High-speed solid state disk with sliding structure for heat dissipation

Abstract

The utility model relates to the field of solid state disks, in particular to a high-speed solid state disk with a sliding structure for heat dissipation, which comprises a mainboard and a radiator. When the heat-conducting silica gel sheet is used, the heat-conducting silica gel sheet is pasted between a heating component of the mainboard and the heat radiator after the protective film of the heat-conducting silica gel sheet is torn off, the heat-conducting silica gel sheet and the heat radiator are tightly combined through proper pressure, and then the heat radiator can be installed on the outer side of the mainboard. When the solid state disk runs, the heat conduction silica gel sheet can form a good heat conduction channel between a heating component of the mainboard and the radiator, heat generated by the heating component of the mainboard is helped to be rapidly conducted to the radiator, and cooling fins of the radiator are in contact with air through the large-area cooling fin surfaces and the movable plate which is unfolded in a sliding mode. Heat is taken away through air flowing, the heat dissipation effect is achieved, the heat dissipation performance is good, the working temperature of the solid state disk is reduced, the stability and performance of the solid state disk are improved, and the heat dissipation efficiency mainly depends on the size of the surface area and the air flowing speed.

Description

TECHNICAL FIELD

[0001] The utility model relates to solid state disk field especially point to a high -speed solid state disk of sliding structure heat dissipation. BACKGROUND

[0002] With the continuous development of computer hardware, solid state disk capacity, reading rate is strengthened unceasingly, hard disk power and heat quantity also unceasingly increase along with it, when the heat is accumulated to a certain degree in its interior and does not add the control, the continuous high temperature can influence data storage accuracy and service life, serious will cause solid state disk data loss even damage, and the heat dissipation mode of existing external fan already can not satisfy the heat dissipation demand. SUMMARY

[0003] In view of the above background technology's deficiency, the utility model provides a high -speed solid state disk of sliding structure heat dissipation.

[0004] The utility model discloses a technical scheme as follows:

[0005] A high -speed solid state disk of sliding structure heat dissipation, characterized in that, the solid state disk includes a mainboard and a heat sink, two heat sinks are respectively arranged on the upper and lower surfaces of the mainboard, and a heat-conducting silica gel sheet is arranged between the heat sink and the mainboard, the heat sink is in abutment with the heat-generating components on the mainboard through the heat-conducting silica gel sheet, and the heat sink includes:

[0006] A heat sink is in abutment with the heat-generating components on the mainboard through the heat-conducting silica gel sheet, and a plurality of heat dissipation fins are arranged on the surface of the heat sink away from the mainboard;

[0007] Two movable plates are arranged, and the two movable plates are respectively arranged at the two ends of the heat sink in a telescopic manner, the movable plate is located on the surface of the heat sink away from the mainboard, and the heat dissipation fins on the heat sink are located between the two movable plates;

[0008] Among them, the heat sink, the heat dissipation fin and the movable plate are all metal materials, when the movable plates at the two ends of the heat sink extend outward to the limit position, the two movable plates are suspended above the two ends of the mainboard.

[0009] As a further improvement, the heat sink, the heat dissipation fin and the movable plate are all made of aluminum.

[0010] As a further improvement, both sides of the surface of the heat sink away from the mainboard are provided with a first supporting plate, a sliding groove is formed at both ends of the first supporting plate, both sides of the movable plate are provided with a second supporting plate, and a sliding block is arranged on the side of the second supporting plate away from the movable plate, when the movable plate is arranged at the two ends of the heat sink in a telescopic manner, the sliding block slides in the sliding groove.

[0011] As a further improvement, the cross section of the slider is rectangular or square.

[0012] As a further improvement, the heat sink, the heat dissipation fins on the heat sink and the first supporting plate are integrally formed.

[0013] As a further improvement, the surface of the movable plate opposite to the surface of the heat sink is provided with a plurality of heat dissipation fins.

[0014] As a further improvement, the movable plate, the heat dissipation fins on the movable plate and the second supporting plate are integrally formed.

[0015] As can be seen from the above description of the structure of the utility model, compared with the prior art, the utility model has the following advantages: in use, usually only need to tear off the protective film of the heat-conducting silica gel sheet and paste it between the heat-generating components of the mainboard and the heat sink, and through appropriate pressure to make it tightly combined, the heat sink can be installed outside the mainboard. When the solid state disk runs, the heat-conducting silica gel sheet can form a good heat-conducting path between the heat-generating components of the mainboard and the heat sink, help to quickly conduct the heat generated by the heat-generating components of the mainboard to the heat sink, the heat dissipation fins of the heat sink are in contact with the air through the large-area heat dissipation fin surface and the slidingly expanded movable plate, utilize the air flow to take away the heat, realize the heat dissipation effect, the heat dissipation performance is good, thereby reduce the working temperature of the solid state disk, improve its stability and performance, and the heat dissipation efficiency mainly depends on the size of the surface area and the speed of the air flow. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 It is a three-dimensional structure schematic view of the utility model.

[0017] Figure 2 It is an exploded structure schematic view of the utility model.

[0018] Figure 3 It is an exploded structure schematic view of the heat sink.

[0019] Figure 4 It is a three-dimensional structure schematic view of the movable plate extending outward to the limit position.

[0020] Figure 5 It is a front view structure schematic view of the utility model. DETAILED DESCRIPTION

[0021] The specific implementation manner of the utility model will be described below with reference to the drawings.

[0022] As shown in the accompanying drawings Figure 1 and Figure 2As shown, a high-speed solid-state drive (SSD) with a sliding structure for heat dissipation includes a motherboard 1 and two heat sinks 2. The heat sinks 2 are respectively disposed on the upper and lower surfaces of the motherboard 1, and a thermally conductive silicone pad 3 is provided between the heat sinks 2 and the motherboard 1. The heat sinks 2 contact the heat-generating components on the motherboard 1 through the thermally conductive silicone pad 3. These heat-generating components include flash memory chips 11, main controller firmware 12, and external hard drives. In use, the protective film of the thermally conductive silicone pad 3 is typically removed and then pasted between the heat-generating components on the motherboard 1 and the heat sink 2, applying appropriate pressure to ensure a tight seal. The thermally conductive silicone pad 3 effectively fills the gaps between the contact surfaces, expelling air and ensuring sufficient contact. This allows the thermally conductive silicone pad 3 to form a good thermal conduction path between the heat-generating components on the motherboard 1 and the heat sink 2, helping to quickly conduct the heat generated by the heat-generating components on the motherboard 1 to the heat sink 2, thereby reducing the operating temperature of the SSD and improving its stability and performance. Simultaneously, the thermally conductive silicone pad 3 has good insulation properties, preventing electrical short circuits and ensuring the safe operation of the SSD. In addition, the flexibility and high compressibility of the thermally conductive silicone pad 3 provide a certain degree of shock absorption, which can protect the solid-state drive to some extent. The solid-state drive in this invention uses the PCIe 4.0 interface standard. PCIe 4.0 is the fourth generation of the PCI-Express (PCIe) bus, a high-speed serial computer expansion bus standard with features such as high-speed serial operation, point-to-point dual-channel, and high-bandwidth transmission. Its read speed reaches up to 7000MB / s, and the flash memory chip 11 is a TLC chip. TLC chips have fewer voltage states, making data reading, writing, and transmission relatively easier and faster.

[0023] As attached Figure 2 and Figure 3 As shown, the heat sink 2 includes a heat sink 21 and a movable plate 25. The heat sink 21 contacts the heat-generating components on the motherboard 1 via a thermally conductive silicone pad 3. The surface of the heat sink 21 facing away from the motherboard 1 is provided with several heat dissipation fins 24. The working principle of these heat dissipation fins 24 is to dissipate heat into the air by increasing the surface area and using convection. When heat is transferred from the heat-generating components on the motherboard 1 to the heat sink 21, the heat sink 21 contacts the air through the large surface area of ​​the heat dissipation fins 24, utilizing airflow to carry away the heat, thereby achieving a heat dissipation effect. Its heat dissipation efficiency mainly depends on the size of the surface area and the speed of airflow. Furthermore, a movable plate 25 is provided at each end of the heat sink 21. The movable plate 25 is located on the surface of the heat sink 21 facing away from the motherboard 1, and the heat dissipation fins 24 on the heat sink 21 are located between the two movable plates 25. The heat sink 21, heat dissipation fins 24, and movable plate 25 are all made of aluminum. Aluminum has good thermal conductivity, is lightweight, and easy to process, which can effectively improve heat dissipation efficiency.

[0024] It is worth mentioning that, as shown in the attached document Figures 3 to 5 As shown, two movable plates 25 are respectively provided at both ends of the heat sink 21 for retraction and extension. Specifically, each side of the heat sink 21 facing away from the motherboard 1 has a first support plate 22, and each end of the first support plate 22 has a sliding groove 23. Each side of the movable plate 25 has a second support plate 26, and the side of the second support plate 26 facing away from the movable plate 25 has a slider 27. When the movable plate 25 is retracted at both ends of the heat sink 21, the slider 27 slides within the sliding groove 23. When the solid-state drive is installed in the computer, the two movable plates 25 are slid inward onto the heat sink 21 to avoid the movable plates 25 interfering with the installation of the solid-state drive. After installation, the movable plates 25 can be extended outward as needed to further expand the heat dissipation area and improve the heat dissipation effect. When the solid-state drive is idle or stored, the movable plates 25 can also be extended outward to their extreme positions, extending from both ends of the heat sink 2 and suspended above both ends of the motherboard 1. In this case, the movable plates 25 on the two heat sinks 2 can effectively cover and protect the interfaces at both ends of the motherboard 1, reducing the risk of damage to the solid-state drive interfaces. Simultaneously, by adjusting the size of the slide groove 23, the mating relationship between the slide groove 23 and the slider 27 can be changed. This ensures that when the slider 27 slides, a certain pushing or pulling force is applied to the movable plate 25 and the slider 27 to allow the slider 27 to slide within the slide groove 23, thus completing the extension and retraction of the movable plate 25. This prevents the movable plate 25 from sliding arbitrarily during use, which would affect heat dissipation and the protection of the solid-state drive interface. The slider 27 has a rectangular or square cross-section to prevent the movable plate 25 from rotating around the slider 27 during extension and retraction, thus avoiding any impact on its usability.

[0025] Further details are attached. Figure 3 As shown, the heat sink 21, its heat dissipation fins 24, and the first support plate 22 are integrally formed using a stamping process. This involves placing a metal sheet into a mold and forming it using a stamping machine, eliminating welding, resulting in fast production and a superior manufacturing process. Furthermore, the movable plate 25 has several heat dissipation fins 24 on its surface facing away from the heat sink 21, and the movable plate 25, its heat dissipation fins 24, and the second support plate 26 are also integrally formed using a stamping process.

[0026] In summary, when using this invention, it is generally only necessary to peel off the protective film of the thermally conductive silicone pad 3 and stick it between the heat-generating components of the motherboard 1 and the heat sink 2. Applying appropriate pressure will ensure a tight bond, thus installing the heat sink 2 on the outside of the motherboard 1. When the solid-state drive is running, the thermally conductive silicone pad 3 forms a good thermal conductivity path between the heat-generating components of the motherboard 1 and the heat sink 2, helping to quickly conduct the heat generated by the heat-generating components of the motherboard 1 to the heat sink 2. The heat sink 21, through its large surface area of ​​heat dissipation fins 24 and the sliding movable plate 25, comes into contact with the air, utilizing airflow to remove heat and achieve a cooling effect. The excellent heat dissipation performance reduces the operating temperature of the solid-state drive, improving its stability and performance. Its heat dissipation efficiency mainly depends on the surface area and the airflow speed.

[0027] The above are merely specific embodiments of this utility model, but the design concept of this utility model is not limited thereto. Any non-substantial modifications made to this utility model using this concept shall be considered as an infringement of the protection scope of this utility model.

Claims

1. A high-speed solid-state drive with a sliding structure for heat dissipation, characterized in that, The solid-state drive includes a motherboard and two heat sinks. The heat sinks are respectively disposed on the upper and lower surfaces of the motherboard, and a thermally conductive silicone pad is provided between the heat sinks and the motherboard. The heat sinks contact the heat-generating components on the motherboard via the thermally conductive silicone pad. The heat sink includes: A heat sink is provided, which abuts against the heat-generating components on the motherboard via the thermally conductive silicone pad, and the surface of the heat sink facing away from the motherboard is provided with a plurality of heat dissipation fins. The device includes two movable plates, which are respectively located at both ends of the heat sink and extend and retract. The movable plates are located on the surface of the heat sink facing away from the motherboard, and the heat dissipation fins on the heat sink are located between the two movable plates. The heat sink, heat dissipation fins, and movable plates are all made of metal. When the movable plates at both ends of the heat sink extend outward to their limit positions, the two movable plates are suspended above both ends of the motherboard.

2. The high-speed solid-state drive with sliding structure heat dissipation as described in claim 1, characterized in that: The heat sink, heat dissipation fins, and movable plate are all made of aluminum.

3. A high-speed solid-state drive with a sliding structure for heat dissipation as described in claim 1, characterized in that: The heat sink has a first support plate on both sides of the surface facing away from the motherboard. Each of the first support plates has a sliding groove at both ends. The movable plate has a second support plate on both sides. Each of the second support plates has a slider on the side facing away from the movable plate. When the movable plate extends or retracts at both ends of the heat sink, the slider slides within the sliding groove.

4. A high-speed solid-state drive with a sliding structure for heat dissipation as described in claim 3, characterized in that: The cross-section of the slider is rectangular or square.

5. A high-speed solid-state drive with a sliding structure for heat dissipation as described in claim 4, characterized in that: The heat sink, its heat dissipation fins, and the first support plate are integrally formed.

6. A high-speed solid-state drive with a sliding structure for heat dissipation as described in claim 1, characterized in that: The surface of the movable plate facing away from the heat sink is provided with several heat dissipation fins.

7. A high-speed solid-state drive with a sliding structure for heat dissipation as described in claim 6, characterized in that: The movable plate, the heat dissipation fins on the movable plate, and the second support plate are integrally formed.

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