Low-power-consumption standby circuit under high-voltage direct-current working condition

Abstract

The utility model discloses a low power consumption standby circuit under high voltage direct current work, which comprises a control module, a power supply management module, a power supply module and an output module, the control module is bidirectionally and electrically connected with the power supply management module, and the control module provides high voltage for starting the power supply management module. After being started, the power management module generates a signal and feeds the signal back to the control module to close the control module; the power supply management module is electrically connected with the power supply module, and the power supply management module is used for converting electric energy generated by the power supply module and using part of the electric energy for self-power supply; the power supply management module is electrically connected with the output module, and the power supply module is bidirectionally and electrically connected with the power supply management module, so that the power supply module can supply power to the power supply management module in a self-breaking manner, the power supply of the control module to the power supply management module is cut off, and resources are saved.

Description

Technical Field

[0001] This utility model belongs to the technical field of electronic circuits, specifically a low-power standby circuit operating under high-voltage direct current. Background Technology

[0002] With the vigorous development of the new energy field, high-voltage direct current (HVDC) is being used more and more widely to improve power transmission efficiency, enhance grid stability, and realize long-distance power transmission.

[0003] Correspondingly, in the field of new energy, the power supply under high voltage DC operation has increasingly higher requirements for standby power consumption, and standby power consumption is a key requirement of high voltage battery power supply system. Traditional high voltage resistor start-up circuits will set multiple resistors under high input voltage, and high resistance will generate high heat, which can easily lead to high static loss. Utility Model Content

[0004] The purpose of this invention is to provide a low-power standby circuit operating under high-voltage direct current to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A low-power standby circuit operating under high voltage direct current includes a control module, a power management module, a power supply module, and an output module;

[0007] The control module and the power management module are bidirectionally electrically connected. The control module provides high voltage to start the power management module. After the power management module starts, it generates a signal to feed back to the control module to shut down the control module.

[0008] The power management module is electrically connected to the power supply module. The power management module is used to convert the electrical energy generated by the power supply module and to use part of the electrical energy for self-powering.

[0009] The power management module is electrically connected to the output module.

[0010] In a further technical solution, the control module includes a high-voltage input module, a first resistor module, a second resistor module, a transistor G2, and a switch module;

[0011] The output terminal of the high voltage input module is electrically connected to the first resistor module and the second resistor module respectively. The output terminal of the first resistor module is electrically connected to the base of the transistor G2. The output terminal of the second resistor module is electrically connected to the collector of the transistor G2. The input terminal of the power management module is electrically connected to the emitter of the transistor G2.

[0012] The power management module is used to control the switching module to turn on, and the switching module is used to turn off the transistor G2.

[0013] In a further technical solution, the power management module is directly electrically connected to the switching module.

[0014] A further technical solution also includes an MCU microprocessor, wherein the power management module is electrically connected to the MCU microprocessor, and the MCU microprocessor is electrically connected to the switching module.

[0015] In a further technical solution, the first resistor module includes multiple resistors connected in series, the second resistor module includes multiple resistors connected in series, and the resistance value of the first resistor module is greater than the resistance value of the second resistor module.

[0016] A further technical solution is provided, wherein the power management module includes an IC chip, a diode D2, a Zener diode ZD1, and a capacitor C2. The anode of the diode D2 is electrically connected to the emitter of the transistor G2, one end of the cathode of the diode D2 is electrically connected to the cathode of the Zener diode ZD1, and the other end of the cathode of the diode D2 is electrically connected to the input pin of the IC chip. The anode of the Zener diode ZD1 is grounded. One end of the capacitor C2 is electrically connected to the input pin of the IC chip, and the other end of the capacitor C2 is electrically connected to the anode of the Zener diode ZD1.

[0017] In a further technical solution, the first resistor module includes resistors R4, R5, R6, R8, R11 and R13 connected in series. One end of resistor R4 is electrically connected to the high voltage input module, and resistor R13 is electrically connected to the base of transistor G2.

[0018] In a further technical solution, the IC chip is used to output a high-level signal to the switching module.

[0019] In a further technical solution, the switching module includes an NMOS transistor G1, a capacitor C1, and a resistor R10. The drain of the NMOS transistor G1 is electrically connected to the node between the resistors R5 and R8. The source of the NMOS transistor G1 is grounded. The gate of the NMOS transistor G1, the capacitor C1, and the resistor R10 form an intermediate node. The other end of the capacitor is grounded. The other end of the resistor R10 is electrically connected to the MCU microprocessor. The IC chip is electrically connected to the MCU microprocessor.

[0020] The beneficial effects of this utility model are:

[0021] This utility model provides a control module for high-voltage startup of the power management module. After startup, the power management module can control the power supply module to start. After startup, the power supply module can output voltage to the output module through the voltage reduction of the power management module. In traditional high-voltage startup, the control module is in working state after startup. Since there are multiple large resistors in the control module, heat is easily generated, which wastes resources. In this application, the power supply module and the power management module are bidirectionally electrically connected, so that the power supply module can provide self-supply to the power management module, thereby cutting off the power supply from the control module to the power management module and saving resources.

[0022] Other features and advantages of this invention will be described in detail in the following detailed description section. Attached Figure Description

[0023] Figure 1 The process of this utility model Figure 1 .

[0024] Figure 2 : Flowchart of Embodiment 1 of this utility model.

[0025] Figure 3 : Flowchart of Embodiment 2 of this utility model.

[0026] Figure 4 : Circuit diagram of this utility model. Detailed Implementation

[0027] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0028] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings. Some terms used in the embodiments of this application will be explained below to facilitate understanding by those skilled in the art.

[0029] The NMOS transistor G1 is a field-effect transistor made of N-type semiconductor material. It has three main terminals: drain (D), source (S), and gate (G). In the NMOS transistor G1, the current between the drain and source is controlled by the gate voltage.

[0030] A battery management IC (BMS IC) is an integrated circuit specifically designed to monitor, manage, and protect battery packs. Its main functions include measuring key battery parameters such as voltage, current, and temperature to ensure the battery operates within safe operating ranges. In certain scenarios, it is typically used when a high voltage is required to start the device and then switch to a lower voltage supply during normal operation.

[0031] Example 1:

[0032] Please refer to Figure 1 , Figure 2 and Figure 4 ;

[0033] Existing high-voltage resistor starting circuits typically use multiple resistors with large resistance values ​​connected in series to achieve high-voltage starting. However, after high-voltage starting, the resistors in the circuit will consume power, causing heat generation and resulting in high static losses.

[0034] This embodiment provides a low-power standby circuit operating under high-voltage direct current, including a control module, a power management module, a power supply module, and an output module. The control module contains multiple resistors with large resistance values ​​connected in series to generate a high voltage. The control module and the power management module are bidirectionally electrically connected. In this embodiment, the control module should have a switch that operates according to the signal output by the power management module. The power management module and the power supply module are electrically connected. During operation, the control module first provides a high voltage to the power management module to start it up. After the power management module starts up with high voltage, the electrical energy in the power supply module can be transferred to the power management module and converted by the power management module to be output from the output module. At the same time, the power management module sends a signal to the control module to stop the control module from outputting high voltage to the power management module. Since the power management module is now supplied with electrical energy by the power supply module, a self-feedback power supply method is used to cyclically provide electrical energy to maintain its normal startup state, thereby maintaining normal power conversion operation. The control module stops providing high voltage to the power management module, thus ultimately achieving the goal of reducing energy consumption. The power management module in this embodiment should have a power management IC chip, a power conversion circuit, and a power supply circuit that enables self-feeding power to the power management IC chip. The power supply circuit can refer to the relevant technology in the publicly available technical document "CN106055011B - A self-starting power supply circuit".

[0035] Specifically, the control module can start the power management module under high voltage. However, since the control module has multiple resistors with large resistance values ​​connected in series, the control module will generate excessive heat when it is in operation for a long time. In this embodiment, the power management module after high voltage start can form a self-destructive power supply with the power supply module to maintain the normal operation of the power management module. At the same time, the power management module feeds back a signal to the control module to shut down the control module, thereby reducing the power consumption of the resistors.

[0036] In one embodiment based on the above examples, the control module includes a high-voltage input module, a first resistor module, a second resistor module, and a transistor G2. The output terminal of the high-voltage input module is electrically connected to the first resistor module and the second resistor module, respectively. The output terminal of the first resistor module is electrically connected to the base of the transistor G2, and the output terminal of the second resistor module is electrically connected to the collector of the transistor G2. Therefore, the resistance value of the second resistor module should be less than the resistance value of the first resistor module, so that the base of the transistor G2 is at a high voltage, thereby enabling the transistor G2 to conduct. The first input terminal of the power management module is electrically connected to the emitter of the transistor G2, so that the high voltage can be applied to the power management module, enabling the power management module to complete high-voltage startup.

[0037] In this embodiment, the power management module can also be used to control the switching module to turn on. Turning on the switching module can make the base voltage of transistor G2 low, thereby turning off transistor G2, reducing the resistance in the standby circuit, and thus reducing standby power consumption.

[0038] By making the resistance of the first resistor module less than that of the second resistor module, the DC power output from the high-voltage DC power supply is divided by the first and second resistor modules, resulting in a base voltage greater than the collector voltage of transistor G2. This causes transistor G2 to conduct. The reduced voltage then acts on the power management module to complete its high-voltage startup. The power management module can then control the switching module to conduct. The conduction of the switching module lowers the voltage of transistor G2, resulting in a low base voltage and ultimately turning transistor G2 off. This reduces the resistance of the parallel-connected first and second resistor modules when the high-voltage input module outputs high-voltage DC power, thereby reducing the high static losses generated by the first and second resistor modules and achieving a low-power standby circuit under high-voltage DC operation.

[0039] Specifically: Taking the power management module including the IC chip as an example, in this embodiment, the first resistor module includes resistors R4, R5, R6, R8, R11, and R13 connected in series. One end of resistor R4 is electrically connected to the high-voltage input module, and resistor R13 is electrically connected to the base of transistor G2. In this embodiment, the resistance values ​​of resistors R4, R5, R6, R8, R11, and R13 are all 750 ohms. The second resistor module includes resistors R1, R2, R3, R7, R9, and R12 connected in series. Resistor R1 is electrically connected to the high-voltage input module, and resistor R12 is electrically connected to the collector of transistor G2.

[0040] The power management module also includes diode D2, Zener diode ZD1, and capacitor C2. The anode of diode D2 is electrically connected to the emitter of transistor G2, one end of the cathode of diode D2 is electrically connected to the cathode of Zener diode ZD1, and the other end of the cathode of diode D2 is electrically connected to the IC-VCC input pin of the IC chip. The anode of Zener diode ZD1 is grounded. One end of capacitor C2 is electrically connected to the IC-VCC pin of the IC chip, and the other end of capacitor C2 is electrically connected to the anode of Zener diode ZD1. The power supply module includes an external power supply and diode D1. The anode of diode D1 is electrically connected to the external power supply. The cathode of the IC chip is electrically connected to the input pin, allowing an external power supply to power the IC chip. More specifically, the switching module includes an NMOS transistor G1, a capacitor C1, and a resistor R10. The gate of the NMOS transistor G1, capacitor C1, and resistor R10 form an intermediate node. The drain of the NMOS transistor G1 is electrically connected to the node between resistors R5 and R8. The source of the NMOS transistor G1 is grounded, the other end of capacitor C1 is grounded, and the other end of resistor R10 is electrically connected to the output terminal of the IC chip. Simultaneously, the power management module is electrically connected to the output module, enabling the power supply module to power the output module after conversion by the power management module.

[0041] In this embodiment, the high-voltage input module can generate high voltage. The resistance values ​​of resistors R4, R5, R6, R8, R11, and R13 in the first resistor module are greater than the total resistance value of resistors R1, R2, R3, R7, R9, and R12 in the second resistor module connected in series. This allows transistor G2 to conduct, and the high voltage can then be transmitted to the IC chip through diode D2, thus completing the high-voltage startup of the IC chip. After the IC chip is started at high voltage, it can output a signal to the external power supply, enabling the external power supply to power the output module through the power management system. On the other hand, the external power supply can provide self-powered power to the IC chip, maintaining its normal operation. After the IC chip is started at high voltage, it outputs a high-level signal, which, through resistor R10, makes the gate of NMOS transistor G1 high, thereby turning on NMOS transistor G1. This allows the DC power output from the high-voltage input module to form a path through NMOS transistor G1, thereby reducing the resistance value on the high-voltage DC power and reducing the static consumption of the high-voltage DC power.

[0042] Example 2:

[0043] Reference Figure 1 , Figure 3 and Figure 4 ;

[0044] In this embodiment, the power management module is electrically connected to an MCU microprocessor, and the MCU microprocessor is electrically connected to the switching module. Specifically, the IC chip is electrically connected to the MCU microprocessor, and the MCU microprocessor is electrically connected to the other end of the resistor R10. The MCU microprocessor can control the conduction and cutoff of the NMOS transistor Q1, thereby controlling the conduction and cutoff of the switching module.

[0045] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0046] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style of the specification is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other implementations that can be understood by those skilled in the art.

Claims

1. A low-power standby circuit operating under high-voltage direct current, comprising a control module, a power management module, a power supply module, and an output module, characterized in that: The control module and the power management module are bidirectionally electrically connected. The control module provides high voltage to start the power management module. After the power management module starts, it generates a signal to feed back to the control module to shut down the control module. The power management module is electrically connected to the power supply module. The power management module is used to convert the electrical energy generated by the power supply module and to use part of the electrical energy for self-powering. The power management module is electrically connected to the output module; The control module includes a high-voltage input module, a first resistor module, a second resistor module, a transistor G2, and a switch module; The output terminal of the high voltage input module is electrically connected to the first resistor module and the second resistor module respectively. The output terminal of the first resistor module is electrically connected to the base of the transistor G2. The output terminal of the second resistor module is electrically connected to the collector of the transistor G2. The input terminal of the power management module is electrically connected to the emitter of the transistor G2. The power management module is used to control the switching module to turn on and off, and the switching module is used to turn off the transistor G2.

2. The low-power standby circuit under high-voltage direct current operation according to claim 1, characterized in that, The power management module is directly electrically connected to the switching module.

3. The low-power standby circuit under high-voltage direct current operation according to claim 1, characterized in that, It also includes an MCU microprocessor, the power management module is electrically connected to the MCU microprocessor, and the MCU microprocessor is electrically connected to the switching module.

4. A low-power standby circuit operating under high-voltage direct current as described in claim 2 or 3, characterized in that, The first resistor module includes multiple resistors connected in series, the second resistor module includes multiple resistors connected in series, and the resistance value of the first resistor module is greater than the resistance value of the second resistor module.

5. A low-power standby circuit operating under high-voltage direct current as described in claim 4, characterized in that, The power management module includes an IC chip, a diode D2, a Zener diode ZD1, and a capacitor C2. The anode of the diode D2 is electrically connected to the emitter of the transistor G2, one end of the cathode of the diode D2 is electrically connected to the cathode of the Zener diode ZD1, and the other end of the cathode of the diode D2 is electrically connected to the input pin of the IC chip. The anode of the Zener diode ZD1 is grounded. One end of the capacitor C2 is electrically connected to the input pin of the IC chip, and the other end of the capacitor C2 is electrically connected to the anode of the Zener diode ZD1.

6. The low-power standby circuit under high-voltage direct current operation according to claim 1, characterized in that, The first resistor module includes resistors R4, R5, R6, R8, R11 and R13 connected in series. One end of resistor R4 is electrically connected to the high voltage input module, and resistor R13 is electrically connected to the base of transistor G2.

7. A low-power standby circuit operating under high-voltage direct current as described in claim 5, characterized in that, The IC chip is used to output a high-level signal to the switching module.

8. A low-power standby circuit operating under high-voltage direct current as described in claim 5, characterized in that, The switching module includes an NMOS transistor G1, a capacitor C1, and a resistor R10. The drain of the NMOS transistor G1 is electrically connected to the node between resistors R5 and R8. The source of the NMOS transistor G1 is grounded. The gate of the NMOS transistor G1, the capacitor C1, and the resistor R10 form an intermediate node. The other end of the capacitor C1 is grounded. The other end of the resistor R10 is electrically connected to the MCU microprocessor. The IC chip is electrically connected to the MCU microprocessor.

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