Receiving module and electronic device
By employing a dual-chip structure and filter support components in the lidar receiver module, the problem of small detection range of the receiver module is solved, enabling wider detection range and miniaturization, and improving integration and imaging quality.
Patent Information
- Application Number
- CN202423238559.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-26
- Publication Date
- 2025-12-12
- Estimated Expiration
- 2034-12-26
AI Technical Summary
Existing lidar receiving modules have limited resolution, resulting in a small scanning range for the reflected signals and thus limiting the detection range.
The device employs a dual-chip structure, with the first and second receiving chips arranged in different directions and staggered, combined with filtering and support components, to expand the detection range and achieve miniaturization.
The line scan range of the receiving module has been increased, achieving a larger detection range and miniaturization, improving integration, and ensuring imaging quality.
Smart Images
Figure CN223666398U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of camera assemblies, in particular to a receiving module and an electronic device. BACKGROUND
[0002] Laser radar is a device that emits a probe signal (laser beam) to a target through a transmitter, and then a receiving module compares the signal received from the target with the emitted signal, and after appropriate processing, the relevant information of the target can be obtained. At present, laser radar mostly uses a single chip as a receiving module. However, the resolution of such a receiving module is limited, and the scanning range of the reflected signal on the receiving module is small, resulting in a small detection range. CONTENT OF THE UTILITY MODEL
[0003] In view of the above, it is necessary to provide a receiving module and an electronic device to expand the detection range of the receiving module and realize the miniaturization of the receiving module.
[0004] The first aspect of the embodiment of the present application provides a receiving module, comprising: a protection support, a light passing hole is formed in the protection support; a receiving lens, which is arranged on the protection support and located at the light passing hole; a circuit board, which is arranged in the protection support and arranged opposite to the receiving lens; a photosensitive sensor, which is arranged on the circuit board and electrically connected with the circuit board, comprising a first receiving chip and a second receiving chip, the second receiving chip is arranged on one side of the first receiving chip, a first photosensitive area opposite to the receiving lens is arranged on the first receiving chip, a second photosensitive area opposite to the receiving lens is arranged on the second receiving chip, and the first photosensitive area and the second photosensitive area are used to receive light from the receiving lens.
[0005] In the scheme provided by the embodiment of the present application, the first receiving chip and the second receiving chip are arranged on the circuit board, and the first photosensitive area on the first receiving chip and the second photosensitive area on the second receiving chip are used to receive light from the receiving lens, which expands the detection range of the receiving module, realizes the miniaturization of the receiving module, and improves the integration of the receiving module.
[0006] In a possible implementation, the first receiving chip and the second receiving chip are arranged along a first direction perpendicular to the optical axis, and the first receiving chip and the second receiving chip are arranged in a staggered manner along a second direction perpendicular to the optical axis and the first direction.
[0007] In the scheme provided by the embodiment of the present application, the first receiving chip and the second receiving chip are arranged along the first direction, and the first receiving chip and the second receiving chip are arranged in a staggered manner along the second direction, which can increase the line scanning range of the receiving module and realize a large detection range.
[0008] In a possible implementation, the first light sensing region and the second light sensing region have gaps in the first direction and the second direction.
[0009] In the scheme provided by the embodiments of the present application, by making the first light sensing region and the second light sensing region have gaps in the first direction and the second direction, the maximum line scanning range of the receiving module in the first direction and the second direction can be achieved.
[0010] In a possible implementation, the receiving module further includes a support assembly arranged on the first receiving chip and the second receiving chip and spaced apart from the first light sensing region and the second light sensing region respectively; and a filtering assembly arranged on the support assembly and arranged opposite to the receiving lens to filter stray light.
[0011] In the scheme provided by the embodiments of the present application, by arranging the filtering assembly, the stray light entering from the receiving lens can be filtered, and the imaging quality can be ensured; by arranging the support assembly, the filtering assembly can be separated from the first light sensing region and the second light sensing region, so that the filtering assembly does not contact the first light sensing region and the second light sensing region, thereby affecting the imaging quality.
[0012] In a possible implementation, the support assembly includes a first support body and a second support body, the first support body is arranged on the first receiving chip and spaced apart from the first light sensing region, and the second support body is arranged on the second receiving chip and spaced apart from the second light sensing region; and the filtering assembly includes a first filtering piece and a second filtering piece, the first filtering piece is arranged on the first support body, and the second filtering piece is arranged on the second support body, and the first filtering piece and the second filtering piece are used to filter stray light.
[0013] In the scheme provided by the embodiments of the present application, by arranging the filtering assembly as the first filtering piece and the second filtering piece, and arranging the first filtering piece on the first support body and the second filtering piece on the second support body, when the first filtering piece or the second filtering piece is damaged, only the damaged first filtering piece or second filtering piece needs to be replaced, and the replacement is more convenient.
[0014] In a possible implementation, the receiving module further includes a conducting piece, one end of the conducting piece is connected to the first receiving chip or the second receiving chip, and the other end of the conducting piece is connected to the circuit board to conduct the first receiving chip and the circuit board and conduct the second receiving chip and the circuit board.
[0015] In the scheme provided by the embodiments of the present application, by arranging the conducting piece, the electrical connection of the first receiving chip, the second receiving chip and the circuit board can be achieved.
[0016] In a possible implementation, the receiving module further includes a first encapsulation body arranged on the circuit board and encapsulating the conducting member, the non-photosensitive area of the first receiving chip, the non-photosensitive area of the second receiving chip, the side of the first filter away from the first support body, and the side of the second filter away from the second support body.
[0017] In the scheme provided by the embodiments of the present application, the first receiving chip, the second receiving chip, the first filter, the first support body, the second filter and the second support body are fixed together, and the conducting member is protected, by encapsulating the conducting member, the non-photosensitive area of the first receiving chip, the non-photosensitive area of the second receiving chip, the side of the first filter away from the first support body, and the side of the second filter away from the second support body by the first encapsulation body.
[0018] In a possible implementation, the receiving module further includes a second encapsulation body arranged between the first receiving chip and the second receiving chip, one end of the second encapsulation body being connected to the circuit board, and the other end of the second encapsulation body extending out of the filter assembly along the optical axis direction; and a third encapsulation body connected to the other end of the second encapsulation body, and two ends of the third encapsulation body being connected to the first filter and the second filter respectively.
[0019] In the scheme provided by the embodiments of the present application, the first filter, the second filter, the first support body and the second support body are fixed together, and the stability of the structure is ensured, by arranging the second encapsulation body and the third encapsulation body.
[0020] In a possible implementation, the receiving module further includes an adhesive member arranged between the first receiving chip and the circuit board, and between the second receiving chip and the circuit board, to fix the first receiving chip, the second receiving chip and the circuit board.
[0021] In the scheme provided by the embodiments of the present application, the first receiving chip, the second receiving chip and the circuit board are fixed together firmly, by arranging the adhesive member.
[0022] The second aspect of the embodiments of the present application further provides an electronic device including a main body and the receiving module as any one of the above embodiments, and the receiving module is arranged on the main body.
[0023] In the scheme provided by the embodiments of the present application, the first receiving chip and the second receiving chip are arranged on the circuit board, and the light rays from the receiving lens are received by the first photosensitive area on the first receiving chip and the second photosensitive area on the second receiving chip, the detection range of the receiving module is expanded, the miniaturization of the receiving module is realized, and the integration of the receiving module is improved. BRIEF DESCRIPTION OF DRAWINGS
[0024] Figure 1 is a sectional structure schematic diagram of a receiving module provided by an embodiment of the application.
[0025] Figure 2 is Figure 1 is a top view of a circuit board and a photosensitive sensor of the receiving module.
[0026] Figure 3 is a three-dimensional structure schematic diagram of an electronic device provided by an embodiment of the application.
[0027] Figure 4 is a three-dimensional structure schematic diagram of an automobile provided by an embodiment of the application.
[0028] Main element symbol description: receiving module 100, protection support 10, light transmission hole 11, receiving lens 20, circuit board 30, photosensitive sensor 40, first receiving chip 41, first photosensitive area 411, second receiving chip 42, second photosensitive area 421, support assembly 50, first support body 51, second support body 52, filtering assembly 60, first filtering piece 61, second filtering piece 62, conduction piece 70, first encapsulation body 80, second encapsulation body 90, third encapsulation body 92, adhesive piece 95, main body 200, electronic device 1000, vehicle body 101, automobile 1. DETAILED DESCRIPTION
[0029] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the drawings, wherein the same or similar notations represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are only used to explain the present application, and cannot be understood as a limitation of the present application.
[0030] In the description of the present application, it should be understood that the terms indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as a limitation of the present application. In addition, the terms "first" and "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first" and "second" can explicitly or implicitly include one or more features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.
[0031] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the term "connection" should be interpreted broadly. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a connection that allows for communication; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0032] The following disclosure provides many different embodiments or examples for implementing various structures of this invention. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of the invention. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, examples of various specific processes and materials are provided in this invention, but those skilled in the art will recognize the application of other processes and / or the use of other materials.
[0033] The embodiments of this application will be described in detail below with reference to the accompanying drawings.
[0034] Please see Figure 1 The first aspect of this application provides a receiving module 100, including a protective bracket 10, a receiving lens 20, a circuit board 30, and a photosensor 40.
[0035] Please see also Figure 2 A light-transmitting hole 11, which is approximately circular, is provided on the protective bracket 10. A receiving lens 20 is mounted on the protective bracket 10 and located at the light-transmitting hole 11, wherein the receiving lens 20 is connected to the wall of the light-transmitting hole 11. A circuit board 30 is disposed inside the protective bracket 10 and is positioned opposite to the receiving lens 20. A photosensor 40 is mounted on and electrically connected to the circuit board 30. The photosensor 40 includes a first receiving chip 41 and a second receiving chip 42. The second receiving chip 42 is located on one side of the first receiving chip 41. The first receiving chip 41 has a first photosensitive area 411 opposite to the receiving lens 20, and the second receiving chip 42 has a second photosensitive area 421 opposite to the receiving lens 20. The first photosensitive area 411 and the second photosensitive area 421 are used to receive light incident from the receiving lens 20.
[0036] In the scheme provided by the embodiment of the application, the first receiving chip 41 and the second receiving chip 42 are arranged on the circuit board 30, and the light rays from the receiving lens 20 are received by the first photosensitive area 411 on the first receiving chip 41 and the second photosensitive area 421 on the second receiving chip 42, so that the detection range of the receiving module 100 is expanded, the receiving module 100 is miniaturized, and the integration of the receiving module 100 is improved.
[0037] In a possible implementation, the first receiving chip 41 and the second receiving chip 42 are arranged along a first direction perpendicular to the optical axis, and the first receiving chip 41 and the second receiving chip 42 are arranged in a staggered manner along a second direction perpendicular to the optical axis and the first direction. The first direction is the X-axis direction, and the second direction is the Y-axis direction.
[0038] In the scheme provided by the embodiment of the application, the first receiving chip 41 and the second receiving chip 42 are arranged along the first direction, and the first receiving chip 41 and the second receiving chip 42 are arranged in a staggered manner along the second direction, so that the line scanning range of the receiving module 100 is increased, and a large detection range is achieved.
[0039] It can be understood that, in other embodiments, the first receiving chip 41 and the second receiving chip 42 are arranged along the first direction, and the first receiving chip 41 and the second receiving chip 42 are arranged in a relative manner.
[0040] In a possible implementation, the first photosensitive area 411 and the second photosensitive area 421 have gaps in the first direction and the second direction.
[0041] In the scheme provided by the embodiment of the application, the first photosensitive area 411 and the second photosensitive area 421 have gaps in the first direction and the second direction, so that the line scanning range of the receiving module 100 in the first direction and the second direction is maximized.
[0042] In a possible implementation, the receiving module 100 further includes a support assembly 50 and a filtering assembly 60. The support assembly 50 is arranged on the first receiving chip 41 and the second receiving chip 42, and is arranged in a spaced manner from the first photosensitive area 411 and the second photosensitive area 421. The filtering assembly 60 is arranged on the support assembly 50, and is arranged in a spaced manner from the receiving lens 20 to filter stray light.
[0043] In the scheme provided by the embodiment of the application, the filtering assembly 60 is arranged to filter the stray light from the receiving lens 20, so that the imaging quality is ensured. The support assembly 50 is arranged to separate the filtering assembly 60 from the first photosensitive area 411 and the second photosensitive area 421 in the optical axis direction, so that the filtering assembly 60 does not contact the first photosensitive area 411 and the second photosensitive area 421, and the imaging quality is not affected.
[0044] In a possible implementation, the support assembly 50 includes a first support body 51 and a second support body 52, the first support body 51 is arranged on the first receiving chip 41 and spaced apart from the first photosensitive region 411, and the second support body 52 is arranged on the second receiving chip 42 and spaced apart from the second photosensitive region 421; the filtering assembly 60 includes a first filtering member 61 and a second filtering member 62, the first filtering member 61 is arranged on the first support body 51, and the second filtering member 62 is arranged on the second support body 52, and the first filtering member 61 and the second filtering member 62 are used for filtering stray light. In this embodiment, the first support body 51 is two and arranged on opposite sides of the first photosensitive region 411, the second support body 52 is two and arranged on opposite sides of the second photosensitive region 421, and the first support body 51 and the second support body 52 are both solidified by GOS (Glass on sensor) glue; the first filtering member 61 and the second filtering member 62 are both optical filters.
[0045] In the scheme provided by the embodiments of the present application, by arranging the filtering assembly 60 as the first filtering member 61 and the second filtering member 62, and arranging the first filtering member 61 on the first support body 51 and the second filtering member 62 on the second support body 52, when the first filtering member 61 or the second filtering member 62 is damaged, only the damaged first filtering member 61 or the second filtering member 62 needs to be replaced, which is more convenient to replace.
[0046] In a possible implementation, the receiving module 100 further includes a conducting member 70, one end of the conducting member 70 is connected to the first receiving chip 41 or the second receiving chip 42, and the other end of the conducting member 70 is connected to the circuit board 30, so as to conduct the first receiving chip 41 and the circuit board 30 and conduct the second receiving chip 42 and the circuit board 30. In this embodiment, the conducting member 70 is a gold wire, and the number of the conducting member 70 is two.
[0047] In the scheme provided by the embodiments of the present application, by arranging the conducting member 70, the electrical connection of the first receiving chip 41, the second receiving chip 42 and the circuit board 30 can be realized.
[0048] In a possible implementation, the receiving module 100 further includes a first encapsulation body 80, the first encapsulation body 80 is arranged on the circuit board 30 and encapsulates the conducting member 70, the non-photosensitive region of the first receiving chip 41, the non-photosensitive region of the second receiving chip 42, the side of the first filtering member 61 away from the first support body 51, and the side of the second filtering member 62 away from the second support body 52. In this embodiment, the first encapsulation body 80 is filled with glue and solidified.
[0049] In the scheme provided in the embodiment of the present application, the first packaging body 80 is used to package the conducting part 70, the non-photosensitive area of the first receiving chip 41, the non-photosensitive area of the second receiving chip 42, the side of the first filter part 61 away from the first support body 51, and the side of the second filter part 62 away from the second support body 52, so as to fix the first receiving chip 41, the second receiving chip 42, the first filter part 61, the first support body 51, the second filter part 62 and the second support body 52 together, and protect the conducting part 70.
[0050] In a possible implementation, the receiving module 100 further includes a second packaging body 90 and a third packaging body 92. The second packaging body 90 is arranged between the first receiving chip 41 and the second receiving chip 42. One end of the second packaging body 90 is connected to the circuit board 30, and the other end of the second packaging body 90 extends out of the filtering assembly 60 along the optical axis direction. The third packaging body 92 is connected to the other end of the second packaging body 90, and two ends of the third packaging body 92 are respectively connected to the first filter part 61 and the second filter part 62. In the embodiment, the second packaging body 90 and the third packaging body 92 are formed in a T shape, and the second packaging body 90 and the third packaging body 92 are both formed by filling glue and curing.
[0051] In the scheme provided in the embodiment of the present application, the second packaging body 90 and the third packaging body 92 are arranged, so as to fix the first filter part 61, the second filter part 62, the first support body 51 and the second support body 52 together, and ensure the stability of the structure.
[0052] In a possible implementation, the receiving module 100 further includes an adhesive 95 arranged between the first receiving chip 41 and the circuit board 30, and between the second receiving chip 42 and the circuit board 30, so as to fix the first receiving chip 41, the second receiving chip 42 and the circuit board 30. In the embodiment, the adhesive 95 is formed by curing DA (die attach adhesives) glue.
[0053] In the scheme provided in the embodiment of the present application, the adhesive 95 is arranged, so as to firmly fix the first receiving chip 41, the second receiving chip 42 and the circuit board 30 together.
[0054] Please refer to Figure 3The second aspect of the embodiments of the present application further provides an electronic device 1000, which comprises a main body 200 and the receiving module 100 as described above, and the receiving module 100 is arranged on the main body 200. The electronic device 1000 is a vehicle-mounted camera device, for example, a laser radar, which can cooperate with an auxiliary driving system or an automatic driving system to transmit the obtained image information to a terminal to judge the road condition, and then remind the driver or automatically perform the driving operation. Or the electronic device 1000 can also cooperate with a display screen in the cab, for example, display the obtained image on the display screen for the driver to observe.
[0055] Please refer to Figure 4 Some embodiments of the present application further provide a vehicle 1. The vehicle 1 comprises a vehicle body 101 and the electronic device 1000 described above, and the electronic device 1000 is arranged on the vehicle body 101. A plurality of electronic devices 1000 can be arranged on the vehicle 1 to obtain image information of the vehicle body in all directions. The image information obtained by the plurality of electronic devices 1000 can also be displayed on the display screen after splicing, or displayed in different areas of the display screen. The vehicle 1 can obtain a larger field of view, larger depth information and clearer road image through the electronic device 1000 with the receiving module 100 described above, so that the driver or the driving control system can obtain a more timely and accurate warning, thereby meeting the industry's requirements for driving safety.
[0056] In the technical scheme provided by the embodiments of the present application, the first receiving chip 41 and the second receiving chip 42 are arranged on the circuit board 30, and the light rays from the receiving lens 20 are received by the first photosensitive area 411 on the first receiving chip 41 and the second photosensitive area 421 on the second receiving chip 42, thereby expanding the detection range of the receiving module 100, realizing the miniaturization of the receiving module 100, and improving the integration of the receiving module 100.
[0057] It is apparent for those skilled in the art that the present application is not limited to the details of the above-mentioned exemplary embodiments, but can be implemented in other concrete forms without departing from the spirit or essential characteristics of the present application. Therefore, the embodiments should be regarded as exemplary and non-limiting, and the scope of the present application is defined by the appended claims rather than the above description, and all changes falling within the meaning and range of equivalents of the essential elements of the claims are intended to be included in the present application. Any reference signs in the claims should not be regarded as limiting the claims involved. In addition, it is clear that the word "comprise" does not exclude other units or steps, and the singular does not exclude the plural.
[0058] Finally, it should be noted that the above embodiments are merely intended to illustrate the technical solutions of the present application and are not limiting. Although the present application has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present application can be modified or equivalently replaced without departing from the spirit and scope of the technical solutions of the present application.
Claims
1. A receiving module, characterized in that, The application relates to a receiving module. The receiving module comprises: a protection support, wherein a light hole is formed in the protection support; a receiving lens, which is arranged on the protection support and located at the light hole; a circuit board, which is arranged in the protection support and arranged opposite to the receiving lens; 2. The receiving module of claim 1, wherein, a photosensitive sensor, which is arranged on the circuit board and electrically connected with the circuit board, and comprises a first receiving chip and a second receiving chip, the second receiving chip is arranged on one side of the first receiving chip, the first receiving chip is provided with a first photosensitive area opposite to the receiving lens, the second receiving chip is provided with a second photosensitive area opposite to the receiving lens, and the first photosensitive area and the second photosensitive area are used for receiving light from the receiving lens.
3. The receiving module of claim 2, wherein, The first receiving chip and the second receiving chip are arranged along a first direction perpendicular to an optical axis, and the first receiving chip and the second receiving chip are arranged in a staggered mode along a second direction perpendicular to the optical axis and the first direction.
4. The receiving module of claim 3, wherein, The first photosensitive area and the second photosensitive area have gaps in the first direction and the second direction. The receiving module further comprises: a support assembly, which is arranged on the first receiving chip and the second receiving chip and is arranged in a spaced mode with the first photosensitive area and the second photosensitive area respectively; 5. The receiving module of claim 4, wherein, a filtering assembly, which is arranged on the support assembly and arranged opposite to the receiving lens to filter stray light. The support assembly comprises: a first support body and a second support body, the first support body is arranged on the first receiving chip and arranged in a spaced mode with the first photosensitive area, and the second support body is arranged on the second receiving chip and arranged in a spaced mode with the second photosensitive area; The filtering assembly comprises:
6. The receiving module of claim 5, wherein, a first filter and a second filter, the first filter is arranged on the first support body, the second filter is arranged on the second support body, and the first filter and the second filter are used for filtering stray light. The receiving module further comprises:
7. The receiving module of claim 6, wherein, a conducting piece, one end of the conducting piece is connected with the first receiving chip or the second receiving chip, and the other end of the conducting piece is connected with the circuit board to conduct the first receiving chip and the circuit board and conduct the second receiving chip and the circuit board. The receiving module further comprises:
8. The receiving module of claim 7, wherein, a first packaging body, which is arranged on the circuit board and encapsulates the conducting piece, a non-photosensitive area of the first receiving chip, a non-photosensitive area of the second receiving chip, one side of the first filter away from the first support body and one side of the second filter away from the second support body. The receiving module further comprises: a second packaging body, which is arranged between the first receiving chip and the second receiving chip, one end of the second packaging body is connected with the circuit board, and the other end of the second packaging body extends out of the filtering assembly along the optical axis direction; 9. The receiving module of claim 1, wherein, a third packaging body, which is connected with the other end of the second packaging body, and two ends of the third packaging body are connected with the first filter and the second filter respectively. The receiving module further comprises: an adhesive piece, which is arranged between the first receiving chip and the circuit board and between the second receiving chip and the circuit board to fix the first receiving chip, the second receiving chip and the circuit board.
10. An electronic device, comprising: The receiving module as claimed in any one of claims 1-9 is arranged on the main body.