Copper powder sucking and adding device for electroplating and electroplating system comprising copper powder sucking and adding device

Abstract

The utility model discloses a copper powder sucking and adding device for electroplating, which comprises a powder sucking pipe used for sucking copper powder; the vibration motor is fixed at one end of the powder suction pipe; the vacuum assembly is arranged at the end, away from the vibration motor, of the powder suction pipe. The vibration hopper is arranged on the lower side of the vacuum assembly, and the powder suction pipe is communicated with the vibration hopper through the vacuum assembly; the electroplating system comprises the copper powder sucking and adding device for electroplating. The vibration motor is arranged at one end of the powder suction pipe, so that the copper powder can be shattered by the vibration motor, and the problem that the copper powder cannot be sucked due to hardening can be prevented, and therefore, in the production and manufacturing process, the supply of the copper powder can be maintained, the overall quality of the produced product can be improved, the copper powder is saved, and waste is reduced; and a large amount of cost is saved, sufficient suction of the copper powder at the bottom is facilitated, and therefore the cost is further saved.

Description

Technical Field

[0001] This utility model relates to the field of powder transportation technology, and in particular to a copper powder absorption and addition device for electroplating and an electroplating system including the same. Background Technology

[0002] When preparing composite current collectors, copper is often plated by electroplating. During the electroplating process, copper powder needs to be added to the solution continuously to ensure sufficient copper ions in the solution, thereby ensuring the quality of the finished product. However, current copper powder adding devices cannot absorb copper powder when it clumps due to factors such as moisture. As a result, copper ions cannot be replenished in subsequent product processing, leading to a decline in the quality of the finished product. Utility Model Content

[0003] To overcome the above-mentioned shortcomings, the purpose of this utility model is to provide a copper powder absorption and addition device for electroplating. By using a vibration motor at one end of the powder absorption tube, the copper powder can be broken up by the vibration motor, which helps to prevent the copper powder from caking and becoming unabsorbable. This ensures a continuous supply of copper powder during the production process, which helps to improve the overall quality of the produced products, saves copper powder, reduces waste, and saves a lot of costs.

[0004] To achieve the above objectives, the technical solution adopted by this utility model is: a copper powder absorption and addition device for electroplating, comprising:

[0005] A suction tube for drawing copper powder;

[0006] A vibration assembly, wherein the vibration assembly is fixed to one end of the powder suction tube;

[0007] A vacuum assembly is disposed at the end of the powder suction tube away from the vibration assembly;

[0008] A vibrating hopper is located below the vacuum assembly, and the powder suction pipe is connected to the vibrating hopper through the vacuum assembly.

[0009] In this technical solution, the suction pipe is used to pick up copper powder and transfer it. The vibration component is used to vibrate the copper powder, which helps to crush any clumps of copper powder, thus facilitating its collection. The vacuum component provides power for the suction pipe to pick up the copper powder. The vibrating hopper loads the collected copper powder and guides it to the target location. By using a vibration motor at one end of the suction pipe, the copper powder can be broken up, preventing clumps that would prevent it from being collected. This ensures a continuous supply of copper powder during production, improving the overall quality of the product, saving copper powder, reducing waste, and saving significant costs. Furthermore, it allows for the full collection of copper powder from the bottom, further reducing costs.

[0010] In some embodiments, the vibrating hopper includes an inlet end and a outlet end, the inlet end is cylindrical and the outlet end is funnel-shaped, the inlet end is located above the outlet end, and the inlet end is connected to the powder suction pipe through a vacuum assembly.

[0011] In this technical solution, the feed end is used to receive the copper powder introduced by the powder suction pipe, and the funnel-shaped discharge end is conducive to the aggregation of copper powder and the guidance of copper powder to the target position.

[0012] In some embodiments, the vibrating hopper further includes a feeding end, which is located at the end of the discharge end away from the inlet end. The feeding end is hemispherical, and a hopper vibration motor is provided on the outer wall of the discharge end.

[0013] In this technical solution, the feeding end is used to collect copper powder, so as to facilitate the centralized transfer of copper powder to the target position. A hopper vibration motor is installed on the outer wall of the unloading end to prevent copper powder from caking in the hopper.

[0014] In some embodiments, the copper powder absorption and addition device for electroplating further includes a feeding assembly disposed below the vibrating hopper.

[0015] In this technical solution, the feeding component is used to transport copper powder to the target location.

[0016] In some embodiments, the feeding assembly includes a drive unit and a screw conveyor. The screw conveyor includes a screw rod, the drive end of the drive unit is connected to the screw rod, and a conveying pipe is sleeved on the screw rod, passing through the feeding end and communicating with the feeding end.

[0017] In this technical solution, copper powder is transported by driving a screw conveyor. The screw is driven to rotate by the drive device, and the copper powder falls into the conveying pipe from the feeding end. The copper powder moves in the conveying pipe as the screw rotates, transporting the copper powder to the target position.

[0018] In some embodiments, the vacuum assembly includes a vacuum generator, the inlet of which is connected to a powder suction pipe and the outlet of which is connected to a vibrating hopper.

[0019] In this technical solution, the inlet of the vacuum generator is connected to the powder suction pipe, and the outlet of the vacuum generator is connected to the vibrating hopper, so that the copper powder can be sucked into the vibrating hopper through the powder suction pipe under the negative pressure generated by the vacuum generator.

[0020] In some embodiments, the copper powder absorption and addition device for electroplating further includes a mounting plate, on which the feeding assembly is fixed.

[0021] In this technical solution, the mounting plate is used to install and fix the feeding assembly.

[0022] In some embodiments, the copper powder absorption and addition device for electroplating further includes a support assembly, on which the mounting plate and the vibrating hopper are fixed.

[0023] In this technical solution, the support component is used to install the vibrating hopper and the mounting plate to prevent the vibrating hopper from tipping over, which helps to improve the stability of the vibrating hopper.

[0024] In some embodiments, the copper powder suction and addition device for electroplating further includes a copper powder loading cylinder, the vibration component includes a vibration motor, one end of the powder suction tube away from the vacuum component and the vibration motor are disposed inside the copper powder loading cylinder, and a cover is provided on the top of the copper powder loading cylinder to cover the cylinder body.

[0025] In this technical solution, the loading cylinder is used to load the copper powder, and a vibration motor is installed at the end of the powder suction pipe away from the vacuum component. This facilitates the crushing of the copper powder by the vibration motor, making it easier for the powder suction pipe to pick it up. The cover is used to prevent the copper powder from flying away.

[0026] In some embodiments, the present invention also provides an electroplating system, including the copper powder absorption and addition device for electroplating described above.

[0027] The beneficial effects of this utility model are that by using a vibration motor at one end of the powder suction tube, the copper powder can be broken up by the vibration motor, which helps to prevent the copper powder from caking and becoming unabsorbable. This ensures a continuous supply of copper powder during the manufacturing process, which helps to improve the overall quality of the produced products, saves copper powder, reduces waste, saves a lot of costs, and also helps to fully absorb the copper powder at the bottom, thereby further saving costs. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the copper powder absorption and addition device for electroplating according to an embodiment of the present invention. Figure 1 ;

[0029] Figure 2 This is a schematic diagram of the copper powder absorption and addition device for electroplating according to an embodiment of the present invention. Figure 2 ;

[0030] Figure 3 This is a front view schematic diagram of a copper powder absorption and addition device for electroplating according to an embodiment of the present invention;

[0031] Figure 4 This is a schematic diagram of the vibrating hopper of a copper powder absorption and addition device for electroplating according to an embodiment of the present invention;

[0032] In the diagram: 1. Powder suction pipe; 2. Vibration motor; 3. Vacuum assembly; 4. Vibration hopper; 41. Feeding end; 42. Discharge end; 43. Feeding end; 44. Feeding port; 5. Feeding assembly; 51. Drive device; 52. Screw conveyor; 6. Mounting plate; 7. Support assembly; 81. Cylinder body; 82. Cover body; 9. Hopper vibration motor. Detailed Implementation

[0033] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the scope of protection of the present invention.

[0034] Combined with appendix Figure 1 To be continued Figure 3 As shown, this utility model provides a copper powder absorption and addition device for electroplating, comprising:

[0035] Powder suction tube 1, the powder suction tube 1 is used to suck up copper powder;

[0036] The vibration assembly is fixed to one end of the powder suction tube 1 and is fixed to the outer wall of the powder suction tube 1. The vibration assembly includes a vibration motor 2, for example, the vibration motor 2 is fixed to the powder suction tube 1 by screws.

[0037] Vacuum assembly 3 is located at the end of the powder suction tube 1 away from the vibration motor 2. Vacuum assembly 3 is used to provide power to the powder suction tube 1, thereby sucking copper powder into the powder suction tube 1 from the end near the vibration motor 2.

[0038] Vibrating hopper 4 is located below the vacuum assembly. The powder suction pipe 1 draws copper powder into the vibrating hopper 4 through the vacuum assembly 3. The powder suction pipe 1 transfers the copper powder into the vibrating hopper 4, and then the vibrating hopper 4 transfers the copper powder to the target position.

[0039] Continue to combine with the appendix Figure 2 To be continued Figure 4As shown, in some embodiments, the vibrating hopper 4 includes an inlet end 41 and a discharge end 42. The inlet end 41 is cylindrical and the discharge end 42 is funnel-shaped. The inlet end 41 is located on the upper side of the discharge end 42, and an inlet port 44 is provided on the upper side of the inlet end 41. The inlet port 44 is connected to the powder suction pipe 1 through the vacuum assembly 3.

[0040] Continue to combine with the appendix Figure 2 and attached Figure 4 As shown, in some embodiments, the vibrating hopper 4 further includes a feeding end 43, which is located at the end of the discharge end 42 away from the inlet end 41. The feeding end 43 is hemispherical, and a hopper vibration motor 9 is provided on the outer wall of the discharge end 42. The hemispherical feeding end is conducive to the accumulation of copper powder, and the hopper vibration motor 9 is conducive to preventing the copper powder in the vibrating hopper 4 from caking and to the conveying of copper powder.

[0041] Continue to combine with the appendix Figure 1 To be continued Figure 3 As shown, in some embodiments, the copper powder absorption and addition device for electroplating further includes a feeding component 5, which is disposed below the vibrating hopper 4.

[0042] Continue to combine with the appendix Figure 1 To be continued Figure 3 As shown, in some embodiments, the feeding assembly 5 includes a driving device 51 and a screw conveyor 52. The screw conveyor 52 includes a screw rod. The driving end of the driving device 51 is connected to the screw rod. A conveying pipe is sleeved on the screw rod. The conveying pipe passes through the feeding end 43 and communicates with the feeding end 43. Copper powder falls into the conveying pipe from the feeding end 43. The driving device drives the screw rod to rotate, so that the copper powder moves in the conveying pipe under the rotation of the screw rod, causing the copper powder to fall from the end away from the driving device 51. At this time, the target position of the copper powder can be set at the end of the screw rod 52 away from the driving device 51.

[0043] Continue to combine with the appendix Figure 1 To be continued Figure 3 As shown, in some embodiments, the vacuum assembly 3 includes a vacuum generator, the inlet end of which is connected to the powder suction pipe and the outlet end of which is connected to the feed port 44 of the vibrating hopper, so that copper powder can be sucked into the vibrating hopper through the powder suction pipe under the negative pressure generated by the vacuum generator, which facilitates the absorption of copper powder.

[0044] Continue to combine with the appendix Figure 1 To be continued Figure 3 As shown, in some embodiments, the copper powder absorption and addition device for electroplating further includes a mounting plate 6, on which the feeding assembly is fixed. The mounting plate 6 is rectangular and placed parallel to the horizontal plane, which is beneficial for the feeding assembly to be stably set on the mounting plate 6.

[0045] Continue to combine with the appendix Figure 1 To be continued Figure 3 As shown, in some embodiments, the copper powder absorption and addition device for electroplating further includes a support component 7, on which the mounting plate 6 and the vibrating hopper 4 are fixed. The support component 7 is a support frame, and the vibrating hopper 4 is fixed to the support frame by means of screws.

[0046] Continue to combine with the appendix Figure 1 As shown, in some embodiments, the copper powder suction and addition device for electroplating further includes a copper powder loading cylinder, the vibration component includes a vibration motor 2, one end of the powder suction tube 1 away from the vacuum component 3 and the vibration motor 2 are disposed in the copper powder loading cylinder, and a cover 82 covering the cylinder body 81 is provided on the top of the copper powder loading cylinder.

[0047] In some embodiments, the present invention also provides an electroplating system, including the copper powder absorption and addition device for electroplating described above.

[0048] In summary, this utility model provides a copper powder absorption and addition device for electroplating. By utilizing a vibration motor at one end of the powder absorption tube, the copper powder is easily broken up by the vibration motor, which helps prevent the copper powder from caking and becoming unabsorbable. This ensures a continuous supply of copper powder during the manufacturing process, improves the overall quality of the produced products, saves copper powder, reduces waste, and saves a significant amount of cost. Furthermore, it facilitates the full absorption of copper powder at the bottom, thereby further reducing costs.

[0049] The above embodiments are only for illustrating the technical concept and features of this utility model. Their purpose is to enable those skilled in the art to understand the content of this utility model and implement it. They cannot be used to limit the protection scope of this utility model. All equivalent changes or modifications made in accordance with the spirit and essence of this utility model should be covered within the protection scope of this utility model.

Claims

1. A copper powder absorption and addition device for electroplating, characterized in that, include: A suction tube for drawing copper powder; A vibration assembly, wherein the vibration assembly is fixed to one end of the powder suction tube; A vacuum assembly is disposed at the end of the powder suction tube away from the vibration assembly; A vibrating hopper is located below the vacuum assembly, and the powder suction pipe is connected to the vibrating hopper through the vacuum assembly.

2. The copper powder absorption and addition device for electroplating according to claim 1, characterized in that, The vibrating hopper includes an inlet end and a outlet end. The inlet end is cylindrical and the outlet end is funnel-shaped. The inlet end is located on the upper side of the outlet end and is connected to the powder suction pipe through a vacuum assembly.

3. The copper powder absorption and addition device for electroplating according to claim 2, characterized in that, The vibrating hopper also includes a feeding end, which is located at the end of the discharge end away from the inlet end. The feeding end is hemispherical, and a hopper vibration motor is provided on the outer wall of the discharge end.

4. The copper powder absorption and addition device for electroplating according to claim 3, characterized in that, It also includes a feeding assembly, which is disposed on the underside of the vibrating hopper.

5. The copper powder absorption and addition device for electroplating according to claim 4, characterized in that, The feeding assembly includes a driving device and a screw conveying device. The screw conveying device includes a screw rod. The driving end of the driving device is connected to the screw rod. A conveying pipe is sleeved on the screw rod. The conveying pipe passes through the feeding end and communicates with the feeding end.

6. The copper powder absorption and addition device for electroplating according to claim 1, characterized in that, The vacuum assembly includes a vacuum generator, the inlet of which is connected to a powder suction pipe, and the outlet of which is connected to a vibrating hopper.

7. The copper powder absorption and addition device for electroplating according to claim 4, characterized in that, It also includes a mounting plate, on which the feeding assembly is fixed.

8. The copper powder absorption and addition device for electroplating according to claim 7, characterized in that, It also includes a support assembly, on which the mounting plate and the vibrating hopper are fixed.

9. The copper powder absorption and addition device for electroplating according to claim 1, characterized in that, It also includes a copper powder loading cylinder, the vibration assembly includes a vibration motor, the end of the powder suction pipe away from the vacuum assembly and the vibration motor are disposed inside the copper powder loading cylinder, and the top of the copper powder loading cylinder is provided with a cover covering the cylinder body.

10. An electroplating system, characterized in that, The device includes the copper powder absorption and addition apparatus for electroplating as described in any one of claims 1-9.

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