Circuit board glue spraying device

Abstract

The utility model belongs to the technical field of circuit board processing, and particularly discloses a circuit board glue spraying device which comprises a rack, and a glue spraying mechanism used for spraying glue to a circuit board is arranged on the rack. The conveying mechanism is arranged in the rack, the conveying mechanism comprises chain tracks which are oppositely arranged, the chain tracks are used for conveying circuit boards, and an adjusting mechanism used for adjusting the distance between the chain tracks is arranged on the conveying mechanism; and the cooling mechanism is arranged between the chain tracks. According to the utility model, the cooling mechanism is arranged on the conveying mechanism, so that redundant three-proofing glue can be cooled under the condition that smooth glue spraying of a circuit board is guaranteed, damage easily caused by the fact that the interior of a machine body is in contact with high-temperature glue for a long time can be effectively avoided, and meanwhile, corresponding recycling treatment is carried out after cooling, so that the production efficiency is improved. The interior of the machine body can be kept clean, and environmental pollution is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to circuit board processing technical field especially relates to a circuit board glue spraying device. BACKGROUND

[0002] Circuit board is an indispensable component in electronic equipment, used to support and connect electronic components, realize the connection of circuit and the transmission of signal. It is usually composed of non-conductive bottom material (such as glass fiber reinforced epoxy resin) and conductive copper layer. Circuit board can be classified according to different characteristics and application scenarios, mainly including single-sided board, double-sided board, multilayer board, rigid circuit board, flexible circuit board, etc.

[0003] In the processing process of circuit board, three-proofing glue will be sprayed on the circuit board to meet the corresponding process requirements. In the prior art, three-proofing glue is sprayed out by the glue spraying mechanism through high temperature and high pressure. In the case of large-area spraying, the glue spraying mechanism will spray for a long time, and the excess three-proofing glue will contact the inside of the rack. After a long time of accumulation, the high-temperature three-proofing glue will cause damage to the inside of the machine body. In view of the above, the applicant proposes a circuit board glue spraying device. SUMMARY

[0004] In view of the above-mentioned shortcomings of the prior art, the purpose of the utility model is to provide a circuit board glue spraying device to solve the problem that high-temperature three-proofing glue contacts the inside of the machine body and easily causes damage to the machine body.

[0005] To achieve the above-mentioned purpose and other related purposes, the utility model provides a circuit board glue spraying device, which comprises: a rack, a glue spraying mechanism for spraying glue on the circuit board is arranged on the rack;

[0006] A conveying mechanism is arranged in the rack, the conveying mechanism comprises oppositely arranged chain tracks, the chain tracks are used for conveying the circuit board, and an adjusting mechanism for adjusting the distance between the chain tracks is arranged on the conveying mechanism;

[0007] A cooling mechanism is arranged between the chain tracks.

[0008] Optionally, a support plate is further arranged in the rack, a base is arranged on the support plate, the conveying mechanism further comprises a driving mechanism, oppositely arranged first and second mounting plates, the chain tracks are arranged on the side where the first and second mounting plates are close to each other, and the driving mechanism is arranged on the first and second mounting plates and used for driving the chain tracks to move back and forth.

[0009] Optionally, the cooling mechanism comprises a fixing plate and a heat dissipation plate, the fixing plate is arranged on the base, and the heat dissipation plate is arranged between the first mounting plate and the second mounting plate along the length direction of the fixing plate.

[0010] Optionally, the adjusting mechanism comprises an adjusting wheel, an adjusting rod and an adjusting seat, the first mounting plate is arranged on the base, the second mounting plate is arranged on the adjusting seat, the adjusting wheel is arranged on the base, one end of the adjusting rod is connected with the adjusting wheel, and the other end is rotatably connected with the base, a nut seat is arranged on the adjusting rod, the nut seat is arranged on the adjusting seat, and when the adjusting wheel rotates, the adjusting seat drives the second mounting plate to move close to or away from the first mounting plate.

[0011] Optionally, the adjusting seat is provided with a connecting block, and the second mounting plate is fixedly connected with the connecting block.

[0012] Optionally, the support plate is provided with a flow distribution plate, a plurality of flow distribution holes are arranged on the flow distribution plate, a collecting groove is arranged on the side of the support plate away from the flow distribution plate, a containing cavity is arranged in the collecting groove, a recovery port is arranged on the collecting groove, and a recovery pipe is arranged on the rack, and an input end of the recovery pipe is connected with the recovery port.

[0013] Optionally, the glue spraying mechanism comprises a moving assembly and a glue spraying assembly, the moving assembly is used for driving the glue spraying assembly to move in the X-axis and Y-axis directions, and the glue spraying assembly is used for spraying glue on the circuit board.

[0014] Optionally, the first mounting plate and the second mounting plate are further provided with a limiting mechanism, the limiting mechanism comprises a limiting cylinder and a limiting block arranged at the extending end of the limiting cylinder, and the limiting cylinder is used for driving the limiting block to move in the vertical direction.

[0015] As described above, the circuit board glue spraying device has the following beneficial effects:

[0016] Compared with the prior art, the cooling mechanism is arranged on the conveying mechanism, the excess three-proof glue can be cooled in the case that the circuit board is successfully sprayed with glue, damage of the machine body caused by long-time contact with high-temperature glue can be effectively avoided, the corresponding recovery treatment is performed after cooling, the machine body interior is kept clean, and environmental pollution is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 A structure schematic view of an embodiment of the utility model is shown;

[0018] Figure 2 A structure schematic view of a conveying mechanism in an embodiment of the utility model is shown.

[0019] Figure 3 Figure 6 shows a structural schematic view of the rear part of the conveying mechanism in an embodiment of the present application;

[0020] Figure 4 Figure 7 shows a sectional view of the conveying mechanism in an embodiment of the present application;

[0021] Figure 5 Figure 8 shows a structural schematic view of the collecting groove in an embodiment of the present application.

[0022] Legend of reference signs:

[0023] Rack 1, support plate 2, base 3, first mounting plate 4, second mounting plate 5, chain track 6, adjusting wheel 7, driven wheel 8, belt 9, adjusting rod 10, nut seat 11, adjusting seat 12, connecting block 13, cooling plate 14, limiting air cylinder 15, limiting block 16, flow dividing plate 17, flow dividing hole 1701, collecting groove 18, accommodating cavity 1801, recycling opening 19, recycling pipe 20, fixing plate 21, moving assembly 22, glue spraying assembly 23. DETAILED DESCRIPTION

[0024] The above embodiments are only used to illustrate the present application and to convey a further understanding of the present application. Other advantages of the present application can be apparent to those skilled in the art from the above description. The present application can be implemented or used in other different embodiments and each detail in the description can be modified or changed based on different views and applications without departing from the spirit of the present application.

[0025] It should be noted that the drawings provided in the embodiments only schematically illustrate the basic concept of the present application, and thus the drawings only show the components related to the present application, rather than being drawn according to the number, shape and size of the components in actual implementation. The shape, number and proportion of each component in actual implementation can be randomly changed, and the layout pattern of the components can be more complex. The structure, proportion and size shown in the drawings of the present application are only used to understand and read the content disclosed in the description by those skilled in the art, and do not limit the conditions under which the present application can be implemented, and thus do not have technical significance. Any modification of the structure, change of the proportion relationship or adjustment of the size, without affecting the effects and purposes that can be achieved by the present application, should still fall within the scope of the technical content disclosed in the present application. Meanwhile, the terms such as "upper", "lower", "left", "right", "middle" and "one" in the description are only used for the convenience of understanding and are not used to limit the scope of the present application. The change or adjustment of the relative relationship, without substantially changing the technical content, is also considered as the scope of the present application.

[0026] As Figures 1-5 shown, the utility model provides a circuit board glue spraying device.

[0027] In an exemplary embodiment, the circuit board glue spraying device comprises:

[0028] The rack 1 is provided with a glue spraying mechanism for spraying glue on the circuit board.

[0029] The conveying mechanism is arranged in the rack 1, and the conveying mechanism comprises oppositely arranged chain tracks 6 for conveying the circuit board.

[0030] The cooling mechanism is arranged between the chain tracks 6.

[0031] In the embodiment, the cooling mechanism arranged on the conveying mechanism can cool the excess three-proofing glue while ensuring the smooth spraying of the circuit board, effectively avoiding the damage of the machine body caused by long-time contact with high-temperature glue, and facilitating the recycling of the cooled glue, thereby keeping the machine body clean and reducing environmental pollution.

[0032] In an exemplary embodiment, the rack 1 is further provided with a support plate 2, the support plate 2 is provided with a base 3, the conveying mechanism further comprises a driving mechanism, oppositely arranged first and second mounting plates 4 and 5, the chain tracks 6 are arranged on the side close to each other of the first and second mounting plates 4 and 5, and the driving mechanism is arranged on the first and second mounting plates 4 and 5 and used to drive the chain tracks 6 to reciprocate.

[0033] In the embodiment, the base 3 is arranged to fix the first and second mounting plates 4 and 5, and the base 3 is fixed on the support plate 2 by fasteners to ensure the stable transmission of the chain tracks 6.

[0034] In an exemplary embodiment, the driving mechanism of the embodiment drives each chain track 6 individually, and the driving mechanism adopts a driving motor and a driving wheel, the driving wheel adopts a sprocket, the driving motor is started to drive the sprocket to rotate, the sprocket cooperates with the chain to finally drive the chain to reciprocate. To improve the stability of the chain, the driving mechanism can be provided with multiple driving mechanisms on one mounting plate, and a tension gear for tensioning can also be provided to improve the stability of the chain.

[0035] Exemplarily, the cooling mechanism comprises a fixed plate 21 arranged on the base 3 and heat dissipation plates arranged between the first mounting plate 4 and the second mounting plate 5 along the length direction of the fixed plate 21. The fixed plate 21 in the embodiment is mainly used for supporting the heat dissipation plates to guarantee the stability of the heat dissipation plates. Meanwhile, adjacent heat dissipation plates have horizontal and vertical grooves in the case of being attached, which can guide the waterproof adhesive scattered thereon

[0036] Exemplarily, the adjusting mechanism comprises an adjusting wheel 7, an adjusting rod 10 and an adjusting seat 12. The first mounting plate 4 is arranged on the base 3, the second mounting plate 5 is arranged on the adjusting seat 12, the adjusting wheel 7 is arranged on the base 3, one end of the adjusting rod 10 is connected with the adjusting wheel 7, the other end is rotatably connected with the base 3, the adjusting rod 10 is provided with a nut seat 11, the nut seat 11 is arranged on the adjusting seat 12, and when the adjusting wheel 7 rotates, the adjusting seat 12 drives the second mounting plate 5 to move close to or away from the first mounting plate 4. In the embodiment, the adjusting rod 10 is a screw rod, which is threadedly connected with the nut seat 11, so that the adjusting seat 12 can move when the screw rod rotates.

[0037] When it is needed to increase the distance between the first mounting plate 4 and the second mounting plate 5 according to different widths of the circuit board, the adjusting wheel 7 is rotated clockwise, the nut seat 11 drives the adjusting seat 12 to move away from the first mounting plate 4, the second mounting plate 5 fixed on the adjusting seat 12 synchronously moves away from the first mounting plate 4, and correspondingly, the number of heat dissipation plates needs to be increased according to the distance between the first mounting plate 4 and the second mounting plate 5 to guarantee that there is no gap between the heat dissipation plates. The second mounting plate 5 can make all the heat dissipation plates attach to each other by counterclockwise rotation of the adjusting wheel 7, so as to better guide the waterproof adhesive.

[0038] When it is needed to decrease the distance between the first mounting plate 4 and the second mounting plate 5 according to different widths of the circuit board, the adjusting wheel 7 is rotated counterclockwise, the nut seat 11 drives the adjusting seat 12 to move close to the first mounting plate 4, the second mounting plate 5 fixed on the adjusting seat 12 synchronously moves close to the first mounting plate 4, and correspondingly, the number of heat dissipation plates needs to be decreased according to the distance between the first mounting plate 4 and the second mounting plate 5 to guarantee that there is no gap between the heat dissipation plates. The second mounting plate 5 can make all the heat dissipation plates attach to each other by counterclockwise rotation of the adjusting wheel 7, so as to better guide the waterproof adhesive.

[0039] Exemplarily, the adjusting seat 12 is provided with a connecting block 13, and the second mounting plate 5 is fixedly connected with the connecting block 13. In the embodiment, the connecting block 13 can stably connect the second mounting plate 5 with the adjusting seat 12.

[0040] It is worth noting that in the embodiment, the adjusting wheel 7 can be driven to rotate by a handle, and the handle is arranged outside the rack 1, which is convenient for manual operation.

[0041] It should be noted that, as shown in Figure 2 In this embodiment, since the number of cooling mechanisms is two, a driven wheel 8 is arranged on the other cooling mechanism, a belt 9 is arranged between the adjusting wheel 7 and the driven wheel 8, and when the adjusting wheel 7 rotates, the driven wheel 8 can be synchronously driven to rotate, thereby achieving the corresponding function. In order to improve the power, the number of adjusting rods 10 can be increased, and all the adjusting rods 10 can be synchronously driven to rotate through the belt 9.

[0042] The support plate 2 is provided with a flow distribution plate 17, the flow distribution plate 17 is provided with a plurality of flow distribution holes 1701 distributed uniformly, and the side of the support plate 2 away from the flow distribution plate 17 is provided with a collecting groove 18, the collecting groove 18 is provided with a containing cavity 1801, and the collecting groove 18 is provided with a recovery port 19. The rack 1 is provided with a recovery pipe 20, and the input end of the recovery pipe 20 is connected with the recovery port 19.

[0043] In this embodiment, the flow distribution plate 17 and the flow distribution holes 1701 can distribute the three-proofing glue scattered on the upper surface, so that the three-proofing glue falls uniformly into the containing cavity 1801 of the collecting groove 18, and damage to the collecting groove 18 caused by the three-proofing glue falling to the same place for a long time is avoided. After entering the containing cavity 1801, the three-proofing glue in the containing cavity 1801 is recovered by the air pump connected with the recovery pipe 20, environmental pollution is avoided, the environment inside the machine body is protected, and the service life of the machine body is improved.

[0044] In this embodiment, the position of the heat dissipation plate is above the flow distribution plate 17, so that the three-proofing glue guided by the heat dissipation plate can enter the containing cavity 1801 as much as possible.

[0045] In an example embodiment, the glue spraying mechanism includes a moving assembly 22 and a glue spraying assembly 23, the moving assembly 22 can be used to drive the glue spraying assembly 23 to move in the X-axis and Y-axis directions, and the glue spraying assembly 23 is used to spray glue on the circuit board.

[0046] In this embodiment, the moving assembly 22 uses a pneumatic cylinder or a hydraulic cylinder to move the glue spraying assembly 23 in the X-axis and Y-axis directions, and the glue spraying assembly 23 is provided with a part that can move in the Y-axis direction and is also controlled by a pneumatic cylinder. The glue spraying assembly 23 and the moving assembly 22 are prior art, and will not be described here.

[0047] In an example embodiment, the first mounting plate 4 and the second mounting plate 5 are further provided with a limiting mechanism, the limiting mechanism includes a limiting pneumatic cylinder 15 and a limiting block 16 arranged at the extending end of the limiting pneumatic cylinder 15, and the limiting pneumatic cylinder 15 can be used to drive the limiting block 16 to move in the vertical direction. When the circuit board enters, the limiting pneumatic cylinder 15 is elongated, and the limiting block 16 limits the circuit board, and after the glue spraying is completed, the limiting block 16 is reset, and the circuit board moves to the next station with the chain rail 6.

[0048] Specific implementation steps: first, the circuit board enters the chain track 6 through the inlet on the rack 1, the chain track 6 moves to transmit the circuit board, the limiting block 16 limits the circuit board, after detecting that the circuit board is in place, the glue spraying mechanism sprays the circuit board; second, in the process of spraying glue, the excess three-proof glue falls on the heat sink or directly drops on the shunt plate 17, and finally enters the accommodating cavity 1801 in the collecting groove 18 through the shunt hole 1701, and the three-proof glue in the accommodating cavity 1801 can be recycled and treated by opening the recovery pipe 20.

[0049] In summary, the utility model discloses a cooling mechanism is arranged on the conveying mechanism, can cool the excess three-proof glue under the condition that guaranteeing circuit board to spray glue smoothly, can effectively avoid the damage that the inside of fuselage is easily produced in long -time contact to high -temperature colloid, simultaneously carries out corresponding recovery processing after cooling, be favorable to keep the inside of fuselage clean, has reduced environmental pollution.

[0050] The above embodiment only illustrates the principle and effect of the utility model, and is not used to limit the utility model. Any person skilled in the art can modify or change the above embodiment without departing from the spirit and scope of the utility model. Therefore, all equivalent modifications or changes completed by those skilled in the art without departing from the spirit and technical thought disclosed by the utility model should be covered by the claims of the utility model.

Claims

1. A circuit board glue spraying device characterized by comprising: The utility model relates to a circuit board spraying and cooling device, which comprises a rack, a spraying mechanism for spraying glue on a circuit board arranged on the rack, a conveying mechanism arranged in the rack, the conveying mechanism comprising oppositely arranged chain tracks for conveying the circuit board, and an adjusting mechanism arranged on the conveying mechanism for adjusting the distance between the chain tracks, and a cooling mechanism arranged between the chain tracks. The rack further comprises a support plate, a base arranged on the support plate, a driving mechanism, oppositely arranged first and second mounting plates, the chain tracks being arranged on the side of the first and second mounting plates that are close to each other, and the driving mechanism being arranged on the first and second mounting plates for driving the chain tracks to move back and forth. The cooling mechanism comprises a fixing plate arranged on the base and heat dissipation plates arranged between the first and second mounting plates along the length direction of the fixing plate. The adjusting mechanism comprises an adjusting wheel, an adjusting rod and an adjusting seat, the first mounting plate is arranged on the base, the second mounting plate is arranged on the adjusting seat, the adjusting wheel is arranged on the base, one end of the adjusting rod is connected to the adjusting wheel and the other end of the adjusting rod is rotatably connected to the base, a nut seat is arranged on the adjusting rod, the nut seat is arranged on the adjusting seat, and when the adjusting wheel rotates, the adjusting seat drives the second mounting plate to move close to or away from the first mounting plate.

2. The circuit board glue spraying apparatus according to claim 1, characterized in that: The adjusting seat is provided with a connecting block, and the second mounting plate is fixedly connected to the connecting block.

3. The circuit board glue spraying apparatus according to claim 2, wherein: The support plate is provided with a flow distribution plate, the flow distribution plate is provided with a plurality of flow distribution holes arranged uniformly, the side of the support plate away from the flow distribution plate is provided with a collecting groove, the collecting groove is provided with a receiving cavity, the collecting groove is provided with a recovery opening, the rack is provided with a recovery pipe, and the input end of the recovery pipe is connected to the recovery opening.

4. The circuit board glue spraying apparatus according to claim 3, wherein: The spraying mechanism comprises a moving assembly and a glue spraying assembly, the moving assembly is used for driving the glue spraying assembly to move in the X-axis and Y-axis directions, and the glue spraying assembly is used for spraying glue on the circuit board.

5. The circuit board glue spraying apparatus according to claim 4, wherein: The first and second mounting plates are further provided with a limiting mechanism, the limiting mechanism comprises a limiting cylinder and a limiting block arranged at the extending end of the limiting cylinder, and the limiting cylinder is used for driving the limiting block to move in the vertical direction.

6. The circuit board glue spraying apparatus according to claim 2, wherein: ​ 7. The circuit board glue spraying apparatus of claim 1, wherein: ​ 8. The circuit board glue spraying apparatus according to claim 2, wherein: ​

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