Anti-radiation interference debugging system for metal radiating fin

Abstract

The utility model relates to the technical field of PCBs, and provides a metal cooling fin anti-radiation interference debugging system which comprises a PCB, a metal cooling fin, a chip and a connecting piece. The chip is welded on the PCB, the metal cooling fin is connected with the PCB through a fixing column, and one end face, facing the PCB, of the metal cooling fin is attached to one end face, far away from the PCB, of the chip; the connecting piece is detachably arranged on the edge of the fixing column; when the edge of the fixing column is provided with the connecting piece, the fixing column is in short circuit connection with the PCB; and when the edge of the fixing column is not provided with the connecting piece, the fixing column is disconnected from the PCB. Through the detachable connecting piece, the connection state between the metal cooling fin and the PCB can be rapidly adjusted, so that the problem of radiation interference can be flexibly solved, the fixed column does not need to be physically cut off or the PCB does not need to be changed on a large scale, and the problem that the connection relation between the fixed column and the PCB is inconvenient to adjust when the radiation interference exceeds the standard is solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of PCB, and in particular to a metal heat dissipation fin anti-radiation interference debugging system. BACKGROUND

[0002] In modern electronic devices, as the operating speed increases, such as 4K smart display, TV and high-frequency processor (CPU), graphics processor (GPU) and memory (DDR), the heat generated by the device also increases. In order to effectively dissipate heat, a metal heat dissipation fin is generally used to be installed above the chip of the heat source. These metal heat dissipation fins are usually fixed on the circuit board (PCB) through fixing columns, and the metal heat dissipation fin is directly attached to the chip to dissipate heat to keep the temperature of the chip within a safe range.

[0003] In the related technical means, a plurality of fixing columns are provided on the metal heat dissipation fin, then the fixing columns firmly lock the metal heat dissipation fin by means of back soldering, and the fixing columns are welded on the PCB to achieve the effect of fixing the metal heat dissipation fin on the PCB through the fixing columns. The metal heat dissipation fin is attached above the chip, and the high temperature generated by the chip during operation is dissipated to achieve heat dissipation of the chip.

[0004] For the above technical solution, although the metal heat dissipation fin attached above the chip can achieve heat dissipation of the chip, when the metal heat dissipation fin is attached above the chip, the metal heat dissipation fin has a large size and is prone to high-frequency radiation interference. When it is found in actual test verification that the radiation interference exceeds the standard, it is necessary to modify the connection relationship between the fixing column and the PCB to find the best way of minimum radiation, but since the fixing column is directly connected and welded on the PCB, it is necessary to cut off the fixing column, scrape the copper skin, or modify the PCB again to perform radiation interference verification again. There is a problem that the connection relationship between the fixing column and the PCB is not convenient to adjust, which increases the product research and development cost and research and development cycle. SUMMARY

[0005] In order to improve the problem that the connection relationship between the fixing column and the PCB is not convenient to adjust when it is found in actual test verification that the radiation interference exceeds the standard, the present application provides a metal heat dissipation fin anti-radiation interference debugging system.

[0006] The application provides a metal heat sink anti-radiation interference debugging system, which comprises a PCB board, a metal heat sink, a chip and a connecting piece.

[0007] As a preferred solution, the PCB board is provided with a mounting groove, and the connecting piece is detachably mounted on the mounting groove.

[0008] As a preferred solution, the fixing column comprises at least two, and the number of the mounting grooves is consistent with the number of the fixing columns.

[0009] As a preferred solution, the system comprises an electromagnetic compatibility testing device, and the electromagnetic compatibility testing device comprises a plurality of sensors, all of which are arranged at predetermined positions on the PCB board and used for capturing electromagnetic radiation data.

[0010] As a preferred solution, the system further comprises a mechanical arm, which is used for mounting or removing the connecting piece according to the electromagnetic radiation data.

[0011] As a preferred solution, the connecting piece is a 0Ω resistor.

[0012] Compared with the prior art, the application has the following beneficial effects: short research and development cycle and high flexibility. Through the detachable connecting piece, the connection state between the metal heat sink and the PCB board can be quickly adjusted, so that the radiation interference problem can be flexibly coped with, without the need of physically cutting the fixing column or making large-scale PCB board design changes, thereby reducing the dependence on complex welding and mechanical changes, and improving the problem that the connection relationship between the fixing column and the PCB board is inconvenient to adjust when the radiation interference is found to be excessive in actual test verification. BRIEF DESCRIPTION OF DRAWINGS

[0013] In order to more clearly illustrate the technical solutions in the embodiments of the application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the application, and other drawings can be obtained by those skilled in the art without creative labor under the premise of not paying the creative labor.

[0014] The structure, proportion, size, etc. shown in the drawings of the specification are only used to cooperate with the content disclosed in the specification, to be understood and read by those skilled in the art, and do not have technical significance to define the limitations of the application. Any modification of the structure, change of the proportion relationship or adjustment of the size, which does not affect the effect and purpose that can be achieved by the application, should still fall within the scope of the technology disclosed by the application.

[0015] Fig. 1 is a structural schematic diagram of a metal heat sink anti-radiation interference debugging system provided by an embodiment of the application.

[0016] Fig. 2 is a schematic block diagram of a metal heat sink anti-radiation interference debugging system provided by an embodiment of the application.

[0017] Legend:

[0018] 1, PCB board; 11, mounting groove; 2, metal heat sink; 3, chip; 4, connecting piece; 5, fixing column; 6, electromagnetic compatibility test device; 61, sensor; 7, mechanical arm. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the application will be described clearly and completely below with reference to the drawings in the embodiments of the application. Obviously, the described embodiments are some of the embodiments of the application, rather than all the embodiments of the application. Based on the embodiments in the application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of protection of the application.

[0020] The flowchart shown in the drawings is only an example and does not necessarily include all the contents and operations / steps, nor does it have to be executed in the order described. For example, some operations / steps can be further decomposed, combined or partially merged, so the actual execution order may be changed according to the actual situation.

[0021] It should also be understood that the terms used in this specification are only for the purpose of describing specific embodiments and are not intended to limit the application. As used in the specification and the appended claims, unless otherwise clear from the context, the singular forms "a", "an" and "the" are intended to include plural forms.

[0022] It should be further understood that the term "and / or" used in the specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes these combinations.

[0023] The technical solution of this application will be further described below with reference to the accompanying drawings and specific embodiments.

[0024] Example 1:

[0025] like Figs. 1-2 As shown, this application provides a metal heat sink anti-radiation interference debugging system, including a PCB board 1, a metal heat sink 2, a chip 3, and a connector 4.

[0026] Chip 3 is soldered onto PCB board 1. Metal heat sink 2 is connected to PCB board 1 by fixing post 5. The end face of metal heat sink 2 facing PCB board 1 is attached to the end face of chip 3 away from PCB board 1. Connector 4 is detachably set on the edge of fixing post 5.

[0027] By soldering the chip 3 onto the PCB board 1 and ensuring that the end face of the metal heat sink 2 facing the PCB board 1 is attached to the end face of the chip 3 away from the PCB board 1, effective thermal contact is achieved between the metal heat sink 2 and the chip 3. This allows the heat generated by the chip 3 to be directly transferred to the metal heat sink 2 and dissipated into the environment through the metal heat sink 2, effectively controlling the temperature of the chip 3. Furthermore, a detachable connector 4 is provided at the edge of the fixing post 5, enabling a flexible connection between the metal heat sink 2 and the PCB board 1 via the fixing post 5. This allows for quick replacement of the connector 4 as needed during testing and debugging to adjust the electrical connection between the fixing post 5 and the PCB board 1.

[0028] When the connecting piece 4 is installed on the edge of the fixing post 5, the fixing post 5 is short-circuited to the PCB board 1.

[0029] By installing the connector 4 at the edge of the fixing post 5, the fixing post 5 is short-circuited to the PCB board 1. This allows the connection between the metal heat sink 2 and the PCB board 1 to be strengthened by short-circuiting when it is necessary to enhance thermal conductivity or electrical performance. If excessive radiation interference is detected, the direct electrical connection between the metal heat sink 2 and the PCB board 1 can be reduced by connecting or disconnecting the connector to reduce interference.

[0030] When the connecting piece 4 is not installed on the edge of the fixing post 5, the fixing post 5 is disconnected from the PCB board 1.

[0031] By disconnecting the fixing post 5 from the PCB board 1 when the connector 4 is not installed at the edge of the fixing post 5, the direct electrical connection between the metal heat sink 2 and the PCB board 1 can be reduced to decrease interference if excessive radiation interference is detected during the radiation interference test.

[0032] In this embodiment, the chip 3 is soldered onto the PCB board 1, and the metal heat sink 2 is ensured to be in close contact with the chip 3 to absorb and dissipate the heat generated by the chip 3 during operation. The metal heat sink 2 is connected to the PCB board 1 via fixing posts 5 located at its edge. Detachable connectors 4 are installed at the edge of the fixing posts 5. The presence or absence of these connectors 4 determines whether the fixing posts 5 form an electrical connection with the PCB board 1. When it is necessary to adjust the radiation interference performance between the metal heat sink 2 and the PCB board 1, the connection state between the fixing posts 5 and the PCB board 1 can be quickly changed by simply adding or removing the connectors 4, thereby achieving a short circuit or disconnection between the fixing posts 5 and the PCB board 1. This facilitates rapid debugging and verification of radiation interference, effectively improving the design flexibility of the metal heat sink 2 and reducing debugging costs. The detachable connectors 4 allow for quick adjustment of the connection state between the metal heat sink 2 and the PCB board 1, thus flexibly addressing potential radiation interference problems without physically cutting the fixing posts 5 or making large-scale changes to the PCB board 1 design. It reduces reliance on complex welding and mechanical modifications, thereby shortening R&D cycles and costs, while also improving the testability and reusability of product designs, and providing an effective tool for thermal management and electromagnetic compatibility adjustments of electronic devices.

[0033] Example 2:

[0034] like Figs. 1-2 As shown, a mounting slot 11 is provided on the PCB board 1, and the connector 4 is detachably mounted on the mounting slot 11.

[0035] By designing dedicated mounting slots 11 on the PCB board 1 and enabling the connector 4 to be detachably mounted on these mounting slots 11, the flexibility and repeatability of the connector 4 installation are achieved. This allows the connector 4 to be quickly replaced according to test requirements, thereby adjusting the electrical connection between the metal heat sink 2 and the PCB board 1 to cope with different electromagnetic interference test scenarios.

[0036] The fixing column 5 includes at least two columns, and the number of mounting slots 11 is the same as the number of fixing columns 5.

[0037] By ensuring that each fixing post 5 corresponds to a mounting slot 11, and that the number of fixing posts 5 is at least two, a stable and uniform physical and electrical connection between the metal heat sink 2 and the PCB board 1 is achieved, enhancing the stability of the overall structure and providing sufficient fixing points to support the metal heat sink 2.

[0038] like Figs. 1-2 As shown, the anti-radiation interference debugging system of the metal heat sink 2 includes an electromagnetic compatibility testing device 6. The electromagnetic compatibility testing device 6 includes several sensors 61. All sensors 61 are set at predetermined positions on the PCB board 1 to capture electromagnetic radiation data.

[0039] By integrating the electromagnetic compatibility test device 6 and deploying multiple sensors 61 on the PCB board 1 at predetermined positions; Real-time monitoring of electromagnetic radiation generated by the heat dissipation system during operation is achieved, making data collection of electromagnetic radiation more accurate and comprehensive, facilitating analysis and adjustment.

[0040] And the metal heat sink 2 anti-radiation interference debugging system also includes a mechanical arm 7, which installs or removes the connecting piece 4 according to the electromagnetic radiation data.

[0041] By configuring the mechanical arm 7 to automatically adjust the installation state of the connecting piece 4 according to the electromagnetic radiation data; The system is automatically debugged, greatly improving the debugging efficiency and accuracy, reducing human error, and making the debugging process more rapid and accurate.

[0042] Among them, the connecting piece 4 is a 0Ω resistor.

[0043] By using a 0Ω resistor as the connecting piece 4; It can quickly make electrical connections or disconnections during testing, is easy to control and has minimal impact on the system, and is convenient for evaluating electromagnetic radiation changes under different connection states.

[0044] As shown in Figs. 1-2 The preferred fixed column 5 is four, namely fixed column H1, fixed column H2, fixed column H3 and fixed column H4, and the number of connecting pieces 4 is consistent with the number of fixed columns 5, namely connecting piece R1, connecting piece R2, connecting piece R3 and connecting piece R4; Respectively record the electromagnetic radiation data when connecting piece R1 and fixed column H1 are connected or disconnected; Respectively record the electromagnetic radiation data when connecting piece R2 and fixed column H2 are connected or disconnected; Respectively record the electromagnetic radiation data when connecting piece R3 and fixed column H3 are connected or disconnected; Respectively record the electromagnetic radiation data when connecting piece R4 and fixed column H4 are connected or disconnected, a total of 16 kinds of combination state electromagnetic radiation data, and select the fixed column 5 and connecting piece 4 with the optimal electromagnetic radiation data for connection to find the state with the smallest radiation interference.

[0045] By recording the electromagnetic radiation data under the combination of connecting each connecting piece 4 and fixed column 5 connected or disconnected, and analyzing and comparing; It realizes accurate identification and selection of the best electromagnetic compatibility configuration, optimizes the design of the heat dissipation system to reduce electromagnetic interference, and ensures the optimization of system performance.

[0046] At the same time, due to the different layouts of integrated circuit boards, the chip 3 working frequency point multiple frequency coupling emission conditions are also different, so the fixed foot grounding and non-grounding effects of the metal heat sink 2 are also different.

[0047] For example, the metal heat sink 2 has 4 fixing feet, each with 2 states, a total of 16 combination states, which can simply and quickly add or delete 0Ω resistance, quickly find the best way to minimize radiation, efficiently help engineers solve the radiation interference problem of H-shaped metal heat sink 2 and improve the EMI problem of this type of metal heat sink 2, find the smallest radiation interference and the best solution for the system, shorten the development cycle and difficulty.

[0048] In this embodiment, by designing a special mounting groove 11 on the PCB board 1 and configuring a detachable 0Ω resistor as the connecting piece 4, combined with the use of automatic electromagnetic compatibility test device 6 and mechanical arm 7, the precise and automatic debugging of the metal heat sink 2 anti-radiation interference system is realized. During the operation of the electronic equipment, according to the real-time collected electromagnetic radiation data, the connection state between the metal heat sink 2 and the PCB board 1 is automatically adjusted to find the best heat dissipation and electromagnetic compatibility configuration. This not only reduces the time and cost of manual debugging, but also improves the reliability and stability of the equipment in complex environments. In addition, through meticulous testing and adjustment, the system ensures the optimal performance of the metal heat sink 2 under different working conditions, effectively controls electromagnetic interference, and guarantees the high performance and long-term stable operation of the product. Avoid the multiple frequency coupling emission of the chip 3 work frequency point by the metal heat sink 2, at the same time, the metal heat sink 2 is fixed on the PCB board 1 through multiple fixing columns 5, which enhances the reliability and product quality of the product.

[0049] The above-described embodiments are merely used to illustrate the technical solutions of the present application, rather than limit them; although the foregoing embodiments of the present application have been described in detail, those skilled in the art should understand: they can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A metal heat sink anti-radiation interference debugging system, characterized in that, It includes a PCB board (1), a metal heat sink (2), a chip (3), and a connector (4); The chip (3) is soldered onto the PCB board (1), and the metal heat sink (2) is connected to the PCB board (1) by a fixing post (5). The end face of the metal heat sink (2) facing the PCB board (1) is attached to the end face of the chip (3) away from the PCB board (1). The connector (4) is detachably mounted on the edge of the fixed post (5); When the connecting piece (4) is installed on the edge of the fixing post (5), the fixing post (5) is short-circuited to the PCB board (1); When the connecting piece (4) is not installed on the edge of the fixing post (5), the fixing post (5) is disconnected from the PCB board (1).

2. The metal heat sink anti-radiation interference debugging system according to claim 1, characterized in that, The PCB board (1) has an installation slot (11) and the connector (4) is detachably installed on the installation slot (11).

3. The metal heat sink anti-radiation interference debugging system according to claim 2, characterized in that, The fixing column (5) includes at least two columns, and the number of mounting slots (11) is the same as the number of fixing columns (5).

4. The metal heat sink anti-radiation interference debugging system according to claim 1, characterized in that, The system includes an electromagnetic compatibility testing device (6), which includes several sensors (61). All the sensors (61) are set at predetermined positions on the PCB board (1) to capture electromagnetic radiation data.

5. The metal heat sink anti-radiation interference debugging system according to claim 4, characterized in that, The system also includes a robotic arm (7) which installs or removes the connector (4) based on the electromagnetic radiation data.

6. The metal heat sink anti-radiation interference debugging system according to claim 1, characterized in that, The connector (4) is a 0Ω resistor.

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