High-temperature-resistant bionic friction increasing structure for wafer carrying

Abstract

The utility model relates to the technical field of wafer carrying, and discloses a high-temperature-resistant bionic friction increasing structure for wafer carrying, which comprises a grip, a first mounting plate is fixedly connected to the inner bottom of the grip, and mounting columns are fixedly connected to the front and back of the right side in the first mounting plate. First connecting plates are fixedly connected to the front and back of the right side of the first mounting plate, first friction increasing pads are fixedly connected to the right sides of the upper portions of the first connecting plates, supporting columns are evenly and slidably connected to the inner side of the lower portion of the grip, pressing plates are fixedly connected to the lower portions of the supporting columns, and clamping assemblies are arranged on the upper portions of the supporting columns. The wafer clamping device is used for clamping and carrying wafers. According to the utility model, through the cooperation of the pressing plate, the supporting column, the second mounting plate, the second connecting plate, the second friction increasing pad, the spring and other structures, the bionic friction increasing structure can clamp two wafers at the same time, and the wafer carrying efficiency of the bionic friction increasing structure is improved.

Description

Technical Field

[0001] This utility model relates to the field of wafer handling technology, and in particular to a biomimetic friction-enhancing structure for wafer handling that is resistant to high temperatures. Background Technology

[0002] In modern semiconductor manufacturing, wafer handling is a critical step that directly impacts production efficiency and product quality. Traditional wafer handling systems typically use standard clamping and transport devices. However, in high-temperature process environments, these devices may experience material aging and performance degradation, affecting clamping stability and handling safety. Therefore, developing novel handling structures is crucial to improving handling efficiency and reliability at high temperatures.

[0003] In recent years, the concept of bionics has been widely applied in the fields of mechanics and engineering, using the imitation of the structure and function of organisms in nature to design more efficient and adaptable equipment. Particularly in wafer handling, the gradual application of bionic friction-enhancing technology has provided new solutions to the friction and clamping challenges encountered in high-temperature handling. Utility Model Content

[0004] To overcome the above shortcomings, this invention provides a high-temperature resistant biomimetic friction-enhancing structure for wafer handling, aiming to improve the low wafer handling efficiency of existing biomimetic friction-enhancing structures.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a high-temperature resistant biomimetic friction-enhancing structure for wafer handling, comprising a handle, a first mounting plate fixedly connected to the bottom of the handle, mounting posts fixedly connected to the front and rear of the right side of the first mounting plate, a first connecting plate fixedly connected to the front and rear of the right side of the first mounting plate, a first friction-enhancing pad fixedly connected to the upper right side of the first connecting plate, a support post slidably connected to the lower inner side of the handle, a pressing plate fixedly connected to the lower part of the support post, and a clamping assembly provided on the upper part of the support post for clamping and handling the wafer.

[0006] As a further description of the above technical solution:

[0007] The clamping assembly includes a second mounting plate, which is fixedly connected to the upper part of the support column. A second connecting plate is fixedly connected to both the front and rear sides of the right side of the second mounting plate. A second friction pad is fixedly connected to the lower right side of the second connecting plate. Fixed columns are uniformly fixedly connected inside the first mounting plate, and a spring is provided on the upper outer side of the fixed column.

[0008] As a further description of the above technical solution:

[0009] Both the first and second friction-enhancing pads are made of high-temperature resistant polyurethane, the spring is made of stainless steel, and both the first and second connecting plates are made of aluminum alloy.

[0010] As a further description of the above technical solution:

[0011] The lower part of the pressing plate has several grooves evenly distributed.

[0012] As a further description of the above technical solution:

[0013] The upper part of the support column is fixedly connected to the second mounting plate, and the support column passes through the first mounting plate.

[0014] As a further description of the above technical solution:

[0015] The fixed column penetrates the second mounting plate, and the second mounting plate is slidably connected to the outside of the mounting column.

[0016] As a further description of the above technical solution:

[0017] One end of the spring is fixedly connected to the second mounting plate, and the other end of the spring is fixedly connected to the fixing post.

[0018] This utility model has the following beneficial effects:

[0019] 1. In this utility model, the pressing plate drives the support column to move, the support column drives the second mounting plate, the second mounting plate drives the second connecting plate to move, the second mounting plate drives the second connecting plate to move, the second connecting plate drives the second friction pad to move, and releasing the pressing plate causes the spring to push the second mounting plate, the second mounting plate drives the second connecting plate, and the second connecting plate drives the second friction pad to reset. This realizes that the biomimetic friction-enhancing structure can clamp two wafers at the same time, improving the wafer handling efficiency of the biomimetic friction-enhancing structure.

[0020] 2. In this utility model, the first and second friction pads are provided with good friction performance by high-temperature resistant polyurethane material and maintain stability at high temperatures. The spring can still maintain elasticity and strength at high temperatures by stainless steel material. The good high-temperature resistance and strength of aluminum alloy material make the first and second connecting plates suitable for bearing the load generated during wafer handling in high-temperature environments. This realizes that the biomimetic friction-enhancing structure can be used in high-temperature environments and improves the service life of the biomimetic friction-enhancing structure. Attached Figure Description

[0021] Figure 1 This is a three-dimensional view of a high-temperature resistant biomimetic friction-enhancing structure for wafer handling proposed in this utility model;

[0022] Figure 2This is a right view of a high-temperature resistant biomimetic friction-enhancing structure for wafer handling proposed in this utility model.

[0023] Figure 3 This is a structural diagram of a mounting plate with a high-temperature resistant biomimetic friction-enhancing structure for wafer handling, as proposed in this utility model.

[0024] Figure 4 for Figure 2 Enlarged view of point A in the image.

[0025] Legend:

[0026] 1. Handle; 2. First mounting plate; 3. First connecting plate; 4. First friction-enhancing pad; 5. Mounting post; 6. Second mounting plate; 7. Second connecting plate; 8. Second friction-enhancing pad; 9. Fixing post; 10. Spring; 11. Support post; 12. Pressing plate; 13. Groove. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0028] Reference Figures 2-4 This utility model provides an embodiment of a biomimetic friction-enhancing structure for high-temperature resistant wafer handling, comprising a handle 1, a first mounting plate 2 fixedly connected to the bottom of the handle 1, mounting posts 5 fixedly connected to the front and rear of the right side of the first mounting plate 2, a first connecting plate 3 fixedly connected to the front and rear of the right side of the first mounting plate 2, a first friction-enhancing pad 4 fixedly connected to the upper right side of the first connecting plate 3, a support post 11 slidably connected to the lower inner side of the handle 1, the upper part of the support post 11 fixedly connected to a second mounting plate 6, the support post 11 penetrating the first mounting plate 2, a pressing plate 12 fixedly connected to the lower part of the support post 11, and a plurality of grooves 13 evenly formed on the lower part of the pressing plate 12. To facilitate the pressing of the pressing plate 12, a clamping assembly is provided on the upper part of the support column 11 for clamping and transporting the wafer. The clamping assembly includes a second mounting plate 6, which is fixedly connected to the upper part of the support column 11. A second connecting plate 7 is fixedly connected to the front and rear of the right side of the second mounting plate 6. A second friction pad 8 is fixedly connected to the lower right side of the second connecting plate 7. Fixed columns 9 are evenly fixedly connected inside the first mounting plate 2. A spring 10 is provided on the upper part of the outer side of the fixed column 9. The fixed column 9 passes through the second mounting plate 6. The second mounting plate 6 is slidably connected to the outer side of the mounting column 5. One end of the spring 10 is fixedly connected to the second mounting plate 6, and the other end of the spring 10 is fixedly connected to the fixed column 9.

[0029] When wafer handling is required, the pressing plate 12 is pressed first. This action causes the support column 11 to move, which in turn moves the second mounting plate 6. As the second mounting plate 6 moves, it also causes the second connecting plate 7 to move, compressing the spring 10 in the process. This compression deforms the spring 10, storing energy. The movement of the second connecting plate 7 then continues to move the second friction pad 8, ensuring the orderly operation of the entire handling device. During this process, when... After the wafer is placed on the first friction pad 4, the pressing plate 12 is released. The spring 10 automatically resets after losing pressure. This reset action pushes the second mounting plate 6 back, thereby causing the second connecting plate 7 to also move back. Finally, the second friction pad 8 returns to its initial position, thus forming an effective squeezing and clamping of the wafer on the first friction pad 4. Through this set of biomimetic friction-enhancing structures, the clamping and handling of two wafers can be achieved simultaneously, which greatly improves the efficiency of wafer handling, making the whole process more efficient and stable, and ensuring the smooth progress of the handling operation.

[0030] Reference Figures 1-3 The first friction pad 4 and the second friction pad 8 are both made of high-temperature resistant polyurethane, the spring 10 is made of stainless steel, and the first connecting plate 3 and the second connecting plate 7 are both made of aluminum alloy.

[0031] By employing high-temperature resistant polyurethane material, the first friction pad 4 and the second friction pad 8 can provide excellent friction performance in high-temperature environments while maintaining material stability, ensuring that their performance does not degrade during long-term operation. In addition, the spring 10 is made of stainless steel, which can maintain good elasticity and strength at high temperatures, ensuring the reliability and safety of the system under extreme conditions. Meanwhile, the first connecting plate 3 and the second connecting plate 7 are made of aluminum alloy, which has excellent high-temperature resistance and strength, and can effectively withstand the load generated during wafer handling, allowing the entire structure to work stably in high-temperature environments. This comprehensive design makes the biomimetic friction-enhancing structure not only suitable for high-temperature environments, but also significantly improves its service life, ensuring smooth and safe handling processes, and providing strong protection for wafer handling.

[0032] Working principle: When wafers need to be handled, pressing the pressing plate 12 causes the supporting column 11 to move, which in turn moves the second mounting plate 6. The second mounting plate 6 then moves the second connecting plate 7, simultaneously compressing the spring 10. The second mounting plate 6 then moves the second connecting plate 7, which in turn moves the second friction pad 8. The wafer is then placed on top of the first friction pad 4. Finally, releasing the pressing plate 12 causes the spring 10 to lose pressure and reset, pushing the second mounting plate 6. The second mounting plate 6 then moves the second connecting plate 7, which in turn moves the second friction pad 8, resetting and compressing the wafer on top of the first friction pad 4. This allows the biomimetic friction-enhancing structure to simultaneously hold two wafers, improving the wafer handling efficiency of the biomimetic friction-enhancing structure.

[0033] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A high-temperature resistant biomimetic friction-enhancing structure for wafer handling, comprising a grip (1), characterized in that: The grip (1) is fixedly connected to the bottom of the inner part of a first mounting plate (2). The first mounting plate (2) is fixedly connected to the front and back of the right side of the inner part of the first mounting plate (2). The first mounting plate (2) is fixedly connected to the front and back of the right side of the first mounting plate (2). The first friction pad (4) is fixedly connected to the upper right side of the first connecting plate (3). The grip (1) is evenly slidably connected to the lower inner side of the inner part of the grip (1). The lower part of the support column (11) is fixedly connected to a pressing plate (12). The upper part of the support column (11) is provided with a clamping assembly for clamping and transporting the wafer.

2. The high-temperature resistant biomimetic friction-increasing structure for wafer handling according to claim 1, characterized in that: The clamping assembly includes a second mounting plate (6), which is fixedly connected to the upper part of the support column (11). A second connecting plate (7) is fixedly connected to the front and rear of the right side of the second mounting plate (6). A second friction pad (8) is fixedly connected to the lower right side of the second connecting plate (7). A fixing column (9) is evenly fixedly connected inside the first mounting plate (2). A spring (10) is provided on the upper part of the outer side of the fixing column (9).

3. The high-temperature resistant biomimetic friction-increasing structure for wafer handling according to claim 2, characterized in that: The first friction pad (4) and the second friction pad (8) are both made of high-temperature resistant polyurethane, the spring (10) is made of stainless steel, and the first connecting plate (3) and the second connecting plate (7) are both made of aluminum alloy.

4. The high-temperature resistant biomimetic friction-increasing structure for wafer handling according to claim 1, characterized in that: The lower part of the pressing plate (12) is evenly provided with several grooves (13).

5. The high-temperature resistant biomimetic friction-increasing structure for wafer handling according to claim 1, characterized in that: The upper part of the support column (11) is fixedly connected to the second mounting plate (6), and the support column (11) passes through the first mounting plate (2).

6. The high-temperature resistant biomimetic friction-increasing structure for wafer handling according to claim 2, characterized in that: The fixing post (9) penetrates the second mounting plate (6), and the second mounting plate (6) is slidably connected to the outside of the mounting post (5).

7. The high-temperature resistant biomimetic friction-increasing structure for wafer handling according to claim 2, characterized in that: One end of the spring (10) is fixedly connected to the second mounting plate (6), and the other end of the spring (10) is fixedly connected to the fixing post (9).

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