FPC labeling and pressure maintaining production line
By designing an FPC labeling and pressure-holding production line, and utilizing a combination of a film supply device, a calibration device, and a pressure-holding machine, precise bonding and firm adhesion of thermal film to FPC boards were achieved. This solved the problems of large labeling errors and weak adhesion, and improved production efficiency and quality.
Patent Information
- Application Number
- CN202422939853.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-29
- Publication Date
- 2025-12-12
- Estimated Expiration
- 2034-11-29
AI Technical Summary
The existing FPC board labeling process suffers from large labeling errors and weak adhesion, which affects processing quality and increases production costs.
An FPC labeling and pressure-holding production line was designed, including a labeling machine and a pressure-holding machine. The automatic bonding of thermal film to FPC board is achieved through a film feeding device, a calibration device, a material carrier, and a film transfer robot. In the pressure-holding machine, the upper mold assembly and the lower mold assembly cooperate, and the pressure is controlled by a pressure sensor to keep the bonding pressure between the thermal film and the FPC board within a controllable range.
It improves labeling accuracy and adhesion, ensuring stable and efficient production quality and reducing production costs.
Smart Images

Figure CN223666550U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to FPC board surface pastes heat sensitive film technology field especially relates to a kind of FPC label pressurizing production line. BACKGROUND
[0002] FPC / FPC board, also known as flexible circuit board / soft circuit board / soft circuit board / soft circuit board; because it is soft and bendable, it is widely used, commonly used in various small electrical devices, such as mobile phones, battery modules, etc., according to the production process requirements need to paste heat sensitive film or pressure sensitive film at the specified position of FPC board, and place it in the pressurizing machine for pressing, so that the heat sensitive film or pressure sensitive film is connected firmly with FPC board, but the existing label, pressurizing production process has the problems of large label error and poor adhesion, which affects the stability of subsequent processing quality, causes unnecessary loss, leads to high production cost, and cannot meet the production requirements, and needs to be improved. SUMMARY
[0003] In order to overcome the problems of large label error and poor adhesion in the prior art, the purpose of the utility model is to provide a kind of FPC label pressurizing production line, to improve the label accuracy and adhesion, to meet the production requirements.
[0004] To achieve the above purpose, the technical scheme of the utility model is as follows:
[0005] A kind of FP label pressurizing production line, including labeler and pressurizing machine, the labeler includes film supply device, correction device, material loading platform and film transfer manipulator, the film transfer manipulator moves back and forth between film supply device, correction device, material loading platform;
[0006] The pressurizing machine includes upper die assembly and lower die assembly;
[0007] The upper die assembly includes mounting plate and a plurality of pressurizing assemblies, each pressurizing assembly includes a fixing part, a pressure sensor and a pressure head, the fixing part is provided on the mounting plate, one end of the pressure sensor is connected with the fixing part, and the pressure head is slidingly connected with the fixing part;
[0008] The lower die assembly includes a lower die plate, the lower die plate includes a plurality of lower protruding columns, after the upper die assembly and the lower die assembly are combined, one pressure head holds one lower protruding column, and one pressure sensor is used to sense the pressure of one pressure head holding one lower protruding column.
[0009] Further, the film supply device includes a rack, a peeling assembly and a transfer table arranged in sequence;
[0010] The stripping assembly comprises a material supporting plate, a material belt traction element, a face paper collecting element and a bottom film collecting element, the material supporting plate is arranged close to the transfer table, the material belt traction element is arranged below the material supporting plate, the face paper collecting element is arranged above the material supporting plate, and the bottom film collecting element is arranged below the material supporting plate.
[0011] Further, the material supporting plate comprises a suction disc, a separating plate and a material pressing plate, the separating plate is arranged at the end of the suction disc and close to the transfer table, the separating plate is provided with a bottom inclined surface, and the material pressing plate is arranged above the separating plate with a gap.
[0012] Further, the correcting device comprises a first camera and a second camera, the first camera is arranged close to the film supplying device and below the film transfer robot, and the second camera is arranged on the film transfer robot and above the material loading table.
[0013] Further, the material loading table is further provided with a first conveying element and a first heating assembly, the material loading table is fixedly connected with the first heating assembly and arranged above the first heating assembly, and the first conveying element drives the first heating assembly to move.
[0014] Further, the pressure maintaining machine comprises a lifting assembly and a second conveying element, the lifting assembly drives the upper die assembly to move longitudinally, and the second conveying element drives the lower die assembly to move horizontally.
[0015] Further, the fixing element comprises an upper plate element, a guide column and a lower plate element which are connected in sequence, the upper plate element and the lower plate element are arranged with a gap, the pressure sensor is connected with the upper plate element, and the pressure head is slidingly connected with the lower plate element.
[0016] Further, the pressure maintaining assembly further comprises a buffer element and a micro-distance adjusting element, two ends of the buffer element are respectively connected with the pressure sensor and the pressure head, and the micro-distance adjusting element is arranged away from the pressure head and in contact with the pressure sensor.
[0017] Further, the pressure sensor comprises a mounting seat, a sensor and a pressure disc, the mounting seat is arranged on the upper plate element, the pressure disc is slidingly connected with the guide column, the sensor is connected with the mounting seat, the sensor is in contact with the pressure disc, the pressure disc is connected with the buffer element, and the micro-distance adjusting element is in contact with the mounting seat.
[0018] Further, the lower die assembly further comprises a bottom plate, a first heat insulation plate, a second heating assembly, a second heat insulation plate and a temperature control sensing element, the bottom plate, the first heat insulation plate, the second heating assembly and the lower die plate are arranged in sequence from bottom to top, the second heat insulation plate is arranged on the side surface of the first heat insulation plate, the second heat insulation plate is arranged on the side surface of the second heating assembly, the temperature control sensing element senses the temperature of the lower die plate, and the second conveying element drives the bottom plate to move.
[0019] The utility model discloses an advantage lies in that: through setting up glue sheet device, correction device, material carrying table and glue sheet transfer manipulator, realize the automatic sticking of outside heat sensitive sheet and outside FPC board, improve the accuracy of sticking position under the action of correction device, a plurality of pressure maintaining components are arranged to upper die assembly, a plurality of lower convex columns are arranged to lower die base of lower die assembly, one pressure sensor is used for sensing the pressure of one lower convex column that one pressure head holds, make the bonding pressure of each heat sensitive sheet and FPC board be in controllable range, further improve the firmness and stability of bonding quality, improve production efficiency. BRIEF DESCRIPTION OF DRAWINGS
[0020] Figure 1-1 It is the three-dimensional structure schematic diagram of the utility model;
[0021] Figure 2-1 It is the internal structure schematic diagram of the labeling machine of the utility model;
[0022] Figure 2-2 It is the split schematic diagram of the internal structure of the labeling machine of the utility model;
[0023] Figure 2-3 It is the structure schematic diagram of glue sheet device of the utility model;
[0024] Figure 2-4 It is the local structure schematic diagram of glue sheet device of the utility model;
[0025] Figure 2-5 It is the structure schematic diagram of material supporting plate of the utility model;
[0026] Figure 3-1 It is the structure schematic diagram of pressure maintaining machine of the utility model;
[0027] Figure 3-2 It is the split structure schematic diagram of upper die assembly and lower die assembly of the utility model;
[0028] Figure 3-3 It is the structure schematic diagram of pressure maintaining component of the utility model
[0029] Figure 3-4 It is the plane sectional view of pressure maintaining component of the utility model;
[0030] Figure 3-5 It is the three-dimensional sectional view of pressure maintaining component and mounting plate of the utility model;
[0031] Figure 3-6 It is the structure schematic diagram of lower die assembly of the utility model;
[0032] Figure 3-7 It is the split structure schematic diagram of lower die assembly of the utility model.
[0033] Reference signs include:
[0034] 100 - labeling machine 11 - adhesive film supplying device 111 - material rack
[0035] 112 - peeling assembly 1121 - material supporting plate 112a - suction cup
[0036] 112b - separating plate 112c - material pressing plate 112d - bottom inclined surface
[0037] 1122 - material belt traction member 1123 - face paper collecting member 1124 - bottom film collecting member
[0038] 113 - transfer table 12 - correcting device 121 - first camera
[0039] 122 - second camera 13 - material loading table 14 - adhesive film transferring robot
[0040] 15 - first conveying member 16 - first heating assembly
[0041] 200 - pressure maintaining machine 210 - upper mold assembly 220 - lower mold assembly
[0042] 230 - lifting assembly 240 - second conveying member 21 - mounting plate
[0043] 2101 - upper through hole 22 - pressure maintaining assembly 2201 - lower through hole
[0044] 221 - fixing member 22a - upper plate member 22b - guide column
[0045] 22c - lower plate member 222 - pressure sensor 22m - mounting seat
[0046] 22n - sensor 22t - pressure disc 22k - pressure sensing sheet
[0047] 22w - second spring 223 - pressure head 22x - metal plate
[0048] 22y - high-temperature-resistant member 22z - movable member 224 - buffer member
[0049] 22f - column body 22e - first spring 225 - macro adjustment member
[0050] 23 - bottom plate 24 - first heat insulation plate 25 - second heating assembly
[0051] 251 - first plate body 2511 - shaft hole 252 - heating rod
[0052] 26 - lower mold plate 261 - lower protruding column 27 - second heat insulation plate
[0053] 28 - temperature control inductive element 281 - support 282 - inductor
[0054] 300 - carrier. DETAILED DESCRIPTION
[0055] For the convenience of those skilled in the art to understand, the utility model will be further described below in combination with examples and drawings, and the content mentioned in the embodiment is not a limitation of the utility model.
[0056] Please refer to Figures 1-1 to 2-2 , Figures 3-1 to 3-3 The utility model discloses a kind of FPC label sticking pressure holding production lines, including labeler 100 and pressure holding machine 200, the labeler 100 includes film supply device 11, correction device 12, material loading platform 13 and film transfer manipulator 14, the film transfer manipulator 14 is reciprocated between film supply device 11, correction device 12, material loading platform 13, the material loading platform 13 is used to carry external carrier 300;
[0057] The pressure holding machine 200 includes upper die assembly 210 and lower die assembly 220;
[0058] The upper die assembly 210 includes mounting plate 21 and several pressure holding assemblies 22, each pressure holding assembly 22 includes fixing part 221, pressure inductor 222 and pressure head 223, the fixing part 221 is located in mounting plate 21, one end of pressure inductor 222 is connected with the fixing part 221, and the pressure head 223 is connected with the fixing part 221 slidingly.
[0059] The lower die assembly 220 includes lower die plate 26, and the lower die plate 26 includes several lower convex columns 261, after upper die assembly 210 and lower die assembly 220 are closed, one pressure head 223 holds one lower convex column 261, one pressure inductor 222 is used to induct the pressure that one pressure head 223 holds in one lower convex column 261, and the lower die plate 26 is used to carry external carrier 300 from material loading platform 13.
[0060] Specifically, in the embodiment, the labeling machine 100 and the pressure holding machine 200 are connected through a conveying belt for conveying the external carrier 300. The labeling machine 100 needs to paste the external thermal sensitive film on the surface of the external FPC board, and the pressure holding machine 200 needs to firmly bond the thermal sensitive film and the FPC board. The working process is as follows: first, the external carrier 300 loaded with the external FPC board is placed on the loading table 13. The film transfer manipulator 14 realizes the movement in X direction, Y direction and Z direction through a conventional transmission device. The film transfer manipulator 14 further comprises a rotary driving part and a vacuum material suction device. The external thermal sensitive film tape roll is peeled off through the film supply device 11, and the film transfer manipulator 14 adsorbs the peeled thermal sensitive film and transfers it to the correction device 12. The correction device 12 judges the placing angle of the thermal sensitive film and transmits the information to the control center. The correction device 12 judges the placing angle and contour information of the external FPC board placed on the carrier 300 and transmits the information to the control center. The rotary driving part of the film transfer manipulator 14 drives the vacuum material suction device to rotate, so that the adsorbed thermal sensitive film rotates by a preset angle and is accurately aligned with the FPC board to ensure the accuracy of the pasting. Finally, the external thermal sensitive film is adhered to the surface of the external FPC board on the carrier 300. The above steps are repeated to paste the thermal sensitive films one by one on the preset positions of the FPC board, complete the labeling of the FPC board, and then the carrier 300 is conveyed to the pressure holding machine 200. The lower die plate 26 of the pressure holding machine 200 is used to carry the carrier 300 from the loading table 13. The upper die assembly 210 of the pressure holding machine 200 comprises a mounting plate 21 and a plurality of pressure holding assemblies 22. Each pressure holding assembly 22 comprises a fixing part 221, a pressure sensor 222 and a pressure head 223. The center axes of the fixing part 221, the pressure sensor 222 and the pressure head 223 coincide. The fixing part 221 is connected to the lower surface of the mounting plate 21 by screws. The fixing part 221 is provided with a threaded hole. One end of the pressure sensor 222 is screwed into the threaded hole. A plurality of lower protruding columns 261 are formed on the lower die plate 26. After the upper die assembly 210 and the lower die assembly 220 are closed, one pressure holding assembly 22 is held on one lower protruding column 261. One pressure sensor 222 is used to sense the pressure of one pressure head 223 held on one lower protruding column 261, so that each thermal sensitive film bears the pressure generated between the pressure holding assembly 22 and the lower protruding column 261. Each group of pressure holding assemblies 22 is provided with one pressure sensor 222, which facilitates the control of the pressure value between one pressure head 223 and one lower protruding column 261 within the preset machining parameters, realizes the more firm bonding of each thermal sensitive film and the FPC board, improves the bonding quality stability of the thermal sensitive film and the FPC board, and preferably, each pressure head 223 comprises a metal plate 22x, a high temperature resistant part 22y and a movable part 22z. The movable part 22z, the metal plate 22x and the high temperature resistant part 22y are connected in sequence from top to bottom. The movable part 22z is close to the pressure sensor 222. The high temperature resistant part 22y abuts against the lower protruding column 261.The high-temperature-resistant piece 22y is made of high-temperature-resistant silica gel material, and the metal plate 22x is made of hard metal. The metal plate 22x improves the pressure resistance of the pressure head 223 and ensures the balance of pressure transmission. The high-temperature-resistant piece 22y improves the service life of the pressure head 223 working at high temperature. This structure ensures the stability of the pressure during the pressing process of the external thermal sensitive film and the FPC plate at high temperature, improves the service life of the pressure head 223, and reduces the use cost.
[0061] By setting the film supply device 11, the correction device 12, the material loading table 13, and the film transfer manipulator 14, the automatic pasting of the external thermal sensitive film and the external FPC plate is realized. The correction device 12 improves the accuracy of the pasting position. The upper die assembly 210 is provided with a plurality of pressure maintaining assemblies 22, and the lower die plate 2 of the lower die assembly 220 is provided with a plurality of lower protruding columns 261. One pressure maintaining assembly 22 cooperates with one lower protruding column 261, so that the bonding pressure of each thermal sensitive film and FPC plate is within a controllable range, further improving the firmness and stability of the bonding quality and improving the production efficiency.
[0062] Please refer to Figures 2-3 to 2-5 , the film supply device 11 includes a rack 111, a stripping assembly 112, and a transfer table 113 arranged in sequence;
[0063] The stripping assembly 112 includes a material supporting plate 1121, a material belt traction member 1122, a face paper collecting member 1123, and a bottom film collecting member 1124. The material supporting plate 1121 is arranged close to the transfer table 113. The material belt traction member 1122 is located below the material supporting plate 1121. The face paper collecting member 1123 is located above the material supporting plate 1121. The bottom film collecting member 1124 is located below the material supporting plate 1121. The initial state of the external thermal sensitive film is in the form of a roll. The thermal sensitive film is covered by face paper and bottom film. The single-layer thermal sensitive film is supported by the material supporting plate 1121. The material belt traction member 1122 pulls the single-layer thermal sensitive film to move. The thermal sensitive film, face paper, and bottom film are separated at the end of the material supporting plate 1121 away from the rack 111. The face paper is collected by the face paper collecting member 1123, and the bottom film is collected by the bottom film collecting member 1124. The thermal sensitive film enters the transfer table 113. The film transfer manipulator 14 adsorbs the thermal sensitive film located in the transfer table 113 and transfers it to the correction device 12 and the material loading table 13 to complete the correction and pasting procedures in sequence.
[0064] The material supporting plate 1121 comprises a suction disc 112a, a separation plate 112b and a pressing plate 112c. The separation plate 112b is arranged at the end of the suction disc 112a and close to the transfer table 113. The separation plate 112b is provided with a bottom inclined surface 112d. The pressing plate 112c is located directly above the separation plate 112b and is arranged with a gap between the separation plate 112b. Preferably, the number of suction discs 112a is two. The two suction discs 112a are arranged with a gap therebetween and are in a vacuum suction disc structure. One of the two suction discs 112a is arranged in an inclined manner, and the other is arranged in a horizontal manner. The horizontally arranged suction disc 112a is close to the transfer table 113. The two suction discs 112a arranged in the inclined and horizontal manners make the single-layer thermal sensitive adhesive tape in a tensioned state during the conveying process. The arrangement of the suction disc 112a makes the external single-layer thermal sensitive adhesive tape adsorbed on the upper surface of the suction disc 112a, avoiding the thermal sensitive adhesive tape from floating away from the surface of the suction disc 112a during the conveying process, causing the thermal sensitive film to twist and wrinkle during the peeling process from the face paper and the base film, improving the controllability of the flatness of the thermal sensitive film supply. The separation plate 112b is located at the end of the horizontally arranged suction disc 112a. The pressing plate 112c is installed directly above the separation plate 112b, so that the thermal sensitive adhesive tape passes between the separation plate 112b and the pressing plate 112c, further ensuring the stability of the supply direction. The lower surface of the separation plate 112b is the bottom inclined surface 112d. The thickness of the separation plate 112b is less than that of the suction disc 112a. Under the action of the bottom inclined surface 112d, the thermal sensitive film is quickly separated from the base film, and the peeling of the thermal sensitive film is completed.
[0065] Please refer to Figure 2-2 The correction device 12 comprises a first camera 121 and a second camera 122. The first camera 121 is arranged close to the film supply device 11 and below the film transfer manipulator 14. The second camera 122 is arranged on the film transfer manipulator 14 and above the material supporting table 13. The first camera 121 and the second camera 122 are of the same structure. The first camera 121 is arranged close to the transfer table 113. After the film transfer manipulator 14 adsorbs the peeled thermal sensitive film, the film transfer manipulator 14 moves to above the first camera 121. The first camera 121 collects the angle information of the thermal sensitive film and transmits the information to the control center. When the film transfer manipulator 14 moves to directly above the material supporting table 13, the second camera 122 collects the information of the external FPC board carried by the carrier 300 placed on the material supporting table 13 and transmits the information to the control center. The control center issues an instruction to the rotary driving member to control the angle of the vacuum material suction device of the film transfer manipulator 14, so as to accurately paste the thermal sensitive film on the surface of the FPC board, improving the controllability of the production quality.
[0066] The carrier table 13 is further provided with a first conveying member 15 and a first heating assembly 16. The carrier table 13 is fixedly connected with the first heating assembly 16 and located directly above the first heating assembly 16. The first conveying member 15 drives the first heating assembly 16 to move. The first conveying member 15 horizontally conveys the carrier table 13, completes the receiving and discharging of the external carrier 300, and the first heating assembly 16 is arranged to control the temperature of the carrier table 13, so that the external heat-sensitive film is pre-bonded with the FPC board at the optimal temperature.
[0067] Please refer to Figure 3-1 The holding machine 200 comprises a lifting assembly 230 and a second conveying member 240. The lifting assembly 230 drives the upper die assembly 210 to move longitudinally. The second conveying member 240 drives the lower die assembly 220 to move horizontally, realizes the receiving and discharging of the external carrier 300, drives the upper die assembly 210 to move, and realizes the closing and opening actions of the upper die assembly 210 and the lower die assembly 220.
[0068] Please refer to Figures 3-3 to 3-5 The fixing member 221 comprises an upper plate member 22a, a guide column 22b and a lower plate member 22c connected in sequence. The upper plate member 22a and the lower plate member 22c are arranged with a spacing. The pressure sensor 222 is connected with the upper plate member 22a. The pressure head 223 is slidingly connected with the lower plate member 22c. The arrangement of the upper plate member 22a, the guide column 22b and the lower plate member 22c protects the pressure sensor 222 and ensures the stability of the upward and downward movement direction of the pressure sensor 222. Preferably, the movable member 22z of the pressure head 223 is located above the lower plate member 22c and slidingly connected with the guide column 22b. The metal plate 22x is located below the lower plate member 22c, which further ensures the stability of the movement direction of the pressure head 223 and improves the balance of the pressure generated by the high-temperature-resistant member 22y and the upper convex column 261.
[0069] The pressure maintaining assembly 22 further comprises a buffer 224 and a micro-distance adjusting member 225, two ends of the buffer 224 are connected with a pressure sensor 222 and a pressure head 223 respectively, the micro-distance adjusting member 225 is in contact with the pressure sensor 222 and is arranged away from the pressure head 223, the buffer 224 comprises a column 22f and a first spring 22e, a movable member 22z is provided with a limiting hole for fixing the column 22f, the first spring 22e is sleeved outside the column 22f, the pressure sensor 222 is in contact with the first spring 22e, under the action of the first spring 22e, the pressure sensor 222 is prevented from instantaneously sensing a large pressure, and the possibility of misjudgment of the pressure is reduced, the mounting plate 21 is provided with a plurality of upper through holes 2101, the upper plate member 22a is provided with a lower through hole 2201, one upper plate member 22a is arranged in one upper through hole 2101, the center axis of one upper through hole 2101 coincides with the center axis of one lower through hole 2201, the micro-distance adjusting member 225 adopts a micrometer structure, the micro-distance adjusting member 225 is in contact with the pressure sensor 222 by penetrating one upper through hole 2101 and one lower through hole 2201, the pressure sensor 222 is longitudinally adjusted through the micro-distance adjusting member 225, and the precision of the pressure sensor 222 for sensing the surface pressure of the heat-sensitive film is further improved.
[0070] The pressure sensor 222 comprises a mounting seat 22m, a sensor 22n and a pressure disc 22t, the mounting seat 22m is arranged on the upper plate member 22a, the pressure disc 22t is in sliding connection with the guide column 22b, the sensor 22n is connected with the mounting seat 22m, the sensor 22n is in contact with the pressure disc 22t, the pressure disc 22t is connected with the buffer 224, and the micro-distance adjusting member 225 is in contact with the mounting seat 22m, preferably, the pressure sensor 222 further comprises a pressure sensing sheet 22k, the pressure sensing sheet 22k is arranged on the pressure disc 22t, the sensor 22n is in contact with the pressure sensing sheet 22k to improve the pressure sensing sensitivity, the pressure disc 22t is in sliding connection with the guide column 22b, the stability of the sliding direction of the pressure disc 22t is ensured, a blind hole is arranged on the pressure disc 22t, one end of the column 22f is in sliding connection with the blind hole, a second spring 22w is arranged between the pressure disc 22t and the mounting seat 22m, and the second spring 22w and the first spring 22e form a balanced force, so that the pressure disc 22t is in a stable state in a natural state.
[0071] Please refer to Figures 3-6 to 3-7The lower mold assembly 220 further comprises a bottom plate 23, a first heat insulation plate 24, a second heating assembly 25, a second heat insulation plate 27 and a temperature control inductor 28, which are sequentially arranged from bottom to top, the second heat insulation plate 27 is arranged on the side surface of the first heat insulation plate 24, the second heat insulation plate 27 is arranged on the side surface of the second heating assembly 25, the temperature control inductor 28 senses the temperature of the lower mold plate 26, the second conveying element 240 drives the bottom plate 23 to move, the second heating assembly 25 comprises a first plate body 251 and a plurality of heating rods 252, a plurality of shaft holes are arranged on the first plate body 251 along the length direction of the first plate body 251, one heating rod 252 is arranged in one shaft hole, the first plate body 251 is in a flat plate shape, the heating rods 252 are connected with an external power supply to convert electric energy into heat energy, the heating rods 252 are equidistantly arranged on the first plate body 251, so that the heat generated in the unit volume of the first plate body 251 is balanced, the first heat insulation plate 24 is synthesized by glass fiber material and high-heat-resistant composite material, the second heat insulation plate 25 is processed by heat insulation cotton, and the number of the second heat insulation plate 25 is two, the two second heat insulation plates 25 are respectively attached to the two side surfaces of the lower mold assembly 220 in the length direction, preferably, the second heat insulation plate 25 is attached to the side surface of the first heat insulation plate 22 and the second heating assembly 25, the heat generated by the second heating assembly 25 is effectively isolated from the external air, and the heat energy utilization rate of the second heating assembly 25 is further improved, the temperature control inductor 28 is used for instantaneously sensing the working temperature of the lower mold plate 26, and the working process temperature is further ensured to be controlled in a preset range, the number of the temperature control inductor 28 is two, the two temperature control inductors 28 respectively monitor the temperatures of the two ends of the lower mold plate 26 in the length direction, so that the overall working temperature of the lower mold plate 26 is in the preset range, and the stability of the processing quality is further ensured, preferably, each group of temperature control inductors 28 comprises a support 281 and an inductor 282, one end of the support 281 is connected with the bottom plate 23, the other end of the support 281 is located at the same horizontal plane as the lower mold plate 26 and is arranged at a distance from the lower mold plate 26, the inductor 282 is in an infrared temperature sensor structure, the inductor 282 is used for timely detecting the working temperature of the lower mold plate 26, so that the working position temperature of the lower mold plate 26 is ensured to be in a set range, and the inductor 282 is located obliquely above the heating assembly 3, so that the heat generated by the second heating assembly 25 does not affect the detection of the inductor 282, and the accuracy of the production process parameters is further ensured.
[0072] The above merely describes preferred embodiments of the present application, and for ordinary skilled in the art, according to the thought of the present application, the specific implementation manners and application ranges can be changed, and the content of the specification should not be understood as limiting the present application.
Claims
1. An FPC labeling and pressure-holding production line, comprising a labeling machine (100) and a pressure-holding machine (200), characterized in that: The labeling machine (100) includes a film supply device (11), a calibration device (12), a loading platform (13), and a film transfer robot (14), which moves back and forth between the film supply device (11), the calibration device (12), and the loading platform (13); The pressure holding machine (200) includes an upper mold assembly (210) and a lower mold assembly (220); The upper mold assembly (210) includes a mounting plate (21) and a plurality of pressure holding assemblies (22). Each pressure holding assembly (22) includes a fixing member (221), a pressure sensor (222), and a pressure head (223). The fixing member (221) is disposed on the mounting plate (21). One end of the pressure sensor (222) is connected to the fixing member (221). The pressure head (223) is slidably connected to the fixing member (221). The lower mold assembly (220) includes a lower template (26), which includes a plurality of lower protrusions (261). After the upper mold assembly (210) and the lower mold assembly (220) are closed, one of the pressure heads (223) presses against one of the lower protrusions (261), and one of the pressure sensors (222) is used to sense the pressure of one of the pressure heads (223) pressing against one of the lower protrusions (261).
2. The FPC labeling and pressure-holding production line according to claim 1, characterized in that: The film supply device (11) includes a material rack (111), a peeling assembly (112), and a transfer station (113) arranged in sequence; The peeling assembly (112) includes a material support plate (1121), a material belt traction component (1122), a face paper receiving component (1123), and a bottom film receiving component (1124). The material support plate (1121) is located near the transfer table (113). The material belt traction component (1122) is located below the material support plate (1121). The face paper receiving component (1123) is located above the material support plate (1121), and the bottom film receiving component (1124) is located below the material support plate (1121).
3. The FPC labeling and pressure-holding production line according to claim 2, characterized in that: The material support plate (1121) includes a suction cup (112a), a separation plate (112b) and a pressure plate (112c). The separation plate (112b) is located at the end of the suction cup (112a) and close to the transfer table (113). The separation plate (112b) has a bottom inclined surface (112d). The pressure plate (112c) is located directly above the separation plate (112b) and is spaced apart from the separation plate (112b).
4. The FPC labeling and pressure-holding production line according to claim 1, characterized in that: The calibration device (12) includes a first camera (121) and a second camera (122). The first camera (121) is located near the film supply device (11) and below the film transfer robot (14). The second camera (122) is located on the film transfer robot (14) and above the loading platform (13).
5. The FPC labeling and pressure-holding production line according to claim 1, characterized in that: The loading platform (13) is also provided with a first conveying component (15) and a first heating component (16). The loading platform (13) is fixedly connected to the first heating component (16) and located directly above the first heating component (16). The first conveying component (15) drives the first heating component (16) to move.
6. The FPC labeling and pressure-holding production line according to claim 1, characterized in that: The pressure holding machine (200) includes a lifting assembly (230) and a second conveying component (240). The lifting assembly (230) drives the upper mold assembly (210) to move longitudinally, and the second conveying component (240) drives the lower mold assembly (220) to move horizontally.
7. The FPC labeling and pressure-holding production line according to claim 1, characterized in that: The fixing member (221) includes an upper plate (22a), a guide post (22b), and a lower plate (22c) connected in sequence. The upper plate (22a) and the lower plate (22c) are spaced apart. The pressure sensor (222) is connected to the upper plate (22a), and the pressure head (223) is slidably connected to the lower plate (22c).
8. The FPC labeling and pressure-holding production line according to claim 7, characterized in that: The pressure holding assembly (22) further includes a buffer (224) and a micro-adjustment (225). The two ends of the buffer (224) are respectively connected to a pressure sensor (222) and a pressure head (223). The micro-adjustment (225) is positioned to abut against the pressure sensor (222) and away from the pressure head (223).
9. The FPC labeling and pressure-holding production line according to claim 8, characterized in that: The pressure sensor (222) includes a mounting base (22m), a sensor (22n), and a pressure plate (22t). The mounting base (22m) is disposed on the upper plate (22a). The pressure plate (22t) is slidably connected to the guide post (22b). The sensor (22n) is connected to the mounting base (22m) and abuts against the pressure plate (22t). The pressure plate (22t) is connected to the buffer (224). The micro-adjustment component (225) abuts against the mounting base (22m).
10. The FPC labeling and pressure-holding production line according to claim 6, characterized in that: The lower mold assembly (220) also includes a base plate (23), a first heat insulation plate (24), a second heating component (25), a second heat insulation plate (27), and a temperature control sensor (28). The base plate (23), the first heat insulation plate (24), the second heating component (25), and the lower mold template (26) are arranged sequentially from bottom to top. The second heat insulation plate (27) is located on the side surface of the first heat insulation plate (24) and on the side surface of the second heating component (25). The temperature control sensor (28) senses the temperature of the lower mold template (26). The second conveyor (240) drives the base plate (23) to move.