Luminous efficiency detection equipment

By designing a light efficiency testing device and utilizing a collimated light source testing mechanism and an image recognition mechanism, the problem of low efficiency in testing the light efficiency performance of optical components was solved, achieving efficient and accurate light efficiency performance testing and reducing production costs.

CN223650142UActive Publication Date: 2025-12-09SUNNY OMNILIGHT TECH CO LTD
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Patent Information

Application Number
CN202520075253.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-01-13
Publication Date
2025-12-09
Estimated Expiration
2035-01-13

AI Technical Summary

Technical Problem

In existing technologies, the detection efficiency of optical components is low and easily affected by human factors, resulting in large detection errors.

Method used

A light efficiency testing device was designed, including a test box, a support mechanism, a collimating light source testing mechanism, and an image recognition mechanism. Through precise optical path design and automated image recognition, it can accurately identify and judge light spots, reduce human error, and improve testing efficiency and accuracy.

Benefits of technology

It achieves efficient, accurate, and stable luminous efficacy performance testing, reduces production costs, and improves production efficiency and the reliability of test results.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a lighting effect detection device. The lighting effect detection equipment comprises a test box which is provided with a test space; the bearing mechanism is arranged in the test space, the bearing mechanism is provided with a test through hole, and the test wafer is located at the test through hole; the collimation light source detection mechanism is located in the test space, the collimation light source detection mechanism is located on one side of the test through hole, and the collimation light source detection mechanism is used for providing test light for the test wafer; the image recognition mechanism and the collimation light source detection mechanism are located on the two opposite sides of the test through hole respectively, and the image recognition mechanism is used for receiving and recognizing light spots emitted by the test wafer. According to the utility model, the problem of low luminous efficiency performance detection efficiency of the optical element in the prior art is solved.
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Description

Technical Field

[0001] This utility model relates to the field of optical testing equipment technology, and more specifically, to a light efficiency testing device. Background Technology

[0002] With the development of optical devices, more and more electronic products need to incorporate optical components, and the luminous efficacy of some optical devices is a crucial testing standard that determines their quality. Currently, the luminous efficacy of some optical devices is mostly tested manually using optical paths, which is not only time-consuming and labor-intensive, resulting in low testing efficiency, but also susceptible to significant human factors during the testing process, leading to large testing errors.

[0003] In other words, existing optical components suffer from low efficiency in detecting optical performance. Utility Model Content

[0004] The main objective of this invention is to provide a light efficiency testing device to solve the problem of low light efficiency testing efficiency of optical components in the prior art.

[0005] To achieve the above objectives, according to one aspect of the present invention, a light efficiency testing device is provided, comprising: a test chamber having a test space; a support mechanism disposed within the test space and having a test through-hole, wherein a test wafer is located at the test through-hole; a collimating light source detection mechanism located within the test space and situated on one side of the test through-hole, the collimating light source detection mechanism being used to provide test light to the test wafer; and an image recognition mechanism located on opposite sides of the collimating light source detection mechanism, the image recognition mechanism being used to receive and identify the light spot emitted from the test wafer.

[0006] Furthermore, the support mechanism includes: a support plate connected to the inner wall of the test chamber, the support plate having a test area with a light-transmitting hole penetrating the support plate; a carrier having a test through hole for carrying a test wafer, a portion of which is located within the test through hole; and a carrier drive assembly disposed on the support plate for driving the carrier to move along a first direction and a second direction on the support plate, wherein the first direction is perpendicular to the second direction.

[0007] Furthermore, the collimated light source testing mechanism includes: a collimated light source assembly for emitting test light; a power detection assembly, a portion of which is located between the light output port of the collimated light source assembly and the test wafer, for detecting the power of the test light; and a light source driving assembly, which connects the collimated light source assembly and the power detection assembly to the light source driving assembly, which drives the collimated light source assembly and the power detection assembly to move in a first direction, a second direction, and a third direction, wherein the first direction, the second direction, and the third direction are perpendicular to each other.

[0008] Furthermore, the collimating light source assembly includes: a first oscillating component connected to the light source driving component, and a portion of the first oscillating component is oscillating relative to the light source driving component; and a light source connected to the first oscillating component, wherein the first oscillating component is used to adjust the tilt angle of the light-emitting surface of the light source relative to the test wafer.

[0009] Furthermore, the image recognition mechanism includes: a diffusion film located on the side of the support mechanism away from the collimating light source detection mechanism, the diffusion film being used to receive the light spot emitted from the test wafer; a functional camera assembly located on the side of the diffusion film away from the support mechanism, the functional camera assembly being used to capture the light spot on the diffusion film; and a recognition driving assembly, both the diffusion film and the functional camera assembly being connected to the recognition driving assembly, the recognition driving assembly being used to drive the diffusion film and the functional camera assembly to move in a first direction, a second direction, and a third direction, wherein the first direction, the second direction, and the third direction are perpendicular to each other.

[0010] Furthermore, the functional camera assembly includes: a second oscillating assembly connected to the recognition drive assembly, a portion of which is oscillating relative to the recognition drive assembly; and a functional camera connected to the second oscillating assembly, the second oscillating assembly being used to adjust the tilt angle of the light incident surface of the functional camera relative to the diffuser film.

[0011] Furthermore, the light efficiency testing equipment also includes a diffusion film cleaning mechanism, which is located on the side of the diffusion film away from the functional camera components. The diffusion film cleaning mechanism is used to clean dirt from the surface of the diffusion film.

[0012] Furthermore, the luminous efficacy testing equipment also includes a calibration mechanism, which is located on the same side of the support mechanism as the collimating light source testing mechanism. The calibration mechanism is used to calibrate the position of optical components within the test wafer.

[0013] Furthermore, the calibration mechanism includes: a laser displacement sensor for detecting the parallelism of the test wafer; a positioning camera for calibrating the position of optical components within the test wafer; and a calibration drive assembly for driving the laser displacement sensor and the positioning camera to move in a first direction, a second direction, and a third direction, wherein the first direction, the second direction, and the third direction are perpendicular to each other.

[0014] Furthermore, the calibration mechanism also includes a dispensing assembly connected to the calibration drive assembly. The dispensing assembly is used to apply adhesive markings to optical elements with poor light efficiency.

[0015] Furthermore, the calibration mechanism also includes a wiping assembly, which is used to wipe the dispensing head of the dispensing assembly.

[0016] Furthermore, the calibration mechanism also includes a curing component located on one side of the test via, which cures the adhesive applied to the wafer by the dispensing component.

[0017] The luminous efficacy testing equipment using the technical solution of this utility model includes a test chamber, a support mechanism, a collimating light source detection mechanism, and an image recognition mechanism. The test chamber has a test space; the support mechanism is set in the test space and has a test through-hole, at which the test wafer is located; the collimating light source detection mechanism is located in the test space and is located on one side of the test through-hole, and is used to provide test light to the test wafer; the image recognition mechanism is located on opposite sides of the collimating light source detection mechanism, and is used to receive and identify the light spot emitted from the test wafer.

[0018] The carrier mechanism is primarily used to support and fix the test wafer. Test vias are set on the carrier mechanism, and the collimated light source detection mechanism and image recognition mechanism are located on opposite sides of the carrier mechanism. This allows the test light emitted from the collimated light source detection mechanism to pass through the test wafer and be received by the image recognition mechanism. The image recognition mechanism then identifies the light spot emitted from the test wafer and determines whether its luminous efficacy meets the expected standards, reducing errors from human judgment and improving the accuracy and consistency of the test. The collimated light source detection mechanism provides test light to the wafer under test. This collimated light source detection mechanism provides a light source with consistent parallelism and stability in each test, resulting in a more uniform distribution of the light spot on the wafer. This allows for more accurate testing of the wafer's luminous efficacy, reducing factors such as light source instability caused by manual testing and improving testing efficiency. The image recognition mechanism utilizes modern image processing technologies, such as computer vision and deep learning algorithms, to automatically analyze the light spot image. The optical efficiency testing equipment of this application achieves efficient, accurate, and stable optical efficiency performance testing through innovations such as precise optical path design, automated image recognition, and multi-functional support mechanism. This improves production efficiency, reduces production costs, and provides strong technical support for enhancing the optical performance of glass products. Attached Figure Description

[0019] The accompanying drawings, which form part of this application, are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an undue limitation of the present invention. In the drawings:

[0020] Figure 1 A schematic diagram of the structure of a light efficacy detection device according to an optional embodiment of the present invention is shown; and

[0021] Figure 2 It shows Figure 1 A schematic diagram showing the positional relationship between the load-bearing mechanism, the collimating light source detection mechanism, and the calibration mechanism at one angle;

[0022] Figure 3 It shows Figure 1 Schematic diagram showing the positional relationship between the collimating light source detection mechanism and the image recognition mechanism;

[0023] Figure 4 It shows Figure 1 Schematic diagram of the collimation light source detection mechanism;

[0024] Figure 5 It shows Figure 1 Schematic diagram of the designation mechanism;

[0025] Figure 6 It shows Figure 2 A schematic diagram showing the positional relationship between the vehicle and its drive components;

[0026] Figure 7 It shows Figure 6 Schematic diagram showing the positional relationship between the carrier and the test wafer;

[0027] Figure 8 It shows Figure 1 A schematic diagram of the structure of an image recognition mechanism;

[0028] Figure 9 It shows Figure 2 A schematic diagram of the intermediate curing component.

[0029] The above figures include the following reference numerals:

[0030] 10. Test chamber; 11. Test space; 20. Support mechanism; 21. Support plate; 22. Carrier; 23. Carrier drive assembly; 30. Collimated light source detection mechanism; 31. Collimated light source assembly; 311. First swing assembly; 312. Light source; 32. Power detection assembly; 33. Light source drive assembly; 40. Image recognition mechanism; 41. Diffuser film; 42. Functional camera assembly; 421. Second swing assembly; 422. Functional camera; 43. Recognition drive assembly; 50. Diffuser film cleaning mechanism; 60. Calibration mechanism; 61. Laser displacement sensor; 62. Positioning camera; 63. Calibration drive assembly; 64. Dispensing assembly; 65. Removing assembly; 66. Curing assembly; 661. Curing light source; 662. Curing drive component; 100. Test wafer. Detailed Implementation

[0031] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0032] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0033] In this utility model, unless otherwise stated, directional terms such as "upper," "lower," "top," and "bottom" are generally used in relation to the direction shown in the accompanying drawings, or in relation to the vertical, perpendicular, or gravitational direction of the component itself; similarly, for ease of understanding and description, "inner" and "outer" refer to the inner and outer contours of each component itself, but the above directional terms are not used to limit this utility model.

[0034] In order to solve the problem of low efficiency in detecting the light efficacy of optical components in the prior art, the main purpose of this utility model is to provide a light efficacy detection device.

[0035] like Figures 1 to 9As shown, the light efficiency testing equipment includes a test chamber 10, a support mechanism 20, a collimating light source detection mechanism 30, and an image recognition mechanism 40. The test chamber 10 has a test space 11. The support mechanism 20 is disposed in the test space 11 and has a test through hole, at which the test wafer 100 is located. The collimating light source detection mechanism 30 is located in the test space 11 and is located on one side of the test through hole. The collimating light source detection mechanism 30 is used to provide test light to the test wafer 100. The image recognition mechanism 40 is located on opposite sides of the collimating light source detection mechanism 30 and is used to receive and identify the light spot emitted from the test wafer 100.

[0036] The carrier mechanism 20 is mainly used to support and fix the test wafer 100. Simultaneously, by setting test through-holes on the carrier mechanism 20, and with the collimating light source detection mechanism 30 and image recognition mechanism 40 located on opposite sides of the carrier mechanism 20, the test light emitted from the collimating light source detection mechanism 30 is received by the image recognition mechanism 40 after passing through the test wafer 100. The image recognition mechanism 40 identifies the light spot emitted from the test wafer 100 and determines whether its luminous efficacy meets the expected standards, reducing errors from human judgment and improving the accuracy and consistency of the detection. The collimating light source detection mechanism 30 provides test light to the wafer 100. This collimating light source detection mechanism 30 provides a light source with the same parallelism and stability in each test, making the light spot distribution on the wafer more uniform, thus more accurately testing the luminous efficacy of the wafer and reducing factors such as light source instability caused by manual testing, thereby improving detection efficiency. The image recognition mechanism 40 utilizes modern image processing technologies, such as computer vision and deep learning algorithms, to automatically analyze the light spot image. The optical efficiency testing equipment of this application achieves efficient, accurate, and stable optical efficiency performance testing through innovations such as precise optical path design, automated image recognition, and multi-functional support mechanism. This improves production efficiency, reduces production costs, and provides strong technical support for enhancing the optical performance of glass products.

[0037] Furthermore, the design of the test chamber 10 ensures the isolation of the test space 11 from the external environment, avoiding the influence of environmental factors such as external light, temperature changes, and dust on the test results, thus guaranteeing the stability and reliability of the test. Preferably, the internal structure of the test chamber 10 is entirely black to reduce the influence of reflected light on the test.

[0038] In some optional embodiments, the image recognition mechanism 40 can also record test data for each product, including spot shape, diffraction efficiency, energy distribution, etc., to facilitate subsequent data analysis and product quality tracking, and also to provide data support for product optimization and process improvement.

[0039] In some alternative embodiments, please refer to Figure 2 , Figure 6 and Figure 7 The support mechanism 20 includes a support plate 21, a carrier 22, and a carrier drive assembly 23. The support plate 21 is connected to the inner wall of the test chamber 10 and has a test area with a light-transmitting hole penetrating through it. The carrier 22 has a test through-hole and is used to carry a test wafer 100, a portion of which is located within the test through-hole. The carrier drive assembly 23 is mounted on the support plate 21 and is used to drive the carrier 22 to move along a first direction and a second direction on the support plate 21, wherein the first direction is perpendicular to the second direction. The connection between the support plate 21 and the inner wall of the test chamber 10 reduces vibration or displacement during the testing process, ensuring the stability of the testing environment and thus improving the reliability of the testing results. The light-transmitting hole on the support plate 21 and the test through-hole of the carrier 22 ensure that only the light spot aligned with the test wafer and the test through-hole can be recognized by the image recognition mechanism 40, improving the accuracy of the testing. The carrier drive assembly 23 can drive the carrier 22 to move on the support plate 21 along a first direction (e.g., along the X-axis) and a second direction (e.g., along the Y-axis). This can change the alignment position of the test wafer and the test via, allowing the image recognition mechanism 40 and the collimating light source detection mechanism 30 to test optical elements at different positions on the test wafer 100. This enables rapid detection of all optical elements on the test wafer, greatly improving detection efficiency. Simultaneously, the ability of the carrier drive assembly 23 to drive the carrier 22 reduces reliance on operators. Operators only need to place the test wafer 100 on the carrier 22, and the optical efficiency detection equipment can automatically complete the positioning, movement, and detection of the test wafer 100, reducing labor costs and minimizing errors that may result from human operation.

[0040] Furthermore, the movable design of the carrier 22 and the detachable design of the carrier 22 and the support plate 21 not only facilitate the maintenance and adjustment of the luminous efficacy testing equipment, but also eliminate the need for extensive disassembly of the entire equipment when the carrier 22 needs to be replaced or adjusted, reducing maintenance costs and time. It also enables the luminous efficacy testing equipment to test wafers of various models and sizes, enhancing its versatility; for example, different sized carriers 22 can be used when testing wafers of different sizes.

[0041] The precise movement of the carrier 22 enables the optical efficiency inspection to test each optical component on the test wafer 100 individually, improving the comprehensiveness and efficiency of the test. On large-scale production lines, this high-precision movement control is crucial for ensuring product quality and production cycle time, especially in scenarios where testing optical components at multiple locations on the test wafer 100 is required. On large-scale production lines, the test wafer 100 contains a large number of densely distributed optical components. Through the precise movement of the carrier 22, the optical efficiency inspection equipment can efficiently and accurately test each optical component, significantly improving the testing capacity and speed of the production line. This precise positioning and testing capability is indispensable, especially when handling high-density wafers.

[0042] In some alternative embodiments, the vehicle 22 has foolproof and leveling functions.

[0043] In some alternative embodiments, please refer to Figure 4 The collimated light source detection mechanism 30 includes a collimated light source assembly 31, a power detection assembly 32, and a light source driving assembly 33. The collimated light source assembly 31 is used to emit test light. A portion of the power detection assembly 32 is located between the light outlet of the collimated light source assembly 31 and the test wafer 100. The power detection assembly 32 is used to detect the power of the test light. The collimated light source assembly 31 and the power detection assembly 32 are connected to the light source driving assembly 33. The light source driving assembly 33 drives the collimated light source assembly 31 and the power detection assembly 32 to move in a first direction, a second direction, and a third direction, wherein the first direction, the second direction, and the third direction are perpendicular to each other. The power detection component 32 is located between the light outlet of the collimating light source component 31 and the wafer 100 under test. It can monitor the power of the test light in real time to ensure the stability of the test light power during operation. Based on the light power detected by the power detection component 32, it can adaptively adjust the power of the test light emitted by the collimating light source component 31, effectively ensuring the consistency of the test light power during wafer testing. This prevents inaccurate test results due to light power fluctuations, thus improving the reliability and consistency of the test. The light source driving component 33 can drive the collimating light source component 31 and the power detection component 32 to move in three vertical directions (assuming X, Y, and Z axes), achieving automatic alignment and adjustment of the light source. This automated adjustment improves the efficiency of optical path setup, shortens test preparation time, and ensures the consistency of light source intensity and angle at different test positions. The ability of the collimating light source component 31 to move in three directions allows it to meet the testing requirements of different sizes and models of test wafers for different light effects, effectively improving the testing flexibility and applicability of the light effect testing equipment.

[0044] Furthermore, the ability of the light source driving component 33 to drive the collimating light source component 31 and the power detection component 32 enables the luminous efficacy testing equipment to automatically adjust the light source position according to the set requirements during the testing process. This reduces preparation time before product testing and manual adjustments during testing, improving the automation level and overall testing efficiency. Automated adjustment and real-time detection of light power help reduce human error and ensure that the conditions for each test are the same, thereby improving the accuracy and comparability of the test results.

[0045] In some alternative embodiments, please refer to Figure 4 The collimating light source assembly 31 includes a first oscillating assembly 311 and a light source 312. The first oscillating assembly 311 is connected to the light source driving assembly 33, and a portion of the first oscillating assembly 311 can oscillate relative to the light source driving assembly 33. The light source 312 is connected to the first oscillating assembly 311, and the first oscillating assembly 311 is used to adjust the tilt angle of the light-emitting surface of the light source 312 relative to the test wafer 100. The first oscillating assembly 311 allows the light source 312 to oscillate relative to the light source driving assembly 33, which means that the light-emitting surface of the light source 312 can be finely adjusted to the optimal tilt angle to ensure that the light beam can accurately illuminate the optical elements of the test wafer 100, achieving more accurate light efficiency detection. The tilt angle of the light source 312 directly affects the detection accuracy. By setting the first oscillating assembly 311, the incident angle of the light beam can be adjusted according to the detection requirements, avoiding detection errors caused by angle deviations and improving the accuracy and reliability of the detection results. Different optical waveguide products may have specific requirements for the incident angle of the light source. The adjustability of the first swing component 311 enables the light efficiency testing equipment to adapt to various product testing needs, improving the equipment's flexibility and versatility. Furthermore, the design of the first swing component 311 allows for automated adjustment of the light source's tilt angle, reducing the need for manual adjustments, improving testing efficiency, and minimizing inconsistencies caused by manual operation.

[0046] The combination of the first swing component 311 and the light source drive component 33 further increases the degree of freedom of adjustment of the light source 312, so that the position of the light source 312 can be adjusted in multiple directions, such as the first direction, the second direction, the third direction, and the degree of tilt relative to the carrier plate 21.

[0047] In some alternative embodiments, please refer to Figure 8The image recognition mechanism 40 includes a diffusion film 41, a functional camera assembly 42, and a recognition drive assembly 43. The diffusion film 41 is located on the side of the support mechanism 20 away from the collimating light source detection mechanism 30, and is used to receive the light spot emitted from the test wafer 100. The functional camera assembly 42 is located on the side of the diffusion film 41 away from the support mechanism 20, and is used to capture the light spot on the diffusion film 41. Both the diffusion film 41 and the functional camera assembly 42 are connected to the recognition drive assembly 43, which is used to drive the diffusion film 41 and the functional camera assembly 42 to move in a first direction, a second direction, and a third direction, wherein the first direction, the second direction, and the third direction are perpendicular to each other. The diffusion film 41 is positioned on the side of the support mechanism 20 away from the collimating light source detection mechanism 30, and its function is to uniformly present the light spot emitted from the test wafer on the diffusion film 41, ensuring that the functional camera assembly 42 can capture a clear and complete image of the light spot. The presence of the diffusion film 41 optimizes the distribution and size of the light spot, which helps to more accurately identify the shape and diffraction efficiency of the light spot. The recognition drive assembly 43 drives the diffusion film 41 and the functional camera assembly 42 to move in three vertical directions (X, Y, and Z axes). This design enables the image recognition mechanism 40 to automatically align with each product on the test wafer, ensuring that spot images are captured from the optimal angle and distance, thus improving the accuracy and efficiency of image recognition. The ability to move in three directions allows the functional camera assembly 42 and the diffusion film 41 to adapt to wafer products of different positions, sizes, and shapes, as well as image capture under different inspection requirements, enhancing the flexibility and versatility of the inspection equipment.

[0048] Optionally, the spot images captured by the functional camera component 42 can be recorded as data for subsequent analysis and processing. Image analysis techniques, such as computer vision algorithms, can automatically identify the characteristics of the spot and calculate key parameters such as diffraction efficiency and energy distribution, providing data support for product quality control and process optimization.

[0049] In some alternative embodiments, please refer to Figure 8The functional camera assembly 42 includes a second swing assembly 421 and a functional camera 422. The second swing assembly 421 is connected to the recognition drive assembly 43, and a portion of the second swing assembly 421 can swing relative to the recognition drive assembly 43. The functional camera 422 is connected to the second swing assembly 421, and the second swing assembly 421 is used to adjust the tilt angle of the light-incident surface of the functional camera 422 relative to the diffuser film 41. The second swing assembly 421 can adjust the shooting angle of the functional camera 422 so that when the functional camera 422 captures the light spot on the diffuser film 41, it can ensure that the light enters the camera at the optimal angle, thereby obtaining a light spot image with higher clarity and contrast, improving the accuracy and reliability of image recognition. Fine-tuning the camera tilt angle helps to find the optimal focus position, ensuring that the light spot image is in sharp focus and avoiding recognition errors caused by image blur. At the same time, it can adjust the shooting angle according to the distribution of the light spot on the diffuser film to capture the most complete light spot image for subsequent analysis. Optimizing the camera tilt angle helps improve the accuracy of image recognition and is crucial for the accurate measurement of key parameters such as spot shape, diffraction efficiency, and energy distribution, thereby improving the overall accuracy of light effect performance detection. Different light effect detection scenarios may require different camera tilt angles. The adjustability of the second swing component 421 allows the functional camera 422 to adapt to various detection conditions, improving the flexibility and applicability of the equipment.

[0050] Furthermore, the combination of the functional camera assembly 42 and the recognition drive assembly 43 allows the functional camera 422 to be adjusted in multiple directions, increasing the freedom of shooting with the functional camera 422 and facilitating the detection of light effects in different scenarios. In addition, the adjustment process of the second swing assembly 421 and the recognition drive assembly 43 can be automated, reducing manual intervention, improving detection efficiency, ensuring the consistency of detection conditions, and reducing errors caused by human operation.

[0051] In some alternative embodiments, please refer to Figure 2 The light efficiency testing equipment also includes a diffusion film cleaning mechanism 50, located on the side of the diffusion film 41 away from the functional camera assembly 42. The diffusion film cleaning mechanism 50 is used to clean contaminants from the surface of the diffusion film 41. Cleaning the diffusion film 41 is crucial for accurate light efficiency testing. Any contaminants or dust can affect the light diffusion effect, causing distortion in the spot shape, diffraction efficiency, or energy distribution data received by the image recognition mechanism 40. The diffusion film cleaning mechanism 50 cleans the surface of the diffusion film 41, thereby maintaining its transparency and diffusion performance, and improving the accuracy and consistency of the testing results.

[0052] Furthermore, the continuous accumulation of dirt may gradually erode the surface of the diffusion film 41, leading to a decline in its optical performance or even damage. The diffusion film cleaning mechanism 50 enables regular cleaning of the diffusion film 41, which helps extend the service life of the diffusion film 41, reduces the frequency of replacement of the diffusion film 41, and lowers long-term operating costs.

[0053] In some alternative embodiments, please refer to Figure 1 The luminous efficacy testing equipment also includes a calibration mechanism 60, which is located on the same side of the support mechanism 20 as the collimating light source testing mechanism 30. The calibration mechanism 60 is used to calibrate the positions of optical components within the test wafer 100. The calibration mechanism 60 can directly calibrate the positions of the optical components within the test wafer 100 on the support mechanism 20. This function can obtain accurate position information for each optical component on the test wafer 100, which is crucial for subsequent automated testing. It enables precise positioning of each optical component on the test wafer 100, ensuring the accuracy and consistency of the testing. The calibration mechanism 60 is closely integrated with the automated testing process. It can automatically calibrate the positions of the optical components within the test wafer 100 before testing begins, reducing the need for manual operation, accelerating pre-test preparation, and improving testing efficiency. Furthermore, automated calibration reduces human error and improves the reliability of the testing.

[0054] For the multiple optical elements arranged on the test wafer 100, the calibration mechanism 60 can calculate their matrix positions, providing a basis for positional information for the accurate detection of individual optical elements and the comprehensive detection of the entire test wafer 100. This helps the luminous efficacy testing equipment automatically identify the relative position of each optical element and perform targeted luminous efficacy performance testing. The calibration mechanism 60 can provide high-precision positional information, ensuring that the relative positions between the collimating light source detection mechanism 30, the image recognition mechanism 40, and the optical elements are accurate during the testing process, thereby improving the accuracy and reliability of the luminous efficacy data.

[0055] In some alternative embodiments, please refer to Figure 5 The calibration mechanism 60 includes a laser displacement sensor 61, a positioning camera 62, and a calibration drive assembly 63. The laser displacement sensor 61 is used to detect the parallelism of the test wafer 100; the positioning camera 62 is used to calibrate the position of optical elements within the test wafer 100; and the calibration drive assembly 63 is used to drive the laser displacement sensor 61 and the positioning camera 62 to move in a first direction, a second direction, and a third direction, wherein the first direction, the second direction, and the third direction are perpendicular to each other.

[0056] The laser displacement sensor 61 is used to detect the parallelism of the test wafer 100, ensuring that the test wafer maintains a precise parallel relationship with other parts of the inspection equipment (such as the light source and camera) during inspection. This detection is crucial for the accurate evaluation of optical performance, as non-parallelism of the wafer can lead to deviations in the optical path, affecting the reliability of the inspection results. The calibration drive assembly 63 can automatically adjust the position of the test wafer based on the detection results of the laser displacement sensor 61, ensuring that its parallelism meets the inspection requirements. The positioning camera 62 is used to calibrate the specific positions of optical components (such as optical waveguides) within the test wafer 100. This precise calibration is particularly important for automated inspection, as different optical components may require different inspection parameters and position settings. The positioning camera 62 ensures that the inspection of each optical component is performed in the optimal position, improving the accuracy and efficiency of the inspection. The ability to move in three vertical directions allows the calibration mechanism 60 to adapt to wafers of different sizes, shapes, and positions, as well as precise alignment under different inspection requirements. This enhances the versatility and adaptability of the equipment, enabling it to handle various types of wafers and optical components, and improving the flexibility of the production line.

[0057] In some alternative embodiments, please refer to Figure 5 The calibration mechanism 60 also includes a dispensing assembly 64, which is connected to the calibration drive assembly 63. The dispensing assembly 64 is used to apply adhesive markings to optical components with poor light efficiency. Combined with the calibration drive assembly 63, the dispensing assembly 64 accurately marks the optical components with poor light efficiency using the position information provided by the calibration mechanism 60 and the image recognition mechanism 40. This marking not only visually displays the location of the defective components but also ensures accuracy and reduces marking errors. The adhesive marking of defective optical components provides clear indications for subsequent rejection or repair, facilitating rapid identification and processing of defective components, optimizing subsequent wafer processing workflows, and improving production efficiency and wafer yield.

[0058] The dispensing assembly 64 in this application can achieve automated dispensing and marking by relying on the control system inside the optical efficiency inspection equipment, reducing reliance on personnel. Especially in large-scale wafer inspection, manual inspection and marking of defective components is not only time-consuming and labor-intensive, but may also lead to marking errors due to visual fatigue. The introduction of the dispensing assembly significantly reduces labor costs and marking error rates. The program-controlled dispensing assembly 64 can ensure the consistency and reliability of each marking, avoiding the subjectivity and uncertainty of manual operation, and ensuring the accurate identification and marking of optically defective components. The marking results of the dispensing assembly 64 can be recorded together with the inspection data, providing detailed information on the location of defective optical components for data analysis and quality control, which helps to deeply analyze the causes of defects and optimize manufacturing processes and quality control strategies.

[0059] In some alternative embodiments, please refer to Figure 2 The calibration mechanism 60 also includes an adhesive wiping component 65, which is used to wipe the dispensing head of the dispensing component 64. The adhesive wiping component 65 is responsible for cleaning the dispensing head, ensuring that its surface is free of residual adhesive or other contaminants. This is crucial for marking defective products on wafers, as residues can affect the accuracy and marking effect of subsequent dispensing, leading to inaccurate or unclear markings. A clean dispensing head improves the quality of marking. After each dispensing operation, the adhesive wiping component 65 promptly removes the adhesive from the dispensing head, preventing it from curing or accumulating, ensuring that the required amount of adhesive is applied accurately for the next dispensing, and avoiding marking errors caused by uneven, excessive, or insufficient adhesive application. The use of the adhesive wiping component 65 ensures the cleanliness of the dispensing head, avoids the impact of adhesive residue on subsequent dispensing operations, and guarantees the accuracy and consistency of marking. This design is extremely critical in production environments requiring frequent dispensing and marking, significantly improving equipment stability and the reliability of test results. The adhesive cleaning component 65 features a regular cleaning function for the dispensing head, ensuring its cleanliness and preventing adhesive residue from affecting the accuracy of subsequent dispensing and marking. This cleaning function is particularly important in production environments with frequent dispensing and marking, ensuring long-term stable operation of the equipment and preventing production problems caused by inaccurate marking. It is suitable for high-load production lines requiring high efficiency and high-precision marking.

[0060] In some alternative embodiments, please refer to Figure 5 The calibration mechanism 60 also includes a curing component 66, located on one side of the test via. The curing component 66 cures the adhesive applied to the wafer by the dispensing component 64. During optical efficiency testing, for any defective optical components detected, the equipment uses the dispensing component 64 to mark their location on the test wafer 100 for subsequent processing or rejection. The curing component 66 rapidly cures the marking adhesive using UV light or other curing light sources, ensuring the durability and clarity of the marking position. The marking effect is not affected even if the equipment continues to operate or the wafer moves. The curing component 66 ensures that the marking adhesive is fixed to the test wafer 100, preventing it from being wiped off in subsequent processes and guaranteeing the durability of the marking position.

[0061] exist Figure 9 In the specific embodiment shown, the curing component 66 further includes a curing light source 661 and a curing drive 662, wherein the curing drive 662 drives the curing light source 661 to move in a first direction and a second direction.

[0062] Step S10: When performing light effect testing on the test wafer 100, after placing the test wafer 100 into the carrier 22, the periphery of the test wafer 100 is flattened by pressing the cover.

[0063] Step S20: Place the carrier 22 onto the carrier drive assembly 23. Use the positioning pins on the carrier drive assembly 23 to limit the placement direction of the carrier 22. Then close the door of the light effect detection equipment. Then press the start button of the light effect detection equipment to mark and position the optical components on the test wafer 100 (reference point positioning). Calculate the position of the optical component matrix to make position calibration for the subsequent single product inspection.

[0064] In step S30, the light source 312, the test wafer 100, and the diffusion film 41 are located on the same axis. The collimated light emitted by the light source 312 illuminates the test wafer 100 and projects multiple magnified light spots onto the diffusion film 41. The functional camera 422 photographs the diffusion film 41 and identifies the shape, diffraction efficiency, and energy of the multiple light spots, and obtains the corresponding parameters.

[0065] Step S40: The functional camera 422 can automatically adjust the shooting angle and capture the projected light spot on the diffusion film 41 in one shot. The camera 422 then performs calculation and analysis, comparing the light spot shape and power range provided by the customer. If the area meets the criteria, it is OK; otherwise, it is NG.

[0066] Step S50, repeat steps S30 to S40 to complete the light efficiency test of all optical components on the test wafer 100.

[0067] In step S60, after the light efficiency test of all optical components on the test wafer 100 is completed, if there are defective optical components, the dispensing assembly 64 is activated to dispense and mark the defective optical components on the test wafer 100, and then cure them through the curing assembly 66. After marking, the optical component is considered to be defective. If there are no defective products, the test is completed in step S50.

[0068] Obviously, the embodiments described above are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of this utility model.

[0069] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0070] It should be noted that the terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in sequences other than those illustrated or described herein.

[0071] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A light efficiency detection device, characterized in that, include: Test chamber (10), the test chamber (10) having test space (11); A support mechanism (20) is disposed within the test space (11), and the support mechanism (20) has a test via, and the test wafer (100) is located at the test via; A collimated light source detection mechanism (30) is located within the test space (11) and is located on one side of the test via. The collimated light source detection mechanism (30) is used to provide test light to the test wafer (100). An image recognition mechanism (40) is located on opposite sides of the test via and the collimating light source detection mechanism (30). The image recognition mechanism (40) is used to receive and identify the light spot emitted from the test wafer (100).

2. The luminous efficacy detection device according to claim 1, characterized in that, The supporting mechanism (20) includes: The support plate (21) is connected to the inner wall of the test box (10). The support plate (21) has a test area and a light-transmitting hole that passes through the support plate (21). A carrier (22) having the test via, the carrier (22) being used to carry the test wafer (100), a portion of the test wafer (100) being located within the test via; A vehicle drive assembly (23) is disposed on the support plate (21) and is used to drive the vehicle (22) to move along a first direction and a second direction on the support plate (21), wherein the first direction is perpendicular to the second direction.

3. The luminous efficacy detection device according to claim 1, characterized in that, The collimated light source detection mechanism (30) includes: Collimated light source assembly (31), the collimated light source assembly (31) is used to emit the test light; A power detection component (32) is provided, a portion of which is located between the light outlet of the collimating light source component (31) and the test wafer (100). The power detection component (32) is used to detect the power of the test light. A light source driving component (33) is connected to the collimating light source component (31) and the power detection component (32). The light source driving component (33) drives the collimating light source component (31) and the power detection component (32) to move in a first direction, a second direction and a third direction, wherein the first direction, the second direction and the third direction are perpendicular to each other.

4. The luminous efficacy detection device according to claim 3, characterized in that, The collimating light source assembly (31) includes: A first swing component (311) is connected to the light source driving component (33), and a portion of the first swing component (311) is swingable relative to the light source driving component (33). A light source (312) is connected to the first oscillating component (311), which is used to adjust the tilt angle of the light-emitting surface of the light source (312) relative to the test wafer (100).

5. The luminous efficacy detection device according to claim 1, characterized in that, The image recognition mechanism (40) includes: A diffusion film (41) is located on the side of the support mechanism (20) away from the collimating light source detection mechanism (30), and the diffusion film (41) is used to receive the light spot emitted from the test wafer (100); A functional camera assembly (42) is located on the side of the diffusion film (41) away from the support mechanism (20), and the functional camera assembly (42) is used to capture light spots on the diffusion film (41); The recognition driving component (43) is connected to both the diffusion film (41) and the functional camera component (42). The recognition driving component (43) is used to drive the diffusion film (41) and the functional camera component (42) to move in a first direction, a second direction and a third direction, wherein the first direction, the second direction and the third direction are perpendicular to each other.

6. The luminous efficacy detection device according to claim 5, characterized in that, The functional camera component (42) includes: A second swing component (421) is connected to the recognition drive component (43), and a portion of the second swing component (421) is swingable relative to the recognition drive component (43). A functional camera (422) is connected to a second oscillating component (421), which is used to adjust the tilt angle of the light incident surface of the functional camera (422) relative to the diffuser film (41).

7. The luminous efficacy detection device according to claim 5, characterized in that, The light effect detection device also includes a diffusion film cleaning mechanism (50), which is located on the side of the diffusion film (41) away from the functional camera assembly (42) and is used to clean dirt from the surface of the diffusion film (41).

8. The luminous efficacy detection device according to any one of claims 1 to 7, characterized in that, The light effect testing equipment also includes a calibration mechanism (60), which is located on the same side of the support mechanism (20) as the collimating light source testing mechanism (30). The calibration mechanism (60) is used to calibrate the position of the optical element in the test wafer (100).

9. The luminous efficacy detection device according to claim 8, characterized in that, The calibration mechanism (60) includes: A laser displacement sensor (61) is used to detect the parallelism of the test wafer; A positioning camera (62) is used to calibrate the position of optical elements within the test wafer (100); A calibration drive assembly (63) is used to drive the laser displacement sensor (61) and the positioning camera (62) to move in a first direction, a second direction and a third direction, wherein the first direction, the second direction and the third direction are perpendicular to each other.

10. The luminous efficacy detection device according to claim 9, characterized in that, The calibration mechanism (60) further includes a dispensing assembly (64), which is connected to the calibration drive assembly (63) and is used to apply adhesive markings to optical elements with poor light efficiency.

11. The luminous efficacy detection device according to claim 10, characterized in that, The calibration mechanism (60) further includes a wiping assembly (65) for wiping the dispensing head of the dispensing assembly (64).

12. The luminous efficacy detection device according to claim 10, characterized in that, The calibration mechanism (60) further includes a curing component (66) located on one side of the test via, the curing component (66) curing the adhesive applied by the dispensing component (64) on the test wafer (100).