Photoelectric coupling alignment device

By introducing a moving block, a positioning plate, and a snap-fit ​​structure into the optocoupler alignment device, the problems of inaccurate positioning and laser chip detachment in the optocoupler alignment device are solved, achieving convenient positioning and stable effect.

CN223664817UActive Publication Date: 2025-12-12ANHUI MEIMAN PHOTOELECTRIC TECH CO LTD
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Patent Information

Application Number
CN202520209377.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-02-11
Publication Date
2025-12-12
Estimated Expiration
2035-02-11

AI Technical Summary

Technical Problem

Existing optocoupler alignment devices are difficult to adjust the positioning position and stably install and remove laser chips, resulting in inaccurate positioning and easy chip detachment.

Method used

By designing a moving block, positioning plate, threaded rod, and guide rod structure in the optocoupler alignment device, the position adjustment and fixation of the positioning plate can be achieved. Combined with a snap-fit ​​structure, the laser chip can be stabilized, thereby enhancing positioning accuracy and stability.

Benefits of technology

This invention enables convenient adjustment of the positioning position of the optocoupler alignment device and ensures the stability of the laser chip, preventing chip detachment and improving alignment accuracy and stability.

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Abstract

The utility model discloses a photoelectric coupling alignment device which comprises a bottom plate, a plate body is installed at the top end of the bottom plate, a positioning block is installed at the top end of the bottom plate, a positioning structure is installed at the top end of a movable block, the positioning structure comprises a fixed plate, a positioning plate, scales, a threaded rod and a guide rod, and the fixed plate is installed at the top end of the plate body. The movable block is mounted at the top end of the plate body, the position of the fixing plate can be adjusted by moving the movable block, the position of the positioning plate can be adjusted by adjusting the position of the fixing plate, the movable block can be fixed by screwing the mounting screw, the threaded rod can be driven to ascend and descend by screwing the threaded rod, and the height of the positioning plate can be adjusted by ascending and descending the threaded rod. The positioning plate can adapt to different conditions, alignment can be carried out more easily, the guide rod penetrates through the fixing plate, the situation that the fixing plate deviates can be prevented, positioning can be stable and more accurate through the scales, and therefore the purpose that the photoelectric coupling alignment device is convenient to adjust the positioning position is achieved.
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Description

Technical Field

[0001] This utility model relates to the field of optocoupler technology, and in particular to an optocoupler alignment device. Background Technology

[0002] The English name for optocoupler is optical coupler, abbreviated as OC, also known as opto-isolator, or simply optical coupler. Optical coupler isolation uses an optical coupler for isolation. The structure of an optical coupler is equivalent to encapsulating a light-emitting diode (LED) and a phototransistor together. The LED converts the input electrical signal into an optical signal, which is then transmitted to the phototransistor for conversion into an electrical signal output. Because there is no direct electrical connection, this both couples and transmits the signal and isolates interference. When aligning the optocoupler, an optocoupler alignment device is required.

[0003] Current optocoupler alignment devices can basically meet people's needs, but some problems still exist, as detailed below:

[0004] 1. The problem of difficulty in adjusting the positioning position of the optocoupler alignment device: When aligning different optocouplers, it is necessary to adjust the position of different positioning plates so that the positioning plates can adapt to different situations.

[0005] 2. The optocoupler alignment device has difficulty in stably assembling and disassembling the laser chip. During use, the laser chip may fall off, and the fixation is not stable enough. Utility Model Content

[0006] The purpose of this invention is to provide a photoelectric coupling alignment device to solve the shortcomings of existing photoelectric coupling alignment devices, such as difficulty in adjusting the positioning position and difficulty in stably assembling and disassembling laser chips.

[0007] To solve the above-mentioned technical problems, this utility model provides the following technical solution: a photoelectric coupling alignment device, including a base plate;

[0008] A plate body is mounted on the top of the base plate, a positioning block is mounted on the top of the base plate, and a chip body is mounted on the top of the positioning block.

[0009] A laser chip is mounted on the top of the chip body, and a disassembly and assembly structure is mounted on both sides and both ends of the laser chip. A movable block is mounted on the top of the board body, and mounting plates are mounted on both sides of the movable block. A mounting screw passes through the middle of the mounting plate, and a positioning structure is mounted on the top of the movable block.

[0010] The positioning structure includes a fixed plate, a positioning plate, a scale, a threaded rod, and a guide rod, with the fixed plate installed at the top of the plate.

[0011] In use, the movable block can slide at the top of the plate. Moving the movable block adjusts the position of the fixed plate, which in turn adjusts the position of the positioning plate. The mounting plate and mounting screws form a threaded connection. Tightening the mounting screws fixes the movable block. The threaded rod and the fixed plate form a threaded connection. Tightening the threaded rod raises and lowers it, adjusting the height of the positioning plate to adapt to different situations and make alignment easier. The guide rod passes through the fixed plate to prevent it from shifting. The scale ensures stable and accurate positioning.

[0012] Furthermore, a heat dissipation structure is installed at the bottom of the plate, and the heat dissipation structure includes a connecting plate, a heat sink, and a heat dissipation groove. The connecting plate is installed at the bottom of the plate, and a heat sink is installed at the bottom of the connecting plate. The heat sink can dissipate heat quickly.

[0013] Furthermore, heat dissipation grooves are provided at both ends of the heat sink, and the heat sinks are arranged at equal intervals at the bottom of the connecting plate, thereby increasing the surface area of ​​the heat sinks.

[0014] Furthermore, a locking block is provided at the bottom of the laser chip, and a locking slot is provided at the top of the chip body. The laser chip and the chip body form a locking structure, which facilitates disassembly.

[0015] Furthermore, the disassembly and assembly structure includes a baffle, a rotating shaft, and a buckle. The baffle is installed on the top of the chip body, the rotating shaft is installed on the inner side of the baffle, and the buckle is installed on the top of the rotating shaft, which can fix the laser chip.

[0016] Furthermore, a threaded rod extends through the top of the fixing plate, and a positioning plate is installed at the bottom of the threaded rod. The bottom of the positioning plate is marked with a scale, and guide rods are installed on both sides of the top of the positioning plate. The lifting and lowering of the threaded rod can adjust the height of the positioning plate.

[0017] Furthermore, the outer side wall of the threaded rod is uniformly provided with external threads, and the inner side wall of the fixing plate is uniformly provided with internal threads that cooperate with the external threads. The threaded rod and the fixing plate are threadedly connected, and the rotation of the threaded rod can drive the positioning plate to rise and fall.

[0018] The advantages of the photoelectric coupling alignment device provided by this utility model are as follows: during use, the position of the positioning plate can be adjusted to make the positioning position easy to adjust when the photoelectric coupling is aligned. At the same time, the laser chip can be fixed by the buckle to prevent the laser chip from falling off.

[0019] A movable block is installed at the top of the plate, which can slide on the top of the plate. Moving the movable block can adjust the position of the fixed plate, and adjusting the position of the fixed plate can adjust the position of the positioning plate. The mounting plate and mounting screws form a threaded connection. Tightening the mounting screws can fix the movable block. The threaded rod and the fixed plate form a threaded connection. Tightening the threaded rod can drive the threaded rod to rise and fall. The rise and fall of the threaded rod can adjust the height of the positioning plate, allowing the positioning plate to adapt to different situations and making alignment easier. The guide rod passes through the fixed plate to prevent the fixed plate from shifting. The scale can make the positioning more stable and accurate, thereby achieving the purpose of the photoelectric coupling alignment device to facilitate the adjustment of the positioning position.

[0020] By installing a laser chip at the top of the chip body, the laser chip and the chip body form a locking structure. After the laser chip is inserted into the chip body, the rotating shaft on the inside of the baffle can rotate. The rotation of the rotating shaft can drive the buckle to rotate, and the buckle is locked on the top of the laser chip, which can fix the laser chip and prevent the laser chip from falling off during use. This achieves the purpose of the optocoupler alignment device to fix the laser chip. Attached Figure Description

[0021] Figure 1 This is a three-dimensional structural schematic diagram of the present invention;

[0022] Figure 2 This is a frontal cross-sectional view of the present invention.

[0023] Figure 3 For the present utility model Figure 2 Enlarged cross-sectional view of point A in the middle section;

[0024] Figure 4 This is a three-dimensional structural diagram of the disassembly and assembly structure of this utility model;

[0025] Figure 5 This is a three-dimensional structural diagram of the positioning structure of this utility model.

[0026] The following are the annotations in the diagram: 1. Chip body; 2. Positioning block; 3. Board body; 4. Base plate; 5. Heat dissipation structure; 501. Connecting plate; 502. Heat sink; 503. Heat dissipation groove; 6. Laser chip; 7. Moving block; 8. Mounting plate; 9. Mounting screw; 10. Disassembly and assembly structure; 1001. Baffle; 1002. Rotating shaft; 1003. Snap-fit; 11. Positioning structure; 1101. Fixing plate; 1102. Positioning plate; 1103. Scale; 1104. Threaded rod; 1105. Guide rod. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0028] Please see Figures 1-5 One embodiment of this utility model is a photoelectric coupling alignment device, which includes a base plate 4.

[0029] A plate body 3 is installed on the top of the base plate 4, and a heat dissipation structure 5 is installed on the bottom of the plate body 3. The heat dissipation structure 5 includes a connecting plate 501, a heat sink 502, and a heat dissipation groove 503. The connecting plate 501 is installed on the bottom of the plate body 3, and a heat sink 502 is installed on the bottom of the connecting plate 501. Both ends of the heat sink 502 are provided with heat dissipation grooves 503, and the heat sink 502 is arranged at equal intervals on the bottom of the connecting plate 501.

[0030] See attached document Figure 2-3 As shown, during heat dissipation, the connecting plate 501 can conduct heat and transfer the heat of the chip body 1 to the heat sink 502. The board body 3, the connecting plate 501 and the heat sink 502 are all made of metal materials with good heat dissipation effect. The heat sink 502 has a large surface area, and the heat sink 503 can increase the surface area of ​​the heat sink 502. The heat sink 502 can dissipate heat quickly, so that the chip can dissipate heat better.

[0031] A positioning block 2 is installed at the top of the base plate 4, and a chip body 1 is installed at the top of the positioning block 2.

[0032] A laser chip 6 is mounted on the top of the chip body 1, a locking block is provided at the bottom of the laser chip 6, and a locking slot is provided at the top of the chip body 1. The laser chip 6 and the chip body 1 form a locking structure.

[0033] The laser chip 6 has a disassembly and assembly structure 10 installed on both sides and both ends. The disassembly and assembly structure 10 includes a baffle 1001, a rotating shaft 1002 and a buckle 1003. The baffle 1001 is installed on the top of the chip body 1. The rotating shaft 1002 is installed on the inner side of the baffle 1001 and the buckle 1003 is installed on the top of the rotating shaft 1002.

[0034] See attached document Figure 1-2 and attached Figure 4As shown, the laser chip 6 and the chip body 1 form a snap-fit ​​structure. After the laser chip 6 is snapped into the chip body 1, the rotating shaft 1002 on the inner side of the baffle 1001 can rotate. The rotation of the rotating shaft 1002 can drive the buckle 1003 to rotate. The buckle 1003 is snapped into the top of the laser chip 6, which can fix the laser chip 6 and prevent the laser chip 6 from falling off during use.

[0035] A movable block 7 is installed at the top of the plate 3, and mounting plates 8 are installed on both sides of the movable block 7. A mounting screw 9 passes through the middle of the mounting plate 8, and a positioning structure 11 is installed at the top of the movable block 7.

[0036] The positioning structure 11 includes a fixing plate 1101, a positioning plate 1102, a scale 1103, a threaded rod 1104, and a guide rod 1105. The fixing plate 1101 is installed on the top of the plate body 3. The threaded rod 1104 passes through the top of the fixing plate 1101. External threads are evenly arranged on the outer side wall of the threaded rod 1104. Internal threads that cooperate with the external threads are evenly arranged on the inner side wall of the fixing plate 1101. The threaded rod 1104 and the fixing plate 1101 are threadedly connected.

[0037] A positioning plate 1102 is installed at the bottom end of the threaded rod 1104. The bottom end of the positioning plate 1102 is provided with a scale 1103. Guide rods 1105 are installed on both sides of the top of the positioning plate 1102.

[0038] See attached document Figure 1-2 and attached Figure 5 As shown, the movable block 7 can slide at the top of the plate 3. Moving the movable block 7 can adjust the position of the fixed plate 1101. Adjusting the position of the fixed plate 1101 can adjust the position of the positioning plate 1102. The mounting plate 8 and the mounting screw 9 form a threaded connection. Tightening the mounting screw 9 can fix the movable block 7. The threaded rod 1104 and the fixed plate 1101 form a threaded connection. Tightening the threaded rod 1104 can drive the threaded rod 1104 to rise and fall. The rise and fall of the threaded rod 1104 can adjust the height of the positioning plate 1102, allowing the positioning plate 1102 to adapt to different situations and making it easier to align. The guide rod 1105 passes through the fixed plate 1101, which can prevent the fixed plate 1101 from shifting. The scale 1103 can make the positioning more stable and accurate.

[0039] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An optocoupler alignment device, comprising a base plate (4); Its features are: The top of the base plate (4) is equipped with a plate body (3), the top of the base plate (4) is equipped with a positioning block (2), and the top of the positioning block (2) is equipped with a chip body (1). A laser chip (6) is installed at the top of the chip body (1), and a disassembly and assembly structure (10) is installed on both sides and both ends of the laser chip (6). A movable block (7) is installed at the top of the board body (3), and an mounting plate (8) is installed on both sides of the movable block (7). A mounting screw (9) passes through the middle of the mounting plate (8), and a positioning structure (11) is installed at the top of the movable block (7). The positioning structure (11) includes a fixing plate (1101), a positioning plate (1102), a scale (1103), a threaded rod (1104), and a guide rod (1105). The fixing plate (1101) is installed on the top of the plate body (3).

2. The photoelectric coupling alignment device according to claim 1, characterized in that: The bottom end of the plate (3) is equipped with a heat dissipation structure (5), and the heat dissipation structure (5) includes a connecting plate (501), a heat sink (502) and a heat dissipation groove (503). The connecting plate (501) is installed at the bottom end of the plate (3), and the heat sink (502) is installed at the bottom end of the connecting plate (501).

3. The photoelectric coupling alignment device according to claim 2, characterized in that: Both ends of the heat sink (502) are provided with heat dissipation grooves (503), and the heat sink (502) is arranged at equal intervals at the bottom end of the connecting plate (501).

4. The photoelectric coupling alignment device according to claim 1, characterized in that: The laser chip (6) has a locking block at its bottom and a locking slot at its top. The laser chip (6) and the chip body (1) form a locking structure.

5. The photoelectric coupling alignment device according to claim 1, characterized in that: The disassembly and assembly structure (10) includes a baffle (1001), a rotating shaft (1002), and a buckle (1003). The baffle (1001) is installed on the top of the chip body (1). The rotating shaft (1002) is installed on the inner side of the baffle (1001), and the buckle (1003) is installed on the top of the rotating shaft (1002).

6. The photoelectric coupling alignment device according to claim 1, characterized in that: The top end of the fixing plate (1101) is through a threaded rod (1104), and the bottom end of the threaded rod (1104) is equipped with a positioning plate (1102). The bottom end of the positioning plate (1102) is provided with a scale (1103), and guide rods (1105) are installed on both sides of the top end of the positioning plate (1102).

7. The photoelectric coupling alignment device according to claim 1, characterized in that: The threaded rod (1104) has external threads uniformly arranged on its outer side wall, and the fixing plate (1101) has internal threads uniformly arranged on its inner side wall that cooperate with the external threads. The threaded rod (1104) and the fixing plate (1101) are threadedly connected.