LED along direction B-B in the utility model. Figure 5 Figure 4 DETAILED DESCRIPTION

[0021] The specific implementation manner of the utility model will be described below with reference to the drawings. In order to comprehensively understand the utility model, many details are described below, but the utility model can be implemented without these details for those skilled in the art.

[0022] As Figures 1 to 3 ​​As shown in FIG. 1, a COB substrate sequentially comprises a substrate layer and a bonding layer 3 from bottom to top. A hollow part 31 is arranged in the middle of the bonding layer 3, and the lower end of the hollow part 31 is connected to the substrate layer, forming a bowl cup with the substrate layer as the bottom. The bonding layer 3 is composed of a heat-conducting insulating layer and a circuit layer on the heat-conducting insulating layer, which belongs to the conventional structure of the existing COB substrate, and thus the specific structure is not described here.

[0023] As shown in FIG. 2, the substrate layer is composed of an upper substrate 2 and a lower substrate 1 stacked from top to bottom. Figures 1 to 3 As shown in FIG. 3, the upper substrate 2 and the lower substrate 1 are adhered by using the existing pure glue, and the thickness is controlled at about 0.7 mm. The upper substrate 2 and the lower substrate 1 can be mirror aluminum plates or ceramic plates.

[0024] As shown in FIG. 4, preferably, the upper substrate 2 and the lower substrate 1 are both mirror aluminum plates. Of course, the upper substrate 2 and the lower substrate 1 can also be both ceramic plates, or one of the upper substrate 2 and the lower substrate 1 is a mirror aluminum plate and the other is a ceramic plate. Figures 1 to 3 As shown in FIG. 5, preferably, the side wall of the through hole 21 is inclined outward from bottom to top, which can prevent the side wall of the through hole 21 from blocking light and facilitate the placement of LED chips. In addition, the number of through holes 21 includes but is not limited to twenty-four, which can be increased or decreased as needed. The cross-sectional profile of the through hole 21 can be circular, rectangular, etc., which is not limited here.

[0025] Figures 1 to 3 As shown in FIG. 6, the thickness of the lower substrate 1 is 0.25 mm to 0.35 mm, and preferably the thickness of the lower substrate 1 is 0.30 mm.

[0026] As shown in FIG. 7, the thickness of the upper substrate 2 is 0.25 mm to 0.35 mm, and preferably the thickness of the upper substrate 2 is 0.30 mm. An excessively thick upper substrate 2 is not conducive to the processing and forming of the through hole 21 (such as punching), and will also increase the production cost. An excessively thin upper substrate 2 is insufficient in strength and is prone to deformation. Figures 1 to 3 As shown in FIG. 8, the thickness of the lower substrate 1 is 0.25 mm to 0.35 mm, and preferably the thickness of the lower substrate 1 is 0.30 mm.

[0027] Figures 1 to 3 As shown in FIG. 9, the thickness of the upper substrate 2 is 0.25 mm to 0.35 mm, and preferably the thickness of the upper substrate 2 is 0.30 mm. An excessively thick upper substrate 2 is not conducive to the processing and forming of the through hole 21 (such as punching), and will also increase the production cost. An excessively thin upper substrate 2 is insufficient in strength and is prone to deformation.

[0028] As shown in FIG. 10, the thickness of the lower substrate 1 is 0.25 mm to 0.35 mm, and preferably the thickness of the lower substrate 1 is 0.30 mm. Figures 1 to 3 As shown in FIG. 11, the thickness of the upper substrate 2 is 0.25 mm to 0.35 mm, and preferably the thickness of the upper substrate 2 is 0.30 mm. An excessively thick upper substrate 2 is not conducive to the processing and forming of the through hole 21 (such as punching), and will also increase the production cost. An excessively thin upper substrate 2 is insufficient in strength and is prone to deformation.

[0029] Figures 1 to 3 ​​​As shown, the side wall of the through hole 21 is spaced apart from the LED chip placed therein, and the spacing is preferably greater than 0.20 mm, especially 0.25 mm; avoiding too small spacing, the LED chip collides with the upper substrate 2 or the light is blocked; avoiding too large spacing, resulting in too long wire, heat dissipation effect is reduced. In addition, the spacing between the through holes 21 is also not too large, too large will also result in too long wire.

[0030] As shown in the drawings, the COB substrate comprises an upper substrate 2, a bonding layer 3 and a plurality of through holes 21, wherein the bonding layer 3 is arranged on the upper surface of the upper substrate 2, and the through holes 21 are arranged in the bonding layer 3. Figures 1 to 5 As shown, an LED comprises a plurality of LED chips 5 and a COB substrate as described above. Wherein the inside of each concave lamp site includes but is not limited to placing one LED chip 5, and the inside of the bowl cup is filled with a fluorescent glue layer. In addition, the LED chips 5 are electrically connected by bonding wires 6, and the upper surface of the bonding layer 3 is annularly arranged around the edge of the hollow part, and the dam 4 is filled with the fluorescent glue layer as part of the bowl cup.

[0031] As shown in the drawings, the COB substrate comprises an upper substrate 2, a bonding layer 3 and a plurality of through holes 21, wherein the bonding layer 3 is arranged on the upper surface of the upper substrate 2, and the through holes 21 are arranged in the bonding layer 3. Figures 1 to 5 As shown in the drawings, in an embodiment, the fluorescent glue layer comprises a first fluorescent glue layer 7 and a second fluorescent glue layer 8, at least one concave lamp site is filled with the first fluorescent glue layer 7, and the LED chip 5 placed therein is covered by the first fluorescent glue layer 7; the bowl cup and the remaining concave lamp sites are filled with the second fluorescent glue layer 8, and the first fluorescent glue layer 7 is covered by the second fluorescent glue layer 8. In other words, only part of the concave lamp sites can be filled with the first fluorescent glue layer 7, and the other part of the concave lamp sites can be filled with the second fluorescent glue layer 8. Of course, all the concave lamp sites can be filled with the first fluorescent glue layer 7.

[0032] As a preferred, the first fluorescent glue layer 7 is a warm white existing fluorescent glue, and the second fluorescent glue layer 8 is a cold white existing fluorescent glue.

[0033] The above is only a specific embodiment of the present application, but the design concept of the present application is not limited thereto, and any non-essential modification of the present application using this concept shall be deemed as an infringement of the protection scope of the present application.

Claims

1. A COB substrate sequentially comprising a substrate layer and a bonding layer from bottom to top, the bonding layer being composed of a thermally conductive insulating layer and a circuit layer on the thermally conductive insulating layer, a hollow part being provided in the middle of the bonding layer, the lower end of the hollow part opening to the substrate layer to form a bowl cup with the substrate layer as the bottom surface, characterized in that: The substrate layer comprises an upper substrate and a lower substrate stacked one above the other, the upper substrate is provided with at least one through hole in the bottom surface area of the bowl cup, the lower end of the through hole opens to the upper surface of the lower substrate, forming a concave lamp site for placing at least one LED chip.

2. The COB substrate of claim 1, wherein: The thickness of the upper substrate is 0.25mm to 0.35mm.

3. The COB substrate of claim 1, wherein: The side wall of the through hole is spaced apart from the LED chip placed therein.

4. The COB substrate of claim 3, wherein: The side wall of the through hole is spaced apart from the LED chip placed therein by more than 0.20mm.

5. The COB substrate of claim 1, wherein: The side wall of the through hole is outwardly inclined from bottom to top.

6. The COB substrate of claim 1, wherein: The lower substrate and the upper substrate are mirror aluminum plates or ceramic plates.

7. The COB substrate of claim 1, wherein: The lower substrate and the upper substrate are mirror aluminum plates.

8. An LED, characterized by: A COB substrate comprising a structure as claimed in any one of claims 1 to 7. A COB substrate comprising a structure as claimed in any one of claims 1 to 7.

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