Normalizing device and silicon wafer production line

By designing the linkage assembly and guide rod, the problems of complex structure and large space occupation of existing structuring devices are solved, realizing the flexibility and space efficiency of structuring devices.

CN223659174UActive Publication Date: 2025-12-12COWIN LASER (SUZHOU) CO LTD +1
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Patent Information

Application Number
CN202423028454.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-09
Publication Date
2025-12-12
Estimated Expiration
2034-12-09

AI Technical Summary

Technical Problem

Existing sizing devices require multiple drive components for spatial adjustment before the silicon wafer enters the sintering process, resulting in complex structures and large space requirements, making it difficult to coordinate space with other devices.

Method used

The design employs a linkage assembly and guide rod. The linkage assembly is driven to converge centrifugally or expand centrifugally by a moving plate, thereby achieving vertical movement of the guide rod, reducing the use of driving components and lowering the complexity of the device.

Benefits of technology

The spatial range of the regulating device is easily adjustable, making it widely applicable. It also does not occupy the space above when not in use, thus reducing manufacturing and maintenance costs.

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Abstract

The utility model discloses a tidying device and a silicon wafer production line. The tidying device comprises a moving plate and a plurality of connecting rod assemblies, wherein the moving plate is movably arranged in the vertical direction; the connecting rod assemblies are arranged in the circumferential direction of the moving plate; one end of each connecting rod assembly is rotationally connected with the moving plate, a guide rod is arranged at the other end of each connecting rod assembly, the connecting rod assemblies are in linkage with the moving plate, and the connecting rod assemblies are centripetally gathered or centrifugally expanded so that the guide rods can be close to or away from the center line of the moving plate in the vertical direction. According to the arrangement device, the arrangement of driving parts is reduced, no space is occupied, the arrangement space range is easy to adjust, and the application scene is wider.
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Description

Technical Field

[0001] This application relates to the field of transportation positioning technology, and in particular to a straightening device and a silicon wafer production line. Background Technology

[0002] Silicon wafers are the carriers of solar cells, and their quality determines the conversion efficiency of the solar cells. The manufacturing process of solar cells typically includes diffusion, coating, and sintering. If the silicon wafers are not stacked neatly in the fixture before entering the sintering process, it will affect the overall sintering effect and thus the quality of the silicon wafers.

[0003] Existing straightening devices straighten silicon wafers before they enter the sintering process. This requires multiple side-push cylinders around the carrier to push the wafers from all directions to straighten them. The straightening devices have many driving components, are complex in structure, and occupy a large space, making it difficult to avoid space with other devices. Utility Model Content

[0004] The purpose of this utility model is to solve the aforementioned technical problems by providing a sizing device and a silicon wafer production line. This allows the sizing device to reduce the arrangement of drive components, save space, and easily adjust the sizing range, thus broadening its applicability to various scenarios. To achieve the above objectives, the technical solution of this utility model is as follows:

[0005] The alignment device includes a movable plate that moves vertically and a plurality of connecting rod assemblies arranged around the circumference of the movable plate; one end of each connecting rod assembly is rotatably connected to the movable plate, and the other end of each connecting rod assembly is provided with a guide rod. The connecting rod assembly is linked to the movable plate, and the plurality of connecting rod assemblies converge centripetally or expand centrifugally so that the guide rod moves closer to or away from the centerline of the movable plate in the vertical direction.

[0006] Specifically, the linkage assembly includes a fixed seat, a movable seat, a first link, and a second link; the first link is rotatably connected to the fixed seat and the movable seat respectively, and the second link is rotatably connected to the first link and the movable plate respectively.

[0007] Specifically, the upper part of the fixed seat and the upper part of the movable seat are respectively hinged to a first connecting rod, and the lower part of the fixed seat and the lower part of the movable seat are respectively hinged to another first connecting rod.

[0008] Specifically, the fixed seat includes two fixed blocks that are spaced apart from each other in the horizontal direction, and the movable seat includes two movable blocks that are spaced apart from each other in the horizontal direction. The first connecting rod is respectively hinged between the two fixed blocks and between the two movable blocks.

[0009] Specifically, a connecting rod bearing is provided on the first connecting rod near the fixed seat, one end of the second connecting rod is hinged to the connecting rod bearing, and the other end of the second connecting rod is hinged to the moving plate.

[0010] Specifically, the top of the movable seat is provided with a movable component, and the top of the movable component is provided with a plurality of guide seats for mounting the guide rod.

[0011] Specifically, the guide seat is provided with a guide hole extending in the vertical direction, and the guide rod is inserted into the guide hole.

[0012] Specifically, it also includes a substrate, on which a central groove is formed, and a plurality of the connecting rod assemblies are arranged on the substrate in the circumferential direction of the central groove.

[0013] Specifically, the movable plate is located above the central groove, and a drive module that drives it to move vertically is connected to the bottom of the movable plate. The central groove is configured to avoid the drive module.

[0014] A silicon wafer production line, including the aforementioned straightening device.

[0015] Compared with existing technologies, the beneficial effects of this utility model's sizing device and silicon wafer production line are mainly reflected in:

[0016] Several linkage assemblies converge centripetally or expand centrifugally to make the guide rod move closer to or further away from the center line of the moving plate in the vertical direction. The linkage assemblies enclose a regularizable space that is easy to adjust, which can expand the applicable range of the regularization device. At the same time, when the regularization device is not in use, it does not occupy the space above it and can avoid the space above it. Attached Figure Description

[0017] Figure 1 A schematic diagram of the structure of the regularization device is provided for the embodiments of this application;

[0018] Figure 2 A front view schematic diagram of the straightening device is provided for the embodiments of this application;

[0019] Figure 3 A schematic diagram of the drive module is provided for an embodiment of this application.

[0020] Figure label:

[0021] Moving plate 1, moving shaft seat 11;

[0022] Linkage assembly 2, fixed seat 21, fixed block 211, movable seat 22, movable block 221, first link 23, second link 24, link shaft seat 25, movable part 26, guide seat 27, guide hole 271, mounting hole 272;

[0023] Guide rod 3;

[0024] 4. Substrate 4; 41. Central groove 42;

[0025] Drive module 5, drive rod 51, cam rod 52, cam block 53, drive component 54, slide rail 55. Detailed Implementation

[0026] To make the technical solutions and advantages of the embodiments of this application clearer, the exemplary embodiments of this application will be described in further detail below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not an exhaustive list of all embodiments. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other.

[0027] Example 1

[0028] This embodiment provides a straightening device that can be used for circumferential straightening of stacked silicon wafers during production and transportation, and can also be used for circumferential straightening of other stacked materials.

[0029] like Figure 1 , Figure 2 As shown, the straightening device includes a movable plate 1 that moves vertically and a plurality of connecting rod assemblies 2 arranged around the movable plate 1. One end of the connecting rod assembly 2 is rotatably connected to the movable plate 1, and the other end of the connecting rod assembly 2 is provided with a guide rod 3. The connecting rod assembly 2 moves in conjunction with the movable plate 1, and the plurality of connecting rod assemblies 2 converge centripetally or expand centrifugally so that the guide rod 3 moves closer to or away from the center line of the movable plate 1 in the vertical direction.

[0030] In this embodiment, the X-axis and Y-axis are defined as horizontal directions, and the Z-axis is defined as a vertical direction. The centerline of the movable plate 1 is its center position along the vertical direction.

[0031] A carrier (not shown in the figure) can be installed on the vertical centerline of the moving plate 1 and above the moving plate 1. Stacked silicon wafers are installed on the carrier, with the center of the silicon wafers located on the centerline of the moving plate 1. The silicon wafers have four sides, so that each side of the silicon wafer is opposite to the connecting rod assembly 2. When the carrier is at a set position height, the moving plate 1 descends vertically, and the connecting rod assembly 2 is in a convergent state, thereby realizing that several guide rods 3 converge towards the center and rise above the position height of the carrier to laterally push and straighten the silicon wafers. When the moving plate 1 rises vertically, the connecting rod assembly 2 is in an outward expansion state, causing several guide rods 3 to centrifugally expand and sink below the position height of the carrier.

[0032] In this embodiment, the space formed by the enclosed linkage assemblies 2 is easily adjustable, which can expand the applicable range of the straightening device. At the same time, when the straightening device is not in use, it does not occupy the space above it and can avoid the space above it. By moving the moving plate 1 in the vertical direction, the linkage assemblies 2 can be driven to move together, realizing the centripetal convergence and centrifugal expansion functions of the guide rod 3, reducing the use of driving components, reducing the complexity of the straightening device, and reducing manufacturing and maintenance costs.

[0033] Example 2

[0034] This embodiment optimizes the regularization device based on the above embodiments, and in particular provides a specific implementation of the linkage assembly:

[0035] like Figure 1 , Figure 2 As shown, the linkage assembly 2 includes a fixed base 21, a movable base 22, a first link 23, and a second link 24. The first link 23 is rotatably connected to both the fixed base 21 and the movable base 22. In this embodiment, there are two first links 23 in the linkage assembly, which can ensure the rotational stability of the movable base 22 and ensure that the guide rod 3 is in the vertical direction. One end of the first link 23 is hinged to the fixed base 21, and the other end of the first link 23 is hinged to the movable base 22. The fixed base 21 is in a fixed state, and the movable base 22 is in a movable and adjustable state. The upper part of the fixed base 21 and the upper part of the movable base 22 are each hinged with a first link 23, and the lower part of the fixed base 21 and the lower part of the movable base 22 are each hinged with another first link 23.

[0036] The fixed base 21 includes two fixed blocks 211 that are spaced apart from each other in the horizontal direction, and the movable base 22 includes two movable blocks 221 that are spaced apart from each other in the horizontal direction, so that the first connecting rod 23 can be stably hinged between the two fixed blocks 211 and between the two movable blocks 221.

[0037] The second link 24 is rotatably connected to the first link 23 and the moving plate 1 respectively. In this embodiment, there is one second link 24 in the link assembly. The first link 23 is provided with a link bearing 25 near the fixed seat 21. One end of the second link 24 is hinged to the link bearing 25, and the other end of the second link 24 is hinged to the moving plate 1. Specifically, the moving plate 1 is provided with moving bearings 11 on all four sides, and the end of the second link 24 is hinged to the moving bearings 11.

[0038] The top of the movable base 22 is provided with a movable part 26, and the top of the movable part 26 is provided with several guide seats 27 for installing the guide rod 3; specifically, guide seats 27 are provided on both sides of the top of the movable part 26. The movable part 26 and the movable base 22 are detachably connected to facilitate disassembly and adjustment. Replacing the movable part 26 can adapt its specifications and the specifications of the guide rod 3, which can be adapted to the arrangement of different silicon wafers or materials.

[0039] The guide seat 27 is provided with a guide hole 271 extending in the vertical direction. The guide rod 3 is inserted into the guide hole 271. Accordingly, the guide rod 3 is set in the vertical direction. The specifications of the guide rod 3 can be changed according to the material to be shaped so that the side wall of the guide rod 3 abuts against the side of the silicon wafer or the side of the material.

[0040] The side wall of the guide seat 27 is provided with a radially penetrating mounting hole 272. The guide rod 3 can be positioned by a mounting component penetrating the mounting hole 272, and the installation stability of the guide rod 3 in the guide hole 271 can be maintained. The mounting component can be a bolt or a pin.

[0041] The straightening device also includes a base plate 4, a central groove 41 is provided in the middle of the base plate 4, and several connecting rod assemblies 2 are arranged around the base plate 4. Specifically, the top four sides of the base plate 4 are respectively connected to the fixing seats 21. The connection between the fixing seats 21 and the base plate 4 can be a detachable connection or a fixed connection.

[0042] The fixed seat 21 is positioned close to the central groove 41, and the movable seat 22 is positioned away from the central groove 41, so that the second connecting rod 24 can be rotatably connected to the movable plate 1, thereby realizing the centripetal convergence or centrifugal expansion of the movable seat 22.

[0043] Example 3

[0044] This embodiment optimizes the straightening device based on the above embodiments, and in particular provides a specific implementation of the moving plate:

[0045] The aforementioned straightening device also includes a base plate 4, with a central groove 41 formed in the middle of the base plate 4. A movable plate 1 is located above the central groove 41. In this embodiment, the main body of the movable plate 1 is a plate structure and is arranged in a horizontal direction. Several connecting rod assemblies 2 are arranged on the base plate 4 around the central groove 41.

[0046] like Figure 1 , Figure 3 As shown, a drive module 5 is connected to the bottom of the movable plate 1 to drive it to move vertically, and the central groove 41 is positioned to avoid the drive module 5. A support member 42 is provided on the top of the substrate 4, located on the side of the central groove 41.

[0047] The drive module 5 includes a drive rod 51, a cam rod 52 that drives the drive rod 51 to move vertically, a cam block 53 connected to the cam rod 52, and a drive component 54 that drives the cam block 53 to rotate. In this embodiment, the drive component 54 is a motor. The drive end of the drive component 54 drives the cam block 53 to rotate, and the cam block 53 drives the cam rod 52 to rotate eccentrically in sync. The two ends of the cam rod 52 are respectively axially connected to the cam block 53 and the drive rod 51. The top of the drive rod 51 is connected to the bottom of the moving plate 1, specifically, the top of the drive rod 51 is connected to the bottom center position of the moving plate 1.

[0048] The drive module 5 also includes a slide rail 55 arranged vertically on the side of the support member 42, and the side of the drive rod 51 slides in cooperation with the slide rail 55. The cam rod 52 converts the rotational force of the drive member 54 into a linear force of the drive rod 51 along the slide rail 55, thereby realizing the lifting and lowering action of the moving plate 1.

[0049] When the moving plate 1 descends vertically, it drives the surrounding connecting rod assemblies 2 to move together and converge towards the center. The second connecting rod 24 drives the first connecting rod 23 to rotate around the fixed base 21. At the same time, the first connecting rod 23 drives the movable base 22 to move upward in an arc. The guide rod 3 gradually approaches the center line of the moving plate 1 in the vertical direction. When the moving plate 1 rises vertically, it drives the surrounding connecting rod assemblies 2 to move together and expand outward in a centrifugal direction. The second connecting rod 24 drives the first connecting rod 23 to rotate around the fixed base 21. At the same time, the first connecting rod 23 drives the movable base 22 to move downward in an arc. The guide rod 3 gradually moves away from the center line of the moving plate 1 in the vertical direction.

[0050] Example 4

[0051] This embodiment provides a silicon wafer production line, including the straightening device in the above embodiment, for straightening the perimeter of the silicon wafer.

[0052] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0053] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0054] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0055] Although preferred embodiments of this application have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of this application.

[0056] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. A straightening device, characterized in that: It includes a movable plate that moves vertically and a plurality of connecting rod assemblies disposed around the circumference of the movable plate; one end of each connecting rod assembly is rotatably connected to the movable plate, and the other end of each connecting rod assembly is provided with a guide rod. The connecting rod assembly is linked to the movable plate, and the plurality of connecting rod assemblies converge centripetally or expand centrifugally so that the guide rod moves closer to or away from the centerline of the movable plate in the vertical direction.

2. The regularization device according to claim 1, characterized in that: The linkage assembly includes a fixed base, a movable base, a first link, and a second link; the first link is rotatably connected to the fixed base and the movable base respectively, and the second link is rotatably connected to the first link and the movable plate respectively.

3. The regularization device according to claim 2, characterized in that: The fixed base includes two fixed blocks spaced apart from each other in the horizontal direction, and the movable base includes two movable blocks spaced apart from each other in the horizontal direction. The first connecting rod is respectively hinged between the two fixed blocks and between the two movable blocks.

4. The regularization device according to claim 2, characterized in that: The upper part of the fixed seat and the upper part of the movable seat are respectively hinged to a first connecting rod, and the lower part of the fixed seat and the lower part of the movable seat are respectively hinged to another first connecting rod.

5. The regularization device according to claim 2, characterized in that: A connecting rod bearing is provided on the first connecting rod near the fixed seat, one end of the second connecting rod is hinged to the connecting rod bearing, and the other end of the second connecting rod is hinged to the moving plate.

6. The regularization device according to claim 2, characterized in that: The top of the movable seat is provided with a movable component, and the top of the movable component is provided with several guide seats for mounting the guide rod.

7. The regularization device according to claim 6, characterized in that: The guide seat is provided with a guide hole extending in the vertical direction, and the guide rod is inserted into the guide hole.

8. The regularization device according to claim 1, characterized in that: It also includes a substrate, on which a central groove is formed, and a plurality of the connecting rod assemblies are arranged on the substrate in the circumferential direction of the central groove.

9. The regularization device according to claim 8, characterized in that: The movable plate is located above the central slot, and a drive module that drives it to move vertically is connected to the bottom of the movable plate. The central slot is configured to avoid the drive module.

10. A silicon wafer production line, characterized in that: Includes the regularization device as described in any one of claims 1-9.