Auxiliary device for oven process of wafer
By designing an automated auxiliary device for wafer ovens, the problems of dirt and falling wafers during the baking process were solved, enabling stable and safe wafer operation and improving work efficiency.
Patent Information
- Application Number
- CN202422956118.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-02
- Publication Date
- 2025-12-09
- Estimated Expiration
- 2034-12-02
AI Technical Summary
During the wafer baking process, the existing technology for placing and removing wafers can easily lead to dirt and breakage, affecting yield and increasing costs.
Design an auxiliary device that includes a horizontally moving component, a power control component, a rotating component, and a horizontally extendable robotic arm, combined with a vacuum chuck, to achieve automated placement and removal of wafers, avoiding manual operation.
It improves the stability and safety of wafers during the baking process, reduces the risk of dirt, scratches and falling, and increases work efficiency.
Smart Images
Figure CN223651384U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a semiconductor equipment technical field especially relates to a kind of auxiliary device for wafer to carry out oven process. BACKGROUND
[0002] In the manufacturing process of semiconductor, wafer is often placed in oven for baking process, if wafer is dirty during placing, it will affect the yield of wafer, if wafer slides, wafer can only be scrapped, which seriously affects wafer processing progress and increases cost. Therefore, wafer oven process placement process needs to be strictly controlled. In the field of wafer oven process, in the prior art, the operator places the wafer in the oven by vacuum suction pen manually, and after completing the oven process, the operator manually takes the wafer out of the oven. In this process, the operator contacts the wafer in the relatively narrow oven space, which can easily cause the wafer to be dirty. During manual operation, the wafer has a risk of falling. SUMMARY
[0003] The utility model aims at overcoming the technical problems in the prior art, and provides an auxiliary device for wafer to carry out oven process.
[0004] The utility model aims to realize the following technical scheme:
[0005] An auxiliary device for wafer to carry out oven process is provided, which comprises:
[0006] A horizontal moving part is provided with a caterpillar guide rail;
[0007] A power control part is provided on the horizontal moving part, and the rear end thereof is connected with the guide rail;
[0008] A rotating part is coaxially and vertically arranged with the power control part, and the rear end thereof is connected with the front end of the power control part;
[0009] A horizontally telescopic mechanical arm is vertically arranged with the rotating part, and the rear end thereof is connected with the front end of the rotating part; the rotating part is provided with a first caterpillar belt for vertical transmission, and the mechanical arm is connected with the first caterpillar belt;
[0010] A wafer suction cup is provided at the front end of the mechanical arm;
[0011] An oven is provided with multiple layers of carrier plates, and each carrier plate is provided with multiple groups of pedestals for placing wafers;
[0012] The power control part is connected with the horizontal moving part, the rotating part and the mechanical arm, respectively.
[0013] In some embodiments, the power control component comprises a programmable logic controller with a power supply and an operation interface; the horizontal moving component, the rotating component and the mechanical arm are provided with driving motors, and the programmable logic controller is connected with the motors.
[0014] In some embodiments, the wafer chuck is a vacuum adsorption chuck provided with a vacuum adsorption pipeline.
[0015] Preferably, the wafer chuck is a smooth plastic chuck.
[0016] Preferably, the wafer chuck is an arc-shaped chuck.
[0017] In some embodiments, the mechanical arm is provided with a second track belt for horizontal transmission, so that the mechanical arm can move up and down and horizontally stretch out and in.
[0018] Preferably, the mechanical arm is a six-axis mechanical arm, and the model of the mechanical arm is LT750-B-6.
[0019] In some embodiments, the rotating component is a component capable of 360-degree rotation.
[0020] In some embodiments, the wafer chuck is threadedly connected with the mechanical arm through a screw rod and a nut.
[0021] In some embodiments, the power control component is provided with buttons for controlling the start and stop of the horizontal moving component, the rotating component and the mechanical arm, and the buttons are connected with the programmable logic controller.
[0022] It should be further explained that the corresponding technical features in each of the above embodiments can be combined or replaced to form new technical solutions.
[0023] Compared with the prior art, the utility model has the beneficial effects that:
[0024] (1) The utility model discloses a horizontal moving component, a power control component, a rotating component, a horizontally stretchable mechanical arm and a wafer chuck are structurally designed and cooperated with each other to realize the operation of a wafer in a baking process, wherein the power control component is arranged above the horizontal moving component, the power control component is provided with the rotating component, the rotating component is connected with the mechanical arm, the mechanical arm can vertically move along the rotating component, and the mechanical arm is connected with the wafer chuck.
[0025] (2) In some embodiments, by setting the vacuum adsorption chuck, the stability in the wafer picking and placing process is improved, and the risk of wafer falling and damage is further reduced. The smooth solid plastic such as Teflon material is set on the wafer chuck, and the risk of wafer scratching is further reduced.
[0026] (3) In some embodiments, by the power control component, the motion trajectory of the rotating component, the mechanical arm and the horizontal moving component can be accurately controlled, and the position memory is realized, and the accuracy in the wafer picking and placing process is further improved.
[0027] (4) In some embodiments, the crawler-type guide rail is arranged in the horizontal moving component, which is used for horizontally moving the whole device except the oven, and the position of the device in actual use is adjusted.
[0028] (5) In some embodiments, by setting the base on the oven carrier plate, the wafer can be effectively placed and taken. BRIEF DESCRIPTION OF DRAWINGS
[0029] Fig. 1 A schematic view of an auxiliary device for wafer oven process is shown for the embodiments of the present application;
[0030] Fig. 2 A top view of the device is shown for the embodiments of the present application;
[0031] Fig. 3 A left side view of the device is shown for the embodiments of the present application.
[0032] In the figure: 1-power control component; 2-rotating component; 3-mechanical arm; 4-wafer chuck; 5-horizontal moving component; 6-oven; 7-carrier plate; 8-base; 9-wafer. DETAILED DESCRIPTION
[0033] The technical solutions of the present application will be described clearly and completely in combination with the drawings. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by the ordinary skilled in the art without creative labor belong to the scope of protection of the present application.
[0034] In the description of the utility model, it needs to explain, belong to "center", "upper", "lower", "left", "right", "vertical", "horizontal", "internal", "external" and so on indication direction or positional relationship is based on the direction or positional relationship described in the drawing, only for the convenience of describing the utility model and simplifying the description, and not indicating or implying that the device or element must have a specific orientation, a specific orientation and operation, therefore, it cannot be understood as a limitation on the utility model. In addition, "first", "second" is only for the purpose of description, and cannot be understood as indicating or implying relative importance.
[0035] In the description of the utility model, it needs to explain, unless otherwise specified and limited, "installation", "connection" and "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be connected inside two elements. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.
[0036] Reference Figs. 1-3 In an exemplary embodiment, an auxiliary device for wafer oven process is provided, comprising:
[0037] Horizontal moving part 5, wherein the crawler track guide is arranged;
[0038] Power control part 1, arranged on the horizontal moving part 5, the rear end of which is connected with the guide;
[0039] Rotary part 2, coaxially arranged vertically with the power control part 1, the rear end of which is connected with the front end of the power control part 1;
[0040] Horizontally telescopic mechanical arm 3, arranged vertically with the rotary part 2, the rear end of which is connected with the front end of the rotary part 2; the rotary part 2 is provided with a first crawler belt conveying in the vertical direction, and the mechanical arm 3 is connected with the first crawler belt;
[0041] Wafer chuck 4, arranged at the front end of the mechanical arm 3;
[0042] Oven 6, wherein a plurality of layers of carrier plates 7 are arranged, and a plurality of groups of pedestals 8 for placing wafers 9 are arranged on the carrier plates 7;
[0043] The power control part 1 is connected with the horizontal moving part 5, the rotary part 2 and the mechanical arm 3 respectively.
[0044] Specifically, the power control component 1 controls the rotating component 2, the mechanical arm 3 and the horizontal moving component 5 respectively; the rotating component 2 can complete 360-degree rotation movement; the mechanical arm 3 completes vertical direction movement along the rotating component 2 through the first track, and the mechanical arm 3 can perform horizontal telescopic movement; the horizontal moving component 5 is a track type guide rail, and the power control component 1 can complete horizontal movement thereon; the oven 6 and the horizontal moving component 5 are arranged on the same horizontal plane, and the oven 6 is located at the lateral side of the guide rail of the horizontal moving component 5; the wafer chuck 4 is connected with the mechanical arm 3 to complete the movement of the wafer 9; the base 8 is used for placing the wafer 9, which facilitates the storage and grabbing of the wafer 9 by the wafer chuck 4.
[0045] Further, the mechanical arm 3 can adopt an existing six-axis mechanical arm such as an LT750-B-6 type mechanical arm, which can flexibly rotate in three-dimensional space, and the mechanical arm 3 is provided with the wafer chuck 4 with vacuum adsorption at the front end. When the wafer 9 is placed on the wafer chuck 4, the wafer 9 will be adsorbed by vacuum, improving the stability of the wafer 9 in the movement process. More specifically, the power of the rotating component 2, the mechanical arm 3 and the horizontal moving component 5 is provided by a motor, the rear end part of the mechanical arm 3 can complete vertical direction movement along the rotating component 2 through the first track, the rotating component 2 can complete 360-degree rotation movement along the power control component 1, and the front end of the mechanical arm 3 connected with the wafer chuck 4 can realize the control of the position of the wafer chuck 4. Alternatively, the wafer chuck 4 is connected with the front end of the mechanical arm 3, such as using a screw nut thread connection, which can be regularly checked for stability to ensure normal work of the device.
[0046] More specifically, the rotating component 2 contains a first track for the movement of the mechanical arm 3, and the first track rotates through motor movement, thereby driving the mechanical arm 3 to complete up-down movement along the Z axis. Similarly, a small track (second track) is also arranged in the mechanical arm 3, and the mechanical arm 3 completes horizontal displacement along the X axis. Further, the wafer chuck 4 is used for grabbing the wafer 9. Specifically, the wafer chuck is an existing device on the market, which can be directly connected with the workshop vacuum pipeline. Further, the size of the wafer chuck 4 is adapted to the size of the wafer 9. In this embodiment, the wafer 9 is a standard 6-inch wafer, and correspondingly, the wafer chuck 4 is a 6-inch arc-shaped wafer chuck 4, which is beneficial to adsorb the wafer and ensure the reliability of the storage and access action. Similarly, in other embodiments, when the wafer 9 is a standard 8-inch wafer, the wafer chuck 4 is an 8-inch arc-shaped wafer chuck 4.
[0047] Optionally, the material in this example is preferably aluminum alloy, and smooth plastic materials such as Teflon are used in specific positions such as wafer chuck 4, and the same material as the carrier plate 7 in the oven 6 is used for the pedestal 8. The power control component 1 in this example is a programmable logic controller (PLC), which can effectively control the position of the rotating component 2, the mechanical arm 3, and the horizontal moving component 5. It should be noted that after the device described in this example is installed, the technician should first use the power control component 1 to adjust and memorize the positions of the rotating component 2, the mechanical arm 3, and the horizontal moving component 5. Further, a start / pause button is provided on the power control component 1, and the actions of the rotating component 2, the mechanical arm 3, and the horizontal moving component 5 can be selected according to the actual situation. It should be further noted that the connection and control between the power control component 1 and the rotating component 2, the mechanical arm 3, and the horizontal moving component 5 are known to those skilled in the art, and the connection mode of the corresponding device and other devices can be obtained by querying the device manual of the device. It is not within the scope of protection of the utility model, and the pin connection relationship between the devices will not be further described below.
[0048] The process of using the device to automatically replace the wafer is as follows:
[0049] After the device is installed, the technician uses the power control component 1 to adjust and memorize the positions of the rotating component 2, the mechanical arm 3, and the horizontal moving component 5, so that the wafer chuck 4 is directly above the pedestal 8, and the position of each pedestal 8 for placing the wafer 9 is memorized. The power control component 1 completes the action of the wafer 9 into and out of the oven 6.
[0050] After the user opens the oven 6 door, places the wafer 9 on the wafer chuck 4, and the vacuum suction on the wafer chuck 4 starts working and sucks the wafer 9, the user can select the storage position on the power control component 1 and click the storage button. The motor starts working. First, the power control component 1 controls the horizontal moving component 5 to move horizontally to the memorized position through the internal track. Then the power control component 1 controls the rotating component 2 to rotate counterclockwise through the internal cylinder until the wafer is aligned with the inside of the oven 6. Then the power control component 1 controls the mechanical arm 3 to extend along the internal small track (second track) to send the wafer chuck 4 with the wafer 9 to the top of the pedestal 8. At this time, the power component 1 controls the mechanical arm 3 to move downward along the rotating component 2 internal track (first track). After the wafer 9 is placed on the pedestal 8, the wafer chuck 8 is separated from the wafer 9. At this time, the power control component 1 controls the mechanical arm 3 to complete the contraction action along the internal small track, controls the rotating component 2 to complete the clockwise rotation along the internal cylinder, and controls the horizontal moving component 5 to return to the initial position along the track. The power component 1 stops working. Finally, the user closes the oven 6 door and starts the oven process.
[0051] After the oven process is completed, the user opens the door of the oven 6, then selects the position of the wafer 9 to be taken out on the power control component 1, clicks the taking-out button, and the power control component 1 completes the control of the rotating component 2, the mechanical arm 3 and the horizontal moving component 5, takes out the wafer 9 at the memory position, and finally the power component 1 returns to the initial position, the user takes away the wafer 9 from the wafer suction cup 4, closes the door of the oven 6, and the wafer 9 taking-out action of the oven 6 is completed.
[0052] The utility model discloses a power control component 1, rotating component 2, mechanical arm 3, horizontal moving component 5 are introduced, complete the automatic access action of wafer 9 in the oven process in the course, the stability of wafer 9 in the process of putting into the oven 6 and taking out the oven 6 is improved greatly, prevent wafer 9 from appearing dirty, scratching, falling in the movement process, and the whole process user will not directly contact wafer 9 in the oven 6, the automation degree is high, further promotes the working efficiency of wafer 9 in the oven process.
[0053] It should be noted that the working process of all power devices involved in the utility model relates to the common knowledge of those skilled in the art and is not within the scope of the utility model.
[0054] In addition, the technical features involved in the different embodiments of the utility model described below can be combined with each other as long as there is no conflict.
[0055] The above specific embodiments are detailed descriptions of the utility model, and cannot be considered as limiting the specific embodiments of the utility model to these descriptions. For ordinary skilled persons in the technical field to which the utility model belongs, some simple deductions and substitutions can be made without departing from the concept of the utility model, and all of them should be considered as belonging to the protection scope of the utility model.
Claims
1. An auxiliary device for wafer undergoing oven process, characterized in that, The utility model relates to a horizontal moving part, wherein a caterpillar guide rail is arranged; a power control part is arranged on the horizontal moving part, and the rear end of the power control part is connected with the guide rail; a rotating part is coaxially arranged vertically with the power control part, and the rear end of the rotating part is connected with the front end of the power control part; a horizontally telescopic mechanical arm is arranged vertically with the rotating part, and the rear end of the mechanical arm is connected with the front end of the rotating part; a first caterpillar is arranged in the rotating part and is used for conveying in the vertical direction; the mechanical arm is connected with the first caterpillar; a wafer suction disc is arranged at the front end of the mechanical arm; an oven is arranged, wherein a plurality of layers of loading plates are arranged in the oven, and a plurality of groups of pedestals for placing wafers are arranged on the loading plates; the power control part is connected with the horizontal moving part, the rotating part and the mechanical arm respectively. The power control part comprises a programmable logic controller, and driving motors are arranged in the horizontal moving part, the rotating part and the mechanical arm; the programmable logic controller is connected with the motors. The wafer suction disc is a vacuum suction disc, and a vacuum suction pipeline is arranged in the wafer suction disc. The wafer suction disc is a smooth plastic suction disc. The wafer suction disc is an arc-shaped suction disc. A second caterpillar is arranged in the mechanical arm and is used for conveying in the horizontal direction. The mechanical arm is a six-axis mechanical arm, and the model of the mechanical arm is LT750-B-6. The rotating part can rotate by 360 degrees.
2. The auxiliary device for wafer baking process according to claim 1, wherein, The wafer suction disc is threadedly connected with the mechanical arm through a screw rod and a nut.
3. The auxiliary device for wafer baking process according to claim 1, wherein Buttons for starting and stopping the horizontal moving part, the rotating part and the mechanical arm are arranged on the power control part, and the buttons are connected with the programmable logic controller.
4. The auxiliary device for wafer baking process according to claim 3, wherein, 5. The auxiliary device for wafer baking process according to claim 3, wherein, 6. The auxiliary device for wafer baking process according to claim 1, wherein 7. The auxiliary device for wafer baking process according to claim 1, wherein 8. The auxiliary device for wafer baking process according to claim 1, wherein, 9. The auxiliary device for wafer baking process according to claim 1, wherein, 10. The auxiliary device for wafer baking process according to claim 2, wherein,