Pressing module and electronic equipment

Abstract

The utility model provides a pressing module and an electronic device to reduce manufacturing cost and replacement cost on the basis of achieving touch pressing, the pressing module comprises a first circuit board used for being installed on the inner side of a shell of the electronic device; the pressing piece is used for being embedded in the shell and protruding out of the shell; the first bonding piece is connected between the first circuit board and the pressing piece so as to fix the pressing piece and the first circuit board; the supporting piece is arranged on the side, away from the first bonding piece, of the first circuit board and is used for being installed in the shell; the switch piece is arranged on the side, facing the first circuit board, of the supporting piece and electrically connected with the first circuit board, and the switch piece and the first circuit board can form a conductive loop; the second circuit board is used for being installed on the inner side of the shell and arranged on the side, away from the first circuit board, of the supporting piece, and the second circuit board is electrically connected with the first circuit board; and the pressure sensing piece is arranged on the side, away from the supporting piece, of the second circuit board, electrically connected with the second circuit board and used for sensing the deformation amount of the second circuit board.

Description

TECHNICAL FIELD

[0001] The utility model relates to electronic equipment technical field, concretely relates to a press moulding and electronic equipment. BACKGROUND

[0002] For the existing electronic equipment, press the button in the electronic equipment, can make the electronic equipment realize the corresponding function, for example: video recording, taking a photograph, focusing, unlocking screen etc. At present, the button in the electronic equipment is fixed on other components in the electronic equipment through the welding mode, and the process cost is high and the replacement cost is big. SUMMARY

[0003] In view of the above, it is necessary to provide a press moulding and electronic equipment to reduce manufacturing cost and replacement cost on the basis of realizing touch pressing.

[0004] The utility model embodiment provides a press moulding, it includes:

[0005] First circuit board, for installing in the inner side of the shell of electronic equipment;

[0006] Pressing piece, for embedding in the shell, and part of the pressing piece protrudes the shell;

[0007] First adhesive, between the first circuit board and the pressing piece, to fix the pressing piece and the first circuit board;

[0008] Supporting piece, set up in the side of the first circuit board away from the first adhesive, and for installing in the shell;

[0009] Switch piece, set up in the side of the supporting piece towards the first circuit board and with the first circuit board electric connection;

[0010] Second circuit board, for installing in the inner side of the shell, and set up in the side of the supporting piece away from the first circuit board, and the second circuit board with the first circuit board electric connection;

[0011] Pressure sensing piece, set up in the side of the second circuit board away from the supporting piece and with the second circuit board electric connection, for sensing the deformation of the second circuit board;

[0012] Among them, when the pressing piece is pressed, the first circuit board, the switch piece, the supporting piece, the second circuit board and the pressure sensing piece are pushed in turn, to make the switch piece and the first circuit board form the conductive loop.

[0013] The press component and the first circuit board are connected through the first adhesive, which can reduce the assembly difficulty of the press module, thereby reducing the manufacturing cost of the press module. In addition, when the press component is pressed, the first circuit board, the switch component, the support component, the second circuit board and the pressure sensing component are sequentially pushed, the switch component and the first circuit board form a conductive loop to form a tactile feedback, and the pressure sensing component and the second circuit board are electrically connected to form a pressure feedback, so that the press module realizes the touch pressing function.

[0014] In some embodiments, the surface of the press component facing the first circuit board and the surface of the first circuit board facing the press component are shaped to match each other, and the projection area of the first adhesive on the press component in the direction from the first circuit board to the press component is smaller than the area of the surface of the press component facing the first circuit board.

[0015] Therefore, the projection area of the first adhesive on the press component in the direction from the first circuit board to the press component is smaller than the area of the surface of the press component facing the first circuit board, so that a gap is formed between the first adhesive and the periphery of the press component, thereby preventing the first adhesive from overflowing from the periphery of the press component during curing and extrusion, and improving the appearance quality of the press module after being installed on the electronic device.

[0016] In some embodiments, the support component comprises:

[0017] a main body carrying the switch component and configured to be installed in the housing;

[0018] two support bodies respectively connected to opposite ends of the main body and configured to support the first circuit board.

[0019] Therefore, the two support bodies are respectively connected to opposite ends of the main body, so that the support component has a substantially U-shaped structure, and the two support bodies can support the first circuit board respectively, thereby reducing the pressure of the first circuit board on the switch component and improving the service life of the switch component.

[0020] In some embodiments, the pressure sensing component comprises at least one of ink and piezoelectric ceramic.

[0021] Therefore, the sensitivity of ink and piezoelectric ceramic is higher than that of other pressure sensing components, which is conducive to improving the sensing accuracy of the pressure sensing component.

[0022] In some embodiments, the pressure sensing component comprises at least one of ink and piezoelectric ceramic.

[0023] Therefore, the two pressure sensing members correspond to the two ends of the support member in the direction in which the second circuit board points to the first circuit board, so that the sensing accuracy of the pressure sensing module can be improved.

[0024] In some embodiments, the pressure sensing module further comprises:

[0025] An elastic member is arranged on the inner side of the housing and between the second circuit board and the support member, and the elastic member elastically supports the support member.

[0026] Therefore, the elastic member can elastically support the support member, so as to avoid damage of the support member caused by excessive force, and the service life of the support member can be improved.

[0027] In some embodiments, the elastic member comprises:

[0028] An elastic body is arranged between the second circuit board and the support member.

[0029] Two mounting bodies are respectively connected to the two ends of the elastic body, and the two mounting bodies are respectively used for detachably connecting the housing, and each mounting body is bent and extended from the end of the elastic body.

[0030] The shape of the region of the second circuit board corresponding to the elastic member is matched with the shape of the elastic member.

[0031] Therefore, the two mounting bodies and the elastic body make the elastic member have a U-shaped structure, and the shape of the region of the second circuit board corresponding to the elastic member is matched with the shape of the elastic member, so that the pressure sensing module can be miniaturized.

[0032] In some embodiments, the pressure sensing module further comprises:

[0033] A second adhesive member is connected between the support member and the elastic body, so as to fix the elastic member and the support member.

[0034] Therefore, the elastic member and the support member are fixed by the second adhesive member, so that the assembly difficulty of the pressure sensing module can be reduced, the manufacturing cost of the pressure sensing module can be reduced, and the separation difficulty of the elastic member and the support member can be reduced, so that the replacement cost of the elastic member and the support member can be reduced.

[0035] In some embodiments, the pressure sensing module further comprises:

[0036] A third adhesive member is connected between the second circuit board and the elastic body, so as to fix the elastic member and the second circuit board.

[0037] Therefore, the elastic member and the second circuit board are fixed by the third adhesive, so that the assembly difficulty of the pressing module is reduced, the manufacturing cost of the pressing module is reduced, the separation difficulty of the elastic member and the second circuit board is reduced, and the replacement cost of the elastic member and the second circuit board is reduced.

[0038] The utility model embodiment further provides an electronic equipment, including:

[0039] The shell;

[0040] The pressing module, the first circuit board is installed on the inner side of the shell, the pressing member is embedded in the shell, and part of the pressing member protrudes from the shell.

[0041] In the pressing module of the electronic equipment, the pressing member for starting the function of the electronic equipment is connected with the first circuit board through the first adhesive, so that the assembly difficulty of the pressing module is reduced, the manufacturing cost of the electronic equipment is reduced, the separation difficulty of the pressing member and the first circuit board is reduced, and the maintenance cost of the electronic equipment is reduced. In addition, when the pressing member in the electronic equipment is pressed, the first circuit board, the switch member, the supporting member, the second circuit board and the pressure sensing member are sequentially pushed, the switch member and the first circuit board form a conductive loop to form a tactile feedback, and the pressure sensing member is electrically connected with the second circuit board to form a pressure feedback, so that the touch pressing function of the electronic equipment is realized. BRIEF DESCRIPTION OF DRAWINGS

[0042] Figure 1 It is a structure schematic view of the pressing module of the utility model embodiment.

[0043] Figure 2 It is Figure 1 It is an exploded schematic view of the pressing module.

[0044] Figure 3 It is a structure schematic view of the electronic equipment of the utility model embodiment.

[0045] Main element symbol explanation: pressing module 100, first circuit board 110, pressing member 120, first adhesive 130, supporting member 140, main body 141, support body 142, switch member 150, second circuit board 160, pressure sensing member 170, elastic member 180, elastic body 181, mounting body 182, second adhesive 190, third adhesive 191, electronic equipment 1000, shell 200. DETAILED DESCRIPTION

[0046] The embodiments of the present application will be described in detail below, examples of which are shown in the drawings, wherein the same or similar notations represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by reference to the drawings are exemplary only, and are merely intended to explain the present application, and are not to be understood as limiting the present application.

[0047] In the description of the present application, it should be noted that unless specifically defined and limited otherwise, the term "connection" should be interpreted broadly, for example, it can be fixed connection, or detachable connection, or integrally connected; it can be mechanical connection, or electrical connection or can communicate with each other; it can be directly connected, or indirectly connected through an intermediate medium, or the internal communication of two elements or the interaction relationship between two elements. In the description of the present application, it should be noted that the meaning of "multiple" is two or more than two, unless otherwise specifically limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0048] The embodiments of the present application will be described in detail below, examples of which are shown in the drawings, wherein the same or similar notations represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by reference to the drawings are exemplary only, and are merely intended to explain the present application, and are not to be understood as limiting the present application.

[0049] Please refer to Figure 1 and Figure 2 The embodiment of the present application provides a kind of pressing module 100, including first circuit board 110, pressing piece 120, first adhesive 130, support piece 140, switch piece 150, second circuit board 160 and pressure sensing piece 170.First circuit board 110 is used to be installed in the inner side of the shell of electronic equipment, pressing piece 120 is used to be embedded in the shell, and part of pressing piece 120 protrudes from the shell, first adhesive 130 is connected between first circuit board 110 and pressing piece 120, to fix pressing piece 120 and first circuit board 110, support piece 140 is arranged on the side of first circuit board 110 away from first adhesive 130, and is used to be installed in the shell, switch piece 150 is arranged on the side of support piece 140 towards first circuit board 110 and is electrically connected with first circuit board 110, second circuit board 160 is used to be installed in the inner side of the shell, and is arranged on the side of support piece 140 away from first circuit board 110, and second circuit board 160 is electrically connected with first circuit board 110, pressure sensing piece 170 is arranged on the side of second circuit board 160 away from support piece 140 and is electrically connected with second circuit board 160, for sensing the deformation amount of second circuit board 160. Wherein, when pressing piece 120 is pressed, first circuit board 110, switch piece 150, support piece 140, second circuit board 160 and pressure sensing piece 170 are sequentially pushed, to make switch piece 150 and first circuit board 110 form conductive loop.

[0050] Exemplarily, the switch piece 150 is a metal spring piece, wherein the switch piece 150 is located on the conductive area of the first circuit board 110, when the switch piece 150 is pushed by the first circuit board 110, the center of the switch piece 150 is concave downward to contact the circuit on the first circuit board 110, so that the switch piece 150 and the first circuit board 110 form a conductive loop, and the flowing current is generated between the first circuit board 110 and the switch piece 150, thereby starting the preset function of the electronic device on which the pressing module 100 is located.

[0051] It should be noted that the first adhesive 130 can be a finished double-sided adhesive, or a solidified glue formed by injection molding.

[0052] In the pressing module 100, the pressing piece 120 for starting the function of the electronic device is connected with the first circuit board 110 through the first adhesive 130, which can reduce the assembly difficulty of the pressing module 100, thereby reducing the manufacturing cost of the pressing module 100, and the pressing piece 120 and the first circuit board 110 are connected through the first adhesive 130, which can reduce the separation difficulty of the pressing piece 120 and the first circuit board 110, thereby reducing the replacement cost of the pressing module 100. In addition, when the pressing piece 120 is pressed, the first circuit board 110, the switch piece 150, the support piece 140, the second circuit board 160 and the pressure sensing piece 170 are sequentially pushed, the switch piece 150 and the first circuit board 110 form a conductive loop to form a tactile feedback, and the pressure sensing piece 170 and the second circuit board 160 are electrically connected to form a pressure feedback, so that the pressing module 100 realizes the touch pressing function.

[0053] In some embodiments, the shape of the surface of the pressing piece 120 facing the first circuit board 110 and the surface of the first circuit board 110 facing the pressing piece 120 is matched, and the projection area of the first adhesive 130 on the pressing piece 120 in the direction of the first circuit board 110 pointing to the pressing piece 120 is smaller than the area of the surface of the pressing piece 120 facing the first circuit board 110.

[0054] Therefore, the projection area of the first adhesive 130 on the pressing piece 120 in the direction of the first circuit board 110 pointing to the pressing piece 120 is smaller than the area of the surface of the pressing piece 120 facing the first circuit board 110, which can form a gap between the first adhesive 130 and the periphery of the pressing piece 120, so as to avoid the overflow of the first adhesive 130 from the periphery of the pressing piece 120 during solidification and extrusion, thereby improving the appearance quality of the pressing module 100 after being installed on the electronic device.

[0055] Please refer to Figure 2In some embodiments, the support 140 comprises a main body 141 and two support bodies 142. The main body 141 carries the switch member 150 and is mounted in the housing, and the two support bodies 142 are respectively connected to opposite ends of the main body 141 and are both used to support the first circuit board 110.

[0056] Therefore, the two support bodies 142 are respectively connected to opposite ends of the main body 141, so that the support 140 is substantially in a U-shaped structure, and the two support bodies 142 both support the first circuit board 110, which can reduce the pressure of the first circuit board 110 on the switch member 150 and is conducive to improving the service life of the switch member 150.

[0057] In the embodiment, the main body 141 and the two support bodies 142 are in an integrated structure, so as to simplify the processing difficulty of the support 140. In addition, each support body 142 is arranged to be inclined relative to the main body 141, and the inclination directions of the two support bodies 142 relative to the main body 141 are opposite, so as to reduce the occupied space of the support 140 and is conducive to the miniaturization of the pressing module 100. Exemplarily, the material of the support 140 can be thermoplastic polyurethane elastomer.

[0058] In some embodiments, the pressure sensing member 170 comprises at least one of ink and piezoelectric ceramic. Wherein, when the ink is stressed, the surface of the ink will be deformed, thereby causing a change in resistance, and when the piezoelectric ceramic is stressed, the surface of the piezoelectric ceramic will be deformed, thereby causing a change in electric charge. The working process and principle of pressure detection by ink and piezoelectric ceramic can be directly obtained from the published documents, and will not be described here.

[0059] Therefore, the sensitivity of the ink and the piezoelectric ceramic is higher than that of other pressure sensing members 170, which is conducive to improving the sensing accuracy of the pressure sensing member 170.

[0060] Please refer to Figure 2 In some embodiments, the pressure sensing member 170 is two, and the two pressure sensing members 170 correspond to the two ends of the support 140 in the direction in which the second circuit board 160 points to the first circuit board 110.

[0061] Therefore, the two pressure sensing members 170 correspond to the two ends of the support 140 in the direction in which the second circuit board 160 points to the first circuit board 110, which can improve the sensing accuracy of the pressing module 100 to the pressure.

[0062] Exemplarily, the pressure sensing member 170 comprises two inks, or comprises two piezoelectric ceramics, or comprises one ink and one piezoelectric ceramic. In order to ensure the sensing accuracy of the pressure sensing member 170 to the pressure, it is preferred that the pressure sensing member 170 comprises two inks or two piezoelectric ceramics.

[0063] Please refer to Figure 2In some embodiments, the pressing module 100 further comprises an elastic member 180. The elastic member 180 is arranged on the inner side of the housing and between the second circuit board 160 and the support member 140, and the elastic member 180 elastically supports the support member 140.

[0064] Therefore, the elastic member 180 can elastically support the support member 140 to avoid damage of the support member 140 caused by excessive force, and facilitate to improve the service life of the support member 140.

[0065] In some embodiments, the elastic member 180 comprises an elastic body 181 and two mounting bodies 182. The elastic body 181 is arranged between the second circuit board 160 and the support member 140, and the two mounting bodies 182 are respectively connected to two ends of the elastic body 181. The two mounting bodies 182 are respectively used for detachably connecting the housing, and each mounting body 182 is bent and extended from the end of the elastic body 181. In this embodiment, the shape of the region of the second circuit board 160 corresponding to the elastic member 180 is matched with the shape of the elastic member 180.

[0066] Therefore, the two mounting bodies 182 and the elastic body 181 make the elastic member 180 have a U-shaped structure, and the shape of the region of the second circuit board 160 corresponding to the elastic member 180 is matched with the shape of the elastic member 180, which facilitates the miniaturization of the pressing module 100.

[0067] In this embodiment, the elastic body 181 and the two mounting bodies 182 are in an integrated structure, which can reduce the processing difficulty of the elastic member 180. For example, the material of the elastic member 180 is steel, and the thickness of the elastic member 180 is thin, and the elastic member 180 has a sheet structure as a whole.

[0068] Please refer to Figure 2 In some embodiments, the pressing module 100 further comprises a second adhesive member 190. The second adhesive member 190 is connected between the support member 140 and the elastic body 181 to fix the elastic member 180 and the support member 140. For example, the second adhesive member 190 is a structural adhesive.

[0069] Therefore, the second adhesive member 190 can fix the elastic member 180 and the support member 140, which can reduce the assembly difficulty of the pressing module 100, facilitate to reduce the manufacturing cost of the pressing module 100, and can reduce the separation difficulty of the elastic member 180 and the support member 140, thereby facilitating to reduce the replacement cost of the elastic member 180 and the support member 140.

[0070] Please refer to Figure 2In some embodiments, the pressing module 100 further comprises a third adhesive 191. The third adhesive 191 is connected between the second circuit board 160 and the elastic body 181 to fix the elastic member 180 and the second circuit board 160. For example, the third adhesive 191 is a structural adhesive.

[0071] Therefore, fixing the elastic member 180 and the second circuit board 160 by the third adhesive 191 can reduce the assembly difficulty of the pressing module 100, and is conducive to reducing the manufacturing cost of the pressing module 100. In addition, fixing the elastic member 180 and the second circuit board 160 by the third adhesive 191 can reduce the separation difficulty of the elastic member 180 and the second circuit board 160, and is conducive to reducing the replacement cost of the elastic member 180 and the second circuit board 160.

[0072] Please refer to Figure 3 The utility model embodiment further provides an electronic equipment 1000 comprising a shell 200 and the pressing module 100 of the above embodiment. The first circuit board 110 in the above pressing module 100 is installed on the inner side of the shell 200, the pressing member 120 is embedded in the shell 200, and part of the pressing member 120 protrudes from the shell 200. Wherein, the electronic equipment 1000 can be a mobile phone, a tablet computer and the like.

[0073] In the pressing module 100 of the above electronic equipment 1000, the pressing member 120 for starting multiple functions of the electronic equipment 1000 is connected with the first circuit board 110 through the first adhesive 130, which can reduce the assembly difficulty of the pressing module 100, thereby reducing the manufacturing cost of the electronic equipment 1000. In addition, the pressing member 120 is connected with the first circuit board 110 through the first adhesive 130, which can reduce the separation difficulty of the pressing member 120 and the first circuit board 110, thereby reducing the maintenance cost of the electronic equipment 1000. Furthermore, when the pressing member 120 in the electronic equipment 1000 is pressed, the first circuit board 110, the switch member 150, the supporting member 140, the second circuit board 160 and the pressure sensing member 170 are sequentially pushed, the switch member 150 and the first circuit board 110 form a conductive loop to form a tactile feedback, and the pressure sensing member 170 is electrically connected with the second circuit board 160 to form a pressure feedback, thereby realizing the touch pressing function of the electronic equipment 1000.

[0074] It is apparent for those skilled in the art that the present application is not limited to the details of the foregoing exemplary embodiments, and the present application can be implemented in other concrete forms without departing from the spirit or essential characteristics of the present application. Therefore, the embodiments should be considered in all aspects as exemplary and non-restrictive, and the scope of the present application is defined by the appended claims rather than the foregoing description, and all changes falling within the meaning and range of equivalents of the claims are intended to be embraced therein.

[0075] It should be pointed out finally that the above embodiments are only used to illustrate the technical solutions of the present application and are not limiting. Although the present application has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the technical solutions of the present application can be modified or replaced equivalently without departing from the spirit and scope of the technical solutions of the present application.

Claims

1. A pressing module, characterized in that, include: The first circuit board is used to be installed inside the housing of the electronic device; A pressing member is used to be embedded in the housing, and a portion of the pressing member protrudes from the housing; A first adhesive component is connected between the first circuit board and the pressing component to fix the pressing component and the first circuit board. A support member is provided on the side of the first circuit board opposite to the first adhesive member and is used for mounting inside the housing; A switch is disposed on the side of the support member facing the first circuit board and is electrically connected to the first circuit board; The second circuit board is used to be installed inside the housing and is located on the side of the support member opposite to the first circuit board, and the second circuit board is electrically connected to the first circuit board. A pressure sensor is disposed on the side of the second circuit board away from the support member and electrically connected to the second circuit board, for sensing the amount of deformation of the second circuit board; When the pressing member is pressed, the first circuit board, the switching member, the support member, the second circuit board, and the pressure sensing member are pushed in sequence to form a conductive circuit between the switching member and the first circuit board.

2. The pressing module as described in claim 1, characterized in that, The shape of the surface of the pressing member facing the first circuit board and the shape of the surface of the first circuit board facing the pressing member are adapted to each other, and the projected area of ​​the first adhesive member on the pressing member along the direction from the first circuit board to the pressing member is smaller than the area of ​​the surface of the pressing member facing the first circuit board.

3. The pressing module as described in claim 1, characterized in that, The support member includes: The main body supports the switch element and is used for mounting within the housing; Two supports are connected to opposite ends of the main body, and both are used to support the first circuit board.

4. The pressing module as described in claim 1, characterized in that, The pressure sensing element includes at least one of ink and piezoelectric ceramic.

5. The pressing module as described in claim 4, characterized in that, There are two pressure sensors, and the two pressure sensors correspond one-to-one with the two ends of the support member along the direction from the second circuit board to the first circuit board.

6. The pressing module as described in claim 1, characterized in that, The pressing module also includes: An elastic element is installed inside the housing and disposed between the second circuit board and the support member, the elastic element elastically supporting the support member.

7. The pressing module as described in claim 6, characterized in that, The elastic element includes: An elastomer is disposed between the second circuit board and the support member; Two mounting bodies are respectively connected to both ends of the elastic body. The two mounting bodies are used to detachably connect to the housing, and each mounting body extends from the end of the elastic body by bending. The shape of the region of the second circuit board corresponding to the elastic element is adapted to the shape of the elastic element.

8. The pressing module as described in claim 7, characterized in that, The pressing module also includes: The second adhesive element is connected between the support member and the elastomer to fix the elastomer and the support member.

9. The pressing module as described in claim 7, characterized in that, The pressing module also includes: A third adhesive element is connected between the second circuit board and the elastomer to fix the elastomer and the second circuit board.

10. An electronic device, characterized in that, include: case; According to any one of claims 1 to 9, the first circuit board is mounted inside the housing, the pressing member is embedded in the housing, and a portion of the pressing member protrudes from the housing.

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