Air supply pressure adjusting device and semiconductor process equipment

Abstract

The embodiment of the utility model provides a gas supply pressure adjusting device and semiconductor process equipment, and the gas supply pressure adjusting device comprises a screw type gas conveyor, a driver and a gas pressure detector; the screw type gas conveyor is provided with a first gas inlet and a first gas outlet, the first gas inlet is used for being connected with a gas source, and the first gas outlet is used for being connected with a semiconductor process chamber of semiconductor process equipment; the driver is in driving connection with the screw type gas conveyor and is used for driving the screw type gas conveyor to work, so that gas input from the first gas inlet is discharged from the first gas outlet; the air pressure detector is connected with the first air outlet and used for detecting the pressure of air output by the first air outlet. And the gas supply pressure adjusting device can adjust the pressure of the gas conveyed to the semiconductor process chamber according to the process requirement based on the detection result of the gas pressure detector.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor equipment, in particular to a gas supply pressure adjusting device and a semiconductor process equipment. BACKGROUND

[0002] In the process of implementing semiconductor process, sometimes it is necessary to input process gas into the semiconductor process chamber. In the process of gas transmission from the gas source to the semiconductor process chamber, a large amount of inlet gas pressure is lost; thus, in some cases, the process gas delivered to the semiconductor process chamber may have a problem of insufficient pressure. CONTENT

[0003] Embodiments of the present application provide a gas supply pressure adjusting device and a semiconductor process equipment to solve the problems in the background art.

[0004] In a first aspect, embodiments of the present application provide a gas supply pressure adjusting device.

[0005] The gas supply pressure adjusting device provided by the embodiments of the present application is applied to a semiconductor process equipment, and includes a screw type gas conveyor, a driver and a gas pressure detector; the screw type gas conveyor is provided with a first gas inlet and a first gas outlet, the first gas inlet is used to be connected with a gas source, and the first gas outlet is used to be connected with a semiconductor process chamber of the semiconductor process equipment; the driver is drivingly connected with the screw type gas conveyor, and is used to drive the screw type gas conveyor to work, so that the gas input through the first gas inlet is discharged through the first gas outlet; the gas pressure detector is connected with the first gas outlet, and is used to detect the pressure of the gas output by the first gas outlet.

[0006] Optionally, the gas supply pressure adjusting device further includes a flow detector; the flow detector is arranged between the first gas outlet and the semiconductor process chamber, and is used to detect the flow of the gas delivered from the first gas outlet to the semiconductor process chamber.

[0007] Optionally, the screw type gas conveyor includes a housing, a stator and a screw rotor; the stator is arranged in the housing, the stator is provided with a receiving hole, the screw rotor is arranged in the receiving hole, and the driver is drivingly connected with the screw rotor; the first gas inlet and the first gas outlet are respectively arranged in the housing, and the first gas inlet and the first gas outlet are respectively located at two ends of the screw rotor.

[0008] Optionally, the screw type gas conveyor further includes a connecting rod and a transmission shaft, the transmission shaft is rotationally connected with the housing, one end of the connecting rod is connected with the transmission shaft, the other end of the connecting rod is connected with the screw rotor, and the driver is connected with the transmission shaft.

[0009] Optionally, the screw gas conveyor further comprises a universal joint, and an end of the connecting rod, which is away from the transmission shaft, is connected with the screw rotor through the universal joint.

[0010] Optionally, the driver is a rotary motor, and the rotary motor is used to drive the screw rotor to rotate.

[0011] Optionally, the gas supply pressure adjusting device further comprises a first on-off valve, and the first gas inlet is used to be connected with the gas source through the first on-off valve.

[0012] In a second aspect, an embodiment of the present application provides a semiconductor process equipment.

[0013] The semiconductor process equipment provided by the embodiment of the present application comprises: a semiconductor process chamber and any one of the gas supply pressure adjusting devices provided by the embodiment of the present application, wherein the semiconductor process chamber is provided with a second gas inlet, and the first gas outlet is connected with the second gas inlet.

[0014] Optionally, the semiconductor process equipment further comprises a plurality of gas supply pipelines, wherein each of the gas supply pipelines is provided with a third gas inlet and a second gas outlet, each of the third gas inlets is used to be connected with a gas source, and each of the second gas outlets is connected with the first gas inlet.

[0015] Optionally, the gas supply pipeline is provided with a mass flow controller.

[0016] The above at least one technical scheme adopted by the embodiment of the present application can achieve the following beneficial effects:

[0017] In the embodiment of the present application, the rotation speed of the driver can be adjusted based on the pressure parameter of the gas output by the first gas outlet acquired by the gas pressure detector, so as to adjust the rotation speed of the screw gas conveyor, and then the pressure of the gas conveyed to the semiconductor process chamber through the first gas outlet is adjusted, so that the pressure of the gas conveyed to the semiconductor process chamber meets the process requirement. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical schemes in the embodiments of the present application or the related technical schemes, the drawings needed to be used in the embodiment or the related technical description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments described in the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0019] Figure 1 FIG. 1 is a schematic diagram of a semiconductor process equipment provided by an embodiment of the present application and configured with a gas supply pressure adjusting device;

[0020] Figure 2 A schematic diagram of a gas supply pressure adjustment device provided in an embodiment of this application;

[0021] Figure 3 A schematic diagram of a screw-type gas conveyor provided in an embodiment of this application;

[0022] Figure 4 A cross-sectional view of a stator and a screw rotor provided for an embodiment of this application;

[0023] Figure 5 A cross-sectional view of a stator and screw rotor provided for an embodiment of this application shows that in Figure 4 Based on this, consider the case where the screw rotor rotates relative to the stator by a first angle;

[0024] Figure 6 A cross-sectional view of a stator and screw rotor provided for an embodiment of this application shows that in Figure 5 Based on this, consider the case where the screw rotor rotates a second angle relative to the stator.

[0025] Explanation of reference numerals in the attached figures:

[0026] 10-Semiconductor process equipment;

[0027] 100 - Gas supply pressure adjustment device;

[0028] 110 - Screw-type gas conveyor; 111 - Housing; 111a - First housing; 111b - Second housing; 111c - Third housing; 1111 - First air inlet; 1112 - First air outlet; 112 - Stator; 113 - Screw rotor; 114 - Connecting rod; 115 - Drive shaft; 116 - Universal joint;

[0029] 120-drive;

[0030] 130 - Barometer;

[0031] 140 - Flow detector;

[0032] 150 - First switch valve;

[0033] 160-Controller;

[0034] 200 - Semiconductor process chamber;

[0035] 210 - Second air intake;

[0036] 300 - Gas supply line; 300a - Third air inlet; 300b - Second air outlet;

[0037] 310 - mass flow controller; 320 - manual valve; 330 - pressure regulating valve; 340 - second on / off valve; 350 - third on / off valve;

[0038] 20 - gas source. DETAILED DESCRIPTION

[0039] For the purpose of clarity, technical solutions and advantages of the present application, the following will combine the embodiments of the present application and the corresponding drawings to clearly and completely describe the technical solutions of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0040] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting" should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be directly connected, or indirectly connected through an intermediate medium, or the internal communication of two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood based on the specific circumstances.

[0041] In addition, although the terms used in the present application are selected from the commonly known and used terms, some terms mentioned in the specification of the present application may be selected by the applicant according to his or her judgment, and the detailed meaning of the terms is described in the relevant part of the description.

[0042] In addition, the present application is required to be understood not only by the actual terms used, but also by the meaning implied by each term.

[0043] The technical solutions provided by the embodiments of the present application are described in detail below in combination with the drawings.

[0044] The present application provides a gas supply pressure adjusting device. The gas supply pressure adjusting device provided by the embodiments of the present application is applied to a semiconductor process equipment. Referring to Figures 1 to 3 The gas supply pressure adjusting device 100 provided by the embodiments of the present application comprises a screw type gas conveyor 110, a driver 120 and a gas pressure detector 130.

[0045] The screw type gas conveyor 110 is provided with a first gas inlet 1111 and a first gas outlet 1112. The first gas inlet 1111 is used to connect with the gas source 20. In this way, the gas output by the gas source 20 can be input into the screw type gas conveyor 110 through the first gas inlet 1111.

[0046] The driver 120 is drivingly connected with the screw-type gas conveyor 110 for driving the screw-type gas conveyor 110 to work, so that the gas input from the first gas inlet 1111 is discharged through the first gas outlet 1112. The first gas outlet 1112 is used to be connected with the semiconductor process chamber 200 of the semiconductor process equipment 10. In this way, the driver 120 can drive the screw-type gas conveyor 110 to work, so as to pressurize the gas input into the screw-type gas conveyor 110, and then supply the pressurized gas to the semiconductor process chamber 200 through the first gas outlet 1112 of the screw-type gas conveyor 110.

[0047] The gas pressure detector 130 is connected with the first gas outlet 1112 for detecting the pressure of the gas output from the first gas outlet 1112.

[0048] In this way, in the embodiments of the present application, the speed of the driver 120 can be adjusted based on the pressure parameter of the gas output from the first gas outlet 1112 obtained by the gas pressure detector 130, so as to adjust the speed of the screw-type gas conveyor 110, and then achieve the effect of adjusting the pressure of the gas conveyed to the semiconductor process chamber 200 through the first gas outlet 1112, so that the pressure of the gas conveyed to the semiconductor process chamber 200 meets the process requirements.

[0049] It should be noted that the speed of the driver 120 can be adjusted based on the pressure parameter obtained by the gas pressure detector 130, which can be specifically performed by an operator. For example, the input power of the driver 120 can be adjusted by rotating a control knob electrically connected with the driver 120, so as to adjust the speed of the driver 120.

[0050] In addition, the speed of the driver 120 can be adjusted in combination with the Proportional Integral Derivative (PID) adjustment method in the prior art. Since the focus of the present application is not to improve the control algorithm, and since the related control method can be used by referring to the related art, the scheme of adjusting the speed of the driver 120 based on the pressure parameter obtained by the gas pressure detector 130 will not be described here.

[0051] Exemplarily, in some embodiments, the gas pressure adjusting device 100 further comprises a flow detector 140. The flow detector 140 is arranged between the first gas outlet 1112 and the semiconductor process chamber 200. The flow detector 140 is used to detect the flow of the gas conveyed to the semiconductor process chamber 200 through the first gas outlet 1112. Exemplarily, the flow detector 140 can be a flow meter. The gas pressure detector 130 can be a vacuum gauge.

[0052] In this way, the speed of the driver 120 can be adjusted based on the pressure parameter of the gas outputted from the first gas outlet 1112 obtained by the pressure detector 130 and the flow parameter of the gas delivered to the semiconductor process chamber 200 by the first gas outlet 1112 obtained by the flow detector 140, so as to adjust the speed of the screw-type gas delivery device 110, and further adjust the pressure and flow of the gas delivered to the semiconductor process chamber 200 by the first gas outlet 1112, so that the pressure and flow of the gas delivered to the semiconductor process chamber 200 meet the process requirements.

[0053] Reference Figure 3 In some embodiments, the screw-type gas delivery device 110 includes a housing 111, a stator 112 and a screw rotor 113. The stator 112 is arranged in the housing 111, the stator 112 is provided with a receiving hole, the screw rotor 113 is arranged in the receiving hole, and the driver 120 is drivingly connected with the screw rotor 113. The first gas inlet 1111 and the first gas outlet 1112 are respectively arranged in the housing 111, and the first gas inlet 1111 and the first gas outlet 1112 are respectively located at two ends of the screw rotor 113. In this way, when the screw rotor 113 rotates, the gas inputted through the first gas inlet 1111 can be delivered to the first gas outlet 1112 under the action of the screw rotor 113.

[0054] Exemplarily, the screw rotor 113 is made of carbon steel or other materials with high hardness, and the stator 112 can be made of rubber or plastic.

[0055] Exemplarily, the housing 111 includes a first shell 111a, a second shell 111b and a third shell 111c. The first shell 111a is a hollow structure. The second shell 111b and the third shell 111c are respectively butted with two ends of the first shell 111a. The stator 112 is arranged in the first shell 111a. The first gas inlet 1111 is arranged in the second shell 111b, and the first gas outlet 1112 is arranged in the third shell 111c. In this way, the assembly difficulty of the screw-type gas delivery device 110 can be reduced by making the housing 111 have a spliced structure.

[0056] In some embodiments, the screw-type gas delivery device 110 further includes a connecting rod 114 and a transmission shaft 115. The transmission shaft 115 is rotationally connected to the housing 111. Exemplarily, the transmission shaft 115 is rotationally connected to the second shell 111b through a bearing. One end of the connecting rod 114 is connected with the transmission shaft 115 of the screw-type gas delivery device 110, and the other end is connected with the screw rotor 113. The driver 120 is connected with the transmission shaft 115 to drive the transmission shaft 115 to rotate, and further drive the connecting rod 114 and the screw rotor 113 to rotate synchronously.

[0057] In some embodiments, the screw gas conveyor 110 further comprises a universal joint 116. The end of the connecting rod 114, which is away from the transmission shaft 115, is connected with the screw rotor 113 through the universal joint 116. In this way, the jamming of the connecting rod 114 during the rotation of the screw rotor 113 can be prevented by setting the universal joint 116.

[0058] In combination Figures 4 to 6 When the screw rotor 113 rotates relative to the stator 112, three working chambers are formed between the outer wall of the screw rotor 113 and the stator 112. Taking the upper working chamber as an example, the volume of the upper working chamber gradually decreases when the screw rotor 113 rotates relative to the stator 112, which can pressurize the gas.

[0059] In addition, during the operation of the screw gas conveyor 110, the volume of the first working chamber near the first gas inlet 1111 gradually increases, forming a negative pressure. Under the action of the pressure difference, the gas is sucked into the first working chamber. With the continuous rotation of the screw rotor 113, the volume of the first working chamber continuously increases to the maximum, and then the working chamber is closed and pushes the gas in the axial direction to the outlet of the first working chamber. At the same time, the working chambers of the front and rear pitches are alternately circulated to suck and discharge the gas, so that the gas is continuously pushed from the suction chamber to the discharge chamber in the axial and tangential directions. Since the gas flows uniformly in the axial direction in the screw gas conveyor 110, the pressure of the screw gas conveyor 110 is stable and is not easy to produce vortex and stirring.

[0060] In some embodiments, the driver 120 is a rotary motor for driving the screw rotor 113 to rotate. Specifically, the driver 120 is drivingly connected with the transmission shaft 115, so as to drive the connecting rod 114 and the screw rotor 113 to rotate synchronously by driving the transmission shaft 115 to rotate. In other embodiments, the driver 120 can also be a hydraulic motor, a gas motor or other driving device.

[0061] Reference Figure 1 and Figure 2 In some embodiments, the gas supply pressure adjusting device 100 further comprises a first on-off valve 150, and the first gas inlet 1111 is connected with the gas source 20 through the first on-off valve 150. In this way, the gas can be blocked in the case of structural failure of the screw gas conveyor 110 and the like, and the continuous introduction of the gas into the semiconductor process chamber 200 can be prevented by closing the first on-off valve 150.

[0062] The embodiments of the present application provide a semiconductor process equipment. Reference Figure 1 and Figure 2The semiconductor process equipment 10 provided by the embodiments of the present application comprises the semiconductor process chamber 200 and any one of the gas supply pressure adjusting devices 100 provided by the embodiments of the present application. The semiconductor process chamber 200 is provided with the second gas inlet 210, the first gas outlet 1112 is connected with the flow detector 140, and the flow detector 140 is connected with the second gas inlet 210. Exemplarily, the semiconductor process equipment 10 can be a vertical furnace equipment. For example, the vertical furnace equipment can be used to generate a silicon film on the surface of a wafer.

[0063] In some embodiments, the semiconductor process equipment 10 further comprises a plurality of gas supply pipelines 300, and each of the gas supply pipelines 300 is provided with a third gas inlet 300a and a second gas outlet 300b. Each of the third gas inlets 300a is connected with a gas source 20 respectively, and each of the second gas outlets 300b is connected with the first gas inlet 1111.

[0064] In some embodiments, the gas supply pipeline 300 is provided with a mass flow controller 310. The mass flow controller (MFC) is a device for accurately measuring and controlling the mass flow of gas or liquid. It not only has the function of a mass flow meter, but more importantly, it can automatically control the flow of gas. Even if the system pressure fluctuates or the environmental temperature changes, the flow rate can remain unchanged at the set value.

[0065] In some embodiments, the gas supply pipeline 300 is further provided with a manual valve 320, a pressure regulating valve 330, a second on-off valve 340 and a third on-off valve 350, and the mass flow controller 310 is arranged between the second on-off valve 340 and the third on-off valve 350. The manual valve 320, the second on-off valve 340 and the third on-off valve 350 can be used to control the opening and closing of the pipeline.

[0066] Exemplarily, the gas supply pipeline 300 comprises a first gas supply pipeline, a second gas supply pipeline and a third gas supply pipeline. The first gas supply pipeline is connected with a first gas source. The first gas source delivers a first process gas to the semiconductor process chamber 200 through the first gas supply pipeline and the screw gas conveyor 110. The second gas supply pipeline is connected with a second gas source. The second gas source delivers a second process gas to the semiconductor process chamber 200 through the second gas supply pipeline and the screw gas conveyor 110. The third gas supply pipeline is connected with a third gas source. The third gas source delivers a third process gas to the semiconductor process chamber 200 through the third gas supply pipeline and the screw gas conveyor 110.

[0067] In some embodiments, the gas supply pressure adjustment device 100 further comprises a controller 160. Exemplarily, the controller 160 is a programmable logic controller (PLC). Exemplarily, the gas pressure detector 130 and the flow detector 140 are connected to the programmable logic controller, so that the pressure signal and the flow signal are fed back to the programmable logic controller. The programmable logic controller is connected to the driver 120, so that the programmable logic controller can adjust the rotating speed of the driver 120 based on the pressure signal and the flow signal, thereby achieving the effect of adjusting the rotating speed of the screw rotor 113 of the screw gas conveyor 110.

[0068] In some embodiments, the first on-off valve 150 is connected to the first gas inlet 1111 of the screw gas conveyor 110 through a vacuum coupling retainer (VCR) welded pipe. The screw gas conveyor 110 is connected to the gas pressure detector 130 and the flow detector 140 through a vacuum coupling retainer welded pipe. The gas pressure detector 130 and the flow detector 140 are connected to the programmable logic controller through signal transmission cables. The programmable logic controller and the driver 120 are connected through transmission cables, and the driver 120 is drivingly connected to the screw gas conveyor 110. The screw mechanism included in the screw gas conveyor 110 can continuously provide a conveying force to the gas compared to other mechanisms, and the conveying rate of the gas can be controlled by adjusting the rotating speed of the screw rotor 113, and the effect of pressure stabilization is achieved.

[0069] The first on-off valve 150 functions to control the on-off of the process gas, so as to ensure that the process gas can be blocked in the case of subsequent structure failure, thereby preventing the process gas from continuing to be introduced. The process gas enters the first on-off valve 150 through a welded pipe, and then enters the screw gas conveyor 110 through a welded pipe. The screw gas conveyor 110 functions to convey the gas. The gas is conveyed forward along the screw pitch under the rotation of the screw gas conveyor 110, and then enters the flow detector 140 through a welded pipe. Finally, the gas is introduced into the semiconductor process chamber 200.

[0070] During the operation of the gas supply pressure adjustment device 100, the gas pressure detector 130 and the flow detector 140 at the rear end of the screw gas conveyor 110 can monitor the inlet pressure and the inlet flow of the process gas in real time. When the inlet pressure and the inlet flow are unstable, the pressure signal and the flow signal can be fed back to the programmable logic controller. Through signal conversion of the programmable logic controller, the pressure signal and the flow signal are converted into an electric signal for controlling the rotating speed of the driver 120, so as to adjust the rotating speed of the screw gas conveyor 110.

[0071] In addition, the speed of the screw gas conveyor 110 can be adjusted according to the air inlet rate and air inlet pressure required by the process through the control of the programmable logic controller. When the pressure requirement at the rear end is high, the speed of the screw gas conveyor 110 is increased, and vice versa. In addition, since the rear end pressure of the screw gas conveyor 110 and the air inlet amount are closely related to the speed of the screw, when the speed of the screw gas conveyor 110 is constant, the air inlet amount and air inlet rate of the process gas can be kept in a stable state, which to some extent plays a role in stabilizing the air inlet pressure and flow.

[0072] It should be noted that the relational terms herein such as first and second, and the like, are used solely to distinguish one from another entity or action, without necessarily requiring or implying any such actual relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus.

[0073] Although the embodiments of the present application have been shown and described, it is to be understood that various changes, modifications, substitutions and alterations can be made to the embodiments of the present application without departing from the principles and spirit of the embodiments of the present application, and the scope of the embodiments of the present application is defined by the appended claims and their equivalents.

Claims

1. A gas pressure adjusting apparatus applied to a semiconductor process equipment, characterized by, The gas supply pressure adjustment device includes: a screw gas conveyor (110), a driver (120), and a gas pressure detector (130). The screw gas conveyor (110) is provided with a first air inlet (1111) and a first air outlet (1112). The first air inlet (1111) is used to connect to the gas source (20), and the first air outlet (1112) is used to connect to the semiconductor process chamber (200) of the semiconductor process equipment. The driver (120) is driven to connect with the screw gas conveyor (110) and is used to drive the screw gas conveyor (110) to work so that the gas input from the first inlet (1111) is discharged through the first outlet (1112). The pressure detector (130) is connected to the first air outlet (1112) and is used to detect the pressure of the gas output from the first air outlet (1112).

2. The air supply pressure adjusting apparatus according to claim 1, characterized by The gas supply pressure adjustment device further includes a flow detector (140); the flow detector (140) is located between the first gas outlet (1112) and the semiconductor process chamber (200), and the flow detector (140) is used to detect the flow rate of the gas delivered from the first gas outlet (1112) to the semiconductor process chamber (200).

3. The air supply pressure adjusting apparatus according to claim 1, wherein The screw gas conveyor (110) includes a housing (111), a stator (112), and a screw rotor (113). The stator (112) is disposed inside the housing (111), the stator (112) is provided with a receiving hole, the screw rotor (113) passes through the receiving hole, and the driver (120) is drivenly connected to the screw rotor (113). The first air inlet (1111) and the first air outlet (1112) are respectively opened on the outer shell (111), and the first air inlet (1111) and the first air outlet (1112) are respectively located at both ends of the screw rotor (113).

4. The air supply pressure adjusting apparatus according to claim 3, characterized by The screw gas conveyor (110) also includes a connecting rod (114) and a drive shaft (115). The drive shaft (115) is rotatably connected to the housing (111). One end of the connecting rod (114) is connected to the drive shaft (115), and the other end is connected to the screw rotor (113). The driver (120) is connected to the drive shaft (115).

5. The gas supply pressure regulating device according to claim 4, characterized in that, The screw gas conveyor (110) also includes a universal joint (116), and the end of the connecting rod (114) opposite to the drive shaft (115) is connected to the screw rotor (113) through the universal joint (116).

6. The gas supply pressure regulating device according to claim 3, characterized in that, The driver (120) is a rotary motor, which is used to drive the screw rotor (113) to rotate.

7. The gas supply pressure regulating device according to claim 1, characterized in that, The gas supply pressure adjustment device also includes a first switch valve (150), and the first air inlet (1111) is used to connect to the gas source (20) via the first switch valve (150).

8. A semiconductor process apparatus, characterized in that, include: The semiconductor process chamber (200) and the gas supply pressure adjustment device according to any one of claims 1 to 7, wherein the semiconductor process chamber (200) is provided with a second air inlet (210) and the first air outlet (1112) is connected to the second air inlet (210).

9. The semiconductor process equipment according to claim 8, characterized in that, The semiconductor process equipment also includes multiple gas supply lines (300), each gas supply line (300) having a third gas inlet (300a) and a second gas outlet (300b). Each of the third gas inlets (300a) is used to connect to a gas source (20) respectively, and each of the second gas outlets (300b) is connected to the first gas inlet (1111).

10. The semiconductor process equipment according to claim 9, characterized in that, The gas supply pipeline (300) is equipped with a mass flow controller (310).

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