High-temperature volatile melt laser flash method heat conduction testing device

Abstract

The utility model relates to a high temperature volatile melt laser flash method heat conduction test device, which comprises a sample pool and a cover, the sample pool is provided with a bottom wall, an outer side wall and an inner side wall, the outer side wall is only provided with a through exhaust hole, and the inner side wall is provided with a through hole. The cover covers the sample cell so as to define a melt containing space and an inner overflow groove space which are communicated with each other on the inner side and the outer side of the inner side wall, and the inner overflow groove space is communicated with the external environment through the exhaust hole. According to the device for testing the heat conduction of the high-temperature volatile melt by the laser flash method, the use amount of samples can be reduced, the volatility influence of the samples can be reduced, the high-safety test of high-temperature volatile melt samples such as chlorine salt can be realized, and the stability of test data can be improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to analytical instrument more particularly to a kind of high temperature volatile melt laser flash method heat conduction test device. BACKGROUND

[0002] High temperature melt, especially inorganic salt high temperature melt, because of its excellent physical, chemical performance and in nuclear power, chemical, metallurgical fields are widely used as heat transfer, heat storage medium. For example in molten salt reactor, as high temperature melt, molten salt is both as fuel carrier maintains the safety of fission reaction, also acts as coolant to ensure the efficient transmission of heat. Thermal conductivity is the key index to measure heat transfer, heat storage performance, and is crucial for thermal-hydraulic design and system safety analysis of molten salt reactor.

[0003] There are many methods to measure thermal conductivity: hot-wire method is simple, but due to the conductivity of melt increases with temperature, resulting in serious shunt phenomenon and large error; Hot plate method can reduce the ionization degree of molten salt, and the container material is less and the design is complex; Periodic heat flow method has small radiation heat loss, but the evaluation of hydraulics and heat inlet length brings larger error.

[0004] Laser flash method is a test method based on laser flash photolysis technology, which uses a series of changes and reactions in the decay process of molecules jumping from ground state to excited state after being excited by light. The existing laser flash method has the problems of large sample consumption and unsuitability for high temperature volatile melt thermal conductivity test. In the actual thermal conductivity test application of toxic and harmful samples such as drug-related and radiation-related, the sample test consumption is large, and the sample preparation process is wasteful. When testing high volatile samples, it is highly corrosive, pollutes the equipment and has safety hazards.

[0005] In addition, based on laser flash method, the current detection equipment and method for thermal conductivity test have long measurement period, and only one melt thermal conductivity can be measured in 12h, with low test efficiency. For example, as shown in the figure, the existing detection equipment only has 3 workstations for testing sample table. Figure 5 The utility model discloses a kind of high temperature volatile melt laser flash method heat conduction test device. Utility model content

[0006] To solve the problem of unsuitability of the above-mentioned laser flash method for high temperature volatile melt thermal conductivity test, the utility model provides a kind of high temperature volatile melt laser flash method heat conduction test device.

[0007] The high temperature volatile melt laser flash method heat conduction test device according to the utility model comprises a sample cell and a lid, wherein the sample cell has a bottom wall, an outer side wall and an inner side wall, there is only one through exhaust hole on the outer side wall, the lid covers the sample cell to define a melt containing space and an inner overflow groove space on the inner and outer sides of the inner side wall, and the inner overflow groove space is communicated with the external environment through the exhaust hole.

[0008] In a preferred embodiment, the lid is composed of a first section, a second section and a third section with gradually decreasing diameters, a bottom surface of the first section rests on a top surface of the outer sidewall, an outer surface of the second section is in direct contact with an inner surface of the outer sidewall, a bottom surface of the second section is in clearance fit with the inner sidewall, an annular inner overflow groove space is formed between the inner surface of the outer sidewall and the outer surface of the inner sidewall, and the melt containing space is defined by the inner surface of the inner sidewall.

[0009] In a preferred embodiment, the top surface of the lid is provided with a first counterbore and a second counterbore in progression, wherein the first counterbore extends from the first section to the second section, and the second counterbore extends from the second section to the third section.

[0010] In a preferred embodiment, a portion between the bottom surface of the second counterbore and the bottom surface of the third section forms a lid body, and the melt containing space is further defined by the bottom surface of the lid body and the top surface of the bottom wall.

[0011] In a preferred embodiment, the melt containing space is further defined by the outer surface of the third section.

[0012] In a preferred embodiment, the bottom surface of the lid body is parallel to the top surface of the bottom wall.

[0013] In a preferred embodiment, the high-temperature volatile melt laser flash method thermal conductivity testing device further comprises a base fixed to the laser thermal conductivity instrument through the convex edge, and the sample cell is arranged on the top of the base.

[0014] In a preferred embodiment, the base is integrally formed with the sample cell.

[0015] In a preferred embodiment, the laser thermal conductivity instrument has a plurality of work station testing sample tables.

[0016] In a preferred embodiment, the outer sidewall and the inner sidewall are arranged perpendicularly to the bottom wall with a radial spacing from each other.

[0017] According to the high-temperature volatile melt laser flash method thermal conductivity testing device of the present application, the sample usage can be reduced, the sample volatility influence can be reduced, the testing of high-temperature volatile melt samples such as chlorides can be performed with higher safety, and the testing data stability can be improved. In addition, according to the high-temperature volatile melt laser flash method thermal conductivity testing device of the present application, the single sample testing period can be shortened, and the sample testing can be performed more efficiently. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 is a schematic diagram of the overall structure of a high-temperature volatile melt laser flash method thermal conductivity testing device according to a preferred embodiment of the present application.

[0019] Figure 2 isFigure 1 A structural diagram of the base and main body.

[0020] Figure 3 yes Figure 1 A schematic diagram of the lid's structure.

[0021] Figure 4 yes Figure 3 The cover is installed into Figure 2 A structural diagram of the main body.

[0022] Figure 5 This illustrates a prior art 3-station test sample stage.

[0023] Figure 6 This invention relates to a 6-station test sample stage. Detailed Implementation

[0024] The preferred embodiments of this utility model are given below with reference to the accompanying drawings and described in detail.

[0025] like Figure 1 As shown, a preferred embodiment of the high-temperature volatile melt laser flash thermal conductivity testing device according to this utility model includes a base 1, a sample cell 2, and a cover 3. The bottom of the base 1 is fixed to a laser thermal conductivity meter, the sample cell 2 is disposed on the top of the base 1, and the cover 3 covers the sample cell 2 to define a melt holding space 4 between the main body and the cover 3. Specifically, the high-temperature volatile melt is placed in the melt holding space 4 and prepared by high-temperature melting to make its texture uniformly spread on the bottom of the sample cell 2, tightly adhering to the sample cell 2 and the cover 3, for thermal conductivity testing to obtain the thermal diffusivity, i.e., the thermal conductivity, of the high-temperature volatile melt.

[0026] like Figure 2 As shown, the base 1 and sample cell 2 are integrally formed. A raised edge 101 is provided on the outer surface of the sidewall of the base 1, and the base 1 is fixed to the sample chamber of the laser thermal conductivity instrument via the raised edge 101. The sample cell 2 has a bottom wall 201 and an outer wall perpendicular to the bottom wall 201. The outer wall has one and only one through-hole vent 202. During the high-temperature melting and sample preparation process, the change in heat will cause a slight change in air pressure within the sample cell. This vent 202 can ensure the normal progress of the sample preparation process, i.e., regulate the internal and external air pressure balance. The vent 202 is a micropore. In this embodiment, the diameter of the vent 202 is 1 mm. The sample cell 2 also has an inner sidewall 203 perpendicular to the bottom wall 201, which is spaced apart radially inward from the outer sidewall.

[0027] like Figure 3As shown, the cover 3 is designed with a three-tiered outer surface, consisting of a first section 301, a second section 302, and a third section 303, each with a gradually decreasing diameter. The cover 3 has a progressively recessed first countersunk hole 305 and a second countersunk hole 306 extending from the center of its top surface. The first countersunk hole 305 extends from the first section 301 to the second section 302, and the second countersunk hole 306 extends from the second section 302 to the third section 303. The portion between the bottom surface of the second countersunk hole 306 and the bottom surface of the third section 303 forms the cover body 307.

[0028] like Figure 4 As shown, the bottom surface of the first segment 301 rests against the top surface of the outer wall of the sample cell 2, the outer surface of the second segment 302 is in direct contact with the inner surface of the outer wall of the sample cell 2, and the bottom surface of the second segment 302 is in clearance fit with the inner wall 203. An annular inner overflow groove space 304 is formed between the bottom surface of the second segment 302, the inner surface of the sample cell 2, and the outer surface of the inner wall 203. A melt holding space 4 is formed between the inner surface of the inner wall 203, the outer surface of the third segment 303, the bottom surface of the cover body 307, and the top surface of the bottom wall 201. In this embodiment, the bottom surface of the cover body 307 is parallel to the top surface of the bottom wall 201.

[0029] Thus, the melt-containing space 4 and the inner overflow groove space 304 are separated by the inner sidewall 203, and the inner overflow groove space 304 is connected to the external environment through the vent 202. During the high-temperature melting and sample preparation process, excess molten sample is temporarily stored in the inner overflow groove space 304, ensuring that the molten sample can be evenly spread across the bottom wall 201 after high-temperature melting, and closely adhere to the bottom surface of the lid body 307 and the top surface of the bottom wall 201. Through the design of the inner sidewall 203 and the inner overflow groove space 304, the melt-containing space 4 is significantly reduced, thereby reducing the amount of sample used in a single test. For example, the amount used in a single test is reduced from 3.0g to 0.28g, which is about 10% of the original sample amount. Reducing the amount of volatile sample used in a single test can reduce the impact of the volatility of the volatile sample on the test results and improve the stability of the high-temperature thermal conductivity test data of the molten sample. Reducing the amount of toxic and hazardous samples used per test can decrease the impact of these samples on personnel, the testing environment, and testing equipment. In summary, this invention meets the testing requirements for the thermal conductivity of high-temperature volatile melts by using the vent 202 and the internal overflow groove space 304. Within a certain range, it reduces the internal dimensions and sample capacity, thereby reducing the amount of sample used per test while ensuring testing accuracy and stability.

[0030] In the utility model, the material of base 1, sample pool 2 and cover 3 is high-purity graphite material with high heat conduction performance, SiC material and the like, which is high-temperature resistant and corrosion resistant without affecting the heat conduction performance test of the sample, and meets the demand of the heat conduction coefficient test of the high-temperature corrosive sample.

[0031] In the utility model, as shown in the drawings, Figure 6 The laser heat conduction instrument has 6-station test sample tables and can simultaneously test six samples, improving the melt sample test efficiency. It should be understood that the 6 stations here are only an example and not a limitation, and other numbers of sample table stations are also feasible. On the basis of reducing the overall size of base 1, sample pool 2 and cover 3, the utility model improves the original test sample amount and only tests one toxic and harmful sample at a time, and updates to test six samples at a time, greatly shortens the total test time, shortens the test cycle and improves the test efficiency.

[0032] The above is only a preferred embodiment of the utility model, and is not used to limit the scope of the utility model, and the above embodiment of the utility model can be variously changed. Any simple, equivalent change and modification made according to the content of the claims and the specification of the utility model application falls within the protection scope of the claims of the utility model patent. The utility model is not described in detail and is conventional technical content.

Claims

1. A high temperature volatile melt laser flash method thermal conductivity testing apparatus, characterized by, The high-temperature volatile melt laser flash method heat conductivity testing device comprises a sample cell and a cover, wherein the sample cell has a bottom wall, an outer sidewall and an inner sidewall, the outer sidewall has only one through exhaust hole, and the cover covers the sample cell to define a melt containing space and an inner overflow groove space on the inner and outer sides of the inner sidewall, and the inner overflow groove space is communicated with the outside environment through the exhaust hole.

2. The high temperature volatile melt laser flash method thermal conductivity test apparatus of claim 1, wherein, The cover is composed of a first section, a second section and a third section with gradually decreasing diameters, the bottom surface of the first section is arranged on the top surface of the outer sidewall, the outer surface of the second section is directly contacted with the inner surface of the outer sidewall, the bottom surface of the second section is in clearance fit with the inner sidewall, and the annular inner overflow groove space is formed between the inner surface of the outer sidewall and the outer surface of the inner sidewall, and the melt containing space is defined by the inner surface of the inner sidewall.

3. The high temperature volatile melt laser flash method thermal conductivity test apparatus of claim 2, wherein, The top surface of the cover is provided with a first counterbore and a second counterbore in a progressive manner, wherein the first counterbore extends from the first section to the second section, and the second counterbore extends from the second section to the third section.

4. The high temperature volatile melt laser flash method thermal conductivity test apparatus of claim 3, wherein, The part between the bottom surface of the second counterbore and the bottom surface of the third section forms a cover body, and the melt containing space is further defined by the bottom surface of the cover body and the top surface of the bottom wall.

5. The high temperature volatile melt laser flash method thermal conductivity test apparatus of claim 4, wherein, The melt containing space is further defined by the outer surface of the third section.

6. The high temperature volatile melt laser flash method thermal conductivity test apparatus of claim 4, wherein, The bottom surface of the cover body is parallel to the top surface of the bottom wall.

7. The high temperature volatile melt laser flash method thermal conductivity test apparatus of claim 1, wherein, The high-temperature volatile melt laser flash method heat conductivity testing device further comprises a base fixed to a laser heat conductivity tester through a convex edge, and the sample cell is arranged on the top of the base.

8. The high temperature volatile melt laser flash method thermal conductivity test apparatus of claim 7, wherein, The base is integrally formed with the sample cell.

9. The high temperature volatile melt laser flash method thermal conductivity test apparatus of claim 7, wherein, The laser heat conductivity tester has a plurality of work station sample tables.

10. The high temperature volatile melt laser flash method thermal conductivity test apparatus of claim 1, wherein, The outer sidewall and the inner sidewall are arranged perpendicularly to the bottom wall with a radial spacing.

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