Cooling system of PECVD (plasma enhanced chemical vapor deposition) equipment

Abstract

The utility model provides a cooling system of PECVD equipment. The PECVD equipment cooling system comprises constant-temperature water supply equipment, a connecting pipe set and a cooling coil, the cooling coil is arranged on the inner cavity wall of the PECVD equipment, and the connecting pipe set is used for feeding cooling water within a preset temperature range provided by the constant-temperature water supply equipment into the cooling coil and feeding cooled return water back to the constant-temperature water supply equipment. According to the utility model, the heat generated in the PECVD film forming process can be effectively taken away in time, and the adverse effect on the conversion efficiency of the battery caused by the over-high temperature of the silicon wafer is avoided.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of photovoltaic equipment manufacturing, especially to PECVD equipment cooling system. BACKGROUND

[0002] In the process of manufacturing heterojunction solar cells, PECVD equipment is used to form amorphous silicon, microcrystalline silicon and amorphous silicon microcrystalline mixed film on both sides of the cell. PECVD film formation is carried out in a vacuum environment, and a large amount of heat is generated during the film formation process. However, it is difficult to dissipate and transfer heat in a vacuum environment, and this part of heat will cause the temperature of the reaction cavity and the silicon wafer to rise. High temperature will affect the final film formation quality and reduce the photoelectric conversion efficiency.

[0003] Therefore, how to provide a PECVD equipment cooling system to effectively remove the heat generated during the PECVD film formation process and avoid the adverse effects of high silicon wafer temperature on cell conversion efficiency has become a technical problem that needs to be solved in the industry. SUMMARY

[0004] To solve the above problems of the prior art, the utility model provides a kind of PECVD equipment cooling system, it includes constant temperature water supply equipment, connecting pipe group and cooling coil, the cooling coil is arranged on the inner cavity wall of PECVD equipment, the connecting pipe group is used to send the cooling water of predetermined temperature range provided by the constant temperature water supply equipment into the cooling coil and send back cooling water to the constant temperature water supply equipment.

[0005] In an embodiment, the connecting pipe group includes a water inlet pipe, a water outlet pipe and a vacuum flange, the vacuum flange is provided with a water inlet port and a water outlet port on the outside, the water inlet port and the water outlet port are respectively communicated with the water inlet pipe and the water outlet pipe, and the vacuum flange is provided with a water supply port and a return water port on the inside for the cooling coil.

[0006] In an embodiment, the constant temperature water supply equipment includes a water inlet module, a temperature sensor, a temperature controller, a heating module, a heat dissipation module and a water outlet module, the water inlet module receives the cooling water discharged from the water outlet pipe, the temperature sensor detects the temperature of the cooling water, the temperature controller controls the heating module or the heat dissipation module according to the temperature of the cooling water detected by the temperature sensor to control the water temperature in the predetermined temperature range, and the water outlet module sends the cooling water in the predetermined temperature range to the water outlet pipe.

[0007] In an embodiment, the predetermined temperature range is 25-60 degrees Celsius.

[0008] In an embodiment, the heat dissipation module includes a cooling tower.

[0009] In one embodiment, the inner side of the vacuum flange is in a vacuum environment, while the outer side of the vacuum flange is in an atmospheric environment.

[0010] In one embodiment, an upper cooling coil and a lower cooling coil are respectively provided on the upper wall and lower wall of the inner cavity of the PECVD equipment, and an upper water supply port, an upper water return port, a lower water supply port and a lower water return port are correspondingly provided on the inner side of the vacuum flange.

[0011] In one embodiment, grooves are provided on both the upper and lower walls of the inner cavity, and the upper and lower cooling coils are respectively disposed in the grooves.

[0012] In one embodiment, the upper cooling coil includes an upper coil inlet and an upper coil outlet respectively connected to an upper water supply port and an upper water return port, and the lower cooling coil includes a lower coil inlet and a lower coil outlet respectively connected to a lower water supply port and a lower water return port.

[0013] In one embodiment, the water inlet module receives water replenishment from a water source.

[0014] Compared to existing technologies where the lack of effective cooling measures within the reaction chamber of PECVD equipment easily leads to reduced cell conversion efficiency due to excessively high silicon wafer temperatures, the cooling system of this invention for PECVD equipment includes a constant-temperature water supply device, a connecting pipe assembly, and a cooling coil. The cooling coil is installed on the inner wall of the PECVD equipment. The connecting pipe assembly is used to deliver cooling water within a predetermined temperature range provided by the constant-temperature water supply device into the cooling coil and to return the cooled water to the constant-temperature water supply device. This invention can effectively remove the heat generated during the PECVD film formation process, preventing adverse effects on cell conversion efficiency due to excessively high silicon wafer temperatures. Attached Figure Description

[0015] The above-described features and advantages of this invention can be better understood after reading the following detailed description of the embodiments of this disclosure in conjunction with the accompanying drawings. In the drawings, the components are not necessarily drawn to scale, and components having similar related characteristics or features may have the same or similar reference numerals.

[0016] Figure 1 This is a schematic diagram of the composition of an embodiment of the cooling system for PECVD equipment of this utility model;

[0017] Figure 2 A partial structural diagram of a PECVD equipment equipped with a PECVD equipment cooling system;

[0018] Figure 3 for Figure 2 A schematic diagram of the composition of the vacuum flange 24; and

[0019] Figure 4 For Figure 1 The schematic structural diagram of the thermostatic water supply equipment 1. DETAILED DESCRIPTION

[0020] The above description can easily understand other advantages and functions of the present application by the content disclosed in the specification. Although the description of the present application will be introduced with the preferred embodiments, it does not mean that the features of the present application are limited to the embodiments. On the contrary, the purpose of introducing the application with the embodiments is to cover other options or modifications which can be extended based on the claims of the present application. In order to provide a deep understanding of the present application, many specific details will be included in the following description. The present application can also be implemented without using these details. In addition, in order to avoid confusion or obscure the focus of the present application, some specific details will be omitted in the description.

[0021] In the description of the present application, it should be pointed out that, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connection" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integrally connected; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through intermediate medium, or the communication inside two elements. For ordinary skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0022] In addition, in the following description, "up", "down", "left", "right", "top", "bottom", "horizontal", "vertical" should be understood as the orientation shown in the paragraph and the related drawings. The relative terms are only used for the convenience of description, and they do not mean that the device described should be manufactured or operated in a particular orientation, so they should not be understood as a limitation of the present application.

[0023] It can be understood that although the terms "first", "second", "third" and the like can be used herein to describe various components, regions, layers and / or parts, these components, regions, layers and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers and / or parts. Therefore, the first component, region, layer and / or part discussed below can be called the second component, region, layer and / or part without departing from some embodiments of the present application.

[0024] Please refer to Figure 1 which is the schematic structural diagram of the PECVD equipment cooling system embodiment of the present application. As shown in Figure 1As shown in the utility model, the PECVD equipment cooling system comprises a constant-temperature water supply device 1, a connecting pipe group 2 and a cooling coil 3 (see Figure 2 ), the cooling coil 3 is arranged on the inner cavity walls 40, 42 of the PECVD equipment, the PECVD inner cavity 44 is between the inner cavity walls 40, 42, the inner cavity walls 40, 42 can be a layered structure, the cooling coil 3 is arranged on the outermost layer of the layered structure, the connecting pipe group 2 is used to send the cooling water of a predetermined temperature range provided by the constant-temperature water supply device 1 into the cooling coil 3 and send the returned water after cooling back to the constant-temperature water supply device 1. The predetermined temperature range is 25-60 degrees Celsius.

[0025] Referring to Figure 2 and Figure 3 , in combination with referring to Figure 1 , Figure 2 , it is a partial structure schematic view of the PECVD equipment equipped with the PECVD equipment cooling system, Figure 3 , it is a component structure schematic view of a vacuum flange. As Figures 1 to 3 shown, the connecting pipe group 2 comprises a water inlet pipe 20, a water outlet pipe 22 and a vacuum flange 24, the water inlet port 240 and the water outlet port 242 are arranged on the outer side of the vacuum flange 24, the water inlet port 240 and the water outlet port 242 are respectively used to communicate with the water inlet pipe 20 and the water outlet pipe 22, the water supply ports 242, 243 and the returned water ports 244, 245 are arranged on the inner side of the vacuum flange 24 for the cooling coil 3.

[0026] The upper water supply port 242, the upper returned water port 243, the lower water supply port 244 and the lower returned water port 245 are arranged on the inner side of the vacuum flange 24 for the cooling coil 3. The upper cooling coil 3 and the lower cooling coil (not shown in the figure) are respectively arranged on the upper inner cavity wall 40 and the lower inner cavity wall 42 of the PECVD equipment 4, the upper cooling coil 3 comprises an upper coil inlet 30 and an upper coil outlet 32 which respectively communicate with the upper water supply port 242 and the upper returned water port 243, and the lower cooling coil comprises a lower coil inlet 34 and a lower coil outlet 36 which respectively communicate with the lower water supply port 244 and the lower returned water port 245. The vacuum flange 24 has a pipeline inside for communicating the water inlet port 240 with the upper water supply port 242 and the lower water supply port 244, and also has a pipeline for communicating the upper returned water port 243 with the lower returned water port 245 and the water outlet port 242.

[0027] Referring to Figure 4 , it is Figure 1The schematic view of the composition structure of the constant-temperature water supply equipment 1 in the PECVD equipment cooling system. The constant-temperature water supply equipment 1 comprises a water inlet module 10, a temperature sensor 11, a temperature controller 12, a heating module 13, a heat dissipation module 14 and a water outlet module 15. The water inlet module 10 receives the cooled backwater discharged by the water outlet pipe 22. The temperature sensor 11 detects the temperature of the cooled backwater. The temperature controller 12 controls the heating module 13 or the heat dissipation module 14 according to the backwater temperature detected by the temperature sensor 11 to control the water temperature in the predetermined temperature range, which is 25-60 degrees Celsius. The heat dissipation module 14 can be a cooling tower or a heat dissipation device commonly used in the industry. The water inlet module 10 can receive water flow from a water source.

[0028] In use of the PECVD equipment cooling system, the water outlet module 15 and the water inlet module 10 of the water supply equipment 1 are connected in communication with the water inlet pipe 20 and the water outlet pipe 22 respectively, then the water inlet pipe 20 and the water outlet pipe 22 are connected in communication with the water inlet port 240 and the water outlet port 242 respectively, after that, the upper disc pipe inlet 30 and the upper disc pipe outlet 32 of the upper cooling disc pipe 3 are connected in communication with the upper water supply port 242 and the upper backwater port 243 respectively, and the lower water supply port 244 and the lower backwater port 245 of the lower cooling disc pipe are connected in communication with the lower disc pipe inlet 34 and the lower disc pipe outlet 36 respectively, then the water supply equipment 1 is started to make the cooling water with the temperature of 25-60 degrees Celsius reach the upper cooling disc pipe 3 and the lower cooling disc pipe to cool the inner cavity upper wall 40 and the inner cavity lower wall 42, and the cooled backwater with the temperature range of 27-65 degrees Celsius is sent back to the water inlet module 10 of the water supply equipment 1, and after being processed by the temperature sensor 11, the temperature controller 12 and the heat dissipation module 14, the cooling water with the temperature of 25-60 degrees Celsius is formed and sent back to the upper cooling disc pipe 3 and the lower cooling disc pipe for water cooling.

[0029] In summary, the PECVD equipment cooling system comprises a constant-temperature water supply equipment, a connecting pipe group and a cooling disc pipe. The cooling disc pipe is arranged on the inner cavity wall of the PECVD equipment. The connecting pipe group is used for sending the cooling water with the predetermined temperature range provided by the constant-temperature water supply equipment into the cooling disc pipe and sending the cooled backwater back to the constant-temperature water supply equipment. The PECVD equipment cooling system can effectively take away the heat generated in the PECVD film forming process in time, and avoid the adverse effects of the high temperature of the silicon wafer on the battery conversion efficiency.

[0030] The prior description of this disclosure is provided to enable any person skilled in the art to make or use this disclosure. Various modifications to this disclosure will be apparent to those skilled in the art, and the general principles defined herein can be applied to other variations without departing from the spirit or scope of this disclosure. Therefore, this disclosure is not intended to be limited to the examples and designs described herein, but should be granted the widest scope consistent with the principles and novel features disclosed herein. The above embodiments are provided to those skilled in the art for implementing or using this invention. Those skilled in the art can make various modifications or changes to the above embodiments without departing from the inventive concept of this invention. Therefore, the scope of protection of this invention is not limited to the above embodiments, but should be the maximum scope conforming to the innovative features mentioned in the claims.

Claims

1. A cooling system for PECVD equipment, characterized in that, The PECVD equipment cooling system includes a constant temperature water supply device, a connecting pipe assembly, and a cooling coil. The cooling coil is installed on the inner wall of the PECVD equipment. The connecting pipe assembly is used to send cooling water within a predetermined temperature range provided by the constant temperature water supply device into the cooling coil and to return the cooled water to the constant temperature water supply device.

2. The PECVD equipment cooling system according to claim 1, characterized in that, The connecting pipe assembly includes an inlet pipe, an outlet pipe, and a vacuum flange. The outer side of the vacuum flange is provided with an inlet port and an outlet port, which are respectively connected to the inlet pipe and the outlet pipe. The inner side of the vacuum flange is provided with a water supply port and a water return port for the cooling coil.

3. The PECVD equipment cooling system according to claim 2, characterized in that, The constant temperature water supply equipment includes a water inlet module, a temperature sensor, a temperature controller, a heating module, a heat dissipation module, and a water outlet module. The water inlet module receives the cooled return water discharged from the water outlet pipe. The temperature sensor detects the temperature of the cooled return water. The temperature controller controls the heating module or the heat dissipation module to control the water temperature within a predetermined temperature range based on the return water temperature detected by the temperature sensor. The water outlet module delivers the cooled water within the predetermined temperature range to the water outlet pipe.

4. The PECVD equipment cooling system according to claim 1 or 3, characterized in that, The predetermined temperature range is 25-60 degrees Celsius.

5. The PECVD equipment cooling system according to claim 3, characterized in that, The heat dissipation module includes a cooling tower.

6. The PECVD equipment cooling system according to claim 2, characterized in that, The inside of the vacuum flange is in a vacuum environment, while the outside of the vacuum flange is in an atmospheric environment.

7. The PECVD equipment cooling system according to claim 2, characterized in that, The upper and lower walls of the inner cavity of the PECVD equipment are respectively provided with an upper cooling coil and a lower cooling coil, and the inner side of the vacuum flange is respectively provided with an upper water supply port, an upper water return port, a lower water supply port and a lower water return port.

8. The PECVD equipment cooling system according to claim 7, characterized in that, Grooves are provided on both the upper and lower walls of the inner cavity, and the upper and lower cooling coils are respectively arranged in the grooves.

9. The PECVD equipment cooling system according to claim 7, characterized in that, The upper cooling coil includes an upper coil inlet and an upper coil outlet that are respectively connected to the upper water supply port and the upper water return port, and the lower cooling coil includes a lower coil inlet and a lower coil outlet that are respectively connected to the lower water supply port and the lower water return port.

10. The PECVD equipment cooling system according to claim 3, characterized in that, The water inlet module receives water replenishment from the water source.

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