Integrated circuit support plate detection equipment

Abstract

The utility model discloses an integrated circuit carrier plate detection device. The integrated circuit carrier plate detection device comprises a first feeding bin, a second feeding bin and a third feeding bin, a first conveying platform; overturning the platform; the feeding grabbing device can move between a first position and a second position, and a first grabbing hand and a second grabbing hand are arranged on the feeding grabbing device. When the feeding grabbing device is located at the first position, the first grabbing hand is suitable for grabbing a carrier plate on the first conveying platform, and the second grabbing hand is suitable for grabbing a carrier plate in the first feeding bin. When the feeding grabbing device is located at the second position, the first grabbing hand is suitable for placing the grabbed carrier plate on the overturning platform, and the second grabbing hand is suitable for placing the grabbed carrier plate on the first conveying platform. According to the embodiment of the utility model, the integrated circuit carrier plate detection equipment has the advantages of high detection efficiency and the like.

Description

Technical Field

[0001] This utility model relates to the field of integrated circuit manufacturing technology, and more specifically, to an integrated circuit substrate testing device. Background Technology

[0002] In the manufacturing process of IC (integrated circuit) substrates, it is necessary to accurately and quickly detect and identify scratches, dents, and other defects on the substrate surface and other areas, and promptly screen out defective products. As an indispensable and important component of electronic products, IC substrates are gradually developing towards miniaturization, densification, and integration. Manual inspection can no longer meet the needs of IC substrate production.

[0003] The integrated circuit substrate testing equipment in related technologies has low substrate loading efficiency and long waiting time between each substrate testing process, resulting in low testing efficiency. Utility Model Content

[0004] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes an integrated circuit substrate testing device, which has the advantages of high testing efficiency.

[0005] To achieve the above objectives, an integrated circuit substrate testing device is proposed according to an embodiment of the present invention. The integrated circuit substrate testing device includes: a first feeding bin; a first conveying platform; a flipping platform; and a feeding gripping device. The feeding gripping device is movable between a first position and a second position. The feeding gripping device is provided with a first gripper and a second gripper. When the feeding gripping device is in the first position, the first gripper is adapted to grip the substrate on the first conveying platform and the second gripper is adapted to grip the substrate in the first feeding bin. When the feeding gripping device is in the second position, the first gripper is adapted to place the gripped substrate on the flipping platform and the second gripper is adapted to place the gripped substrate on the first conveying platform.

[0006] The integrated circuit substrate testing equipment according to the present invention has the advantages of high testing efficiency.

[0007] In addition, the integrated circuit substrate testing equipment according to the above embodiments of this utility model may also have the following additional technical features:

[0008] According to one embodiment of the present invention, the integrated circuit substrate testing equipment further includes a second feeding bin, and the feeding gripping device further has a third position, wherein when the feeding gripping device is in the third position, the second gripper is adapted to grip the substrate in the second feeding bin.

[0009] According to one embodiment of the present invention, the integrated circuit carrier board inspection device further includes a second conveying platform. The flipping platform is flippable between a front position and a back position. When the flipping platform is in the front position, it is located between the first conveying platform and the second conveying platform in the left-right direction. When the flipping platform is in the back position, it is located directly above the second conveying platform. When the feeding gripping device is in the second position, the first gripper is adapted to place the gripped carrier board on the flipping platform in the front position.

[0010] According to one embodiment of the present invention, when the feeding gripping device is in the third position, the flipping platform is located in the reverse position.

[0011] According to one embodiment of the present invention, the feeding gripper can slide left and right. The second feeding bin, the first feeding bin, the first conveying platform, and the flipping platform are arranged sequentially from right to left in the left-right direction. The distance between the first gripper and the second gripper in the left-right direction is equal to the distance between the first feeding bin and the second feeding bin in the left-right direction, equal to the distance between the first feeding bin and the first conveying platform in the left-right direction, and equal to the distance between the first conveying platform and the flipping platform at the front position in the left-right direction.

[0012] According to one embodiment of the present invention, the integrated circuit substrate inspection equipment further includes a front inspection device and a back inspection device, wherein the first conveying platform is adapted to convey the substrate to the front inspection device, and the second conveying platform is adapted to convey the substrate to the back inspection device.

[0013] According to one embodiment of the present invention, the integrated circuit carrier board inspection equipment further includes: a defective material bin; a first unloading bin and a second unloading bin; and an unloading gripping device, the unloading gripping device being adapted to move the carrier board on the second conveying platform to the first unloading bin, the second unloading bin, or the defective material bin.

[0014] According to one embodiment of the present invention, the integrated circuit substrate testing equipment further includes a cabinet, wherein the first loading bin, the second loading bin, the first unloading bin, the second unloading bin, and the defective product bin are slidably disposed on the front surface of the cabinet, the loading gripping device and the unloading gripping device are disposed at the front of the cabinet, and the front detection device and the back detection device are disposed at the rear of the cabinet.

[0015] According to one embodiment of the present invention, the integrated circuit carrier board testing equipment further includes a display and control device, which is disposed on the front surface of the cabinet.

[0016] According to one embodiment of the present invention, the integrated circuit carrier board testing equipment further includes a blower, the first conveying platform, the second conveying platform and the flipping platform are all vacuum adsorption platforms, the blower is connected to the first conveying platform, the second conveying platform and the flipping platform respectively, and the blower is located outside the cabinet.

[0017] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0018] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0019] Figure 1 This is a structural schematic diagram of an integrated circuit carrier board testing device according to an embodiment of the present utility model.

[0020] Figure 2 This is a structural schematic diagram of an integrated circuit carrier board testing device according to an embodiment of the present utility model.

[0021] Figure 3 This is a structural schematic diagram of an integrated circuit carrier board testing device according to an embodiment of the present utility model.

[0022] Figure 4 This is a schematic diagram of the operation process of the integrated circuit carrier board testing equipment according to an embodiment of the present utility model.

[0023] Reference numerals: Integrated circuit carrier board inspection equipment 1, first feeding bin 11, second feeding bin 12, first conveying platform 21, second conveying platform 22, flipping platform 30, first gripper 41, second gripper 42, front inspection device 51, back inspection device 52, defective product bin 61, first unloading bin 62, second unloading bin 63, unloading gripping device 70, mounting plate 81, carrier board 2. Detailed Implementation

[0024] This application is based on the inventor's discoveries and understanding of the following facts and problems:

[0025] The integrated circuit substrate testing equipment in related technologies has low substrate loading efficiency and long waiting time between each substrate testing process, resulting in low testing efficiency.

[0026] Specifically, the testing process for integrated circuit substrates requires a gripping device to remove the substrate from the loading hopper and place it at the first-side testing station. After the first-side testing is completed, the gripping device transfers the substrate to a flipping device, which flips the substrate to the second side for testing. Both the transfer of the substrate from the hopper to the first-side testing station and from the first-side testing station to the flipping device rely on the gripping device. During these transfers, other devices must wait for the transfers to complete, resulting in a long idle time and a long testing interval between the two substrates, leading to low testing efficiency.

[0027] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0028] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, features defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0029] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0030] The integrated circuit carrier board testing device 1 according to an embodiment of the present invention is described below with reference to the accompanying drawings.

[0031] like Figures 1-4As shown, the integrated circuit carrier board testing equipment 1 according to an embodiment of the present utility model includes a first feeding bin 11, a first conveying platform 21, a flipping platform 30, and a feeding gripping device.

[0032] The feeding gripping device is movable between a first position and a second position. The feeding gripping device is provided with a first gripper 41 and a second gripper 42. When the feeding gripping device is in the first position, the first gripper 41 is adapted to grip the carrier plate 2 on the first conveying platform 21 and the second gripper 42 is adapted to grip the carrier plate 2 of the first feeding bin 11. When the feeding gripping device is in the second position, the first gripper 41 is adapted to place the gripped carrier plate 2 on the flipping platform 30 and the second gripper 42 is adapted to place the gripped carrier plate 2 on the first conveying platform 21.

[0033] Specifically, the first gripper 41 and the second gripper 42 can grasp the carrier plate by vacuum adsorption. The first feeding bin 11 is suitable for stacking the carrier plate 2. The first conveying platform 21 is suitable for conveying the carrier plate 2 to the inspection station, and the flipping platform 30 is suitable for flipping the carrier plate 2.

[0034] The carrier plate 2 is transferred from the first feeding bin 11 to the first conveying platform 21 through the feeding gripping device. The first conveying platform 21 conveys the carrier plate 2 for inspection. After the inspection of one side is completed, the feeding gripping device transfers the carrier plate 2 on the first conveying platform 21 to the flipping platform 30. The flipping platform 30 flips the carrier plate 2 to facilitate the inspection of the other side.

[0035] When the feeding gripper is in the first position, as follows: Figure 4 As shown in step c, when the feeding gripper is in the second position, as... Figure 4 As shown in step d.

[0036] like Figure 4 As shown, the feeding gripper moves to the first position, the second gripper 42 grips the carrier plate 2 in the first feeding bin 11, and the first gripper 41 grips the carrier plate 2 on the first conveying platform 21. Then the feeding gripper moves to the second position, the second gripper 42 places the carrier plate 2 on the first conveying platform 21, and the first gripper 41 places the carrier plate 2 on the flipping platform 30.

[0037] In other words, by moving the feeding gripper once, the carrier plate 2 of the first feeding bin 11 can be transferred to the first conveying platform 21 by the second gripper 42, while the carrier plate 2 of the first conveying platform 21 can be transferred to the flipping platform 30 by the first gripper 41, so as to realize the handling of two carrier plates 2 at the same time.

[0038] By reciprocating between the first and second positions, the loading gripper can continuously transfer the carrier plate 2 in the first loading bin 11 to the first conveying platform 21, and transfer the carrier plate 2 on the first conveying platform 21 to the flipping platform 30.

[0039] According to the embodiment of the present invention, the integrated circuit carrier board testing equipment 1, by setting up a first conveying platform 21, a flipping platform 30 and a feeding gripping device, can realize the automatic transfer, automatic conveying and automatic flipping of the carrier board 2. Compared with the manual testing method in related technologies, it can improve the automation level of the testing process.

[0040] Furthermore, by making the feeding gripping device movable between a first position and a second position, a first gripper 41 and a second gripper 42 are provided on the feeding gripping device, such that when the feeding gripping device is in the first position, the first gripper 41 is adapted to grip the carrier plate 2 on the first conveying platform 21 and the second gripper 42 is adapted to grip the carrier plate 2 of the first feeding bin 11, and when the feeding gripping device is in the second position, the first gripper 41 is adapted to place the gripped carrier plate 2 on the flipping platform 30 and the second gripper 42 is adapted to place the gripped carrier plate 2 on the first conveying platform 21. In this way, with a single movement of the feeding gripper, the carrier plate of the first feeding bin 11 can be transferred to the first conveying platform 21 by the second gripper 42, while the carrier plate of the first conveying platform 21 can be transferred to the flipping platform 30 by the first gripper 41. Compared with the integrated circuit carrier plate testing equipment in related technologies, the transfer of two carrier plates 2 can be realized simultaneously without the need to add testing devices, conveying devices and flipping devices, etc., thereby improving the transfer efficiency of carrier plates 2, reducing equipment waiting time, improving the overall testing efficiency, and enabling the testing process to be carried out continuously and efficiently.

[0041] Therefore, the integrated circuit carrier board testing device 1 according to the present invention has the advantages of high testing efficiency.

[0042] The integrated circuit carrier board testing device 1 according to a specific embodiment of the present invention is described below with reference to the accompanying drawings.

[0043] In some specific embodiments of this utility model, such as Figures 1-4 As shown, the integrated circuit carrier board testing equipment 1 according to an embodiment of the present utility model includes a first feeding bin 11, a first conveying platform 21, a flipping platform 30, and a feeding gripping device.

[0044] Specifically, such as Figures 1-4 As shown, the integrated circuit carrier board testing equipment 1 also includes a second feeding bin 12, and the feeding gripping device also has a third position. When the feeding gripping device is in the third position, the second gripper 42 is adapted to grip the carrier board 2 in the second feeding bin 12.

[0045] Specifically, when the feeding gripper is in the first position, as follows: Figure 4 As shown in step c, when the feeding gripper is in the second position, as... Figure 4 As shown in steps b and d, the feeding gripper, when in the third position, as... Figure 4 As shown in step a. The feeding gripper can move between the first position, the second position, and the third position.

[0046] like Figure 4 As shown in step a, the feeding gripping device moves to the third position, and the second gripper 42 grips the carrier plate 2 in the second feeding bin 12.

[0047] like Figure 4 As shown in step b, the feeding gripper moves to the second position, and the second gripper 42 places the carrier plate 2 on the first conveying platform 21.

[0048] like Figure 4 As shown in step c, the feeding gripping device moves to the first position, the second gripper 42 grips the carrier plate 2 in the first feeding bin 11, and the first gripper 41 grips the carrier plate on the first conveying platform 21.

[0049] like Figure 4 As shown in step d, the feeding gripper moves to the second position, the second gripper 42 places the carrier plate 2 on the first conveying platform 21, and the first gripper 41 places the carrier plate 2 on the flipping platform 30.

[0050] The feeding and gripping device then returns to the third position and repeats the above steps to achieve continuous transfer of the carrier plate 2.

[0051] In other words, the feeding gripper moves sequentially between the third position, the second position, the first position, and the second position.

[0052] Therefore, loading can be carried out through two loading bins. The loading gripping device can alternately transfer the carrier boards 2 in the two loading bins. After the carrier boards 2 in one loading bin are transferred, the loading gripping device can also grab the carrier boards 2 in the other loading bin. This allows the operator to replenish the empty bins with carrier boards 2 in a timely manner, reducing the waiting time for replenishing the bins and further improving the detection efficiency of the integrated circuit carrier board testing equipment 1. Moreover, by repeatedly moving the loading gripping device between the third position, the second position, the first position, and the second position, the carrier boards in the first loading bin 11 and the second loading bin 12 can be alternately transferred, so that the running time of each device can be fully utilized, further improving the detection efficiency of the integrated circuit carrier board testing equipment 1.

[0053] More specifically, such as Figures 1-4 As shown, the integrated circuit substrate inspection equipment 1 also includes a second conveying platform 22. A flipping platform 30 is rotatable between a front position and a back position. In the front position, the flipping platform 30 is located between the first conveying platform 21 and the second conveying platform 22 in the left-right direction. In the back position, the flipping platform 30 is located directly above the second conveying platform 22 (the up-down, left-right, and front-back directions are shown by arrows in the figure). When the loading gripper is in the second position, the first gripper 41 is adapted to place the gripped substrate onto the flipping platform 30 in the front position. This allows the loading gripper to easily transfer the substrate to the flipping platform 30 when it is in the front position, and to transfer the flipped substrate 2 to the second conveying platform 22 when it is in the back position. This enables the flipping platform 30 to simultaneously complete the transfer and flipping processes of the substrate 2, further improving the inspection efficiency of the integrated circuit substrate inspection equipment 1.

[0054] Advantageously, such as Figure 4 As shown in steps a and b, when the loading gripping device is in the third position, the flipping platform 30 is located in the reverse position. This allows the transfer of the carrier plate 2 from the second loading bin 12 to the first conveying platform 21 to be completed during the flipping process of the carrier plate 2. It makes full use of the time when the flipping platform 30 is not in the front position and cannot receive new carrier plates, further reducing the waiting time for the transfer of the carrier plate 2 and further improving the detection efficiency of the integrated circuit carrier plate detection equipment 1.

[0055] Figures 1-3 An integrated circuit substrate testing device 1 according to some examples of the present invention is shown. For example... Figures 1-3 As shown, the feeding gripper can slide left and right. The second feeding bin 12, the first feeding bin 11, the first conveying platform 21, and the tilting platform 30 are arranged sequentially from right to left in the left-right direction. The distance between the first gripper 41 and the second gripper 42 in the left-right direction is equal to the distance between the first feeding bin 11 and the second feeding bin 12 in the left-right direction, equal to the distance between the first feeding bin 11 and the first conveying platform 21 in the left-right direction, and equal to the distance between the first conveying platform 21 and the tilting platform 30 in the front position in the left-right direction. This facilitates the simultaneous transfer of two adjacent carrier plates 2 by the first gripper 41 and the second gripper 42 without changing the distance between them, eliminating the need for a drive device to adjust the distance between the first gripper 41 and the second gripper 42, thus simplifying the structure of the feeding gripper.

[0056] Specifically, such as Figure 3As shown, the integrated circuit substrate inspection equipment 1 also includes a front inspection device 51 and a back inspection device 52. A first conveying platform 21 is adapted to convey the substrate 2 to the front inspection device 51, and a second conveying platform 22 is adapted to convey the substrate 2 to the back inspection device 52. Specifically, the front inspection device 51 and the back inspection device 52 can be image acquisition devices, such as inspection cameras. This not only improves inspection accuracy and automation of the inspection process, avoiding damage to the substrate caused by manual inspection, but also allows the front and back inspections of the substrate 2 to be performed by two independent devices, enabling two substrates 2 to be inspected simultaneously, achieving continuous and uninterrupted inspection of the substrates, and further improving the inspection efficiency of the substrates 2.

[0057] More specifically, such as Figures 1-3 As shown, the integrated circuit substrate inspection equipment 1 also includes a defective product bin 61, a first unloading bin 62, a second unloading bin 63, and an unloading gripping device 70. The unloading gripping device 70 is adapted to move the substrate 2 on the second conveyor platform 22 to the first unloading bin 62, the second unloading bin 63, or the defective product bin 61. Specifically, the unloading gripping device 70 transfers the substrate 2 on the second conveyor platform 22 to the defective product bin 61, the first unloading bin 62, or the second unloading bin 63 based on the inspection results of the inspected substrate 2. When the substrate 2 is detected as defective, the unloading gripping device 70 can transfer the substrate 2 to the defective product bin 61; when the substrate 2 passes the inspection, the unloading gripping device 70 can transfer the substrate 2 to the first unloading bin 62 or the second unloading bin 63. This allows for the unloading of the tested carrier board 2, which is then placed in the defective product bin 61, the first unloading bin 62, or the second unloading bin 63 according to the test results. This achieves classified unloading of the carrier board 2. Furthermore, by setting up two unloading bins, the unloading gripping device 70 can first transfer the carrier board 2 to one of the bins. After one bin is full, it can be transferred to the other bin. Operators can promptly empty the full bins, reducing the waiting time required for emptying the bins and further improving the operating efficiency of the integrated circuit carrier board testing equipment 1.

[0058] Advantageously, such as Figure 1 and Figure 3As shown, the integrated circuit substrate testing equipment 1 also includes a cabinet. A first loading bin 11, a second loading bin 12, a first unloading bin 62, a second unloading bin 63, and a defective product bin 61 are slidably mounted on the front surface of the cabinet. The loading gripping device and the unloading gripping device 70 are located at the front of the cabinet, and the front detection device 51 and the back detection device 52 are located at the rear of the cabinet. Specifically, the cabinet has a mounting plate 81. The first loading bin 11, the second loading bin 12, the first unloading bin 62, the second unloading bin 63, the defective product bin 61, the first conveying platform 21, the second conveying platform 22, the tilting platform 30, the loading gripping device, and the unloading gripping device 70 are all located at the front of the mounting plate 81. This facilitates the replenishment and cleaning of substrates within the bins and avoids the impact of movement of the bins and gripping devices on the testing device, thereby improving the accuracy and reliability of the testing device.

[0059] More advantageously, the integrated circuit substrate testing equipment 1 also includes a display and control device, which is located on the front surface of the cabinet. This facilitates the monitoring and operation of the integrated circuit substrate testing equipment 1.

[0060] Optionally, the integrated circuit substrate testing equipment 1 further includes a blower. The first conveying platform 21, the second conveying platform 22, and the flipping platform 30 are all vacuum adsorption platforms. The blower is connected to the first conveying platform 21, the second conveying platform 22, and the flipping platform 30, respectively, and is located outside the cabinet. This not only saves space inside the cabinet but also avoids the vibration of the blower affecting the accuracy of the testing results.

[0061] The following is for reference. Figures 1-4 The working process of the integrated circuit carrier board testing device 1 according to an embodiment of the present utility model is described.

[0062] Taking one of the carrier plates 2 as an example, the carrier plate 2 is transferred from the hopper to the first conveying platform 21 via the feeding gripping device. The first conveying platform 21 conveys the carrier plate to the front detection device 51, which detects the carrier plate 2. The first conveying platform 21 then returns the detected carrier plate 2. The feeding gripping device transfers the carrier plate 2 from the first conveying platform 21 to the flipping platform 30. The flipping platform 30 flips the carrier plate 2 and transfers it to the second conveying platform 22. The second conveying platform 22 conveys the carrier plate to the back detection device 52, which detects the carrier plate 2. The second conveying platform 22 then returns the detected carrier plate 2. The unloading gripping device 70 transfers the carrier plate 2 to the defective product hopper 61, the first unloading hopper 62, or the second unloading hopper 63 according to the detection results.

[0063] Multiple carrier plates 2 can be transported simultaneously:

[0064] like Figure 4As shown in step a, the feeding gripper moves to the third position, and the second gripper 42 grips the carrier plate 2 in the second feeding bin 12. At this time, the flipping platform 30 flips to the reverse position.

[0065] like Figure 4 As shown in step b, the feeding gripper moves to the second position, and the second gripper 42 places the carrier plate 2 on the first conveying platform 21.

[0066] like Figure 4 As shown in step c, the feeding gripper moves to the first position, the second gripper 42 grips the carrier plate 2 in the first feeding bin 11, and the first gripper 41 grips the carrier plate on the first conveying platform 21. At this time, the flipping platform 30 flips to the front position.

[0067] like Figure 4 As shown in step d, the feeding gripper moves to the second position, the second gripper 42 places the carrier plate 2 on the first conveying platform 21, and the first gripper 41 places the carrier plate 2 on the flipping platform 30.

[0068] The feeding and gripping device then returns to the third position and repeats the above steps to achieve continuous transfer of the carrier plate 2.

[0069] Other components and operations of the integrated circuit carrier board testing device 1 according to the embodiments of the present invention are known to those skilled in the art and will not be described in detail here.

[0070] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0071] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. An integrated circuit substrate testing device, characterized in that, include: First feeding bin; First conveyor platform; Flip platform; A feeding gripping device is movable between a first position and a second position. The feeding gripping device is provided with a first gripper and a second gripper. When the feeding gripping device is in the first position, the first gripper is adapted to grip a carrier plate on the first conveying platform and the second gripper is adapted to grip a carrier plate in the first feeding bin. When the feeding gripping device is in the second position, the first gripper is adapted to place the gripped carrier plate on the flipping platform and the second gripper is adapted to place the gripped carrier plate on the first conveying platform.

2. The integrated circuit substrate testing equipment according to claim 1, characterized in that, It also includes a second feeding bin, and the feeding gripping device also has a third position, in which the second gripper is adapted to grip the carrier plate in the second feeding bin when the feeding gripping device is in the third position.

3. The integrated circuit substrate testing equipment according to claim 2, characterized in that, It also includes a second conveying platform, the flipping platform being flippable between a front position and a back position. When in the front position, the flipping platform is located between the first conveying platform and the second conveying platform in the left-right direction. When in the back position, the flipping platform is located directly above the second conveying platform. When the feeding gripper is in the second position, the first gripper is adapted to place the gripped carrier plate on the flipping platform in the front position.

4. The integrated circuit substrate testing equipment according to claim 3, characterized in that, When the feeding and gripping device is in the third position, the flipping platform is located in the reverse position.

5. The integrated circuit substrate testing equipment according to claim 3, characterized in that, The feeding gripper can slide left and right. The second feeding bin, the first feeding bin, the first conveying platform, and the tilting platform are arranged sequentially from right to left in the left-right direction. The distance between the first gripper and the second gripper in the left-right direction is equal to the distance between the first feeding bin and the second feeding bin in the left-right direction, equal to the distance between the first feeding bin and the first conveying platform in the left-right direction, and equal to the distance between the first conveying platform and the tilting platform at the front position in the left-right direction.

6. The integrated circuit substrate testing equipment according to claim 3, characterized in that, It also includes a front detection device and a back detection device, wherein the first conveying platform is adapted to convey the carrier plate to the front detection device, and the second conveying platform is adapted to convey the carrier plate to the back detection device.

7. The integrated circuit substrate testing equipment according to claim 6, characterized in that, Also includes: Defective material warehouse; First and second feeding bins; A feeding gripping device, which is adapted to move a carrier plate on the second conveying platform to the first feeding bin, the second feeding bin, or the defective product bin.

8. The integrated circuit substrate testing equipment according to claim 7, characterized in that, It also includes a cabinet, with the first feeding bin, the second feeding bin, the first unloading bin, the second unloading bin, and the defective product bin being slidably mounted on the front surface of the cabinet. The feeding gripping device and the unloading gripping device are located at the front of the cabinet, and the front detection device and the back detection device are located at the rear of the cabinet.

9. The integrated circuit substrate testing equipment according to claim 8, characterized in that, It also includes a display and control device, which is located on the front surface of the cabinet.

10. The integrated circuit substrate testing equipment according to claim 8, characterized in that, It also includes a blower. The first conveying platform, the second conveying platform and the tilting platform are all vacuum adsorption platforms. The blower is connected to the first conveying platform, the second conveying platform and the tilting platform respectively. The blower is located outside the cabinet.

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