Waste printed circuit board recycling device

Abstract

The utility model discloses a waste printed circuit board recycling device which comprises a fixed base, a positioning plate is movably connected to the fixed base, a plurality of clamping plates are arranged on the positioning plate, a positioning area is defined by the clamping plates, the clamping plates are connected with an air cylinder, a fixed supporting frame is arranged on the fixed base, and the air cylinder is connected with the fixed supporting frame. A first mechanical arm, a second mechanical arm and a detection camera are arranged on the fixed supporting frame, a small hot air gun is arranged on the first mechanical arm, a small solder sucker is arranged on the second mechanical arm, the detection camera is located above the positioning area, automatic tin melting and sucking operation is achieved, and efficiency is high.

Description

Technical Field

[0001] This utility model belongs to the field of recycling technology, and more specifically relates to a waste printed circuit board recycling device. Background Technology

[0002] In the recycling process of waste printed circuit boards, some electronic components and PCBs on the circuit boards have reuse value and can be reused through refurbishment. Currently, most electronic components are soldered to the PCB board using solder. Therefore, the main way to disassemble them is to use a hot air gun to melt the solder, use a desoldering pump to remove the molten solder, and then remove the electronic components from the board. Since the disassembly of electronic components and the use of a desoldering pump need to be done simultaneously, manual disassembly usually involves holding a hot air gun in one hand and a desoldering pump in the other to remove the molten solder before manually removing the electronic components from the board. This method is time-consuming and laborious. Utility Model Content

[0003] To address the shortcomings of existing technologies, this utility model provides a waste printed circuit board recycling device that achieves automated solder melting and desoldering operations with high efficiency.

[0004] To achieve the above objectives, this utility model provides the following technical solution: a waste printed circuit board recycling device, comprising a fixed base, a positioning plate movably connected to the fixed base, a plurality of clamping plates provided on the positioning plate, the plurality of clamping plates surrounding to form a positioning area, the clamping plates being connected to a cylinder, a fixed support frame provided on the fixed base, a first robotic arm, a second robotic arm and a detection camera provided on the fixed support frame, a small hot air gun provided on the first robotic arm, a small desoldering pump provided on the second robotic arm, and the detection camera located above the positioning area.

[0005] Furthermore, a translation mechanism, a rotation mechanism, and an angle adjustment mechanism are sequentially arranged between the fixed base and the positioning plate from bottom to top.

[0006] Furthermore, the translation mechanism includes a first translation plate and a second translation plate. The first translation plate is slidably connected to the fixed base, and the second translation plate is slidably connected to the first translation plate. Each of the first and second translation plates is connected to a separate drive mechanism.

[0007] Furthermore, the rotating mechanism includes a drive motor and a rotating support block, a reduction gear set is provided between the motor and the rotating support block, and the rotating support block is rotatably connected to the translation mechanism.

[0008] Furthermore, the angle adjustment mechanism includes an electric telescopic rod, a connecting rod hinged to the electric telescopic rod, the connecting rod being hinged to a positioning plate, and the positioning plate being hinged to a rotating mechanism.

[0009] Furthermore, a rubber support plate is provided within the positioning area.

[0010] Furthermore, a rubber layer is provided on the clamp.

[0011] Furthermore, a lifting plate is connected to the fixed support frame, and the first and second robotic arms are located on the lifting plate.

[0012] Furthermore, a controller and an operation display screen are provided on the fixed base.

[0013] Compared with the prior art, the beneficial effects of this utility model are: the circuit board to be recycled is placed in the positioning area, the circuit board is clamped by the operation of the cylinder, the electronic components on the circuit board are scanned and identified by the detection camera, and finally the first and second robotic arms drive the small hot air gun and the small desoldering pump to melt and absorb the solder between the electronic components and the circuit board, thereby realizing automated recycling operation and improving efficiency. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of the waste printed circuit board recycling device of this utility model;

[0015] Reference numerals: 1. Fixed base; 2. Positioning plate; 3. Clamping plate; 4. Cylinder; 5. Fixed support frame; 6. First robotic arm; 7. Second robotic arm; 8. Detection camera; 9. Small desoldering pump; 10. First translation plate; 11. Second translation plate; 12. Drive motor; 13. Rotary support block; 14. Electric telescopic rod; 15. Connecting rod; 16. Rubber support plate; 17. Lifting plate; 18. Small hot air gun. Detailed Implementation

[0016] In the description of this utility model, it should be noted that the directional terms such as "center", "horizontal (X)", "longitudinal (Y)", "vertical (Z)", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", and "counterclockwise" indicate the orientation and positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. They should not be construed as limiting the specific protection scope of this utility model.

[0017] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features. Thus, the use of "first" and "second" to define a feature may explicitly or implicitly include one or more of that feature. In the description of this utility model, "several" or "a number" means two or more, unless otherwise explicitly specified.

[0018] Reference Figure 1 The present invention will be further described below.

[0019] A waste printed circuit board recycling device includes a fixed base 1, a positioning plate 2 movably connected to the fixed base 1, a plurality of clamping plates 3 arranged on the positioning plate 2, the plurality of clamping plates 3 enclosing a positioning area, a cylinder 4 connected to the clamping plates 3, a fixed support frame 5 arranged on the fixed base 1, a first robotic arm 6, a second robotic arm 7 and a detection camera 8 arranged on the fixed support frame 5, a small hot air gun 18 arranged on the first robotic arm 6, a small desoldering pump 9 arranged on the second robotic arm 7, and the detection camera 8 located above the positioning area.

[0020] like Figure 1 As shown, the circuit board to be recycled is placed in the positioning area. The operation of the cylinder 4 drives the clamping plate 3 to hold the circuit board. Then, the detection camera 8 scans and identifies the electronic components on the circuit board. Finally, the first robotic arm 6 and the second robotic arm 7 drive the small hot air gun 18 and the small desoldering pump 9 to melt and remove the solder between the electronic components and the circuit board, realizing automated recycling operation and improving efficiency.

[0021] like Figure 1 As shown in this example, preferably, the fixed base 1 and the positioning plate 2 are provided with a translation mechanism, a rotation mechanism and an angle adjustment mechanism from bottom to top.

[0022] like Figure 1 As shown in the example, preferably in this embodiment, the translation mechanism includes a first translation plate 10 and a second translation plate 11. The first translation plate 10 is slidably connected to the fixed base 1, and the second translation plate 11 is slidably connected to the first translation plate 10. Each of the first translation plate 10 and the second translation plate 11 is connected to a separate drive mechanism.

[0023] Specifically, the circuit board is moved in the planar direction by the first translation plate 10 and the second translation plate 11, which facilitates the melting and desoldering of electronic components at different positions on the circuit board.

[0024] like Figure 1As shown in the example, the preferred embodiment of this example includes a drive motor 12 and a rotating support block 13. A reduction gear set is provided between the motor and the rotating support block 13, and the rotating support block 13 is rotatably connected to the translation mechanism.

[0025] Specifically, the drive motor 12 drives the rotating support block 13 to rotate through the reduction gear set, thereby rotating the circuit board at a certain angle when necessary, which facilitates the melting and desoldering of electronic components.

[0026] Specifically, the rotating support block 13 is rotatably connected to the second translation plate 11.

[0027] like Figure 1 As shown in the example, the preferred embodiment of this example includes an electric telescopic rod 14, a connecting rod 15 hinged to the electric telescopic rod 14, the connecting rod 15 being hinged to the positioning plate 2, and the positioning plate 2 being hinged to the rotating mechanism.

[0028] Specifically, the positioning plate 2 is hinged to the rotating support block 13.

[0029] Specifically, the positioning plate 2 is tilted by the extension and retraction of the electric telescopic rod 14 and the linkage of the connecting rod 15, which facilitates the melting and desoldering of electronic components when necessary.

[0030] like Figure 1 As shown in this example, preferably, a rubber support plate 16 is provided in the positioning area to support the circuit board.

[0031] In this example, preferably, the clamping plate 3 is provided with a rubber layer to avoid damage to the edges of the circuit board when clamping it.

[0032] Specifically, the rubber layer on the rubber support plate 16 and the clamping plate 3 is high-temperature resistant rubber, and the temperature it can withstand is slightly lower, the same as, or higher than the solder melting temperature.

[0033] like Figure 1 As shown in this example, preferably, the fixed support frame 5 is connected to a lifting plate 17, the first robotic arm 6 and the second robotic arm 7 are located on the lifting plate 17, and a drive mechanism is connected to the lifting plate 17.

[0034] Specifically, the drive mechanism connecting the lifting plate 17 can be a lead screw and nut plus a motor, or a linear motor can be used to directly drive the lifting plate 17 to rise and fall. The motor can be a servo motor or a displacement sensor such as a grating ruler.

[0035] In this preferred embodiment, the fixed base 1 is equipped with a controller and an operation display screen, which allows for input of operation commands to the mechanism through the display screen to achieve automation.

[0036] The above description is merely a preferred embodiment of this utility model. The protection scope of this utility model is not limited to the above embodiments. All technical solutions falling within the scope of this utility model's concept are protected. It should be noted that for those skilled in the art, any improvements and modifications made without departing from the principle of this utility model should also be considered within the protection scope of this utility model.

Claims

1. A waste printed circuit board recycling device, characterized in that: The device includes a fixed base, on which a positioning plate is movably connected. Several clamping plates are provided on the positioning plate, forming a positioning area. The clamping plates are connected to a cylinder. A fixed support frame is provided on the fixed base, and a first robotic arm, a second robotic arm, and a detection camera are provided on the fixed support frame. A small hot air gun is provided on the first robotic arm, a small desoldering pump is provided on the second robotic arm, and the detection camera is located above the positioning area.

2. The waste printed circuit board recycling device according to claim 1, characterized in that: The fixed base and the positioning plate are provided with a translation mechanism, a rotation mechanism and an angle adjustment mechanism from bottom to top.

3. The waste printed circuit board recycling device according to claim 2, characterized in that: The translation mechanism includes a first translation plate and a second translation plate. The first translation plate is slidably connected to the fixed base, and the second translation plate is slidably connected to the first translation plate. Each of the first and second translation plates is connected to a separate drive mechanism.

4. The waste printed circuit board recycling device according to claim 2, characterized in that: The rotating mechanism includes a drive motor and a rotating support block. A reduction gear set is provided between the motor and the rotating support block. The rotating support block is rotatably connected to the translation mechanism.

5. The waste printed circuit board recycling device according to claim 2, characterized in that: The angle adjustment mechanism includes an electric telescopic rod, a connecting rod hinged to the electric telescopic rod, the connecting rod being hinged to a positioning plate, and the positioning plate being hinged to a rotating mechanism.

6. The waste printed circuit board recycling device according to claim 1, characterized in that: A rubber support plate is provided within the positioning area.

7. The waste printed circuit board recycling device according to claim 1, characterized in that: The clamp is provided with a rubber layer.

8. The waste printed circuit board recycling device according to claim 1, characterized in that: A lifting plate is connected to the fixed support frame, and the first and second robotic arms are located on the lifting plate.

9. The waste printed circuit board recycling device according to claim 1, characterized in that: A controller is mounted on the fixed base, and an operation display screen is also mounted on the fixed base.

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