Wafer purging device
By designing a wafer purging device that uses a driver to sweep the extended section across the wafer surface, the problem of residual contaminants on the wafer surface in existing technologies has been solved, achieving comprehensive wafer cleaning and improved measurement accuracy.
Patent Information
- Application Number
- CN202423262687.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-27
- Publication Date
- 2025-12-09
- Estimated Expiration
- 2034-12-27
AI Technical Summary
Existing optical measurement equipment cannot perform targeted localized cleaning of the wafer surface, resulting in residual contaminants on the wafer surface, which affects measurement accuracy and efficiency. Furthermore, it is difficult to simultaneously clean the back side of the wafer, which may cause equipment contamination.
A wafer cleaning device was designed, which drives the first and second extension sections to sweep the upper and lower surfaces of the wafer respectively through a driver, and uses air holes to uniformly clean the wafer surface, thereby achieving thorough cleaning of both sides of the wafer.
It achieves comprehensive and uniform cleaning of the upper and lower surfaces of the wafer, improving the accuracy and efficiency of optical measurements and avoiding the risk of equipment contamination.
Smart Images
Figure CN223651371U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor processing, and more specifically, to a wafer purging apparatus. Background Technology
[0002] During wafer fabrication, numerous contaminants, including metal ions, organic matter, acidic gases, and dust particles, negatively impact the wafer fabrication process and lead to a decrease in final wafer yield. For example, when optical metrology equipment is used to inspect parameters such as wafer thickness, critical dimensions, and defects, contaminants not promptly removed from the wafer surface will introduce interference, thus affecting the optical measurement results. Therefore, wafer fabrication processes place extremely high demands on environmental cleanliness.
[0003] Existing optical metrology equipment primarily employs FFUs (Fan Filter Units) or a combination of fans and high-efficiency filters to perform laminar flow purging of the internal cavity of the equipment, ensuring cleanliness within the cavity. However, these cleaning methods generally do not perform targeted localized purging of the wafer itself, failing to thoroughly remove particulate matter from the wafer surface. This results in residual particulate matter on the wafer surface, affecting optical measurement results and consequently impacting measurement accuracy and efficiency. Furthermore, existing optical metrology equipment mostly uses a top-down purging method, only purging the front side of the wafer and failing to address the back side. If contaminants adhere to the back side of the wafer, they can easily contaminate the wafer carrier stage and may even contaminate subsequently placed wafers, leading to serious consequences. Therefore, there is a need for equipment capable of targeted localized purging of the wafer to achieve thorough cleaning of both sides and ensure the accuracy of optical measurements. Utility Model Content
[0004] The purpose of this application is to provide a wafer cleaning device that can drive a first extension section and a second extension section to sweep across the upper and lower surfaces of a wafer by a driver, so that the airflow can be evenly blown across the upper and lower surfaces of the wafer through the air holes on the surfaces of the first and second extension sections, thereby achieving thorough cleaning of both sides of the wafer.
[0005] This application provides a wafer purging apparatus, including a base, a venting conduit, a gas supply device, and a driver. The base includes a fixed upper base and a lower base. The venting conduit includes an upper pipe section and a lower pipe section arranged vertically with their axes coinciding, and a bent pipe section connecting the upper and lower pipe sections. The upper pipe section is rotatably connected to the upper base, and the lower pipe section is rotatably connected to the lower base. The bent pipe section includes a first extension section, a second extension section, and a connecting section. The first extension section and the second extension section are spaced apart by a predetermined distance and arranged parallel to each other. The first end of the first extension section and the first end of the second extension section are connected through the connecting section. The second end of the first extension section is connected to the lower opening of the upper pipe section, and the second end of the second extension section is connected to the upper opening of the lower pipe section. The surface of the first extension section facing the second extension section has a plurality of first vent holes, and the surface of the second extension section facing the first extension section has a plurality of second vent holes. The lower opening of the lower pipe section is rotatably and sealingly connected to the gas supply device's conduit, and the upper opening of the upper pipe section is closed. The actuator is rotatably connected to the upper pipe section and is used to drive the ventilation line to rotate. During wafer cleaning, the wafer is located between the first extension section and the second extension section.
[0006] In one feasible embodiment, the first pore includes a plurality of pores uniformly distributed along the axial direction of the first extension, and the second pore includes a plurality of pores uniformly distributed along the axial direction of the second extension, wherein the plurality of pores of the first pore corresponds one-to-one with the plurality of pores of the second pore.
[0007] In one feasible embodiment, the vertical spacing between the first extension segment and the second extension segment is 30-60 mm.
[0008] In one feasible embodiment, a distance sensor is provided on the lower surface of the first extension and / or the upper surface of the second extension.
[0009] In one feasible embodiment, the first extension is detachably connected to the upper pipe section, and the second extension is detachably connected to the lower pipe section.
[0010] In one feasible approach, the venting line comprises multiple bends connected sequentially in a vertical direction.
[0011] In one feasible embodiment, the first extension and the second extension are serpentine tubes arranged in a horizontal plane.
[0012] In one feasible solution, a flow regulating valve is installed between the gas supply device and the lower pipe section.
[0013] In one feasible solution, a heating device for heating the airflow is installed between the gas supply device and the lower pipe section.
[0014] Compared with the prior art, the beneficial effects of this application include at least the following:
[0015] This application provides a wafer cleaning device, which is provided with a curved tube section including a first extension section, a second extension section and a connecting section. It can drive the first extension section and the second extension section to sweep across the upper and lower surfaces of the wafer respectively through a driver, so that the airflow can be evenly blown through the air holes on the surfaces of the first extension section and the second extension section to clean various positions on the upper and lower surfaces of the wafer, thereby achieving comprehensive and uniform cleaning of the wafer.
[0016] Furthermore, the ventilation duct of the wafer purging device may include multiple bends connected in sequence along the vertical direction to enable simultaneous purging and cleaning of multiple wafers, thereby improving production efficiency. Attached Figure Description
[0017] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0018] Figure 1 This is a schematic diagram of a wafer purging apparatus in operation according to an embodiment of this application;
[0019] Figure 2 A schematic diagram of the ventilation piping of a wafer purging device;
[0020] Figure 3 This is a cross-sectional view of the ventilation piping.
[0021] Figure 4 This is a cross-sectional view of a venting pipeline that includes multiple bends.
[0022] Figure 5 A schematic diagram showing the rotation angle of the wafer purging device;
[0023] Figure 6 This is a top view of the first extension section, which is a serpentine tube.
[0024] In the diagram: 1. Base; 2. Ventilation pipe; 3. Gas supply device; 4. Driver; 5. Wafer; 101. Upper base; 102. Lower base; 201. Upper pipe section; 202. Lower pipe section; 203. Bend section; 231. First extension section; 232. Second extension section; 233. Connecting section; 241. First vent; 242. Second vent; 501. Robotic arm. Detailed Implementation
[0025] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.
[0026] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.
[0027] like Figure 1 and Figure 2 As shown, this application provides a wafer purging apparatus, including a base 1, a ventilation pipe 2, a gas supply device 3, and a driver 4. The base 1 includes a fixedly disposed upper base 101 and a lower base 102. The ventilation pipe 2 includes an upper pipe section 201 and a lower pipe section 202 arranged vertically with their axes coinciding, and a bent pipe section 203 connecting the upper and lower pipe sections 201. The upper pipe section 201 is rotatably connected to the upper base 101, and the lower pipe section 202 is rotatably connected to the lower base 102. The bent pipe section 203 includes a first extension section 231, a second extension section 232, and a connecting section 233. The first extension section 231 and the second extension section 232 are spaced apart by a predetermined distance and arranged parallel to each other. The first end of the first extension section 231 and the first end of the second extension section 232 are connected through the connecting section 233. The second end of the first extension section 231 communicates with the lower opening of the upper pipe section 201, and the second end of the second extension section 232 communicates with the upper opening of the lower pipe section 202. The surface of the first extension section 231 facing the second extension section 232 is provided with a plurality of first air holes 241, and the surface of the second extension section 232 facing the first extension section 231 is provided with a plurality of second air holes 242. The lower opening of the lower pipe section 202 is rotatably and sealingly connected to the pipeline of the air supply device 3, and the upper opening of the upper pipe section 201 is closed. The actuator 4 is rotatably connected to the upper pipe section 201 and is used to drive the air supply pipeline 2 to rotate.
[0028] In use, wafer 5 is placed on the robotic arm 501 of the wafer transport device, and then the robotic arm 501 moves wafer 5 between the first extension segment 231 and the second extension segment 232. The position of the robotic arm 501 can be adjusted to keep the distance between wafer 5 and the lower surface of the first extension segment 231 and the upper surface of the second extension segment 232 as consistent as possible, and to ensure that the rotation axis of the upper tube segment 201 passes through the center of wafer 5. Preferably, a distance sensor (not shown in the figure) can be installed on the lower surface of the first extension segment 231 and / or the upper surface of the second extension segment 232. This allows for accurate determination of whether wafer 5 is located in the middle position between the first extension segment 231 and the second extension segment 232 by using the distance value or distance difference provided by the distance sensor, thus providing guidance for adjusting the position of wafer 5.
[0029] After the wafer 5 is transported into place, the gas supply device 3 is activated. The airflow enters the ventilation pipe 2 through the lower opening of the lower pipe section 202, and as it flows through the second extension section 232 and the first extension section 231, it is blown onto the lower and upper surfaces of the wafer 5 through the second air hole 242 and the first air hole 241, respectively. Preferably, the parameters of the gas supply device 3 can be adjusted so that the airflow velocity reaching the upper and lower surfaces of the wafer 5 is 0.3m / s-0.5m / s, and the difference in airflow velocity between the upper and lower surfaces of the wafer 5 does not exceed 10%, to ensure that both sides of the wafer 5 are uniformly purged. The gas supply device 3 can use air or nitrogen to supply gas to the ventilation pipe 2; no specific limitation is made here. Then, the driver 4 is activated, causing the upper pipe section 201 to rotate at a constant speed according to a preset program, driving the first extension section 231 and the second extension section 232 to sweep across the upper and lower surfaces of the wafer, so that all parts of the surface of the wafer 5 are uniformly purged.
[0030] It should be noted that, as Figure 5 As shown, during the sweeping process of the first extension section 231 and the second extension section 232, care should be taken to control the rotation angle of the driver 4 to avoid contact with the robot arm 501. A distance sensor (not shown in the figure) can be installed on the side of the connecting section 233 to detect the distance between the ventilation pipe 2 and the robot arm 501, and a controller connected to the driver 4 and the distance sensor respectively can be installed to control the rotation angle of the driver 4.
[0031] In one embodiment, such as Figure 2 and Figure 3As shown, the first vent 241 includes multiple vents uniformly distributed along the axial direction of the first extension 231, and the second vent 242 includes multiple vents uniformly distributed along the axial direction of the second extension 232. The multiple vents of the first vent 241 correspond one-to-one with the multiple vents of the second vent 242. The first vent 241 and the second vent 242 can be configured as small circular holes. Gas is blown out through the vents and diffuses in a conical shape, finally uniformly covering the surface of the wafer. Maintaining consistency in the number and arrangement of the multiple vents of the first vent 241 and the second vent 242 helps to keep the airflow velocity on the upper and lower surfaces of the wafer 5 as consistent as possible, thereby reducing the potential risk of wafer deformation or damage.
[0032] In one embodiment, the vertical distance between the first extension segment 231 and the second extension segment 232 can be set to 30-60 mm. If the vertical distance between the first extension segment 231 and the second extension segment 232 is too small, the airflow may be too fast when it reaches the surface of the wafer 5, which may easily damage the wafer 5. In addition, the small distance may also cause the wafer 5 to collide with the ventilation pipe 2 during transportation. If the distance is too large, the purging airflow will diffuse too much before reaching the surface of the wafer 5, which may result in incomplete cleaning of the wafer 5 due to the low wind speed.
[0033] In one embodiment, the first extension section 231 is detachably connected to the upper pipe section 201, and the second extension section 232 is detachably connected to the lower pipe section 202. With this configuration, when the bend section 2 experiences an unexpected failure, such as pipe deformation or vent blockage, the entire bend section 2 can be disassembled and replaced, thereby minimizing the time spent on workflow interruptions and reducing production costs. The detachable connection between the first extension section 231 and the upper pipe section 201, and between the second extension section 232 and the lower pipe section 202, can be achieved using snap-fit or quick-release couplings; the specific connection method is not limited here.
[0034] In one embodiment, such as Figure 4 As shown, the ventilation duct 2 includes multiple bends 203 connected sequentially in a vertical direction. For two adjacent bends 203, the upper opening of the first extension 231 of the lower bend 203 communicates with the lower opening of the second extension 232 of the upper bend 203. Preferably, the projections of all bends 203 on the horizontal plane coincide. By setting multiple bends 203, multiple wafers can be cleaned simultaneously, which helps improve production efficiency. The specific relative positions of the multiple bends 203 can be adjusted appropriately according to the robot arm to ensure that each wafer is cleaned uniformly. During use, the airflow experiences a pressure drop after passing through each bend 203, resulting in a decrease in the pressure of the airflow from the vent, affecting the cleaning effect on the wafer 5. Therefore, as... Figure 4As shown, it is preferable to set two bends 203 to ensure that each bend 203 has sufficient wafer cleaning capability.
[0035] In one embodiment, such as Figure 5 As shown, the first extension section 231 and the second extension section 232 are serpentine tubes arranged in the horizontal plane. The serpentine tubes can effectively increase the length of the first extension section 231 and the second extension section 232, as well as the number of the first vent 241 and the second vent 242, without increasing the distance between the connecting section 233 and the center of the wafer 5. This increases the sweeping area of the bent tube section 2 on the wafer 5, making the airflow sweeping effect more uniform and thorough.
[0036] In one embodiment, a flow regulating valve (not shown in the figure) can be installed between the gas supply device 3 and the lower pipe section 202 to conveniently regulate the flow rate and pressure of the gas ejected from the gas orifice. Furthermore, a heating device (not shown in the figure) for heating the gas flow can also be installed between the gas supply device 3 and the lower pipe section 202. In use, by installing the heating device, the temperature difference between the gas flow and the surrounding environment of the wafer 5 can be maintained within a preset range, preventing damage to the wafer 5 due to overheating expansion or undercooling contraction. Preferably, the temperature difference range between the gas flow and the surrounding environment of the wafer 5 can be set to ±0.05℃.
[0037] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.
Claims
1. A wafer cleaning device, characterized in that, include: The base (1) includes a fixed upper base (101) and a lower base (102); The ventilation duct (2) includes an upper pipe section (201) and a lower pipe section (202) arranged vertically and having coincident axes, and a bend section (203) connecting the upper pipe section (201) and the lower pipe section (202); the upper pipe section (201) is rotatably connected to the upper base (101), and the lower pipe section (202) is rotatably connected to the lower base (102); the bend section (203) includes a first extension section (231), a second extension section (232), and a connecting section (233), wherein the first extension section (231) and the second extension section (232) are spaced apart by a predetermined distance and are flat. The first extension segment (231) is connected to the first end of the second extension segment (232) via the connecting segment (233); the second end of the first extension segment (231) is connected to the lower opening of the upper pipe segment (201), and the second end of the second extension segment (232) is connected to the upper opening of the lower pipe segment (202); a plurality of first vent holes (241) are provided on the surface of the first extension segment (231) facing the second extension segment (232), and a plurality of second vent holes (242) are provided on the surface of the second extension segment (232) facing the first extension segment (231); The lower opening of the lower pipe section (202) is rotatably sealed to the pipeline of the gas supply device (3), and the upper opening of the upper pipe section (201) is closed. A driver (4), which is rotatably connected to the upper pipe section (201), is used to drive the ventilation pipe (2) to rotate; During the cleaning of the wafer, the wafer is located between the first extension segment (231) and the second extension segment (232).
2. The wafer cleaning apparatus according to claim 1, characterized in that, The first vent (241) includes a plurality of vents evenly distributed along the axial direction of the first extension (231), and the second vent (242) includes a plurality of vents evenly distributed along the axial direction of the second extension (232). The plurality of vents in the first vent (241) correspond one-to-one with the plurality of vents in the second vent (242).
3. The wafer purging apparatus according to claim 1, characterized in that, The vertical distance between the first extension segment (231) and the second extension segment (232) is 30-60mm.
4. The wafer cleaning apparatus according to claim 1, characterized in that, A distance sensor is provided on the lower surface of the first extension segment (231) and / or the upper surface of the second extension segment (232).
5. The wafer cleaning apparatus according to claim 1, characterized in that, The first extension section (231) is detachably connected to the upper pipe section (201), and the second extension section (232) is detachably connected to the lower pipe section (202).
6. The wafer cleaning apparatus according to claim 1, characterized in that, The ventilation pipe (2) includes multiple bends (203) connected sequentially in a vertical direction.
7. The wafer purging apparatus according to claim 1, characterized in that, The first extension section (231) and the second extension section (232) are serpentine tubes arranged in the horizontal plane.
8. The wafer purging apparatus according to claim 1, characterized in that, A flow regulating valve is provided between the gas supply device (3) and the lower pipe section (202).
9. The wafer cleaning apparatus according to claim 1, characterized in that, A heating device for heating the airflow is provided between the gas supply device (3) and the lower pipe section (202).