Tin liquor impurity removal device for chip tin immersion process

Abstract

The utility model relates to a tin liquor impurity removal device for a chip tin immersion process, which comprises a stand and two groups of tin baths which are oppositely distributed on the top surface of the stand, one side of each tin bath is provided with a tin slag tank, the top surface of the stand on one side of each tin bath is provided with a tin scraping component, and the tin scraping components are used for cleaning tin oxide floating in the tin baths. According to the technical scheme, the tin scraping component extends into the tin bath and is used for removing tin oxide attached to the surface layer of tin liquid, then the tin oxide is pushed to the tin slag bath to be collected in a centralized mode, the process effectively prevents the tin oxide from being attached to the electronic element in the tin immersion operation, and therefore the tin immersion effect of the electronic element is remarkably improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip processing technology field, concretely relates to the tin liquid impurity removal device for chip tin immersion technology. BACKGROUND

[0002] In the assembly production process of electronic products, electronic components are usually installed on the PCB (printed circuit board) and then fixed on the PCB by welding. The commonly used welding methods include immersion welding, wave soldering and reflow soldering. For PCB with through-hole insertion, immersion welding is mainly used. Immersion welding is a method of immersing the PCB with inserted electronic components in a molten tin furnace to complete the welding of numerous solder joints at one time.

[0003] The operation process of immersion welding is as follows: 1. Put tin into the tin furnace and heat the tin furnace to melt the tin; 2. Apply flux to the soldering surface of the printed circuit board and the component pins, usually by immersing the soldering surface of the printed circuit board and the component pins in the flux solution or foam, or spraying the flux solution onto the soldering surface of the printed circuit board and the component pins through a spraying device; 3. Preheat to raise the temperature of the printed circuit board and component pins and dry the applied flux; 4. Immerse the soldering surface of the printed circuit board and the component pins in the molten tin in the tin furnace, contact the soldering surface of the printed circuit board and the component pins with the molten tin for a period of time, and then take them out. The tin will be welded to the soldering surface of the printed circuit board and the component pins, completing the welding process. 5. Perform pin cutting operation (cut off the excess pins of electronic components) on the welded printed circuit board.

[0004] Under the current process level, when the electronic component pins are immersed in molten tin and kept for a period of time, and then taken out, a layer of tin oxide residue will form on the surface of the tin furnace. If these tin oxide residues are not removed in time, they will adversely affect the subsequent tin immersion process of electronic components and reduce the tin immersion effect. CONTENT OF THE UTILITY MODEL

[0005] Therefore, the purpose of the utility model is to provide a tin liquid impurity removal device for chip tin immersion process to solve the problems raised in the background technology.

[0006] The utility model realizes the following technical solutions:

[0007] The tin liquid impurity removal device for chip tin immersion process includes a rack and two groups of tin slots installed on the top surface of the rack in opposite distribution. Characterized in that: a tin residue groove is installed on one side of each group of tin slots, and a tin scraping component is arranged on the top surface of the rack on one side of each group of tin slots. The tin scraping component is used to clean the floating tin oxide in the tin slot.

[0008] Further, the tin scraping member comprises a support, a first reciprocating pushing mechanism and a scraper, one end of the support is installed on the top surface of the rack, the other end extends upward, the first reciprocating pushing mechanism is transversely installed on the top surface of the support, and the scraper is installed on one side of the first reciprocating pushing mechanism and located above the notch of the tin tank.

[0009] Further, a second reciprocating pushing mechanism is vertically installed on the side of the support away from the tin residue tank, and the top surface of the second reciprocating pushing mechanism is connected with the first reciprocating pushing mechanism.

[0010] Further, a guide plate is arranged on the top surface of one side of the tin tank, and the guide plate and the tin residue tank are both installed on the same side of the tin tank and the guide plate is located above the tin residue tank.

[0011] Further, the tin dipping mechanism is installed on the top surface of the rack, and the tin dipping mechanism is used for clamping electronic components into the tin tank for tin dipping.

[0012] Further, the tin dipping mechanism comprises a movable seat, a mechanical arm and a clamping member, the movable seat is installed on the top surface of the rack, one end of the mechanical arm is connected with the movable seat, and the other end is connected with the clamping member.

[0013] Further, the clamping member comprises an installation plate, a mounting seat and two symmetrically distributed clamping plates, the installation plate is connected with the end of the mechanical arm away from the movable seat, the installation plate is provided with a mounting hole, the mounting seat is installed in the mounting hole, and the two clamping plates are slidingly fitted to the bottom surface of the mounting seat.

[0014] Further, the bottom surface of the mounting seat is provided with a sliding groove extending along the length direction of the mounting seat, the outer sides of the two clamping plates are both connected with a fixing plate, one end of the fixing plate is connected with the outer side of the clamping plate, the other end extends upward, the top surfaces of the two fixing plates are both installed with electric sliding blocks slidingly fitted to the sliding groove, and the two electric sliding blocks drive the two electric sliding blocks to move synchronously towards or away from each other along the sliding groove.

[0015] The beneficial effects of the utility model lie in:

[0016] The tin liquid impurity removal device for the chip tin dipping process, by the tin scraping member is inserted into the tin tank, used for removing the tin oxide attached to the surface of the tin liquid, and then pushing the tin oxide to the tin residue tank for centralized collection, this process effectively avoids the tin oxide from being attached to the electronic components in the tin dipping operation, thereby significantly improving the effect of the electronic component tin dipping.

[0017] The other advantages, objects and features of the utility model will be described in the subsequent specification to some extent, and to some extent, it will be obvious to those skilled in the art based on the study of the following text or can be taught from the practice of the utility model. The objects and other advantages of the utility model can be realized and obtained by the following specification. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 is a perspective view of the utility model;

[0019] Figure 2 is a schematic view of the tin scraping component structure of the utility model;

[0020] Figure 3 is a schematic view of the clamping component of the utility model;

[0021] Figure 4 is an exploded view of the clamping component of the utility model.

[0022] In the figure: 1, frame; 2, tin tank; 3, tin residue tank; 4, deflector;

[0023] 5, tin scraping component; 501, bracket; 502, first reciprocating pushing mechanism; 503, scraper; 504, second reciprocating pushing mechanism;

[0024] 6, tin immersion mechanism; 601, movable seat; 602, mechanical arm; 603, clamping component; 6031, mounting plate; 6032, mounting seat; 6033, mounting hole; 6034, clamping plate; 6035, sliding groove; 6036, fixed plate; 6037, electric sliding block. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be described clearly and completely below in combination with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, rather than all the embodiments. The components of the embodiments of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.

[0026] Therefore, the following detailed description of the embodiments of the utility model provided in the drawings is not intended to limit the scope of the claimed utility model, but only represents selected embodiments of the utility model. Based on the embodiments in the utility model, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of protection of the utility model.

[0027] It should be noted that: similar reference numbers and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0028] In the above description of the utility model, it needs to be explained that the terms "one side", "the other side" and the like indicate the orientation or position relationship based on the orientation or position relationship shown in the drawings, or the orientation or position relationship when the utility model product is usually placed, which is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the indicated device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the utility model. In addition, the terms "first", "second" and the like are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0029] In addition, the term "same" and the like do not mean that the components must be absolutely the same, but there can be slight differences. The term "vertical" only means that the position relationship between the components is more vertical than "parallel", and does not mean that the structure must be completely vertical, but can be slightly inclined.

[0030] Please refer to Figures 1-4 The utility model provides a technical scheme: a tin liquid impurity removal device for chip tin immersion process, including stand 1 and two groups of tin groove 2 of opposite distribution of installation in the top surface of stand 1, the tin residue groove 3 is installed to one side of two groups of tin groove 2, the top surface of stand 1 of one side of two groups of tin groove 2 is all provided with tin scraping member 5, and tin scraping member 5 is used to clean the tin oxide floating in tin groove 2.

[0031] First, the tin block is placed in the specially-made tin groove 2, then the tin groove 2 is heated, so that the tin block is gradually melted by heat, and finally changes into liquid tin, that is, tin liquid;

[0032] Then, the electronic component is immersed in the liquid tin to perform the tin immersion operation. In the tin immersion process, the surface of the liquid tin will inevitably be exposed to the air, thereby directly chemically contacting with oxygen, triggering an oxidation reaction. The oxidation does not only occur at the initial stage of the tin immersion, but also continuously occurs as new surfaces of the liquid tin are continuously exposed to the air during the tin immersion.

[0033] When the tin immersion process is completed, a layer of covering formed by the tin oxide generated during the tin immersion of the electronic component is observed on the surface of the liquid tin. The layer of tin oxide is a direct result of the chemical reaction between the tin liquid and the oxygen in the air. Therefore, before the next batch of electronic components is subjected to the tin immersion, the tin oxide floating on the surface of the liquid tin needs to be cleaned. The tin scraping member 5 is inserted into the tin groove 2 to remove the tin oxide attached to the surface of the liquid tin, and then the tin oxide is pushed to the tin residue groove 3 for collection. This process effectively avoids the attachment of the tin oxide to the electronic component during the tin immersion operation, thereby significantly improving the effect of the tin immersion of the electronic component.

[0034] The technical scheme, the tin scraping component 5 includes a support 501, a first reciprocating pushing mechanism 502 and a scraper 503, one end of the support 501 is installed on the top surface of the frame table 1, the other end extends upward, the first reciprocating pushing mechanism 502 is transversely installed on the top surface of the support 501, and the scraper 503 is installed on one side of the first reciprocating pushing mechanism 502 and located above the slot of the tin groove 2.

[0035] In the scheme, the output direction of the first reciprocating pushing mechanism 502 is the direction of the tin groove 2, and the first reciprocating pushing mechanism 502 drives the scraper 503 to reciprocate in the tin groove 2 synchronously when the first reciprocating pushing mechanism 502 reciprocates, and the first reciprocating pushing mechanism 502 can be a pneumatic cylinder or a hydraulic cylinder; in addition, one end of the scraper 503 is connected with the first reciprocating pushing mechanism 502, and the other end is inclined and attached to the inner wall of the tin groove 2.

[0036] When it is necessary to clean the oxidized tin floating on the surface of the liquid tin, the first reciprocating pushing mechanism 502 is started, the first reciprocating pushing mechanism 502 drives the scraper 503 to reciprocate along the direction of the slot of the tin groove 2, so as to scrape off the oxidized tin floating on the surface of the liquid tin and push the oxidized tin into the tin residue groove 3 for centralized collection.

[0037] In the embodiment, a second reciprocating pushing mechanism 504 is vertically installed on the side of the support 501 away from the tin residue groove 3, and the top surface of the second reciprocating pushing mechanism 504 is connected with the first reciprocating pushing mechanism 502.

[0038] Before the oxidized tin floating on the surface of the liquid tin is scraped off, the second reciprocating pushing mechanism 504 is first controlled to push upward, which can drive the first reciprocating pushing mechanism 502 and the scraper 503 to ascend synchronously until the bottom surface of the scraper 503 is higher than the surface of the liquid tin, then the first reciprocating pushing mechanism 502 is started, the first reciprocating pushing mechanism 502 drives the scraper 503 to move toward the side away from the tin residue groove 3 to the other end, then the second reciprocating pushing mechanism 504 is controlled to contract downward, which drives the first reciprocating pushing mechanism 502 and the scraper 503 to descend synchronously until the bottom surface of the scraper 503 contacts the surface of the liquid tin, then the first reciprocating pushing mechanism 502 is controlled again, the first reciprocating pushing mechanism 502 drives the scraper 503 to push the floating oxidized tin to contract toward the side close to the tin residue groove 3 until the oxidized tin is pushed into the tin residue groove 3.

[0039] The first reciprocating pushing mechanism 502 and the second reciprocating pushing mechanism 504 can be pneumatic cylinders or hydraulic cylinders.

[0040] In the embodiment, a flow guide plate 4 is arranged on the top surface of one side of the tin groove 2, the flow guide plate 4 and the tin residue groove 3 are both installed on the same side of the tin groove 2, and the flow guide plate 4 is located above the tin residue groove 3.

[0041] When the doctor blade 503 scrapes off the tin oxide in the tin tank 2, the tin oxide first stays on the top surface of the tin tank 2, and then falls into the tin residue tank 3 through the inclined angle of the guide plate 4.

[0042] In this embodiment, the tin immersion mechanism 6 is further included, which is installed on the top surface of the rack 1 and is used to clamp the electronic components into the tin tank 2 for tin immersion.

[0043] When the electronic components are immersed in tin, if manual immersion is used, not only the efficiency is slow, but also the workers are easily injured. Therefore, the electronic components can be immersed in tin by the tin immersion mechanism 6, so as to improve the immersion efficiency.

[0044] In this embodiment, the tin immersion mechanism 6 includes a movable seat 601, a mechanical arm 602 and a clamping member 603. The movable seat 601 is installed on the top surface of the rack 1. One end of the mechanical arm 602 is connected with the movable seat 601, and the other end is connected with the clamping member 603.

[0045] In this scheme, the mechanical arm 602 is a robot capable of simulating human arm movement, which is composed of multiple joints and actuators, and can complete various complex industrial operations through remote control of the controller. It is a mature technology in the prior art, and therefore will not be described in detail herein.

[0046] The staff controls the mechanical arm 602 to move to the position where the electronic components are placed, and then controls the clamping member 603 to clamp and fix the arranged electronic components, and finally controls the mechanical arm 602 to put the clamped electronic components into the tin tank 2 for tin immersion.

[0047] In this embodiment, the clamping member 603 includes an installation plate 6031, a mounting seat 6032 and two symmetrically distributed clamping plates 6034. The installation plate 6031 is connected with the end of the mechanical arm 602 away from the movable seat 601. The installation plate 6031 is provided with a mounting hole 6033. The mounting seat 6032 is installed in the mounting hole 6033. The two clamping plates 6034 are slidingly fitted to the bottom surface of the mounting seat 6032.

[0048] When the electronic components need to be clamped, the two clamping plates 6034 can adjust the spacing on the bottom surface of the mounting seat 6032, so as to facilitate clamping and releasing the electronic components.

[0049] In the embodiment, the bottom surface of the mounting base 6032 is provided with a sliding groove 6035 extending along the length direction of the mounting base 6032, and the outer sides of the two clamping plates 6034 are connected with fixed plates 6036, one end of each fixed plate 6036 is connected with the outer side of the clamping plate 6034, and the other end extends upward, the top surfaces of the two fixed plates 6036 are respectively provided with electric sliding blocks 6037 slidingly fitted in the sliding groove 6035, and the two electric sliding blocks 6037 drive the two electric sliding blocks 6037 to move synchronously towards or away from each other along the sliding groove 6035.

[0050] In use, the interval between the two clamping plates 6034 is adjusted by controlling the two electric sliding blocks to move synchronously towards or away from each other along the sliding groove 6035.

[0051] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application and are not limiting. Although the present application has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present application can be modified or replaced equivalently without departing from the spirit and scope of the present application, and all should be covered in the scope of the claims of the present application.

Claims

1. A tin solution impurity removal device for chip immersion tin process, comprising a rack (1) and two groups of tin grooves (2) oppositely distributed on the top surface of the rack (1), characterized in that: Two groups of tin tank (2) one side are equipped with tin residue tank (3), two groups of tin tank (2) one side's stand (1) top are provided with tin scraping component (5), tin scraping component (5) is used for cleaning tin tank (2) in floating tin oxide.

2. The tin solution purifying device for chip immersion tin process according to claim 1, characterized in that: The tin scraping component (5) includes a bracket (501), a first reciprocating pushing mechanism (502) and a scraper (503), one end of the bracket (501) is installed on the top surface of the stand (1), the other end extends upward, the first reciprocating pushing mechanism (502) is transversely installed on the top surface of the bracket (501), and the scraper (503) is installed on one side of the first reciprocating pushing mechanism (502) and above the slot of the tin tank (2).

3. The tin solution purifying device for chip immersion tin process according to claim 2, characterized in that: The bracket (501) is vertically installed with a second reciprocating pushing mechanism (504) on the side away from the tin residue tank (3), and the top surface of the second reciprocating pushing mechanism (504) is connected with the first reciprocating pushing mechanism (502).

4. The tin solution purifying device for chip immersion tin process according to claim 1, characterized in that: The top surface of one side of the tin tank (2) is provided with a flow guide plate (4), the flow guide plate (4) and the tin residue tank (3) are installed on the same side of the tin tank (2), and the flow guide plate (4) is above the tin residue tank (3).

5. The tin solution purifying device for chip immersion tin process according to any one of claims 1-4, characterized in that: It also includes a tin immersion mechanism (6), which is installed on the top surface of the stand (1), and the tin immersion mechanism (6) is used for clamping electronic components into the tin tank (2) for tin immersion.

6. The tin solution purifying device for chip immersion tin process according to claim 5, characterized in that: The tin immersion mechanism (6) includes a movable seat (601), a mechanical arm (602) and a clamping component (603), the movable seat (601) is installed on the top surface of the stand (1), one end of the mechanical arm (602) is connected with the movable seat (601), and the other end is connected with the clamping component (603).

7. The tin solution purifying device for chip immersion tin process according to claim 6, characterized in that: The clamping component (603) includes a mounting plate (6031), a mounting seat (6032) and two symmetrically distributed clamping plates (6034), the mounting plate (6031) is connected with the end of the mechanical arm (602) away from the movable seat (601), the mounting plate (6031) is provided with a mounting hole (6033), the mounting seat (6032) is installed in the mounting hole (6033), and the two clamping plates (6034) are slidingly fitted to the bottom surface of the mounting seat (6032).

8. The tin solution purifying device for chip immersion tin process according to claim 7, characterized in that: The bottom surface of the mounting seat (6032) is provided with a sliding groove (6035), the sliding groove (6035) extends along the length direction of the mounting seat (6032), the outer sides of the two clamping plates (6034) are connected with fixing plates (6036), one end of the fixing plate (6036) is connected with the outer side of the clamping plate (6034), and the other end extends upward, the top surfaces of the two fixing plates (6036) are provided with electric sliding blocks (6037) slidingly fitted in the sliding groove (6035), and the two electric sliding blocks (6037) drive the two electric sliding blocks (6037) to move synchronously towards or away from each other along the sliding groove (6035).

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