Sputtering automatic spot test device
By designing an automatic sampling and testing device for sputtering, automated testing of crystal oscillator products is achieved, solving the problems of poor accuracy and safety hazards of manual testing, and improving the accuracy and safety of testing.
Patent Information
- Application Number
- CN202423010824.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-06
- Publication Date
- 2025-12-09
- Estimated Expiration
- 2034-12-06
AI Technical Summary
Sputtering inspection of crystal oscillator products suffers from poor accuracy and safety hazards due to manual testing, especially when small chips are not properly placed, which affects the accuracy of the product frequency.
Design an automated sputtering sampling and testing device, comprising a worktable, mounting bracket, x-axis, y-axis, z-axis translation mechanisms, nozzle, testing mechanism, and tray, to achieve automated testing and is suitable for testing wafers of different sizes.
Automated testing reduces manual operations, improves testing accuracy, lowers safety risks, and ensures the accuracy of product frequency.
Smart Images
Figure CN223646618U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of testing equipment, and in particular to an automatic sampling and testing device for sputtering. Background Technology
[0002] Sputtering testing of crystal oscillators is a crucial technical means to ensure product quality. Only with a good bond between the crystal and the silver surface can the crystal achieve stable performance; poor bonding can cause frequency deviation or even prevent oscillation altogether. Random sampling testing of sputtered products is essential to ensuring frequency accuracy. After sputtering, products are randomly sampled based on the initial sputtering results. Frequency corrections for the next batch are then performed based on the test data. Inaccurate test frequencies will affect the accuracy of sputtering frequency conversion, causing problems for subsequent product operations.
[0003] Currently, the performance testing of SMD quartz crystal resonators in the crystal oscillator industry still relies on manual testing after sputtering the mask tray. This method is susceptible to human error; if the wafer is too small, improper placement may also occur. Manual testing suffers from poor accuracy and poses safety hazards due to operator fatigue. Summary of the Invention
[0004] This invention mainly solves the above-mentioned problems and provides an automatic sampling and testing device for sputtering.
[0005] The technical solution adopted by this utility model to solve its technical problem is an automatic sputtering sampling and testing device, including a worktable, a mounting frame, an x-axis translation mechanism, a y-axis translation mechanism, a z-axis translation mechanism, a suction nozzle, a detection mechanism, and a tray. The mounting frame is set on the worktable, the x-axis translation mechanism is set on the mounting frame, the z-axis translation mechanism is set on the x-axis translation mechanism, the suction nozzle and the detection mechanism are set on the z-axis translation mechanism, the y-axis translation mechanism is set on the worktable, the tray is set on the y-axis translation mechanism, and an angle adjustment mechanism is provided on the side of the tray.
[0006] As a preferred embodiment of the above solution, the z-axis translation mechanism includes a mounting plate, a slide rail, a sliding plate, a motor, a rotating plate, and rollers. The mounting plate is vertically mounted on the sliding part of the x-axis translation mechanism, the slide rail is vertically mounted on the mounting plate, the sliding plate is slidably mounted on the slide rail, and the upper end of the sliding plate is provided with a horizontally extending oblong hole. The motor is fixedly mounted on the sliding part of the x-axis translation mechanism, and the output shaft of the motor passes through the mounting plate and is fixed to the middle of the rotating plate. The rollers are rotatably mounted at one end of the mounting plate and extend into the oblong hole.
[0007] As a preferred embodiment of the above solution, the suction nozzle and the detection mechanism are fixedly mounted on the sliding plate.
[0008] As a preferred embodiment of the above scheme, the x-axis translation mechanism and the y-axis translation mechanism are linear slides.
[0009] As a preferred embodiment of the above solution, the tray is provided with an NG cup on its side.
[0010] As a preferred embodiment of the above solution, the detection mechanism includes a pitch module and two detection heads, with the detection heads fixedly mounted on the two movable ends of the pitch module.
[0011] As a preferred embodiment of the above solution, the angle adjustment mechanism includes a vertical rod, a camera, and a rotary motor. The vertical rod is mounted on the worktable, the camera is fixedly mounted on the upper end of the vertical rod, and the rotary motor is mounted on the side of the tray. The rotary motor is equipped with a rotating platform for placing the product to be tested.
[0012] As a preferred embodiment of the above solution, the camera is provided with a surrounding panel, and the surrounding panel is provided with electronic control components.
[0013] As a preferred embodiment of the above solution, the electronic control components include a human-machine interface screen, a timer, a counter, and an emergency stop switch.
[0014] As a preferred embodiment of the above solution, the tray is provided with positioning protrusions.
[0015] The advantages of this invention are: it can automatically test wafers, minimizing manual labor; and it is equipped with a variable pitch module, making it suitable for wafers of different sizes. Attached Figure Description
[0016] Figure 1 This is a schematic diagram of an automatic sampling and testing device for sputtering.
[0017] Figure 2 This is a schematic diagram of the x-axis translation mechanism and the z-axis translation mechanism.
[0018] Figure 3 This is a schematic diagram of the z-axis translation mechanism.
[0019] Figure 4 This is a structural diagram of the tray and angle adjustment mechanism.
[0020] 1-Workbench 2-Mounting frame 3-X-axis translation mechanism 4-Z-axis translation mechanism 5-Angle adjustment mechanism 6-Pattern 7-Wall panel 8-Y-axis translation mechanism 9-MASK tray 10-Detection mechanism 11-Suction nozzle 41-Mounting plate 42-Slide plate 43-Oval hole 44-Roller 45-Rotating plate 46-Motor 51-Vertical rod 52-Camera 53-Rotary motor 54-Rotating platform 61-NG cup 62-Positioning protrusion. Detailed Implementation
[0021] The technical solution of this utility model will be further described below through embodiments and in conjunction with the accompanying drawings.
[0022] Example:
[0023] This embodiment describes an automatic sampling and testing device for sputtering, such as... Figures 1 to 4 As shown, the system includes a worktable 1, a mounting frame 2, an x-axis translation mechanism 3, a y-axis translation mechanism 8, a z-axis translation mechanism 4, a suction nozzle 11, a detection mechanism 10, and a tray 6. The mounting frame 2 is located at the rear end of the worktable 1. The x-axis translation mechanism 3 is mounted on the mounting frame 2. The z-axis translation mechanism 4 is mounted on the x-axis translation mechanism 3. The suction nozzle 11 and the detection mechanism 10 are mounted on the z-axis translation mechanism 4. The y-axis translation mechanism 8 is mounted on the worktable 1. The tray 9 is mounted on the y-axis translation mechanism. An angle adjustment mechanism 7 is also provided on the side of the tray. The x-axis translation mechanism and the y-axis translation mechanism are linear slides, both of which are existing mechanisms.
[0024] The z-axis translation mechanism includes a mounting plate 41, a slide rail, a sliding plate 42, a motor 46, a rotating plate 45, and rollers 44. The mounting plate 41 is vertically mounted on the sliding part of the x-axis translation mechanism 3. The slide rail is vertically mounted on the mounting plate 41. The sliding plate 42 is slidably mounted on the slide rail. The upper end of the sliding plate 42 is provided with a horizontally extending oblong hole 43. The motor 46 is fixedly mounted on the sliding part of the x-axis translation mechanism 3. The output shaft of the motor 46 passes through the mounting plate 41 and is fixed to the middle of the rotating plate 45. The rollers 44 are rotatably mounted on one end of the mounting plate 45 and extend into the oblong hole 44. The nozzle and the detection mechanism are respectively fixedly mounted on different sliding plates and controlled by different motors for lifting and lowering. When the motor is running, the motor drives the rotating plate to rotate, and the rotating plate drives the rollers to move in a circle in the vertical plane. During this process, the rollers move left and right in the oblong hole and drive the mounting plate to slide up and down along the slide rail, thereby realizing the height adjustment of the detection mechanism and the nozzle. In this embodiment, the detection mechanism includes a variable-pitch module and two detection heads, which are fixedly mounted on the two movable ends of the variable-pitch module. The variable-pitch module is an existing mechanism that allows adjustment of the distance between the two movable ends, thereby changing the distance between the two detection heads and enabling the detection mechanism to detect wafers of different sizes.
[0025] The tray is used to hold the mask tray. A positioning protrusion 62 is provided on each side of the tray. The mask tray has positioning holes that match the positioning protrusions 62. The positioning protrusions 62 and positioning holes allow the mask tray to be placed in the designated position on the tray for subsequent testing. In this embodiment, an NG cup 61 for placing wafers that have failed the test is also provided on the front left side of the tray.
[0026] The angle adjustment mechanism 5 includes a vertical rod 51, a camera 52, and a rotary motor 53. The vertical rod is mounted on the worktable 1, the camera 52 is fixedly mounted on the upper end of the vertical rod 51, and the rotary motor 53 is located at the rear left side of the tray 6. A rotating platform 54 for placing the product to be tested is mounted on the rotary motor 53. The angle adjustment mechanism determines the electrode angle direction of the wafer by photographing it on the rotating platform with the camera, and then adjusts the electrode angle direction of the wafer using the rotary motor to ensure that the testing mechanism can test the wafer. A protective plate 7 is also provided outside the camera. In addition to protecting the camera, the protective plate 7 can also be used to install electrical control components such as human-machine interface screens, timers, counters, and emergency stop switches.
[0027] The working process of the automatic sputtering sampling and testing device in this embodiment is as follows: After the worker places the MASK tray containing the wafers to be tested onto the pallet, the corresponding parameters are set through the human-machine interface screen, and automatic testing can begin. During testing, the y-axis translation mechanism moves the MASK tray back and forth, while the x-axis and z-axis translation mechanisms move the detection mechanism and the nozzle left and right and up and down. Through the configuration of the x-axis, y-axis, and z-axis translation mechanisms, the nozzle can pick up the wafers to be tested from the MASK and place them on the rotating platform. After the angle adjustment mechanism adjusts the angle of the wafers to be tested, the detection mechanism tests the wafers. If the test is qualified, the wafer is returned to its original position on the MASK tray through the nozzle, and the nozzle picks up the next wafer to be tested for testing. If the test is unqualified, the wafer is placed into the NG cup through the nozzle, and the next wafer to be tested is picked up from the MASK tray for testing. After all the wafers in the MASK tray have been tested, the worker removes the MASK tray and places a new MASK tray containing the wafers to be tested on it.
[0028] The specific embodiments described herein are merely illustrative of the spirit of the invention. Those skilled in the art to which this invention pertains may make various modifications or additions to the described specific embodiments or use similar methods to substitute them, without departing from the spirit of the invention or exceeding the scope defined by the appended claims.
Claims
1. An automatic sampling and testing device for sputtering, characterized in that: The device includes a worktable, a mounting frame, an x-axis translation mechanism, a y-axis translation mechanism, a z-axis translation mechanism, a suction nozzle, a detection mechanism, and a tray. The mounting frame is mounted on the worktable, the x-axis translation mechanism is mounted on the mounting frame, the z-axis translation mechanism is mounted on the x-axis translation mechanism, the suction nozzle and detection mechanism are mounted on the z-axis translation mechanism, the y-axis translation mechanism is mounted on the worktable, and the tray is mounted on the y-axis translation mechanism. An angle adjustment mechanism is provided on the side of the tray. The angle adjustment mechanism includes a vertical rod, a camera, and a rotary motor. The vertical rod is mounted on the worktable, the camera is fixedly mounted on the upper end of the vertical rod, and the rotary motor is located on the side of the tray. A rotating platform for placing the product to be tested is provided on the rotary motor.
2. The automatic sputtering sampling and testing device according to claim 1, characterized in that: The z-axis translation mechanism includes a mounting plate, a slide rail, a sliding plate, a motor, a rotating plate, and rollers. The mounting plate is vertically mounted on the sliding part of the x-axis translation mechanism. The slide rail is vertically mounted on the mounting plate. The sliding plate is slidably mounted on the slide rail. The upper end of the sliding plate is provided with a horizontally extending oblong hole. The motor is fixedly mounted on the sliding part of the x-axis translation mechanism. The output shaft of the motor passes through the mounting plate and is fixed to the middle of the rotating plate. The rollers are rotatably mounted at one end of the mounting plate and extend into the oblong hole.
3. The automatic sputtering sampling and testing device according to claim 2, characterized in that: The suction nozzle and detection mechanism are fixedly mounted on the sliding plate.
4. The automatic sputtering sampling and testing device according to claim 1, characterized in that: The x-axis translation mechanism and the y-axis translation mechanism are linear slides.
5. The automatic sputtering sampling and testing device according to claim 1, characterized in that: The tray has an NG cup on its side.
6. The automatic sputtering sampling and testing device according to claim 1 or 3, characterized in that: The detection mechanism includes a pitch module and two detection heads, with the detection heads fixedly mounted on the two movable ends of the pitch module.
7. The automatic sputtering sampling and testing device according to claim 1, characterized in that: The camera is surrounded by a panel, and electronic control components are installed on the panel.
8. The automatic sputtering sampling and testing device according to claim 7, characterized in that: The electronic control components include a human-machine interface screen, a timer, a counter, and an emergency stop switch.
9. The automatic sputtering sampling and testing device according to claim 1, characterized in that: The tray is provided with positioning protrusions.