Soldering tin groove switching feeding mechanism

By designing a solder bath switching and feeding mechanism, the rapid switching of the solder bath is achieved using a slider, toothed plate, and drive motor. This solves the problems of long material replacement time and burn risk in the solder bath of safety-certified ceramic capacitor production equipment, and improves safety and the utilization rate of electrode materials.

CN223656192UActive Publication Date: 2025-12-12KUNSHAN MICRO CAPACITORS ELECTRONICS
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Patent Information

Application Number
CN202422869207.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-25
Publication Date
2025-12-12
Estimated Expiration
2034-11-25

AI Technical Summary

Technical Problem

Existing safety-certified ceramic capacitor production equipment uses a single solder bath, which requires a long cleaning time when changing solder materials, and there is a risk of burns during the cleaning process.

Method used

Design a solder bath switching and feeding mechanism, including a slider, a solder bath, a toothed plate and a drive motor. The mechanism enables rapid switching of the solder bath through a transmission box and a drive motor, and is equipped with a moving plate, a moving column and a lifting column to scrape electrode material, thereby improving material utilization.

Benefits of technology

It enables rapid switching of solder materials, reduces cleaning time, improves safety and electrode material utilization, and solves the problems of long cleaning time and risk of burns.

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Abstract

According to the technical scheme, the soldering tin groove switching feeding mechanism comprises an equipment platform and soldering tin grooves, a dovetail groove is formed in the middle of the top of the equipment platform, a sliding block is installed in the dovetail groove, the soldering tin grooves are formed in the positions, close to the front surface and the rear surface, of the top of the sliding block, and a toothed plate is installed at the bottom of the sliding block; a transmission box is installed at the position, located at the dovetail groove, of the front surface of the equipment platform, a driving motor is installed in the transmission box, a driving gear is installed on an output shaft of the driving motor, and moving plates are installed in the tin soldering grooves in the two sides. The soldering tin groove switching and feeding mechanism solves the problems that an existing safety ceramic capacitor production device adopts a single soldering tin groove, raw materials in an original soldering tin groove need to be cleaned when soldering tin raw materials are replaced, cleaning time is long, and cleaners are prone to being scalded, the raw material switching and supplementing time in the soldering tin groove is shortened, and the production efficiency is improved. And meanwhile, the switching safety of raw materials in the soldering tin groove is improved.
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Description

Technical Field

[0001] This utility model relates to the field of safety-certified ceramic capacitor production technology, specifically a solder bath switching feeding mechanism. Background Technology

[0002] Safety-certified ceramic capacitors are devices that store electrical charge, consisting of two electrodes placed close together with an insulating dielectric layer sandwiched between them. Capacitors are among the most widely used electronic components in electronic devices, extensively applied in circuits for DC blocking and AC passing, coupling, bypassing, filtering, tuning circuits, and energy conversion. Safety-certified ceramic capacitors often use a silver-infiltrating method to fabricate the ceramic dielectric metal electrodes, which is widely used due to its simple manufacturing process and excellent high-frequency characteristics. However, the excellent properties of the ceramic dielectric are often compromised by silver ion migration, leading to capacitor failure. The presence of precious silver in the internal electrodes significantly increases the cost of ceramic capacitors, putting manufacturers in a severe situation of high costs and low profits.

[0003] Existing safety-certified ceramic capacitor production equipment uses a single solder bath. When changing solder materials, it is necessary to clean the materials inside the original solder bath, which takes a long time and the cleaner is prone to burns. Therefore, we propose a solder bath switching feeding mechanism. Utility Model Content

[0004] The purpose of this utility model is to provide a solder bath switching feeding mechanism to achieve the effect of rapid switching of solder materials, so as to solve the problem that the existing safety ceramic capacitor production equipment uses a single solder bath. When changing solder materials, it is necessary to clean the materials inside the original solder bath, which takes a long time and the cleaner is prone to burns.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a solder bath switching and feeding mechanism, comprising an equipment platform and a solder bath, wherein a dovetail groove is provided in the middle of the top of the equipment platform, a slider is installed inside the dovetail groove, solder baths are installed on the top of the slider near both the front and rear surfaces, a toothed plate is installed at the bottom of the slider, a transmission box is installed on the front surface of the equipment platform at the position of the dovetail groove, a drive motor is installed inside the transmission box, and a drive gear is installed on the output shaft of the drive motor.

[0006] Preferably, the toothed plate meshes with the drive gear via transmission teeth.

[0007] Preferably, there are two solder baths, which are evenly distributed on both sides of the top of the slider, and the two solder baths are filled with silver electrode material and copper electrode material respectively.

[0008] Preferably, a movable plate is installed inside the solder baths on both sides, and a movable column is installed at the bottom of the movable plate, with the movable column sleeved on the top of the slider.

[0009] Preferably, the equipment platform has a transmission groove located at the position of the moving column, and a lifting column is installed at the bottom of the transmission groove through a bearing. The lifting column is sleeved inside the moving column, and the lifting column and the moving column are connected by a threaded connection.

[0010] Preferably, a gear B is installed on the outer surface of the lifting column near the bottom, and a rotating shaft is installed on both sides inside the slider. A gear A is installed at one end of the rotating shaft on the outer surface of the gear B, and the gear A meshes with the gear B.

[0011] Preferably, a heating unit is installed on the top of the slider near the two solder baths, a heater is installed on the bottom of the movable plate near the outer surface, and temperature sensors are installed on the bottom of the movable plates on both sides near the middle.

[0012] Preferably, a control box is installed on the front surface of the equipment platform near the dovetail groove.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0014] 1. This utility model achieves rapid switching of solder materials through a slider, two solder baths, a toothed plate, and a drive motor. A slider is installed inside the dovetail groove, with solder baths located near the front and rear surfaces of the top of the slider. A toothed plate is installed at the bottom of the slider. A transmission box is located on the front surface of the equipment platform at the dovetail groove position, and a drive motor is installed inside the transmission box. This solves the problem of existing safety-certified ceramic capacitor production equipment using a single solder bath, which requires cleaning the existing solder bath when changing solder materials. This cleaning process is time-consuming and poses a risk of burns to the cleaner. The new model reduces the time required for replenishing solder materials inside the solder bath and improves the safety of solder material switching.

[0015] 2. This utility model achieves the effect of scraping the electrode material inside the solder bath by setting up a movable plate, a movable column, and a lifting column. A movable plate is set inside the solder bath on both sides, a movable column is set at the bottom of the movable plate, a gear B is set on the outer surface of the lifting column near the bottom, and a rotating shaft is set on both sides inside the slider. This solves the problem that soldering safety ceramic capacitors is inconvenient and the utilization rate of electrode materials is poor when there is little electrode material inside the solder bath. This improves the utilization rate of electrode materials. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the main structure of this utility model;

[0017] Figure 2This is a cross-sectional structural diagram of the present invention;

[0018] Figure 3 For this Figure 3 A schematic diagram of the enlarged structure of section A;

[0019] Figure 4 For this Figure 3 The enlarged structural diagram of B is shown below.

[0020] Reference numerals in the attached diagram: 1. Equipment platform; 2. Transmission box; 3. Slider; 4. Control box; 5. Solder bath; 6. Dovetail groove; 7. Gear plate; 8. Moving plate; 9. Heating unit; 10. Rotating shaft; 11. Transmission groove; 12. Moving column; 13. Temperature sensor; 14. Heater; 15. Gear A; 16. Lifting column; 17. Gear B; 18. Drive gear; 19. Drive motor. Detailed Implementation

[0021] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments. Example

[0022] like Figure 1 , Figure 2 and Figure 4 As shown, to achieve the above objectives, this utility model provides the following technical solution: a solder bath switching and feeding mechanism, including a device platform 1 and a solder bath 5. A dovetail groove 6 is provided in the middle of the top of the device platform 1. A slider 3 is installed inside the dovetail groove 6. Solder baths 5 are installed on the top of the slider 3 near both its front and rear surfaces. A toothed plate 7 is installed at the bottom of the slider 3. A transmission box 2 is installed on the front surface of the device platform 1 at the position of the dovetail groove 6. A drive motor 19 is installed inside the transmission box 2. A drive gear 18 is installed on the output shaft of the drive motor 19. The toothed plate 7 meshes with the drive gear 18 through transmission teeth. The motor 19 drives the toothed plate 7 to move, thereby driving the slider 3 to move. There are two solder baths 5, which are evenly distributed on both sides of the top of the slider 3. The two solder baths 5 are filled with silver electrode material and copper electrode material respectively. A heating host 9 is installed on the top of the slider 3 near the two solder baths 5. A heater 14 is installed on the bottom of the moving plate 8 near the outer surface. Temperature sensors 13 are installed on the bottom of the two moving plates 8 near the middle. The temperature inside the solder bath 5 is sensed by the temperature sensors 13. A control box 4 is installed on the front surface of the equipment platform 1 near the dovetail groove 6.

[0023] The working principle of the solder bath switching feeding mechanism based on Embodiment 1 is as follows: After the present invention is installed, during normal use, the heating host 9 is powered on the heater 14, and the heater 14 heats the moving plate 8, thereby heating the silver electrode material. The heated silver electrode material inside the solder bath 5 is used to solder the safety ceramic capacitor. When it is necessary to switch the copper electrode material, the drive motor 19 is started, which drives the drive gear 18 to rotate. The drive gear 18 drives the toothed plate 7 to move, the toothed plate 7 drives the slider 3 to move, and the slider 3 drives the solder bath 5 to move and switch, thereby switching the electrode material. After completion, the safety ceramic capacitor can be soldered with the copper electrode material. Thus, the working process of this equipment is completed. Example

[0024] like Figure 2 and Figure 3 As shown, the solder bath switching feeding mechanism proposed in this utility model, compared with Embodiment 1, further includes: a movable plate 8 installed inside the solder baths 5 on both sides, a movable column 12 installed at the bottom of the movable plate 8, the movable column 12 being sleeved on the top of the slider 3, a transmission groove 11 provided inside the equipment platform 1 at the position of the movable column 12, a lifting column 16 installed at the bottom of the transmission groove 11 through a bearing, the lifting column 16 being sleeved inside the movable column 12, the lifting column 16 and the movable column 12 being connected by a threaded connection, the movable column 12 being moved by the lifting column 16, thereby moving the movable plate 8, a gear B17 being installed on the outer surface of the lifting column 16 near the bottom, a rotating shaft 10 being installed on both sides inside the slider 3, a gear A15 being installed at one end of the rotating shaft 10 on the outer surface of the gear B17, the gear A15 meshing with the gear B17.

[0025] In this embodiment, when the content of silver and copper electrode materials inside the solder bath is low, the rotating shaft 10 is activated, which drives the gear A15 to rotate. The rotating gear A15 drives the gear B17 to rotate, and the gear B17 and the lifting column 16 drive the moving column 12 to move. The moving column 12 drives the moving plate 8 to move upward, thereby scraping the silver and copper electrode materials upward, making it easier to utilize the silver and copper electrode materials.

[0026] The above specific embodiments are merely several preferred embodiments of this utility model. Based on the technical solution of this utility model and the relevant teachings of the above embodiments, those skilled in the art can make various alternative improvements and combinations to the above specific embodiments.

Claims

1. A solder bath switching and feeding mechanism, comprising a device platform (1) and a solder bath (5), characterized in that: The equipment platform (1) has a dovetail groove (6) in the middle of the top. A slider (3) is installed inside the dovetail groove (6). A soldering tank (5) is installed on the top of the slider (3) near the front and rear surfaces. A toothed plate (7) is installed at the bottom of the slider (3). A transmission box (2) is installed on the front surface of the equipment platform (1) at the position of the dovetail groove (6). A drive motor (19) is installed inside the transmission box (2). A drive gear (18) is installed on the output shaft of the drive motor (19).

2. The solder bath switching feeding mechanism according to claim 1, characterized in that: The toothed plate (7) meshes with the drive gear (18) via transmission teeth.

3. The solder bath switching feeding mechanism according to claim 1, characterized in that: There are two solder baths (5), and the two solder baths (5) are evenly distributed on both sides of the top of the slider (3). The two solder baths (5) are filled with silver electrode material and copper electrode material respectively.

4. The solder bath switching feeding mechanism according to claim 1, characterized in that: The solder baths (5) on both sides are equipped with movable plates (8), and movable columns (12) are installed at the bottom of the movable plates (8). The movable columns (12) are sleeved on the top of the slider (3).

5. The solder bath switching feeding mechanism according to claim 1, characterized in that: The equipment platform (1) has a transmission groove (11) located at the position of the moving column (12). A lifting column (16) is installed at the bottom of the transmission groove (11) through a bearing. The lifting column (16) is sleeved inside the moving column (12). The lifting column (16) and the moving column (12) are connected by a threaded connection.

6. The solder bath switching feeding mechanism according to claim 5, characterized in that: Gear B (17) is installed on the outer surface of the lifting column (16) near the bottom. Rotating shafts (10) are installed on both sides inside the slider (3). Gear A (15) is installed on one end of the rotating shaft (10) on the outer surface of gear B (17). Gear A (15) meshes with gear B (17).

7. The solder bath switching feeding mechanism according to claim 4, characterized in that: Heating units (9) are installed on the top of the slider (3) near the two solder baths (5), heaters (14) are installed on the bottom of the moving plate (8) near the outer surface, and temperature sensors (13) are installed on the bottom of the moving plates (8) near the middle on both sides.

8. The solder bath switching feeding mechanism according to claim 1, characterized in that: A control box (4) is installed on the front surface of the equipment platform (1) near the dovetail groove (6).