Wafer bearing device and semiconductor process equipment

Abstract

The utility model provides a wafer bearing device and semiconductor processing equipment, relates to the technical field of semiconductor processing, and aims to solve the problem that sensor measurement signal transmission is susceptible to interference. The wafer bearing device comprises a chuck used for bearing a wafer; the base assembly is arranged below the chuck, and an accommodating space is formed by the base assembly and the chuck; the radio frequency power assembly is arranged in the accommodating space and is used for providing radio frequency power for the chuck; the sensor assembly and the wireless module are arranged in the containing space, the wireless module is used for wirelessly transmitting signals detected by the sensor assembly to the outside of the base, and the working frequency of the wireless module is different from that of the radio frequency power assembly. The wafer bearing device provided by the utility model can prevent the measurement signal transmission of the sensor from being interfered.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor processing, specifically, a wafer bearing device and semiconductor process equipment. BACKGROUND

[0002] In the RF (Radio Frequency, electromagnetic frequency) environment, the conventional transmission line signal faces the problem of low signal-to-noise ratio. In the semiconductor field, data transmission needs to have high reliability, and the reduction of signal-to-noise ratio will cause data to have errors, and in severe cases, the signal line level exceeds the tolerance level, causing equipment disconnection, restart, and crash. In the semiconductor equipment, the position of the high-frequency source such as radio frequency and pulse often needs to collect data such as voltage, current, and temperature. However, these positions are also the places with the most RF radiation interference and conducted interference. In order to solve such problems, the current measurement method is generally: a sensor with a shielded cable and an optical fiber sensor. However, these two solutions cannot meet the needs of all scenarios. SUMMARY

[0003] The first purpose of the utility model is to provide a wafer bearing device to solve the technical problem of easy interference of the existing sensor measurement signal transmission.

[0004] The wafer bearing device provided by the utility model includes a chuck for bearing a wafer, a base assembly arranged below the chuck and forming a containing space with the chuck, a radio frequency power assembly arranged in the containing space for providing radio frequency power to the chuck, a sensor assembly and a wireless module arranged in the containing space, the wireless module being used for wirelessly transmitting signals detected by the sensor assembly to the outside of the base, and the working frequency of the wireless module being different from the working frequency of the radio frequency power assembly.

[0005] In an optional technical solution, the wafer bearing device includes at least one circuit board assembly, a mounting connecting piece, and an electrical connecting piece; the radio frequency power assembly, the sensor assembly, and the wireless module are arranged on the circuit board assembly; the mounting connecting piece is used for fixedly connecting the circuit board assembly in the containing space, and the radio frequency power assembly is used for providing radio frequency power to the chuck through the electrical connecting piece.

[0006] In an optional technical solution, each circuit board assembly includes a first sub-circuit board and a second sub-circuit board, the first sub-circuit board is provided with the radio frequency power assembly, and the second sub-circuit board is provided with the sensor assembly and the wireless module; the wafer bearing device further includes a cooling module, and the cooling module is arranged adjacent to the first sub-circuit board.

[0007] Optionally, the sensor assembly comprises a voltage and current sampling circuit, the voltage and current sampling circuit is connected to the electrical connector via the metal conductor and the first sub-circuit board in sequence.

[0008] Optionally, the radio frequency power assembly comprises a heating element, the cooling module is used for cooling one side of the heating element, and the sensor assembly comprises a first temperature sensor, the first temperature sensor is attached to the other side of the heating element.

[0009] Optionally, the base assembly comprises a base and an interface disc, the base is located on the interface disc, the sensor assembly further comprises a second temperature sensor, the second temperature sensor is arranged on one side of the mounting connector connected with the interface disc, and the second temperature sensor is electrically connected with the first sub-circuit board through a conductive interface.

[0010] Optionally, the base assembly comprises a base and an interface disc, the base is located on the interface disc, the top of the mounting connector is provided with a positioning pin, and the mounting connector is connected with the interface disc through the positioning pin and a fastener.

[0011] Optionally, the wafer carrying device further comprises a micro power supply, the second sub-circuit board is provided with a PIN pin, and the micro power supply is used for supplying power to the sensor assembly and the wireless module through the PIN pin.

[0012] Optionally, the second sub-circuit board is provided with a notch part, and the radio frequency power assembly passes through the notch part.

[0013] The wafer carrying device has the following beneficial effects:

[0014] The sensor assembly is connected with the base assembly outside through the wireless module, so that the data transmission of the sensor to the outside of the base assembly is not interfered by the electromagnetic signal in the cavity in the interference frequency band, the data can be transmitted in real time and completely, and the use of the wireless transmission technology can also reduce the cost of control.

[0015] The second object of the utility model is to provide a semiconductor process equipment to solve the technical problem that the sensor measurement signal transmission is easy to be interfered.

[0016] The semiconductor process equipment provided in the second aspect of the application comprises a process cavity and a wireless controller, and the process cavity is provided with the above wafer carrying device.

[0017] By arranging the above wafer carrying device in the semiconductor process equipment, the semiconductor process equipment has all the advantages of the above wafer carrying device, which will not be described here. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the background art, the drawings needed to be used in the description of the embodiments or the background art will be briefly introduced. Obviously, the drawings in the following description only constitute the embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor on the basis of the provided drawings.

[0019] Figure 1 Schematic diagram of the device for measuring temperature and voltage and current information in the related art 1.

[0020] Figure 2 Schematic diagram of the device for measuring temperature and voltage and current information in the related art 2.

[0021] Figure 3 Circuit schematic diagram of the wafer bearing device provided by the embodiment of the present application.

[0022] Figure 4 Partial structure schematic diagram of the wafer bearing device provided by the embodiment of the present application.

[0023] Figure 5 Front view of Figure 4

[0024] Figure 6 Structure schematic diagram of the circuit board assembly in the wafer bearing device provided by the embodiment of the present application.

[0025] Figure 7 Circuit schematic diagram in another implementation of the wafer bearing device provided by the embodiment of the present application.

[0026] Figure 8 Circuit module schematic diagram of the wafer bearing device provided by the embodiment of the present application.

[0027] Figure 9 Three-dimensional exploded view of the circuit board assembly in the wafer bearing device provided by the embodiment of the present application.

[0028] Explanation of reference signs:

[0029] 101-thermocouple thermometer; 102-voltage and current sampling circuit; 103-optical fiber;

[0030] ​200 - circuit board assembly; 210 - first sub-circuit board; 211 - radio frequency power assembly; 212 - wireless communication module; 2121 - reset download circuit; 2122 - USB to serial circuit; 2123 - sensor filtering circuit; 2124 - wireless WiFi chip; 213 - metal conductor; 214 - electrical connector; 220 - second sub-circuit board; 221 - voltage and current sampling circuit; 222 - first temperature sensor;

[0031] 231 - mounting connector; 232 - cooling module; 233 - positioning pin; 234 - second temperature sensor;

[0032] 240 - temperature sensor assembly;

[0033] 251 - controller power supply; 252 - micro power supply;

[0034] 260 - wireless module;

[0035] 300 - wireless controller;

[0036] 410 - base assembly; 411 - base; 412 - interface disc; 420 - chuck. DETAILED DESCRIPTION

[0037] Figure 1 A schematic diagram of a device for measuring temperature and voltage and current information in related art one; as shown in Figure 1 in related art one, a thermocouple thermometer 101 is used to measure temperature, a voltage and current sampling circuit 102 is used to measure voltage and current, and data is sent to the processing end through shielded transmission lines, optical coupling isolation and transformer isolation.

[0038] In related art one, because the thermocouple thermometer 101 and the voltage and current sampling circuit 102 are in an RF environment, the sensor itself and the transmission line are very susceptible to interference, resulting in data transmission failure. Even if the transmission line with a shielding layer blocks the radiation interference, the conduction interference introduced at the sensor end will also cause data transmission failure. And the transmission mode of optical coupling isolation and transformer isolation will also have a large gap between the expected isolation capacity and the actual isolation capacity due to the inherent parasitic capacitance.

[0039] Figure 2 A schematic diagram of a device for measuring temperature and voltage and current information in related art two; as shown in Figure 2 in related art two, an optical fiber 103 is used to measure temperature, and the voltage and current sampling circuit 102 also sends data to the processing end through the optical fiber 103 after measuring voltage and current.

[0040] Related technology two requires less space for temperature measurement and is easy to set up, but its controller is expensive. Measuring current and voltage requires converting electrical signals to optical signals, which necessitates additional power cables. These power cables can introduce transmitted interference, are bulky, and are not easy to install and maintain in confined spaces.

[0041] To make the above-mentioned objectives, features, and advantages of this utility model more apparent and understandable, specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are merely illustrative of this utility model and are not intended to limit it.

[0042] Example 1:

[0043] Figure 3 A circuit diagram of the wafer carrier device provided in an embodiment of this utility model; Figure 4 A partial structural schematic diagram of the wafer carrier device provided in an embodiment of this utility model; Figure 5 for Figure 4 The front view; Figure 6 This is a schematic diagram of the circuit board assembly in the wafer carrier device provided in an embodiment of the present invention; as shown. Figure 3 to Figure 6 As shown, the wafer carrier device provided in Embodiment 1 of this utility model includes a chuck 420, a base assembly 410, an RF power assembly 211, a sensor assembly, and a wireless module 260. The base assembly 410 may include a base 411 and an interface disk 412. The chuck 420 is used to carry the wafer; the base assembly 410 is disposed below the chuck 420 and forms an accommodating space with the chuck 420; the RF power assembly 211 is disposed within the accommodating space and is used to provide RF power to the chuck 420; the sensor assembly and the wireless module 260 are disposed within the accommodating space, and the wireless module 260 is used to wirelessly transmit the signals detected by the sensor assembly to the outside of the base 411. The operating frequency of the wireless module 260 is different from the operating frequency of the RF power assembly 211.

[0044] By wirelessly connecting the sensor assembly to the base assembly 410 via the wireless module 260, the data transmission from the sensor to the outside of the base assembly 410 is no longer affected by the interference of electromagnetic signals in the chamber on the interference frequency band. The data can be transmitted in real time and completely. Moreover, the use of wireless transmission technology can also reduce the cost of control.

[0045] Specifically, in the embodiment, the wireless module 260 avoids the working frequency band of the chamber, which is 400KHz, 2MHz, 13.56MHz, 10MHz, 20MHz, 30MHz, 40MHz, 50MHz, 60MHz, 70MHz, 80MHz, 90MHz, 100MHz, by using the frequency band of the wireless controller 300 located outside the base assembly 410. The frequency band of the wireless transmission channel in the embodiment is 2.4GHz, which is far away from the working frequency band of the chamber, so that the signal transmission will not be disturbed by the working frequency band of the chamber. In addition, the wireless controller 300 can read data such as voltage, current and temperature in real time. The refresh speed of the data can be conveniently set in the software program. The wireless controller 300 is electrically connected to the controller power supply 251.

[0046] In the embodiment, the chuck 420 can be an electrostatic chuck, which is arranged on the top of the base 411. The radio frequency power assembly 211 provides radio frequency power to the chuck 420 to generate a bias voltage to control ion energy.

[0047] Figure 7 A circuit schematic diagram of another implementation mode of the wafer bearing device provided by the embodiment of the utility model is shown in FIG. 4, and a circuit schematic diagram of another implementation mode of the wafer bearing device provided by the embodiment of the utility model is shown in FIG. 5. Figure 7 In addition, the wireless communication transmission is used, and it is very easy to expand the measurement channel. In theory, a single wireless controller 300 can connect multiple wireless modules 260, for example, 254 wireless modules 260, through a wireless channel to realize simultaneous measurement of 254 channels of temperature, voltage and current. When the channel is increased, the wireless controller 300 does not need to be changed in hardware, and only the number of wireless modules 260 needs to be increased, which has great advantages compared with optical fiber measurement and transmission line measurement.

[0048] Figure 9 A perspective exploded view of the circuit board assembly in the wafer bearing device provided by the embodiment of the utility model is shown in FIG. 6, and a perspective view of the circuit board assembly in the wafer bearing device provided by the embodiment of the utility model is shown in FIG. 7. Figure 6 and Figure 9 As shown in FIG. 6 and FIG. 7, the wafer bearing device comprises a circuit board assembly 200, a mounting connecting piece 231 and an electrical connecting piece 214. The circuit board assembly 200 is provided with a radio frequency power assembly 211, a sensor assembly and a wireless module 260. The mounting connecting piece 231 is used for fixedly connecting the circuit board assembly 200 to the inner surface of the accommodating space. The radio frequency power assembly 211 is used for providing radio frequency power to the chuck 420 through the electrical connecting piece 214.

[0049] The base assembly 410 comprises a base 411 and an interface disc 412.

[0050] In the embodiment, the mounting connector 231 is in an inverted L shape, and comprises a top plate portion at the top and a side plate portion below the top plate portion.

[0051] Figure 8 A circuit module schematic diagram of the wafer carrying device is provided in the embodiment of the utility model. Figure 8 And Figure 9 As shown in the drawings, each circuit board assembly 200 comprises a first sub-circuit board 210 and a second sub-circuit board 220, the first sub-circuit board 210 is provided with a radio frequency power assembly 211, and the second sub-circuit board 220 is provided with a sensor assembly and a wireless module 260; the wafer carrying device further comprises a cooling module 232, and the cooling module 232 is arranged close to the first sub-circuit board 210.

[0052] The first sub-circuit board 210 is fixedly installed on the side plate portion of the mounting connector 231 through a male threaded connector such as a screw or a bolt, and the first sub-circuit board 210 and the second sub-circuit board 220 are arranged in parallel and spaced apart, and are fixedly connected through a screw. Specifically, in the embodiment, the sensor assembly and the wireless communication module 212 are arranged on the side of the first sub-circuit board 210 away from the mounting connector 231.

[0053] The radio frequency power assembly 211 is arranged on the first sub-circuit board 210, and the sensor assembly and the wireless module 260 are arranged on the second sub-circuit board 220, so that the strong current elements and the weak current elements can be separated, the first sub-circuit board 210 mainly arranges power elements, and the second sub-circuit board 220 mainly arranges weak current elements, so that the second sub-circuit board 220 on which the sensor assembly and the wireless module 260 are arranged is prevented from flowing through a large current, and the safety of the second sub-circuit board 220 is improved. The cooling module 232 is arranged close to the first sub-circuit board 210, so that after heat generated by the heating elements in the radio frequency power assembly 211 is transferred to the first sub-circuit board 210, the first sub-circuit board 210 is rapidly cooled by the cooling module 232, and the temperature of the devices on the first sub-circuit board 210 is prevented from being too high to affect the service life. In the radio frequency power assembly 211, there are usually elements with a large amount of heat, such as rectifiers, capacitors, transformers or chip elements, and these elements belong to heating elements.

[0054] In the embodiment, the cooling module 232 is arranged at the lower end of the mounting connector 231.

[0055] Figure 8The circuit module schematic view of the wafer bearing device is provided for the embodiment of the utility model, as shown in the figure, Figure 8 Optionally, the wireless module 260 comprises a wireless communication module 212, the wireless communication module 212 comprises a reset download circuit 2121, a USB-to-serial port circuit 2122 and a sensor filtering circuit 2123, the reset download circuit 2121 is electrically connected with the wireless communication module 212, the USB-to-serial port circuit 2122 is electrically connected with the reset download circuit 2121 and the sensor filtering circuit 2123, and the sensor filtering circuit 2123 is electrically connected with the sensor assembly.

[0056] The wireless communication module 212 further comprises a wireless WiFi chip 2124, for example, an ESP8266 wireless WiFi chip, which realizes rapid networking of multiple blocks when applied, so that a special protocol is designed on the basis of the MESH gateway to distinguish the module serial number, temperature, current and voltage signal values. The wireless communication module 212 is installed on the second sub-circuit board 220.

[0057] The circuit in the wireless communication module 212 can effectively filter the signals of the sensor assembly, eliminate noise to ensure the accuracy of signal transmission, and convert the signals into wireless signals to be transmitted to the wireless controller 300.

[0058] As shown in the figure, Figure 6 and Figure 9 Optionally, the sensor assembly comprises a voltage and current sampling circuit 221, which is connected to the electrical connector 214 through the first sub-circuit board 210 and the metal conductor 213 in sequence.

[0059] In this embodiment, the electrical connector 214 can be a voltage and current measurement plug. The voltage and current signals can be connected to the position of the metal via pad near the voltage and current sampling circuit 221 through the voltage and current measurement plug, the first sub-circuit board 210 and the metal conductor 213. Specifically, in this embodiment, the metal conductor 213 can be made of copper sheet. Since the flow of electric charge is mainly concentrated on the surface of the conductor, as long as the surface area of the conductor is large, it can have good current transmission capacity.

[0060] The voltage and current sampling circuit 221 can detect the current and voltage signals during the processing of the semiconductor process equipment. Since the detected voltage and current signals are the signals that cause interference, the detection of current and voltage is not disturbed. Moreover, the external voltage and current signals can be introduced through the electrical connector 214 and the metal conductor 213.

[0061] As shown in the figure, Figure 6 and Figure 9 Optionally, the second sub-circuit board 220 is provided with a notch portion, and the radio frequency power assembly 211 passes through the notch portion.

[0062] Specifically, the upper part and the lower part of the second sub-circuit board 220 are provided with notch portions at the middle part in the respective width directions, and the end portions of the substantial parts of the second sub-circuit board 220 on both sides of the notch portions are fixed to the first sub-circuit board 210 by male threaded connectors such as screws or bolts.

[0063] Since the electronic elements of the radio frequency power assembly 211 are large in volume and tend to generate a large amount of heat power, the notch portions are provided on the second sub-circuit board 220 for the radio frequency power assembly 211 to pass through, and compared with the scheme that the radio frequency power assembly 211 is located between the first sub-circuit board 210 and the second sub-circuit board 220, the overall thickness of the circuit board assembly 200 after the electronic elements are arranged can be reduced, which is conducive to saving the space in the wafer carrier device and improving the heat dissipation performance of the radio frequency power assembly 211.

[0064] As shown in Figure 6 and Figure 9 Optionally, the radio frequency power assembly 211 includes a heat generating element, and the cooling module 232 is configured to cool one side surface of the heat generating element; the sensor assembly includes a temperature sensor assembly 240; and the temperature sensor assembly 240 includes a first temperature sensor 222.

[0065] In the embodiment, the temperature sensor can be a high-precision single-bus digital temperature sensor, which has a measurement range of -40℃ to 150℃ and an accuracy of 0.1℃. The sensor has low cost and good consistency, and does not need to be calibrated or have an additional analog driving circuit. The first temperature sensor 222 is in contact with the radio frequency power assembly 211 through the heat-conducting potting glue. By arranging the heat-conducting potting glue to contact the radio frequency power assembly 211, the heat can be continuously transferred from the radio frequency power assembly 211 to the first temperature sensor 222, thereby ensuring the effectiveness of heat transfer and improving the measurement accuracy.

[0066] As shown in Figure 6 and Figure 9 Optionally, the base assembly 410 includes a base 411 and an interface disc 412, and the temperature sensor assembly 240 further includes a second temperature sensor 234, which is arranged on one side surface of the mounting connector 231 connected to the interface disc 412 and is electrically connected to the first sub-circuit board 210 through a conductive interface (not shown in the figure).

[0067] Specifically, the second temperature sensor 234 is arranged on the upper surface of the top plate portion of the mounting connector 231 so as to be in contact with the interface disc 412. The wireless communication module 212 can be provided with a differential isolation interface, and is connected to the second temperature sensor 234 through the differential isolation interface to send a temperature query instruction and receive a temperature query result.

[0068] By setting the second temperature sensor 234 on the side of the mounting connector 231 connected to the interface plate 412, the second temperature sensor 234 can be made to closely adhere to and fully contact the lower surface of the interface plate 412 by using the components that fix the mounting connector 231 to the interface plate 412, so that the second temperature sensor 234 can more accurately measure the temperature of the interface plate 412, and the accuracy of the measurement of the second temperature sensor 234 is improved.

[0069] As shown in Figure 6 and Figure 9 Optionally, the top of the mounting connector 231 is provided with a positioning pin 233, and the mounting connector 231 is connected to the interface plate 412 through the positioning pin 233 and a fastener (not shown in the figure).

[0070] In the top plate portion of the mounting connector 231, four through holes are arranged in a rectangular distribution, and a male threaded connector such as a screw or a bolt can be passed through each through hole as a fastener to be connected to the threaded hole of the interface plate 412. Between the four through holes, a positioning pin 233 can be arranged to be connected to the positioning hole of the interface plate 412.

[0071] By setting the positioning pin 233 and the fastener to connect the mounting connector 231 to the interface plate 412, the positioning pin 233 can be used to ensure the positional accuracy between the two, and the fastener can be used to ensure the reliability of the connection.

[0072] Optionally, the wafer carrying device further comprises a micro power supply 252, which is arranged in the accommodation space; the second sub-circuit board 220 is provided with a PIN pin (not shown in the figure), and the micro power supply 252 is used to supply power to the sensor assembly and the wireless module 260 through the PIN pin.

[0073] Specifically, the wireless module 260 in the embodiment can be powered by a 5V micro power supply 252, and is electrically connected to the first sub-circuit board 210 through the PIN pin.

[0074] By setting the PIN pin to connect the micro power supply 252, the power supply of the wireless module 260 can be ensured to maintain the stable operation of the sensor assembly and the corresponding circuit.

[0075] Embodiment Two:

[0076] As shown in Figure 3 Embodiment Two further provides a semiconductor process equipment, which comprises a process chamber and a wireless controller 300, and the process chamber is provided with the above-mentioned wafer carrying device.

[0077] The wireless controller 300 is located outside the base assembly 410 and can communicate wirelessly with the wireless module 260 inside the base assembly 410 to collect temperature information collected by the temperature sensor assembly 240 and voltage and / or current information collected by the voltage and current sampling circuit 102. In particular, the frequency band of the wireless transmission channel between the wireless controller 300 and the wireless module 260 is different from the operating frequency of the radio frequency power assembly 211.

[0078] By providing the wafer carrier device in the semiconductor process equipment, the semiconductor process equipment has all the advantages of the wafer carrier device, which will not be repeated here.

[0079] Although the utility model discloses as above, the utility model is not limited to this. Any person skilled in the art, without departing from the spirit and scope of the utility model, can make various changes and modifications, therefore the protection scope of the utility model should be limited to the range defined by the claims.

[0080] Finally, it should also be noted that in this document, relational terms such as first and second and the like can merely be used to distinguish one entity or action from another, without necessarily requiring or implying that these entities or actions are in any way mutually exclusive or directional. Moreover, the terms "comprising" or any other variant thereof are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can also include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element preceded by "comprises a" does not, without more constraints, foreclose the existence of additional identical elements in the process, method, article, or apparatus that comprises the recited element.

[0081] In the above embodiments, the description of the orientation such as "upper", "lower" and the like is based on the drawings.

[0082] The above description of disclosed embodiments allows a person skilled in the art to implement or use the utility model. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the utility model.

[0083] Therefore, the utility model will not be limited to these embodiments shown in the text, but will conform to the widest range consistent with the principles and novel features disclosed in the text.

Claims

1. A wafer carrier device, characterized in that, include: A chuck (420) is used to carry wafers; The base assembly (410) is disposed below the chuck (420) and forms an accommodating space with the chuck (420); A radio frequency power component (211) is disposed within the accommodating space for providing radio frequency power to the chuck (420); A sensor assembly and a wireless module (260) are disposed within the accommodating space. The wireless module (260) is used to wirelessly transmit the signal detected by the sensor assembly to the outside of the base assembly (410). The operating frequency of the wireless module (260) is different from the operating frequency of the radio frequency power assembly (211).

2. The wafer carrier device according to claim 1, characterized in that, The wafer carrier device further includes at least one circuit board assembly (200), a mounting connector (231), and an electrical connector (214). The circuit board assembly (200) is provided with the radio frequency power component (211), the sensor component, and the wireless module (260). The mounting connector (231) is used to fix the circuit board assembly (200) in the accommodating space, and the radio frequency power assembly (211) is used to provide radio frequency power to the chuck (420) through the electrical connector (214).

3. The wafer carrier device according to claim 2, characterized in that, Each of the circuit board assemblies (200) includes a first sub-circuit board (210) and a second sub-circuit board (220). The first sub-circuit board (210) is provided with the radio frequency power component (211), and the second sub-circuit board (220) is provided with the sensor component and the wireless module (260). The wafer carrier further includes a cooling module (232), which is disposed adjacent to the first sub-circuit board (210).

4. The wafer carrier device according to claim 3, characterized in that, The sensor assembly includes a voltage and current sampling circuit (221), which is connected to the electrical connector (214) via a metal conductor (213) and the first sub-circuit board (210).

5. The wafer carrier device according to claim 3, characterized in that, The radio frequency power component (211) includes a heating element, and the cooling module (232) is used to cool one side of the heating element; the sensor component includes a first temperature sensor (222), which is attached to the other side of the heating element.

6. The wafer carrier device according to claim 3, characterized in that, The base assembly (410) includes a base (411) and an interface disk (412). The base (411) is located on the interface disk (412). The sensor assembly also includes a second temperature sensor (234). The second temperature sensor (234) is disposed on the side of the mounting connector (231) connected to the interface disk (412) and is electrically connected to the first sub-circuit board (210) through a conductive interface.

7. The wafer carrier device according to claim 2, characterized in that, The base assembly (410) includes a base (411) and an interface disk (412). The base (411) is located on the interface disk (412). The top of the mounting connector (231) is provided with a positioning pin (233). The mounting connector (231) is connected to the interface disk (412) through the positioning pin (233) and fasteners.

8. The wafer carrier device according to any one of claims 3-6, characterized in that, The wafer carrier also includes a micro power supply (252), and the second sub-circuit board (220) is provided with a PIN pin. The micro power supply (252) is used to supply power to the sensor assembly and the wireless module (260) through the PIN pin.

9. The wafer carrier device according to any one of claims 3-6, characterized in that, The second sub-circuit board (220) has a notch; the radio frequency power component (211) passes through the notch.

10. A semiconductor process apparatus, characterized in that: It includes a process chamber and a wireless controller (300), wherein the process chamber is provided with a wafer carrier device according to any one of claims 1-9.

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