Circular cutting device for wafer after film pasting
By designing an adjustable-angle cutter and pressure roller mechanism, the problem of fixed cutter angle in traditional devices has been solved, improving wafer cutting quality and safety.
Patent Information
- Application Number
- CN202423081702.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-13
- Publication Date
- 2025-12-09
- Estimated Expiration
- 2034-12-13
AI Technical Summary
Traditional wafer dicing equipment cannot precisely adjust the dicing angle after wafer lamination, resulting in poor cutting, high risk of wafer breakage and film residue.
A wafer lamination and subsequent circular cutting device was designed. The cutting angle can be flexibly adjusted by a motor-driven rotating column and a worm gear mechanism. The cutting quality is ensured by the combination of heating wire and temperature sensor, and an adjustable pressure roller is used to prevent the film from detaching.
It enables precise adjustment of the cutting angle, improves cutting quality, reduces wafer breakage and film residue, and ensures smooth and neat cutting edges.
Smart Images
Figure CN223643837U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of wafer lamination technology, specifically referring to a wafer lamination and subsequent circular cutting device. Background Technology
[0002] The film attached to the wafer is a wafer dicing protective film, mainly used for surface treatment and protection in high-temperature environments, electroplating, electrophoresis, ultra-high temperature baking paint, powder coating, and terminal electrodes of wafer components.
[0003] Traditional wafer dicing equipment mainly cuts the wafer by driving the rotation of a cutter. The angle of the cutter is fixed, and it cannot accurately adjust the cutter angle to adapt to the optimal cutting state when facing wafers of different specifications and different wafer dicing process requirements. Utility Model Content
[0004] In view of the above situation and to overcome the defects of the prior art, this utility model provides a wafer lamination and circular cutting device, which effectively solves the problem that the cutting angle cannot be adjusted.
[0005] To achieve the above functions, the technical solution adopted by this utility model is as follows: a wafer lamination and subsequent circular cutting device, including a mounting plate and a motor. The mounting plate is fixedly mounted on a flip cover, and the motor is mounted on the mounting plate. The output end of the motor passes through the mounting plate and the flip cover and is fixedly connected to a rotating column. A bracket is fixed on the rotating column, and two sets of symmetrical moving plates are slidably arranged on the bracket. The two sets of moving plates are respectively provided with a circular cutter and a pressure roller. Both the cutter and the pressure roller can rotate.
[0006] A connecting shaft is fixedly connected to one side of the cutter. The movable plate has a through-hole with openings on both sides. A horizontal rotating shaft that penetrates the outer side of the movable plate is rotatably installed inside the through-hole. A mounting block is fixed on the rotating shaft and located inside the through-hole. The end of the connecting shaft away from the cutter is rotatably installed on the outer side of the mounting block. The angle of the cutter is adjusted by rotating the rotating shaft.
[0007] Preferably, a fixed plate is fixed on the side of the movable plate near the extension of the rotating shaft, and a vertically arranged worm is rotatably mounted on the fixed plate. An end block is fixed at the top of the worm, and a worm wheel is fixed at the end of the rotating shaft extending outward. The worm wheel and the worm are meshed together.
[0008] Preferably, the movable plate is fixed to an external plate on one side of the cutter, and a protractor is fixed to the external plate.
[0009] Preferably, the bracket is provided with a horizontal groove, and a bidirectional lead screw is horizontally rotatably provided in the groove. Two sets of moving plates are symmetrically threadedly connected to the bidirectional lead screw and slide relative to the groove. One end of the bidirectional lead screw is fixed with a rotating block.
[0010] Preferably, the cutter has a built-in heating wire, and a temperature sensor is installed near the cutting edge of the cutter.
[0011] Preferably, the connecting shaft and the cutter are connected by a conductive slip ring.
[0012] Preferably, the width of the pressure roller is greater than the width of the cutter, and the pressure roller is made of a plastic material.
[0013] The beneficial effects of the above-mentioned structure of this utility model are as follows: the rotating end block drives the worm to rotate, the worm drives the worm wheel to rotate, the worm wheel drives the rotating shaft to rotate, and thus drives the mounting block and the cutter to rotate as a whole, thereby adjusting the angle of the cutter. This ensures that when cutting wafers of different shapes and sizes, the cutter always contacts the wafer film at the optimal angle, resulting in neater and smoother cutting edges, reducing the risk of wafer breakage and film residue, and greatly improving the cutting quality. Attached Figure Description
[0014] Figure 1 This is a schematic diagram of the overall structure of the wafer lamination and circular dicing device proposed in this utility model. Figure 1 ;
[0015] Figure 2 This is a schematic diagram of the overall structure of the wafer lamination and circular dicing device proposed in this utility model. Figure 2 ;
[0016] Figure 3 This is a schematic diagram of the overall structure of the wafer lamination and circular dicing device proposed in this utility model. Figure 3 ;
[0017] Figure 4 for Figure 3 A magnified view of a section at point A in the middle;
[0018] Figure 5 This is a schematic diagram of the structure of the through-hole of the wafer lamination and circular cutting device proposed in this utility model.
[0019] The components are as follows: 1. Mounting plate, 2. Motor, 3. Rotating column, 4. Bracket, 5. Moving plate, 6. Cutter, 7. Pressure roller, 8. Connecting shaft, 9. Through port, 10. Rotating shaft, 11. Mounting block, 12. Worm gear, 13. Worm, 14. Fixing plate, 15. End block, 16. Insert groove, 17. Bidirectional lead screw, 18. Rotating block, 19. Protractor, 20. Temperature sensor, 21. Conductive slip ring, 22. External plate. Detailed Implementation
[0020] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.
[0021] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The utility model will be further described in detail below with reference to the accompanying drawings.
[0022] like Figure 1-5 As shown, the wafer dicing device proposed in this utility model includes a mounting plate 1 and a motor 2. The mounting plate 1 is fixedly mounted on a flip cover, and the motor 2 is mounted on the mounting plate 1. The output end of the motor 2 is fixedly connected to a rotating column 3 through the mounting plate 1 and the flip cover. A bracket 4 is fixed on the rotating column 3. Two sets of symmetrical moving plates 5 are slidably mounted on the bracket 4. The two sets of moving plates 5 are respectively equipped with a circular cutter 6 and a pressure roller 7. Both the cutter 6 and the pressure roller 7 can rotate. The width of the pressure roller 7 is greater than the width of the cutter 6. The pressure roller 7 is used to perform secondary film application along the trajectory of the cutter 6, effectively preventing the film from detaching from the wafer at the cutting position when the cutter 6 cuts off excess film. The pressure roller 7 is made of a plastic material, which ensures that the film can be completely adhered without damaging the wafer.
[0023] like Figure 4 As shown, the cutter 6 has a built-in heating wire, which is evenly distributed in specific channels inside the cutter 6 to ensure that the cutter 6 is heated evenly. The heating wire is made of high resistance alloy material, which can generate heat quickly and has good thermal stability. A temperature sensor 20 is installed near the cutting edge of the cutter 6 to detect the temperature of the cutter 6. A connecting shaft 8 is fixedly connected to one side of the cutter 6. The connecting shaft 8 and the cutter 6 are connected through a conductive slip ring 21. The stator part of the conductive slip ring 21 is electrically connected to the cutter 6 to realize the transmission of current and signal from the connecting shaft 8 to the cutter 6.
[0024] The movable plate 5 has a through-hole 9 with openings on both sides. A horizontal rotating shaft 10 is rotatably installed inside the through-hole 9 and passes through the outer side of the movable plate 5. A mounting block 11 is fixed on the rotating shaft 10 and is located inside the through-hole 9. The end of the connecting shaft 8 away from the cutter 6 is rotatably installed on the outer side of the mounting block 11. The rotating shaft 10 drives the mounting block 11 and the connecting shaft 8 to rotate as a whole, thereby driving the cutter 6 to rotate and adjusting the angle of the cutter 6. An outer plate 22 is fixed on one side of the movable plate 5 near the cutter 6. A protractor 19 is fixed on the outer plate 22 to determine the angle of the cutter 6.
[0025] like Figure 4 , 5 As shown, a fixed plate 14 is fixed to the side of the movable plate 5 near the extension of the rotating shaft 10. A vertically arranged worm gear 13 is rotatably mounted on the fixed plate 14. An end block 15 is fixed to the top of the worm gear 13. A worm wheel 12 is fixed to one end of the rotating shaft 10. The worm wheel 12 and the worm gear 13 are meshed. Rotating the end block 15 drives the worm gear 13 to rotate, which in turn drives the worm wheel 12 to rotate. The worm wheel 12 drives the rotating shaft 10 to rotate, thereby driving the mounting block 11 and the cutter 6 to rotate as a whole, thus adjusting the angle of the cutter 6.
[0026] like Figure 1 , 3 As shown, the bracket 4 is provided with a horizontal groove 16, and a bidirectional lead screw 17 is horizontally rotatable in the groove 16. Two sets of moving plates 5 are symmetrically threaded onto the bidirectional lead screw 17 and slide relative to the groove 16. One end of the bidirectional lead screw 17 is fixed with a rotating block 18. Rotating the rotating block 18 drives the bidirectional lead screw 17 to rotate. The bidirectional lead screw 17 drives the moving plates 5 to move closer or further away from each other, thereby driving the cutter 6 and pressure roller 7 to be adjusted to the size of the wafer to be cut as needed.
[0027] In actual use, before cutting, the operator rotates the end block 15 to drive the worm 13 to rotate, the worm 13 drives the worm wheel 12 to rotate, the worm wheel 12 drives the rotating shaft 10 to rotate, which in turn drives the mounting block 11 and the cutter 6 to rotate as a whole, and adjusts the angle of the cutter 6. The angle is judged by the protractor 19 and the cutter 6 is adjusted to the appropriate angle.
[0028] By rotating the rotating block 18, the bidirectional lead screw 17 is driven to rotate. The bidirectional lead screw 17 drives the moving plate 5 to move closer or further away from each other, thereby driving the cutter 6 and pressure roller 7 to be adjusted so as to cut the wafer size as needed.
[0029] The flip cover is closed, so that the cutter 6 is in close contact with the film. The required temperature of the cutter 6 for this cut is input on the human-machine interface. After the PLC receives the parameter, the heating wire heats the cutter 6. The temperature sensor 20 detects the temperature. When the temperature of the cutter 6 reaches the set temperature, the motor 2 is started and the cutter 6 starts to rotate at high speed, driving the rotating column 3 and the bracket 4 to rotate. At the same time, the cutter 6 and the pressure roller 7 rotate, and the cutter 6 cuts the film.
[0030] The present invention and its embodiments have been described above. This description is not restrictive, and the accompanying drawings are only one embodiment of the present invention; the actual structure is not limited thereto. In conclusion, if those skilled in the art are inspired by this description and design similar structures and embodiments without departing from the inventive spirit of the present invention, such designs should fall within the protection scope of the present invention.
Claims
1. A wafer dicing apparatus after wafer lamination, characterized in that: Includes a mounting plate (1) and a motor (2). The mounting plate (1) is fixedly mounted on the flip cover. The motor (2) is mounted on the mounting plate (1). The output end of the motor (2) passes through the mounting plate (1) and the flip cover and is fixedly connected to a rotating column (3). A bracket (4) is fixed on the rotating column (3). Two sets of symmetrical moving plates (5) are slidably arranged on the bracket (4). The two sets of moving plates (5) are respectively provided with a circular cutter (6) and a pressure roller (7). Both the cutter (6) and the pressure roller (7) can rotate. A connecting shaft (8) is fixedly connected to one side of the cutter (6). The movable plate (5) is provided with a through-hole (9) with openings on both sides. A horizontal rotating shaft (10) is rotatably provided in the through-hole (9) and passes through the outer side of the movable plate (5). A mounting block (11) is fixed on the rotating shaft (10) and located in the through-hole (9). The end of the connecting shaft (8) away from the cutter (6) is rotatably provided on the outer side of the mounting block (11). The rotating shaft (10) rotates to adjust the angle of the cutter (6).
2. The wafer dicing apparatus after wafer lamination according to claim 1, characterized in that: A fixed plate (14) is fixed on the side of the movable plate (5) that extends outward from the rotating shaft (10). A vertically arranged worm (13) is rotatably mounted on the fixed plate (14). An end block (15) is fixed to the top of the worm (13). A worm wheel (12) is fixed to one end of the rotating shaft (10) that extends outward. The worm wheel (12) and the worm (13) are meshed together.
3. The wafer dicing apparatus after wafer lamination according to claim 2, characterized in that: The movable plate (5) is fixed with an outer plate (22) on one side of the cutter (6), and a protractor (19) is fixed on the outer plate (22).
4. The wafer dicing apparatus after wafer lamination according to claim 3, characterized in that: The bracket (4) is provided with a horizontal groove (16), and a bidirectional lead screw (17) is provided in the groove (16) for horizontal rotation. Two sets of moving plates (5) are symmetrically threaded on the bidirectional lead screw (17) and slide relative to the groove (16). One end of the bidirectional lead screw (17) is fixed with a rotating block (18).
5. The wafer dicing apparatus after wafer lamination according to claim 4, characterized in that: The cutter (6) has a built-in heating wire, and a temperature sensor (20) is installed near the cutting edge of the cutter (6).
6. The wafer dicing apparatus after wafer lamination according to claim 5, characterized in that: The connecting shaft (8) and the cutter (6) are connected by a conductive slip ring (21).
7. The wafer dicing apparatus after wafer lamination according to claim 6, characterized in that: The width of the pressure roller (7) is greater than the width of the cutter (6), and the pressure roller (7) is made of a plastic material.