Light emitting device

Abstract

The utility model discloses a light-emitting device. The light-emitting device comprises a lead frame, a shell, a light-emitting diode and an integrated circuit. The lead frame has a central platform and a lead. The housing surrounding the lead frame has a first cavity and a second cavity. The light-emitting diode located in the first cavity is arranged on the upper surface of the center platform and electrically connected with the lead. The integrated circuit located in the second cavity is arranged on the lower surface of the center platform and electrically connected with the lead. Therefore, according to the light-emitting device provided by the utility model, the integrated circuit and the bonding wire of the light-emitting diode can be separated, and the light of the light-emitting diode cannot be shielded by the integrated circuit.

Description

TECHNICAL FIELD

[0001] The utility model relates to a light emitting device, especially to a light emitting device with wire bonding of integrated circuit and light emitting diode without interference. BACKGROUND

[0002] The intelligent vehicle atmosphere lamp has a chip and a light emitting diode in the packaging structure, and can freely control the RGB light emitting diode to form various light mixing effects.

[0003] The existing packaging needs complex wire bonding to meet the multi-pin circuit design requirement of the chip, which limits the wire bonding space and makes it difficult to control the yield of wire bonding. Since the current is output through the chip, it is not possible to directly verify whether there is leakage, and it is also not possible to identify abnormal signals. Moreover, the chip blocks the light of the light source, resulting in poor brightness performance of the light emitting diode. SUMMARY

[0004] The utility model provides a light emitting device to solve the technical problem of wire bonding interference between integrated circuit and light emitting diode in the prior art.

[0005] To solve the above technical problems, one of the technical solutions adopted by the utility model is to provide a light emitting device, which comprises: a lead frame comprising a center platform and a plurality of leads, the center platform having a first surface and a second surface. A plurality of light emitting diodes are arranged on the first surface and electrically connected to a part of the plurality of leads. An integrated circuit (IC) is arranged on the second surface, and a part of the plurality of leads are electrically connected to the integrated circuit. A housing surrounds the lead frame, the housing comprising a first end face and a second end face, and a peripheral side wall arranged between the first end face and the second end face; wherein the peripheral side wall comprises an upper side wall part, the upper side wall part comprising a bottom plate part, the bottom plate part being arranged around a part of the first surface.

[0006] Further, the upper side wall part comprises four inner side surfaces, the bottom plate part is connected to at least three inner side surfaces and forms a U-shaped structure; wherein the four inner side surfaces, the bottom plate part and the first surface form a first cavity.

[0007] Further, the light emitting device further comprises a light-transmitting packaging glue filling the first cavity; wherein the light-transmitting packaging glue further comprises: a brightening glue coated around each light emitting diode, only exposing an outgoing surface of each light emitting diode.

[0008] Further, the lead frame further comprises at least one first pre-support structure disposed on a notch side of the bottom plate portion, wherein each of the first pre-support structures has a fracture surface and a chamfered edge connected to the fracture surface, and the housing further comprises at least one pre-recess for accommodating at least one second pre-support structure in a forming process of the lead frame, and the lead frame is connected with the at least one second pre-support structure in the forming process.

[0009] Further, the peripheral side wall further comprises a lower side wall portion comprising four side portions, wherein the four side portions and the second surface form a second cavity, and the integrated circuit is disposed in the second cavity.

[0010] Further, the light emitting device further comprises an opaque encapsulation gel filled in the second cavity.

[0011] Further, the second end surface comprises a plurality of grooves, each of the grooves has an outward opening, and the grooves are separated from each other, each of the grooves accommodates at least one of the leads, and the leads are attached to the bottom surface of the grooves and are bent outwardly and then towards the second surface.

[0012] Further, the light emitting device further comprises an insulating layer disposed on the first surface and the second surface of the central platform, respectively, and the insulating layer further comprises a through portion disposed between any of the central platform and the leads.

[0013] Further, the thickness of the insulating layer is greater than the thickness of the central platform, and the height of the top surface of the insulating layer is lower than or equal to the height of the surface of the bottom plate portion.

[0014] Further, the top surface on the upper side of the insulating layer has a first minimum distance from the first surface, and the top surface on the lower side has a second minimum distance from the second surface, and the first minimum distance and the second minimum distance are in the range of 20% to 50% of the thickness of the central platform.

[0015] Further, the central platform further comprises a first extension portion, a second extension portion, and a third extension portion, wherein the central platform, the first extension portion, the second extension portion, and the third extension portion form a virtual triangle, and the center of gravity of the virtual triangle is offset to one side of the central platform.

[0016] Further, the plurality of lead lines further comprises at least one first display lead line and at least one second display lead line; the first display lead line is located at a first side of the central platform, and the second display lead line is located at a second side of the central platform opposite to the first side; wherein, at least one first display lead line is electrically connected to each light emitting diode; each second display lead line is electrically connected to each light emitting diode.

[0017] Further, a base is further included, disposed on the first surface and electrically connected to the lead frame, the base has an upper surface and a lower surface, and the upper surface is provided with a patterned metal layer.

[0018] Further, a metal heat dissipation layer is further included, disposed on the lower surface.

[0019] Further, the patterned metal layer comprises a first pattern and a plurality of second patterns electrically isolated from the first pattern, and any two adjacent second patterns are insulated from each other; a plurality of light emitting diodes are respectively electrically connected to the corresponding second pattern of the first pattern.

[0020] Further, the plurality of light emitting diodes are of a flip-chip type, the patterned metal layer is a III-shaped, and is electrically connected to a plurality of light emitting diodes.

[0021] Further, the plurality of light emitting diodes are of a wire-bonding type, the first pattern is a convex shape, and a plurality of light emitting diodes are respectively electrically connected to the second pattern through a plurality of wires.

[0022] To solve the above technical problems, the utility model provides another technical scheme which is a light emitting device, the light emitting device comprises: a lead frame, comprising a central platform and a plurality of leads; a shell, surrounding the lead frame, the shell has a first end face and a second end face and a peripheral side wall arranged between the first end face and the second end face. Wherein, the peripheral side wall comprises an upper side wall part and a lower side wall part, the upper side wall part and the central platform define a first cavity, and the lower side wall part and the central platform define a second cavity, the first cavity has a first opening towards the first end face, and the second cavity has a second opening towards the second end face. A plurality of light emitting diodes are arranged in the first cavity and electrically connected to a part of the plurality of leads; and an integrated circuit is arranged in the second cavity, and a part of the plurality of leads is electrically connected to the integrated circuit. Wherein, the upper side wall part comprises a bottom plate part and four inner side faces, the bottom plate part is connected to three inner side faces, and the bottom plate part and each inner side face form a stepped structure, the stepped structure covers a part of the plurality of leads and forms an inner cavity surrounding the plurality of light emitting diodes and having a gap.

[0023] Further, the width of the inner cavity is greater than one half of the width of the first opening of the first cavity.

[0024] Further, the height of the bottom plate part is less than or equal to the height of the plurality of light emitting diodes.

[0025] Further, the lead frame further comprises: at least one first pre-supporting structure arranged on one side of the gap formed by the bottom plate part, wherein each first pre-supporting structure has a fracture surface and a chamfered edge connected to the fracture surface, wherein the shell further comprises at least one pre-insertion hole for accommodating at least one second pre-supporting structure in a forming process of the lead frame, and the lead frame is connected to at least one second pre-supporting structure in the forming process.

[0026] Further, the second end face comprises a plurality of grooves; each groove has an outward opening, and the plurality of grooves are separated from each other; each groove accommodates at least one lead; the plurality of leads are flatly attached to the bottom surface of the groove and are bent outwardly and then towards the second surface.

[0027] Further, an insulating layer is arranged on the first surface and the second surface of the central platform respectively, and the insulating layer further comprises a through portion arranged to penetrate part of the central platform.

[0028] Further, the thickness of the insulating layer is greater than the thickness of the center platform, and the height of the top surface of the insulating layer is lower than or equal to the height of the surface of the bottom plate portion.

[0029] Further, the top surface on the upper side of the insulating layer has a first shortest distance from the first surface, and the top surface on the lower side has a second shortest distance from the second surface, and the first shortest distance and the second shortest distance are in the range of 20% to 50% of the thickness of the center platform.

[0030] Further, the center platform further comprises a first extension portion, a second extension portion, and a third extension portion, wherein the center platform, the first extension portion, the second extension portion, and the third extension portion form a virtual triangle, and the center of gravity of the virtual triangle is offset to one side of the center platform.

[0031] Further, the plurality of lead wires further comprises at least one first display lead wire and at least one second display lead wire, the first display lead wire is located on the first side of the center platform, and the second display lead wire is located on the second side opposite to the first side of the center platform, wherein at least one first display lead wire is electrically connected to each light emitting diode, and each second display lead wire is electrically connected to each light emitting diode.

[0032] Further, the light emitting device further comprises a light shielding encapsulation glue filled in the second cavity.

[0033] Further, the light emitting device further comprises a light shielding encapsulation glue filled in the second cavity.

[0034] Further, the inner cavity is filled with a brightening glue, and the brightening glue is coated around each light emitting diode, and only an emitting surface of each light emitting diode is exposed.

[0035] In order to enable a further understanding of the features and technical contents of the present application, please refer to the following detailed description and drawings of the present application. However, the drawings provided are only for reference and illustration, and are not intended to limit the present application. BRIEF DESCRIPTION OF DRAWINGS

[0036] Figure 1 It is a schematic diagram of the light emitting device of the first embodiment of the present application.

[0037] Figure 2 It is a schematic diagram of the light emitting device of the first embodiment of the present application.

[0038] Figure 3 It is a schematic diagram of the light emitting device of the first embodiment of the present application. Figure 2 It is a schematic diagram of the light emitting device of the first embodiment of the present application.

[0039] Figure 4 This is a top exploded view of the light-emitting device according to the first embodiment of the present invention.

[0040] Figure 5 This is an exploded view from below of the light-emitting device according to the first embodiment of this utility model.

[0041] Figure 6 This is an X-ray perspective schematic diagram of the light-emitting device according to the first embodiment of this utility model.

[0042] Figure 7 for Figure 6 Detailed schematic diagram of the section cut from line VII to line VII.

[0043] Figure 8 This is a schematic diagram of the uncut light-emitting device forming process in the first embodiment of this utility model.

[0044] Figure 9 This is a bottom view of the light-emitting device according to the first embodiment of this utility model.

[0045] Figure 10 for Figure 3 A detailed schematic diagram of the middle dashed coil.

[0046] Figure 11 This is a perspective view of the light-emitting device according to the first embodiment of this utility model.

[0047] Figure 12 This is a schematic diagram of the light-emitting device according to the second embodiment of the present invention.

[0048] Figure 13 For along Figure 12 A schematic diagram of the cross-section taken from the mid-section line XIII-XIII.

[0049] Figure 14 This is a schematic diagram of the light-emitting device according to the third embodiment of the present invention.

[0050] Figure 15 For along Figure 14 A schematic diagram of the cross-section taken by the mid-section line XXV-XXV. Detailed Implementation

[0051] The following is to illustrate the embodiments of the light emitting device disclosed by the present application through specific examples. Those skilled in the art can understand the advantages and effects of the present application from the disclosure. The present application can be implemented or applied by other different specific embodiments, and the details in the specification can be modified and changed in various ways based on different viewpoints and applications without departing from the concept of the present application. In addition, the drawings of the present application are only simple schematic illustrations, not the actual size description, and the prior declaration. The following embodiments will further illustrate the related technical content of the present application, but the disclosed content is not used to limit the protection scope of the present application.

[0052] It should be understood that although the terms "first", "second", "third" and the like can be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are mainly used to distinguish one component from another component, or one signal from another signal. In addition, the term "or" used herein can include any one or more combinations of the associated listed items.

[0053] First embodiment

[0054] Referring to Figures 1 to 5 .The schematic diagram of the light emitting device of the present application. Figure 1 The top view schematic diagram of the light emitting device of the first embodiment of the present application. Figure 2 The cross-sectional view taken along the cross-sectional line III-III in FIG. 1. Figure 3 The top view exploded schematic diagram of the light emitting device of the present application. Figure 2 The bottom view exploded schematic diagram of the light emitting device of the present application. The light emitting device LE includes a lead frame 1, a housing 2, a light emitting diode 3, an integrated circuit 4, a light-transmitting encapsulation glue 5, and an insulating layer 6. Figure 4 Figure 5 As shown in FIG. 1, the lead frame 1 is composed of a conductive material and has a central platform 11 and lead wires 12 arranged around the central platform 11. Moreover, the central platform 11 has a first surface 111 and a second surface 112 opposite to the first surface 111. The conductive material of the lead frame 1 can be, for example, a metal such as one of titanium (Ti), copper (Cu), nickel (Ni), gold (Au), chromium (Cr), tantalum (Ta), platinum (Pt), tin (Sn), silver (Ag), phosphorus (P), or an alloy thereof. In addition, the lead frame 1 can also include a single metal layer or different metal layers.

[0055] As shown in FIG. 1, the lead frame 1 is composed of a conductive material and has a central platform 11 and lead wires 12 arranged around the central platform 11. Moreover, the central platform 11 has a first surface 111 and a second surface 112 opposite to the first surface 111. The conductive material of the lead frame 1 can be, for example, a metal such as one of titanium (Ti), copper (Cu), nickel (Ni), gold (Au), chromium (Cr), tantalum (Ta), platinum (Pt), tin (Sn), silver (Ag), phosphorus (P), or an alloy thereof. In addition, the lead frame 1 can also include a single metal layer or different metal layers. Figure 3 Please refer to

[0056] , Figure 1 , Figure 3The housing 2 surrounds the lead frame 1. The housing 2 has a first end face 22, a second end face 23, and a peripheral side wall 21 disposed between the first end face 22 and the second end face 23. The peripheral side wall 21 includes an upper side wall portion 211, which includes a floor portion 2111 surrounding three sides of the first surface 111. The upper side wall portion 211 of the peripheral side wall 21 and the central platform 11 define a first cavity 24. The first cavity 24 has a first opening 241 facing the first end face 22. The light emitting diodes 3 are disposed in the first cavity 24, i.e. on the first surface 111 of the central platform 11. Moreover, the light emitting diodes 3 are electrically connected to the partial leads 12.

[0057] The peripheral side wall 21 further includes a lower side wall portion 212, which and the central platform 11 define a second cavity 25. The second cavity 25 has a second opening 251 facing the second end face 23. The integrated circuit 4 is disposed in the second cavity 25, and the partial leads 12 are electrically connected to the integrated circuit 4.

[0058] In detail, the upper side wall portion 211 has four inner side faces 2112, which together with the first surface 111 form the first cavity 24. Moreover, the upper side wall portion 211 has the floor portion 2111, which is connected to at least three of the inner side faces 2112 and forms a U-shape. The four inner side faces, the floor portion 2111, and the first surface 111 form the first cavity 24. That is, the floor portion 2111 and each inner side face 2112 form a step structure 2113, which covers the partial leads 12 and forms an inner cavity 2114 surrounding the light emitting diodes 3.

[0059] In order to achieve the desired color and brightness of the light emitting diodes 3, the width of the inner cavity 2114 is greater than half of the width of the first opening 241 of the first cavity 24. Moreover, the height of the floor portion 2111 is less than or equal to the height of the light emitting diodes 3. When the light emitting diodes 3 are surrounded by the brightness enhancement material 51, the height of the brightness enhancement material 51 filling the inner cavity 2114 is equal to the height of the floor portion 2111. Therefore, the height of the floor portion 2111 is less than or equal to the height of the light emitting diodes 3, i.e. the height of the brightness enhancement material 51 is less than or equal to the height of the light emitting diodes 3, so that the light emitting surface 31 of the light emitting diodes 3 is not covered by the brightness enhancement material 51. Moreover, the brightness enhancement material 51 can be a reflective material (white glue) or a fluorescent material.

[0060] The light emitting diodes 3 are disposed on the first surface 111 and electrically connected with some of the plurality of leads 12. The light emitting diodes 3 can include colored light emitting diodes emitting red light, green light, blue light or white light. The light emitting device LE has various combinations of light emitting diodes to obtain desired color and brightness. For example, the light emitting device LE can have four color light emitting diodes, such as a combination of white, red and green, to obtain a higher Color Rendering Index (CRI). In the present embodiment, the light emitting diodes 3 have three single color light emitting diodes, including red, green and blue, arranged in a triangle on the first surface 111, evenly distributed in the first cavity 24, to improve the light emitting efficiency of each single color light emitting diode. However, the above is only an example, and the color type and arrangement of the light emitting diodes 3 are not limited by the present application.

[0061] As shown in Figure 3 , the peripheral side wall 21 further has a lower side wall portion 212 close to the second end surface 23. The lower side wall portion 212 further has four side portions 2121. The four side portions 2121 and the second surface 112 form a second cavity 25, and the integrated circuit 4 is disposed in the second cavity 25. That is, the integrated circuit 4 is disposed on the second surface 112 of the central platform 11. The integrated circuit 4 is electrically connected with some of the plurality of leads 12. The integrated circuit 4 of the present embodiment integrates a driving circuit, a control circuit and a power supply circuit, and provides power to drive the light emitting diodes, and can control the brightness and time of the light emitting diodes 3.

[0062] As shown in Figure 2 , the leads 12 have a first display lead 124 and a plurality of second display leads 125, the first display lead 124 is disposed on one side of the central platform 11, and the plurality of second display leads 125 are disposed on the opposite side of the first display lead 124. In the first cavity 24, the light emitting diodes 3 are respectively electrically connected with the first display lead 124 and the plurality of second display leads 125. As shown in Figure 5 , in the second cavity 25, the integrated circuit 4 is respectively electrically connected with the leads 12 surrounding the central platform 11. The light emitting diodes 3 and the integrated circuit 4 are located in different cavities. Therefore, the integrated circuit 4 does not shield the light of the light emitting diodes 3. Further, the wire bonding of the light emitting diodes 3 is concentrated in the first cavity 24, and the wire bonding of the integrated circuit 4 is concentrated in the second cavity 25, the wire bonding of the integrated circuit 4 and the light emitting diodes 3 are separated in different cavities, increasing the wire bonding space, and the wire bonding of the two does not interfere with each other, effectively improving the stability of die bonding and wire bonding.

[0063] Further, the first display lead wire 124 is connected to the red light emitting diode, the green light emitting diode and the blue light emitting diode in the embodiment, and the red light emitting diode, the green light emitting diode and the blue light emitting diode are respectively connected to different second display lead wires 125. Since the single color light emitting diodes are respectively connected to different lead wires in the utility model, the current value of each light emitting diode can be independently measured when the light emitting device LE displays, and the failed light emitting diode can be immediately diagnosed when the display is abnormal.

[0064] As shown in Figure 2 , the upper side wall part 211 further comprises a bottom plate part 2111, and three of the inner side surfaces 2112 are connected to the bottom plate part 2111 and form a U-shaped inner cavity 2114, and the U-shaped structure has a gap O. Since the bottom plate part 2111 surrounds the light emitting diode 3, the bottom plate part 2111 has a structure for uniformly distributing the weight when the die bonding and wire bonding are performed, so as to disperse the stress and improve the stability of the light emitting device LE. Moreover, since the bottom plate part 2111 has a thickness, the stepped structure 2113 extending from the inner side surface 2112 to the first surface 111. When the light emitting diode 3 is coated with the brightening glue 51, the height difference between the bottom plate part 2111 and the first surface 111 can control the height of the brightening glue 51, so that the light emitting surface 31 of the light emitting diode 3 is not covered by the brightening glue 51.

[0065] Table 1 is the luminance measurement data of the light emitting device LE in the embodiment, and the experimental conditions of the experimental group are that the U-shaped bottom plate part 2111 is coated with the brightening glue 51, and the experimental conditions of the control group are that the brightening glue 51 is not coated. As shown in the data in Table 1, under the fixed driving current (Iv), the luminance measured by the experimental group under each color is higher than that measured by the control group. Further, the luminance improvement efficiency of each single color light emitting diode 3 is obtained from the data in Table 1, which is respectively 7.1% for red light, 11% for green light and 12.9% for blue light. Therefore, the brightening glue 51 in the U-shaped bottom plate part 2111 can improve the overall luminance of the light emitting diode 3.

[0066] Table 1

[0067]

[0068] As shown in Figure 4 , Figure 5 , the light emitting device LE further comprises a light-transmitting encapsulation glue 5 and a light-blocking encapsulation glue 7. The light-transmitting encapsulation glue 5 fills the first cavity 24. The light-blocking encapsulation glue 7 fills the second cavity 25. The material of the encapsulation glue can be selected from a sealing glue or an ultraviolet glue. The high adhesion of the encapsulation glue can prevent water vapor from entering the light emitting device LE.

[0069] As shown in Figure 4 , Figure 5As shown, each lead 12 also has a V-shaped groove V on the surface that is bonded to the housing 2, which can increase the contact area between the lead 12 and the housing 2, improve adhesion, and prevent external moisture from easily penetrating the light-emitting device LE.

[0070] like Figure 2 As shown, the housing 2 in this embodiment also includes a pre-injection structure 26, which is formed by recessing from the outer side of the housing 2 towards the center. The pre-injection structure 26 corresponds to the injection hole 261 used when forming the housing 2. Furthermore, the upper sidewall portion 211 has five inner edge edges 2115, one of which corresponds to the pre-injection structure 26 and is inclined relative to the other four inner edge edges 2115. During injection molding, the pre-injection structure 26 not only facilitates injection molding but can also be used to identify the direction of the light-emitting device LE.

[0071] Figure 6 This is an X-ray perspective schematic diagram of the light-emitting device according to an embodiment of the present invention. Figure 7 for Figure 6 Detailed diagrams of sections VII to VII. Figure 8 This is a schematic diagram of the uncut light-emitting device forming process according to an embodiment of the present invention.

[0072] like Figure 6 , Figure 7 As shown, the housing 2 in this embodiment also includes a first pre-support structure 13, disposed on the notch O side of the bottom plate portion 2111. The first pre-support structure 13 has a fracture surface 131 and a chamfered edge 132 connecting the fracture surface. The housing 2 also includes a pre-insertion 27 for accommodating a second pre-support structure 14 during the forming process of the lead frame 1. One end of the second pre-support structure 14 is disposed in the pre-insertion 27 to support the stress during die bonding and wire bonding.

[0073] Figure 9 This is a bottom view schematic diagram of the light-emitting device according to an embodiment of this utility model. Figure 9 As shown, the second end face 23 of the housing 2 in this embodiment has three grooves 2123, each groove 2123 being open and having an outward opening OUT. The three grooves 2123 are separated from each other, and each groove 2123 accommodates three to four leads 12. Each lead 12 is flat against the bottom surface of the groove 2123 and extends outward before bending towards the second surface 112. In the light-emitting device LE of this utility model, each lead 12 is bent along the side portion 2121, so that the lead 12 is stably disposed around the housing 2. In addition, since the lead 12 is located on the three sides of the light-emitting device LE, the injected metal can evenly form each lead 12 during the forming process of the lead 12.

[0074] Figure 10 for Figure 3 A detailed schematic diagram of the dashed box in the middle. (See attached image.)Figure 1 , Figure 3 , Figure 10 As shown, the light-emitting device LE also includes an insulating layer 6, respectively disposed on the first surface 111 and the second surface 112 of the central platform 11. The insulating layer 6 further includes a through portion 61, which is disposed between either the central platform 11 and the lead wire 12. Figure 10 As shown, the thickness TH1 of the through-hole 61 is greater than the thickness TH2 of the central platform, and the top surface TS of the through-hole 61 is lower than or equal to the surface of the bottom plate 2111. The top surface TS of the upper side of the through-hole 61 has a first shortest distance TH3 with the first surface 111. The top surface TS of the lower side of the through-hole 61 has a second shortest distance TH4 with the second surface 112. The size of the first shortest distance TH3 and the second shortest distance TH4 is in the range of 20% to 50% of the thickness of the central platform 11. In other words, the thickness TH1 of the through-hole 61 is preferably 1.4 to 1.67 times the thickness TH2 of the central platform. In this embodiment of the present invention, because the insulating layer 6 has a through-hole structure, the problem of uneven coating and material shortage in the shallow insulating layer in the art can be improved by increasing the thickness TH1 of the through-hole 61, thereby reducing the intrusion of external moisture and strengthening the stability of the lead frame 1.

[0075] Figure 11 This is a perspective view of the light-emitting device according to an embodiment of the present invention. Figure 11 As shown, the central platform 11 also has a first extension 113, a second extension 114, and a third extension 115. The central platform 11, the first extension 113, the second extension 114, and the third extension 115 form a virtual triangle, and the center of gravity of the virtual triangle is offset towards one side of the central platform 11. The area of ​​the virtual triangle is close to the area of ​​the light-emitting device LE, which can provide heat dissipation for the light-emitting device LE and prevent the temperature of the light-emitting device LE from becoming too high when it is turned on, which would cause the current of the light-emitting diode 3 to decrease and cause white balance shift in the display. In addition, the planar area formed by the connection between the lead wire 12 and the central platform 11 can disperse the stress on the light-emitting device LE.

[0076] Second Embodiment

[0077] Figure 12 This is a schematic diagram of the light-emitting device according to the second embodiment of the present invention. Figure 13 For along Figure 12 A schematic diagram of the cross-section taken from the mid-section line XIII-XIII.

[0078] See Figures 12 to 13The utility model discloses a second embodiment provides light emitting device LE, it includes lead frame 1, casing 2, light emitting diode 3, integrated circuit 4, light transmission encapsulation glue 5 and insulating layer 6. Different from first embodiment is, light emitting device LE still includes base 8 and patterned metal layer 9 in the second embodiment.

[0079] The base 8 can be a rectangle, which is disposed on the first surface 111 of the center platform 11 of the lead frame 1, and the area of the base 8 is less than the area of the center platform 11. The casing 2 has a U-shaped bottom plate part 2111, and the bottom plate part 2111 surrounds the base 8 to form an inner cavity 2114. The base 8 is formed of an insulating material. For example, a single-layer or multi-layer structure composed of an insulating material on a printed circuit board, silicon, graphene or a ceramic material. Moreover, the base 8 has an upper surface US and a lower surface LS. The upper surface US of the base 8 is provided with the patterned metal layer 9 to electrically connect the plurality of light emitting diodes 3. In addition, the lower surface LS of the base 8 can be provided with a metal heat dissipation layer 81 to transfer the heat energy generated by the light emitting diodes 3 to the lead frame 1, and the metal heat dissipation layer 81 is not electrically connected to the light emitting diodes 3. In detail, the metal heat dissipation layer 81 is also a rectangle, which covers the lower surface LS, and the coverage area of the metal heat dissipation layer 81 is less than or equal to the area of the base 8. The heat dissipation effect of the base 8 is optimized as the coverage area of the metal heat dissipation layer 81 is larger. In addition, the base 8 and the lead frame 1 have a bonding layer 82. In a preferred embodiment, the base 8 and the lead frame 1 are bonded by high thermal conductivity glue, for example, silver glue. In this embodiment, the weight percentage of the silver glue is greater than or equal to 80%, but the present application is not limited to the above range.

[0080] The light emitting diodes 3 are electrically connected with the lead frame 1 through the patterned metal layer 9. The light emitting diodes 3 in the second embodiment are wire-bonding type light emitting diodes. The patterned metal layer 9 comprises a first pattern 91 and a plurality of second patterns 92 electrically isolated from the first pattern 91, and any two adjacent second patterns 92 are insulated from each other. In the embodiment, the light emitting diodes 3 are single-color light emitting diodes of red, green and blue, arranged in a triangle on the convex shape of the first pattern 91, and evenly distributed in the first cavity 24, so as to improve the light emitting efficiency of each single-color light emitting diode and shorten the length of the wire-bonding for electrical connection, thereby improving the reliability of the product. Each second pattern 92 is in a rectangular shape, one end of which is connected with the single-color light emitting diode 3, and the other end is connected with the lead 12. In addition, the convex shape of the first pattern 91 is a double convex stack, which can not only shorten the length of the wire-bonding, but also assist in positioning the three single-color light emitting diodes. The convex shape of the second pattern 92 can reduce the area of the patterned metal layer 9, thereby enhancing the adhesion between the base 8 and the encapsulating glue, and improving the reliability of the product. In addition, the distribution of the plurality of second patterns 92 is complementary to the pattern of the first pattern 91. For example, in the embodiment, the pattern of the second pattern 92 corresponding to the convex shape of the first pattern 91 is a plurality of rectangles with the shapes of long, horizontal and long from left to right. However, the above is only an example, and the color type and arrangement of the light emitting diodes 3 are not limited in the utility model. The above arrangement can reduce the length of the wire-bonding in the second embodiment from 1.2 cm to 0.7 cm, about 40% of the length is saved, and the cost of the gold wire for wire-bonding is effectively reduced.

[0081] In addition, as shown in Figure 13 The shell 2 of the second embodiment has a first cavity 24 for placing the light emitting diodes 3 and the base 8, and a second cavity 25 for placing the integrated circuit 4. The light emitting device LE comprises a light-transmitting encapsulating glue 5 and a light-blocking encapsulating glue 7. The light-transmitting encapsulating glue 5 fills the first cavity 24. The light-blocking encapsulating glue 7 fills the second cavity 25. The light emitting device LE further comprises a brightening glue 51, such as white glue or fluorescent glue, which is arranged in the first cavity 24, covers the base 8 and the patterned metal layer 9, and is coated around each light emitting diode 3, so that only the light emitting surface of each light emitting diode 3 is exposed. The light emitting diodes 3 are arranged on the base 8, so as to reduce the distance between the light emitting surface of the light emitting diode 3 and the first opening 241 of the first cavity 24, and improve the light emitting efficiency.

[0082] The third embodiment

[0083] Figure 14 The third embodiment of the light emitting device of the utility model is shown in the figure. Figure 15 The cross-sectional view is taken along the Figure 14 sectional plane line XV-XV.

[0084] Referring toFigures 14 to 15 The third embodiment provides a light emitting device LE, which comprises a lead frame 1, a housing 2, a light emitting diode 3, an integrated circuit 4, a base 8 and a patterned metal layer 9'. The light emitting diode 3 of the third embodiment is a flip chip type, which is different from the light emitting diode 3 of the second embodiment. The patterned metal layer 9' comprises a first pattern 91' and a plurality of second patterns 92' electrically isolated from the first pattern 91', and any two adjacent second patterns 92' are insulated from each other. One end of the first pattern 91' is adjacent to the side of the notch O of the bottom plate part 2111 and is electrically connected to the first display lead 124. The plurality of second patterns 92' are arranged away from the side of the notch O of the bottom plate part 2111 and are respectively electrically connected to the plurality of second display leads 125. In addition, the patterned metal layer 9' is an I shape, and one end of the light emitting diode 3 is electrically connected to the first pattern 91' and the other end is electrically connected to the second pattern 92'. As shown in the figure, the patterned metal layer 9' is a III shape, and three light emitting diodes 3 are arranged into a river shape according to the patterned metal layer 9'. That is, the number of I shapes of the patterned metal layer 9' is proportional to the number of light emitting diodes 3. The light emitting diode 3 is electrically connected to the patterned metal layer 9' through the conductive material 93, and a large number of gold wires are not required for the wire bonding process, which can save costs and reduce the problem of display abnormalities caused by the falling of gold wires. Figure 14

[0085] In addition, as shown in the figure, the housing 2 of the third embodiment has a first cavity 24, and the brightening glue 51 is arranged in the first cavity 24 and surrounds the periphery of each light emitting diode and the conductive material 93, only exposes the light emitting surface of each light emitting diode 3, and covers the exposed base 8 and patterned metal layer 9'. The light-transmitting encapsulating glue 5 fills the first cavity 24 outside the above structure. Figure 15

[0086] Advantages of the embodiment

[0087] The light emitting device provided by the utility model can separate the wire bonding of the integrated circuit and the light emitting diode, increase the wire bonding space, and the wire bonding of the two will not interfere with each other, effectively improving the stability of die bonding and wire bonding. In addition, the integrated circuit will not shield the light of the light emitting diode, and the brightness of the light emitting diode 3 is improved. Each monochromatic light emitting diode is electrically connected to different leads, and the current value of each light emitting diode can be independently measured when the light emitting device LE displays, and the failed light emitting diode can be immediately diagnosed when the display is abnormal.

[0088] In addition, the lead frame of the utility model is matched with the base with the patterned metal layer and can be applied to flip chip type or wire bonding type wafers. When the light emitting diode is arranged according to the shape of the first pattern 91 and 91', the length of the wire used for electrical connection can be shortened, so that the reliability of the product is improved.

[0089] ​​The above disclosed is only the preferred feasible embodiment of the utility model, and does not limit the protection scope of the utility model's claims, so that all equivalent technical changes made by applying the utility model specification and the attached drawings are included in the protection scope of the utility model's claims.

Claims

1. A light emitting device, characterized by, The light emitting device comprises: a lead frame comprising a center platform and a plurality of leads, the center platform having a first surface and a second surface; a plurality of light emitting diodes disposed on the first surface and electrically connected to a portion of the plurality of leads; an integrated circuit disposed on the second surface and electrically connected to a portion of the plurality of leads; and a housing surrounding the lead frame, the housing comprising a first end surface and a second end surface and a peripheral sidewall disposed between the first end surface and the second end surface; wherein the peripheral sidewall comprises an upper sidewall portion, the upper sidewall portion comprising a floor portion disposed around a portion of the first surface.

2. The light emitting device of claim 1, wherein The upper sidewall portion comprises four inner sidewalls, the floor portion is connected to at least three of the inner sidewalls and forms a U-shape; wherein the four inner sidewalls, the floor portion and the first surface form a first cavity.

3. The light emitting device of claim 2, wherein The light emitting device further comprises a light transmissive encapsulant filling the first cavity; wherein the light transmissive encapsulant further comprises a brightness enhancement layer disposed around each of the light emitting diodes and exposing a light emitting surface of each of the light emitting diodes.

4. The light emitting device of claim 2, wherein The lead frame further comprises: at least one first pre-support structure disposed on a notch side of the floor portion, wherein each of the first pre-support structures has a fracture surface and a chamfered edge connected to the fracture surface, wherein the housing further comprises at least one pre-recess for accommodating at least one second pre-support structure during a molding process of the lead frame, and the lead frame is connected to the at least one second pre-support structure during the molding process.

5. The light emitting device of claim 1, wherein The peripheral sidewall further comprises a lower sidewall portion comprising four sidewalls; wherein the four sidewalls and the second surface form a second cavity, and the integrated circuit is disposed in the second cavity.

6. The light emitting device of claim 5, wherein The light emitting device further comprises a light blocking encapsulant filling the second cavity.

7. The light emitting device of claim 5, wherein The second end surface comprises a plurality of recesses; wherein each of the recesses has an outward opening, and the recesses are separated from each other; each of the recesses accommodates at least one of the leads; and the leads are flatly disposed on a bottom surface of the recesses and are bent outwardly towards the second surface.

8. The light emitting device of claim 1, wherein The light emitting device further comprises an insulating layer disposed on the first surface and the second surface of the center platform, respectively; wherein the insulating layer further comprises a through portion disposed between any of the center platform and the plurality of leads.

9. The light emitting device of claim 8, wherein, The thickness of the insulating layer is greater than the thickness of the center platform, and the height of a top surface of the insulating layer is lower than or equal to the height of a surface of the floor portion.

10. The light emitting device of claim 9, wherein The top surface on the upper side of the insulating layer has a first minimum distance from the first surface; and the top surface on the lower side has a second minimum distance from the second surface; wherein the first minimum distance and the second minimum distance are in a range of 20% to 50% of the thickness of the center platform.

11. The light emitting device according to any one of claims 1 to 10, wherein The center platform further comprises a first extension, a second extension and a third extension, The center platform and the first, second and third extending parts form a virtual triangle, and the gravity center of the virtual triangle is offset to one side of the center platform.

12. The light emitting device according to any one of claims 1 to 10, wherein The plurality of lead lines further include at least one first display lead line and at least one second display lead line; the first display lead line is located on a first side of the center platform, and the second display lead line is located on a second side of the center platform opposite the first side. At least one first display lead line is electrically connected to each light emitting diode; each second display lead line is electrically connected to each light emitting diode.

13. The light emitting device according to any one of claims 1 to 10, wherein A base is further included, arranged on the first surface and electrically connected to the lead frame, the base has an upper surface and a lower surface, and the upper surface is provided with a patterned metal layer.

14. The light emitting device of claim 13, wherein A metal heat dissipation layer is further included, arranged on the lower surface.

15. The light emitting device of claim 13, wherein The patterned metal layer includes a first pattern and a plurality of second patterns electrically isolated from the first pattern, and any two adjacent second patterns are insulated from each other. A plurality of light emitting diodes are electrically connected to the corresponding second patterns of the first pattern.

16. The light emitting device of claim 15, wherein The plurality of light emitting diodes are of a flip chip type, the patterned metal layer is a III shape, and is electrically connected to the plurality of light emitting diodes.

17. The light emitting device of claim 15, wherein The plurality of light emitting diodes are of a wire bonding type, the first pattern is a convex shape, and the plurality of light emitting diodes are electrically connected to the second pattern through a plurality of wires.

18. A light emitting device comprising: The light emitting device includes: A lead frame including a center platform and a plurality of lead lines; A shell surrounding the lead frame, the shell having a first end surface and a second end surface and a peripheral side wall arranged between the first end surface and the second end surface; The peripheral side wall includes an upper side wall portion and a lower side wall portion, the upper side wall portion and the center platform define a first cavity, and the lower side wall portion and the center platform define a second cavity, the first cavity has a first opening facing the first end surface, and the second cavity has a second opening facing the second end surface; A plurality of light emitting diodes arranged in the first cavity and electrically connected to a part of the plurality of lead lines; and An integrated circuit arranged in the second cavity and electrically connected to a part of the plurality of lead lines; The upper side wall portion includes a bottom plate portion and four inner side surfaces, the bottom plate portion is connected to three inner side surfaces, and the bottom plate portion and each inner side surface form a stepped structure, the stepped structure covers a part of the plurality of lead lines and forms an inner cavity surrounding the plurality of light emitting diodes and having a gap.

19. The light emitting device of claim 18, wherein, The width of the inner cavity is greater than one half of the width of the first opening of the first cavity.

20. The light emitting device of claim 18, wherein, The height of the bottom plate portion is less than or equal to the height of the plurality of light emitting diodes.

21. The light emitting device of claim 18, wherein The lead frame further includes: At least one first pre-supporting structure arranged on one side of the gap formed by the bottom plate portion, wherein each first pre-supporting structure has a fracture surface and a reverse chamfer edge connected to the fracture surface, The shell further comprises at least one pre-insertion hole for accommodating at least one second pre-supporting structure in a forming process of the lead frame, and the lead frame is connected with the at least one second pre-supporting structure in the forming process.

22. The light emitting device of claim 18, wherein The center platform has a first surface and a second surface, and the second surface comprises a plurality of grooves; Each of the grooves has an outward opening, and the grooves are separated from each other; each of the grooves accommodates at least one lead wire; and the lead wires are flatly arranged on the bottom surface of the grooves and are outwardly extended and then bent towards the second surface.

23. The light emitting device of claim 18, wherein An insulating layer is arranged on the first surface and the second surface of the center platform, and the insulating layer further comprises a through portion arranged to penetrate the center platform.

24. The light emitting device of claim 23, wherein, The thickness of the insulating layer is greater than the thickness of the center platform, and the height of the top surface of the insulating layer is lower than or equal to the height of the surface of the bottom plate portion.

25. The light emitting device of claim 24, wherein, The top surface on the upper side of the insulating layer has a first minimum distance from the first surface, and the top surface on the lower side has a second minimum distance from the second surface. The first minimum distance and the second minimum distance are in the range of 20% to 50% of the thickness of the center platform.

26. The light emitting device of any of Claims 18 to 23, wherein, The center platform further comprises a first extension portion, a second extension portion, and a third extension portion. The center platform, the first extension portion, the second extension portion, and the third extension portion form a virtual triangle, and the center of gravity of the virtual triangle is offset to one side of the center platform.

27. The light emitting device of any of Claims 18 to 23, wherein, The lead wires further comprise at least one first display lead wire and at least one second display lead wire; the first display lead wire is located on the first side of the center platform, and the second display lead wire is located on the second side of the center platform opposite to the first side. Each of the first display lead wires is electrically connected with each of the light emitting diodes, and each of the second display lead wires is electrically connected with each of the light emitting diodes.

28. The light emitting device of any of Claims 18 to 23, wherein, The light emitting device further comprises a light shielding encapsulation gel filling the second cavity.

29. The light emitting device of any of Claims 18 to 23, wherein, The light emitting device further comprises a light transmitting encapsulation gel filling the first cavity.

30. The light emitting device of claim 29, wherein, The inner cavity is filled with a brightening gel, and the brightening gel is coated around each of the light emitting diodes, and only an emitting surface of each of the light emitting diodes is exposed.

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