SMT (Surface Mount Technology) adhesive curing device

Abstract

The utility model relates to the technical field of SMT (Surface Mount Technology), in particular to an SMT adhesive curing device, which comprises a base, a sliding frame, an air box, a water cooling box, a heating assembly, an air supply assembly and an air source switching mechanism. A turntable and a bracket are arranged on the base, the carriage is slidably connected with the bracket, a linear module for driving the carriage to lift is arranged on the bracket, and the carriage is connected with a sealing cover; an upper chamber and a lower chamber are arranged in the air bellow, and a gas collecting hood is arranged on the air bellow; the water cooling box is arranged in the upper cavity, a coiled pipe and a refrigerator are arranged in the water cooling box, and the two ends of the coiled pipe are communicated with the outside and the gas collecting hood respectively; a snake-shaped channel is arranged in the lower cavity, the two ends of the snake-shaped channel are communicated with the outside and the gas collecting hood respectively, and the heating assembly is located in the snake-shaped channel; the gas supply assembly communicates with the gas collecting cover and the sealing cover; and the air source switching mechanism is connected with the air bellow. The device can quickly complete switching of cold air and hot air, the cross influence of the cold air and the hot air is small, and the curing efficiency is high.

Description

Technical Field

[0001] This utility model relates to the field of SMT (Surface Mount Technology) technology, and in particular to an SMT adhesive curing device. Background Technology

[0002] SMT (Surface Mount Technology) is an abbreviation for a series of processes performed on a PCB (Printed Circuit Board). SMT is one of the most popular technologies and processes in the electronics assembly industry. After placement, the components need to be cured using curing equipment.

[0003] The technical solution disclosed in Chinese Patent No. CN218244010U, through the setting of a control mechanism, enables the entire device to facilitate the heating and curing of the adhesive on the circuit board by a hair dryer by controlling the switch of the heating wire.

[0004] However, the device still has shortcomings: when the equipment switches from hot air to cold air, even if the heating wire is turned off, the residual heat on the surface of the heating wire takes a long time to dissipate, resulting in the subsequent output air being gradually cooled. This process takes a long time. Furthermore, when switching to the next set of curing operations, the heating wire needs to be turned on again from the off state and heated, which also takes a long time, thus making the curing efficiency of the entire equipment low. Utility Model Content

[0005] The purpose of this invention is to address the problems existing in the background technology by proposing an SMT adhesive curing device.

[0006] The technical solution of this utility model is: an SMT adhesive curing device, including a base, a turntable rotatably connected to the base, a support on the base, and a drive component A for driving the turntable to rotate on the support;

[0007] The carriage is slidably connected to the support frame, and the support frame is equipped with a linear module that drives the carriage to rise and fall. The carriage is connected to a sealing cover.

[0008] The bellows is connected to the base. A heat insulation plate is installed inside the bellows to divide the inner cavity of the bellows into an upper chamber and a lower chamber. An air collection hood is installed on the bellows.

[0009] The water-cooled box is located in the upper chamber. The water-cooled box is equipped with a serpentine tube and a cooler. The serpentine tube is located below the liquid surface, and its input end is connected to the outside. Its output end is connected to the inside of the gas collection hood.

[0010] The heating component has a serpentine channel formed by several intersecting partitions in the lower chamber. The input end of the serpentine channel is connected to the outside, and the output end of the serpentine channel is connected to the inside of the gas collection hood. The heating component is located inside the serpentine channel.

[0011] Gas supply assembly, which connects the gas collection hood and the sealing hood;

[0012] And a gas source switching mechanism, which is connected to the air box. When the gas source switching mechanism is supplying hot gas, it closes the inlet and outlet of the serpentine tube, and when the gas source switching mechanism is supplying cold gas, it closes the inlet and outlet of the serpentine channel.

[0013] Preferably, the turntable has several slots arranged in a circular array around its axis, and a tray is placed in each slot.

[0014] Preferably, an arc-shaped plate A is provided on the base, the arc surface of the turntable is slidably connected to the concave surface of the arc plate A, and an exhaust hole is provided on the arc plate A at the same height as the side opening of the slot.

[0015] Preferably, the opening of the sealing cover faces downward, a heat dissipation plate is provided inside the sealing cover, and each slot passes through the opening of the sealing cover in sequence while the turntable is rotating.

[0016] Preferably, the drive component A includes a central shaft and a motor A. The central shaft is coaxially connected to the turntable, and its two ends are rotatably connected to the base and the bracket, respectively. The body of the motor A is connected to the bracket, and the output end of the motor A is connected to the central shaft.

[0017] Preferably, the cooler includes a thermoelectric cooler chip, and a heat-conducting metal cover connected to its base plate is provided inside the water-cooled box. The cold end of the thermoelectric cooler chip is in contact with the inner wall of the heat-conducting metal cover, and the hot end of the thermoelectric cooler chip is connected to a heat-conducting rod. The heat-conducting rod is connected to heat dissipation fins, and the heat dissipation fins are inserted into a serpentine channel.

[0018] Preferably, the heating assembly includes a heating wire, a temperature sensor, and a controller. The heating wire is disposed in the serpentine channel and connected to the inner wall of the lower chamber. The temperature sensor is disposed in the serpentine channel and connected to its inner wall. Both the temperature sensor and the heating wire are electrically connected to the controller. The controller is electrically connected to the gas supply assembly and the gas source switching mechanism.

[0019] Preferably, two circular grooves are symmetrically arranged on the bellows, and two sets of through holes A and through holes B are symmetrically arranged on the bellows. The two through holes A in the upper layer are located above the heat insulation plate and are connected to the circular grooves on both sides. The two through holes B in the lower layer are located below the heat insulation plate and are connected to the circular grooves on both sides. The two ends of the serpentine tube are connected to the through hole A on the corresponding side, and the two ends of the serpentine channel are connected to the through hole B on the corresponding side. The gas collection hood covers the outside of one of the circular grooves, and a dustproof net is installed inside the opening of the circular groove on the other side.

[0020] Preferably, the air source switching mechanism includes an arc plate B, an arc plate C, and a drive assembly B. The drive assembly B includes a rotating shaft and a motor B. The rotating shaft is rotatably connected to the air box and the dust filter. The arc plate B and the arc plate C are both connected to the rotating shaft. The arc plate B and the arc plate C are respectively located in the circular grooves on the corresponding sides and are slidably connected to their inner walls. The body of the motor B is connected to the dust filter, and the output end of the motor B is connected to the rotating shaft.

[0021] Preferably, the air supply assembly includes a fan, an air extraction pipe at the input end of the fan, the input end of the air extraction pipe being inserted into and communicating with the inside of the air collection hood; an air outlet pipe at the output end of the fan, and an air inlet pipe communicating with the inside of the sealing cover, the air inlet pipe being inserted into the air outlet pipe and slidably connected to its inner wall.

[0022] Compared with the prior art, the present invention has the following beneficial technical effects:

[0023] By setting several slots on the turntable, with trays placed inside the slots, the circuit boards are positioned using the trays. The turntable is driven to rotate intermittently by drive component A, allowing each circuit board to pass sequentially from under the sealed cover, thereby improving the efficiency of circuit board loading, unloading, and curing. A wind box with upper and lower chambers is used, with the upper and lower chambers respectively handling air cooling and heating. An air source switching mechanism allows for different outputs. When hot air is needed, the mechanism closes only the upper chamber, allowing ambient air to flow along a serpentine channel and exchange heat with the heating wire, thus sending hot air into the sealed cover via a fan. When low-temperature air is needed, the mechanism closes only the lower chamber, allowing ambient air to flow along a serpentine tube and exchange heat with the coolant in the cooling chamber, lowering the air temperature. This low-temperature air is then blown onto the circuit boards, improving the cooling efficiency of the adhesive application process. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the structure of one embodiment of the present utility model;

[0025] Figure 2 This is a schematic diagram of the structure of the arc-shaped plate A;

[0026] Figure 3 A schematic diagram of the connection structure of the various components on the bellows;

[0027] Figure 4 This is a schematic diagram of the bellows structure;

[0028] Figure 5 This is a schematic diagram of the connection structure between the arc plate B and the arc plate C and the drive component B.

[0029] Reference numerals: 1. Base; 2. Turntable; 201. Slot; 202. Support plate; 3. Arc plate A; 301. Exhaust port; 4. Bracket; 5. Drive assembly A; 6. Carriage; 7. Linear module; 8. Sealing cover; 9. Air inlet pipe; 10. Air box; 1001. Upper chamber; 1002. Lower chamber; 1003. Circular groove; 1004. Through hole A; 1005. Through hole B; 11. Heat insulation plate; 12. Rotating shaft; 13. Arc plate B; 14. Arc plate C; 15. Dustproof net; 16. Motor B; 17. Gas collection hood; 18. Fan; 19. Exhaust pipe; 20. Exhaust pipe; 21. Water cooling box; 22. Serpentine tube; 23. Heat dissipation fins; 24. Partition plate; 25. Heating wire. Detailed Implementation

[0030] Example 1

[0031] like Figures 1-5As shown, this utility model proposes an SMT adhesive curing device, including a base 1, a slide 6, a bellows 10, a water-cooled box 21, a heating component, an air supply component, and an air source switching mechanism. A turntable 2 is rotatably connected to the base 1. Several slots 201 are arranged in a circular array around the turntable 2's axis, and a support plate 202 is placed within each slot 201. An arc-shaped plate A3 is mounted on the base 1. The arc surface of the turntable 2 is coaxially and slidably connected to the concave surface of the arc-shaped plate A3, and the arc-shaped plate A3 has exhaust holes 301 at the same height as the side openings of the slots 201. A bracket 4 is mounted on the base 1, and a driving component A5 for rotating the turntable 2 is mounted on the bracket 4. The driving component A5 includes a central shaft and a motor A. The central shaft is coaxially connected to the turntable 2, and its two ends are rotatably connected to the base 1 and the bracket 4, respectively. The motor A's body is connected to the bracket 4, and the motor A's output end is connected to the central shaft. The slide 6 is slidably connected to the support 4. A linear module 7 for driving the slide 6 to rise and fall is installed on the support 4. The slide 6 is connected to a sealing cover 8 with its opening facing downwards. A heat dissipation plate is installed inside the sealing cover 8. When the turntable 2 is rotating, each slot 201 passes through the opening below the sealing cover 8 in sequence. The air box 10 is connected to the base 1. A heat insulation plate 11 is installed inside the air box 10 to divide the inner cavity of the air box 10 into an upper chamber 1001 and a lower chamber 1002. An air collection hood 17 is installed on the air box 10. Two circular grooves 1003 are symmetrically arranged on the bellows 10, and two sets of through holes A1004 and B1005 are symmetrically arranged on the bellows 10. The two upper through holes A1004 are located above the heat insulation plate 11 and communicate with the circular grooves 1003 on both sides. The two lower through holes B1005 are located below the heat insulation plate 11 and communicate with the circular grooves 1003 on both sides. A gas collecting hood 17 is provided on the bellows 10, which covers the outside of one of the circular grooves 1003, and a dustproof net 15 is provided inside the opening of the other circular groove 1003. The water-cooled box 21 is located in the upper chamber 1001. A serpentine tube 22 is provided in the water-cooled box 21. The serpentine tube 22 is located below the liquid surface, and the inlet end of the serpentine tube 22 communicates with the outside. The two ends of the serpentine tube 22 are respectively connected to the through holes A1004 on the corresponding sides. The lower chamber 1002 is provided with a serpentine channel formed by several intersecting partitions 24. Both ends of the serpentine channel are connected to through holes B1005 on corresponding sides. The output end of the serpentine channel is connected to the interior of the gas collection hood 17. The heating assembly is located within the serpentine channel. The heating assembly includes a heating wire 25, a temperature sensor, and a controller. The heating wire 25 is located within the serpentine channel and connected to the inner wall of the lower chamber 1002. The temperature sensor is located within the serpentine channel and connected to its inner wall. Both the temperature sensor and the heating wire 25 are electrically connected to the controller. The controller is electrically connected to the gas supply assembly and the gas source switching mechanism. The gas supply assembly includes a fan 18. An extraction pipe 19 is installed at the input end of the fan 18. The input end of the extraction pipe 19 is inserted into the gas collection hood 17 and communicates with its interior.The output end of the fan 18 is provided with an air outlet pipe 20, and the sealing cover 8 is provided with an air inlet pipe 9 communicating with its interior. The air inlet pipe 9 is inserted into the air outlet pipe 20 and slidably connected to its inner wall. The air source switching mechanism includes an arc plate B13, an arc plate C14, and a drive assembly B. The drive assembly B includes a rotating shaft 12 and a motor B16. The rotating shaft 12 is rotatably connected to the air box 10 and the dustproof net 15. The arc plate B13 and the arc plate C14 are both connected to the rotating shaft 12. The arc plate B13 and the arc plate C14 are respectively located in the circular grooves 1003 on the corresponding sides and slidably connected to their inner walls. The body of the motor B16 is connected to the dustproof net 15, and the output end of the motor B16 is connected to the rotating shaft 12. The air source switching mechanism closes the inlet and outlet of the serpentine pipe 22 when supplying hot air, and closes the inlet and outlet of the serpentine channel when supplying cold air.

[0032] In this embodiment, the device is first powered on, and motor B16 is started. Motor B16 drives the rotating shaft 12 to rotate, which in turn drives the arc-shaped plate B13 and arc-shaped plate C14 to rotate, thereby closing the through hole B1005 and opening the through hole A1004. The heating wire 25 is started to preheat, and the circuit board to be cured is inserted into each slot 201. Motor A is started, and motor A drives the turntable 2 to rotate, so that the upper opening of one of the slots 201 is exactly below the opening of the sealing cover 8. The linear module 7 is started, and the linear module 7 presses down the sealing cover 8 to cover the upper opening of the slot 201. Then, motor B16 is started, and motor B16 drives the arc-shaped plate B13 and arc-shaped plate C14 to rotate, thereby closing the through hole A1005. 04. The through hole B1005 is closed and the fan 18 is started. The fan 18 draws the high-temperature air from the lower chamber 1002 and sends it into the sealing cover 8 to heat and cure the adhesive on the circuit board. After a certain period of time, the motor B16 automatically drives the arc plate B13 and arc plate C14 to rotate, so as to close the through hole B1005 and open the through hole A1004. At this time, the fan 18 draws the air from the upper chamber 1001 after it has been cooled by the coolant in the water cooling box 21 and blows it onto the circuit board to promote the cooling of the circuit board and the adhesive. During the cooling process, the linear module 7 slowly pulls up the sealing cover 8. After a certain period of time, the motor A drives the turntable 2 to rotate, and it has switched to the curing of the adhesive on the next circuit board.

[0033] Example 2

[0034] like Figure 3 As shown, the SMT adhesive curing device proposed in this utility model, compared with Embodiment 1, includes a cooler, the cooler including but not limited to a semiconductor cooling chip, a heat-conducting metal cover connected to its base plate is provided in the water-cooled box 21, the cold end of the semiconductor cooling chip is attached to the inner wall of the heat-conducting metal cover, the hot end of the semiconductor cooling chip is connected to a heat-conducting rod, the heat-conducting rod is connected to a heat dissipation fin 23, and the heat dissipation fin 23 is inserted into a serpentine channel.

[0035] In this embodiment, when the semiconductor cooling chip in the water-cooled box 21 is working, its cold end is transferred to the heat-conducting metal cover, and heat is exchanged between the heat-conducting metal cover and the coolant in the water-cooled box 21. At the same time, the hot end of the semiconductor cooling chip generates high temperature, and the heat is dissipated into the lower chamber 1002 by the heat-conducting rod and the heat dissipation fins 23. When hot air is needed, room temperature air enters the serpentine channel along the input end of the serpentine channel and preferentially exchanges heat with the heat dissipation fins 23. The heat dissipation fins 23 are cooled down, and the air is preheated. Then the preheated air is reheated by the heating wire 25 to reach the required temperature. This structure can effectively utilize the heat energy generated by the device itself and reduce the electrical energy required by the heating wire 25 to heat the air. At the same time, when cold air is needed, the lower chamber 1002 is closed, and the high temperature of the heat dissipation fins 23 is stored in the lower chamber 1002. If the curing time of each circuit board is long, the start-up time of the thermoelectric cooler can be set so that it starts when the curing of the previous circuit board is about to end, thus preventing the heat sink fins 23 from failing to dissipate heat in time and causing the thermoelectric cooler to shut down.

[0036] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited thereto. Various changes can be made within the scope of knowledge possessed by those skilled in the art without departing from the spirit of the present invention.

Claims

1. An SMT adhesive curing device, characterized in that, include A base (1) is provided with a turntable (2) that is rotatably connected to the base (1), a bracket (4) is provided on the base (1), and a drive assembly A (5) for driving the turntable (2) to rotate is provided on the bracket (4); The slide (6) is slidably connected to the bracket (4). A linear module (7) for driving the slide (6) to rise and fall is provided on the bracket (4). The slide (6) is connected to a sealing cover (8). A bellows (10) is connected to a base (1). A heat insulation plate (11) is installed inside the bellows (10) to divide the inner cavity of the bellows (10) into an upper chamber (1001) and a lower chamber (1002) through the heat insulation plate (11). A gas collection hood (17) is installed on the bellows (10). Water-cooled box (21) is installed in the upper chamber (1001). A serpentine tube (22) and a cooler are installed in the water-cooled box (21). The serpentine tube (22) is located below the liquid surface, and the input end of the serpentine tube (22) is connected to the outside. The output end of the serpentine tube (22) is connected to the inside of the gas collection hood (17). The heating component has a serpentine channel formed by several partitions (24) arranged in the lower chamber (1002). The input end of the serpentine channel is connected to the outside, and the output end of the serpentine channel is connected to the inside of the gas collection hood (17). The heating component is located inside the serpentine channel. An air supply assembly is connected to an air collection hood (17) and a sealing hood (8); And a gas source switching mechanism, which is connected to the air box (10). The gas source switching mechanism closes the inlet and outlet of the serpentine tube (22) when supplying hot gas, and closes the inlet and outlet of the serpentine channel when supplying cold gas.

2. The SMT adhesive curing device according to claim 1, characterized in that, Several slots (201) are arranged in a ring around the axis of the turntable (2), and a tray (202) is arranged in the slots (201).

3. The SMT adhesive curing device according to claim 2, characterized in that, An arc plate A (3) is provided on the base (1). The arc surface of the turntable (2) is slidably connected to the concave surface of the arc plate A (3) on the same axis. An exhaust hole (301) is provided on the arc plate A (3) at the same height as the side opening of the slot (201).

4. The SMT adhesive curing device according to claim 3, characterized in that, The opening of the sealing cover (8) faces downwards, and a heat-spreading plate is installed inside the sealing cover (8). When the turntable (2) is rotating, each slot (201) passes through the opening of the sealing cover (8) in sequence.

5. The SMT adhesive curing device according to claim 1, characterized in that, The drive assembly A (5) includes a central shaft and a motor A. The central shaft is coaxially connected to the turntable (2). The two ends of the central shaft are rotatably connected to the base (1) and the bracket (4) respectively. The body of the motor A is connected to the bracket (4), and the output end of the motor A is connected to the central shaft.

6. The SMT adhesive curing apparatus according to claim 1, characterized in that, The cooler includes a semiconductor cooling chip. A heat-conducting metal cover connected to its base plate is installed inside the water-cooled box (21). The cold end of the semiconductor cooling chip is in contact with the inner wall of the heat-conducting metal cover. The hot end of the semiconductor cooling chip is connected to a heat-conducting rod. The heat-conducting rod is connected to a heat dissipation fin (23). The heat dissipation fin (23) is inserted into a serpentine channel.

7. The SMT adhesive curing apparatus according to claim 1, characterized in that, The heating assembly includes a heating wire (25), a temperature sensor, and a controller. The heating wire (25) is located in the serpentine channel and connected to the inner wall of the lower chamber (1002). The temperature sensor is located in the serpentine channel and connected to its inner wall. Both the temperature sensor and the heating wire (25) are electrically connected to the controller. The controller is electrically connected to the gas supply assembly and the gas source switching mechanism.

8. The SMT adhesive curing device according to claim 1, characterized in that, Two circular grooves (1003) are symmetrically arranged on the bellows (10), and two sets of through holes A (1004) and through holes B (1005) are symmetrically arranged on the bellows (10). The two through holes A (1004) on the upper layer are located above the heat insulation plate (11) and are connected to the circular grooves (1003) on both sides. The two through holes B (1005) on the lower layer are located below the heat insulation plate (11) and are connected to the circular grooves (1003) on both sides. The two ends of the serpentine tube (22) are connected to the through holes A (1004) on the corresponding side, and the two ends of the serpentine channel are connected to the through holes B (1005) on the corresponding side. The gas collection hood (17) covers the outside of one of the circular grooves (1003), and a dustproof net (15) is provided inside the opening of the circular groove (1003) on the other side.

9. The SMT adhesive curing device according to claim 8, characterized in that, The air source switching mechanism includes an arc plate B (13), an arc plate C (14), and a drive assembly B. The drive assembly B includes a rotating shaft (12) and a motor B (16). The rotating shaft (12) is rotatably connected to the air box (10) and the dustproof net (15). The arc plate B (13) and the arc plate C (14) are both connected to the rotating shaft (12). The arc plate B (13) and the arc plate C (14) are respectively located in the circular groove (1003) on the corresponding side and are slidably connected to their inner walls. The body of the motor B (16) is connected to the dustproof net (15), and the output end of the motor B (16) is connected to the rotating shaft (12).

10. The SMT adhesive curing apparatus according to claim 1, characterized in that, The air supply assembly includes a fan (18), an air extraction pipe (19) is provided at the input end of the fan (18), the input end of the air extraction pipe (19) is inserted into the air collection hood (17) and communicates with its interior; an air outlet pipe (20) is provided at the output end of the fan (18), an air inlet pipe (9) is provided on the sealing cover (8) and communicates with its interior, the air inlet pipe (9) is inserted into the air outlet pipe (20) and is slidably connected to its inner wall.

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