Tool clamp for chip mounting

Abstract

The utility model provides a work fixture for chip mounting, which belongs to the technical field of chip mounting, and comprises a base unit which comprises a first platform and a second platform, and the second platform is provided with a first slot for loading a lead frame; the substrate carrying disc unit is installed on the first platform, and a second open groove used for loading the insulating substrate is formed in the substrate carrying disc unit; the frame carrying disc unit is mounted on the substrate carrying disc unit, and a plurality of pin via holes for lead frame pins to penetrate through are formed in the frame carrying disc unit; and the cover plate unit covers the substrate carrying disc unit so as to cover the frame carrying disc unit. The four-layer separable structure is adopted, three processes of solder paste printing, chip mounting and reflow soldering can be compatible at the same time, the whole process does not need to transfer a carrier disc, and the insulating substrate and the lead frame are printed at the same time, so that the production cost is reduced, the production time is saved, the consumed time of the working procedure is short, and the four-layer separable structure is suitable for mass production.

Description

Technical Field

[0001] This utility model relates to the field of chip mounting technology, and in particular to a tooling fixture for chip mounting. Background Technology

[0002] Intelligent Power Modules (IPMs) typically employ a package structure that combines a leadframe and an insulating substrate. This means that the integrated circuit (IC) chip (low-voltage side) is mounted on the leadframe, while the power chip (high-voltage side) is mounted on the insulating substrate. This ensures sufficient insulation distance and achieves electrical isolation between the high and low voltage sides to meet safety regulations.

[0003] Chip mounting is a process that uses reflow soldering to mount chips and their lead frames onto an insulating substrate. For example... Figure 6 As shown, the insulating substrate 100 typically consists of three layers: upper, middle, and lower. The upper layer 101 and lower layer 103 are conductive layers, while the middle layer 102 is an insulating layer. Common insulating substrates include direct-bonding ceramic substrates (DBC), direct-plating ceramic substrates (DPC), and insulating metal substrates (IMS). The lead frame 200 is typically made of copper alloy. The lead frame 200 has frame positioning holes 201 and lead frame pins 202 for connecting to the upper surface of the insulating substrate 100.

[0004] The traditional process includes the following steps: 1) Place multiple insulating substrates into an insulating substrate carrier, ensuring the surface of the insulating substrates is flush with the surface of the carrier; 2) Solder paste printing: Place the insulating substrate carrier into a stencil printing machine to complete the solder paste printing process; 3) Chip mounting: Place the insulating substrate carrier into a chip mounting machine to complete the chip mounting process; 4) Carrier transfer: Transfer the chip-mounted insulating substrates to a reflow carrier; 5) Add lead frames: Position the lead frames using a lead frame carrier; 6) Cover with a reflow cover: A magnetic component ensures a tight connection between the reflow cover and the carrier, and the substrate is placed in a reflow oven to complete the reflow soldering process, resulting in a reflow soldered product; 7) Clean after reflow soldering; 8) Apply adhesive (silver paste) to the lead frame surface on the reflow soldered product, and then mount the chips; 9) Place in an oven for baking to cure the silver paste, resulting in a packaged semi-finished product.

[0005] However, due to the inherent flow characteristics of conductive silver paste, it is typically applied using a dispensing process, while solder paste is usually applied using a stencil printing process. Therefore, the traditional solution requires two steps: stencil printing and dispensing, which is complex and increases processing costs. Furthermore, conductive silver paste has poor thermal conductivity, leading to lower reliability of the packaged semi-finished product. Utility Model Content

[0006] To address the above technical problems, this utility model provides a tooling fixture for chip mounting.

[0007] The technical problem solved by this utility model can be achieved by the following technical solution:

[0008] A tooling fixture for chip mounting, comprising:

[0009] A base unit, comprising a first platform and a second platform, wherein the second platform has a first slot for mounting a lead frame;

[0010] A substrate carrier unit is mounted on a first platform of the base unit, and a second slot for loading an insulating substrate is provided on the substrate carrier unit.

[0011] A frame carrier unit is mounted on the substrate carrier unit, and the frame carrier unit is provided with a plurality of pin vias for lead frame pins to pass through.

[0012] A cover plate unit that covers the substrate carrier unit to enclose the frame carrier unit.

[0013] Preferably, the base unit and the substrate carrier unit are respectively provided with paired clamping components; and / or

[0014] The substrate carrier unit and the frame carrier unit are respectively provided with paired clamping components; and / or

[0015] The substrate carrier unit and the cover plate unit are respectively provided with a pair of clamping components.

[0016] Preferably, the clamping assembly includes a magnetic element and a fixing element for fixing the magnetic element.

[0017] Preferably, the second platform is provided with a first frame positioning pin, which cooperates with a frame positioning hole provided on the lead frame; and / or

[0018] The frame carrier unit is provided with a second frame positioning pin, which cooperates with the frame positioning hole provided on the lead frame.

[0019] Preferably, the base unit and the substrate carrier unit are respectively provided with mutually cooperating positioning components; and / or

[0020] The substrate carrier unit and the frame carrier unit are respectively provided with mutually cooperating positioning components; and / or

[0021] The substrate carrier unit and the cover plate unit are respectively provided with mutually cooperating positioning components.

[0022] Preferably, the positioning component includes a positioning pin and a positioning hole that cooperates with the positioning pin.

[0023] Preferably, the lower surface of the cover plate unit is provided with a crimping element, which abuts against the upper surface of the lead frame loaded in the frame carrier unit.

[0024] Preferably, the pressing element is any one of a rigid element, a flexible element, or a combination of a rigid element and a flexible element.

[0025] Preferably, the upper surface of the insulating substrate mounted in the second slot and the upper surface of the lead frame mounted in the first slot are coplanar, so that the insulating substrate and the lead frame are printed using the same printing process.

[0026] Preferably, the printing process uses any one of solder paste, silver paste, and copper paste.

[0027] The advantages or beneficial effects of this utility model's technical solution are as follows:

[0028] This utility model adopts a four-layer separable structure consisting of a base unit, a substrate carrier unit, a frame carrier unit, and a cover plate unit. It can simultaneously accommodate three processes: solder paste printing, chip mounting, and reflow soldering. The entire process does not require transferring the carrier, and the insulating substrate and lead frame are printed simultaneously, which reduces production costs, saves production time, and shortens the process time, making it suitable for mass production. Attached Figure Description

[0029] Figure 1 This is a schematic diagram showing the disassembled structure of the tooling fixture in a preferred embodiment of the present invention.

[0030] Figure 2 This is a schematic diagram of the assembly of the substrate carrier unit and the base unit in a preferred embodiment of the present invention.

[0031] Figure 3 In a preferred embodiment of this utility model, Figure 2 Enlarged schematic diagram of the clamping assembly at point A;

[0032] Figure 4 This is a schematic diagram of the structure after the insulating substrate and lead frame are loaded in a preferred embodiment of the present invention.

[0033] Figure 5 This is a schematic diagram of the chip mounting process in a preferred embodiment of the present invention.

[0034] Figure 6 This is a schematic diagram of the structure of the packaged semi-finished product in a preferred embodiment of the present invention.

[0035] Explanation of reference numerals in the attached figures:

[0036] 1. Base unit; 11. First platform; 111. First through hole; 12. Second platform; 121. First slot; 122. First frame positioning pin; 2. Substrate carrier unit; 21. Second slot; 22. Second through hole; 3. Frame carrier unit; 31. Pin through hole; 32. Second frame positioning pin; 4. Cover plate unit; 41. Pressing element; 5a, 5b, 5c. Clamping assembly; 51. Magnetic element; 52. Fixing element; 6a, 6b, 6c. Positioning assembly; 61. Positioning pin; 62. Positioning hole; 7. Solder layer; 8. Chip; 100. Insulating substrate; 101. Upper substrate layer; 102. Middle substrate layer; 103. Lower substrate layer; 200. Lead frame; 201. Frame positioning hole; 202. Lead frame pin. Detailed Implementation

[0037] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0038] It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0039] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, but this is not intended to limit the present invention.

[0040] It should be noted that, for clarity, the embodiments of the present invention are distinguished by clamping components 5a, 5b, and 5c, indicating that they are set at different positions in different units of the fixture. In fact, they can all be referred to as clamping components. Similarly, positioning components 6a, 6b, and 6c can also be referred to as positioning components.

[0041] Current chip mounting processes use solder layers to mount the insulating substrate and conductive silver paste to mount the leadframe. This requires two steps: stencil printing of the solder paste and dispensing of the conductive silver paste. The process is complex and increases costs. Furthermore, the poor thermal conductivity of the conductive silver paste leads to lower reliability of the packaged semi-finished product.

[0042] Based on this, this application proposes the following: by replacing the surface mount material on the lead frame with conductive silver paste or solder paste or silver paste (solder layer / silver solder layer), it is possible to achieve the following: using only one stencil printing process step, that is, to complete the solder paste printing on the insulating substrate and the lead frame simultaneously, thereby reducing process costs.

[0043] However, there are currently no tooling fixtures available for simultaneously printing stencils (solder paste, silver paste, or copper paste) on the lead frame and insulating substrate.

[0044] See Figure 1 In a preferred embodiment of this utility model, based on the above-mentioned problems existing in the prior art, a tooling fixture for chip mounting is provided, comprising:

[0045] The base unit 1 includes a first platform 11 and a second platform 12. The second platform 12 has a first slot 121 for loading the lead frame 200.

[0046] Substrate carrier unit 2 is mounted on the first platform 11 of the base unit 1. The substrate carrier unit 2 has a second slot 21 for loading the insulating substrate 100.

[0047] The frame carrier unit 3 is mounted on the substrate carrier unit 2. The frame carrier unit 3 is provided with a plurality of pin vias 31 for the lead frame pins 202 to pass through.

[0048] Cover plate unit 4 covers the substrate carrier unit 2 to cover the frame carrier unit 3.

[0049] Specifically, this utility model embodiment proposes a tooling fixture for simultaneous stencil printing on lead frames and insulating substrates. This tooling fixture employs a four-layer separable structure consisting of a base unit, a substrate carrier unit, a frame carrier unit, and a cover plate unit. Wherein:

[0050] The base unit 1 is used to mount the substrate carrier unit 2 and the lead frame 200. After the base unit 1 is positioned and engaged with the substrate carrier unit 2, the substrate carrier unit 2 is assembled on the first platform 11 of the base unit 1. Similarly, after the base unit 1 is positioned and engaged with the lead frame 200, the lead frame 200 is assembled in the first slot 121 on the second platform 12 of the base unit 1.

[0051] The substrate carrier unit 2 is used to load the insulating substrate 100, the frame carrier unit 3, and the cover plate unit 4. The substrate carrier unit 2 has an upward-opening second slot 21, within which the insulating substrate 100 is loaded. At this time, stencil printing can be performed simultaneously on the lead frame 200 and the insulating substrate 100, followed by chip mounting.

[0052] The frame carrier unit 3 is used to mount the lead frame 200. After the frame carrier unit 3 is positioned and engaged with the substrate carrier unit 2, the frame carrier unit 3 is assembled onto the substrate carrier unit 2. After assembly, the lead frame 200, which has been stencil printed in the first slot 121, is moved and mounted on the frame carrier unit 3. The lead frame pins 202 pass through the pin vias 31 and are mounted on the insulating substrate 100, which has been stencil printed.

[0053] The cover plate unit 4 is used to fix the insulating substrate 100 and the lead frame 200. After the cover plate unit 4 is positioned and engaged with the substrate carrier unit 2, the cover plate unit 4 is assembled on the substrate carrier unit 2. After assembly, the cover plate unit 4 covers the substrate carrier unit 2, forming a certain space to cover the frame carrier unit 3. The product within the covered space is then reflow soldered to prepare a packaged semi-finished product.

[0054] This fixture can simultaneously support three processes: stencil printing, chip mounting, and reflow soldering. The entire process does not require transferring the carrier tray, and the insulating substrate and lead frame are printed at the same time. This reduces the steps of applying silver paste, chip mounting, and baking on the lead frame, thereby lowering production costs, saving production time, and making it suitable for mass production.

[0055] In a preferred embodiment, the base unit 1 and the substrate carrier unit 2 are respectively provided with a pair of clamping components 5a.

[0056] Specifically, in this embodiment, the clamping assembly 5a is used to securely fix the substrate carrier unit 2 onto the base unit 1. Specifically, the clamping assembly 5a includes a magnetic element 51 and a fixing element 52 for fixing the magnetic element 51.

[0057] The magnetic element 51 can be a magnet, which can ensure a tight fit between the substrate carrier unit 2 and the base unit 1.

[0058] Furthermore, the fixing element 52 is an elastic element, preferably a metal elastic element, such as a spring sheet, which can fix the magnetic element 51 and at the same time provide a certain elastic buffer to adapt to substrate carrier units 2 of different thicknesses.

[0059] In a preferred embodiment, the substrate carrier unit 2 and the frame carrier unit 3 are respectively provided with a pair of clamping components 5b.

[0060] In a preferred embodiment, the substrate carrier unit 2 and the cover plate unit 4 are respectively provided with a pair of clamping components 5c.

[0061] Similarly, clamping components 5b and 5c are provided between the substrate carrier unit 2 and the frame carrier unit 3, and between the substrate carrier unit 2 and the cover plate unit 4, respectively. The structures of clamping components 5b and 5c are the same as those of clamping component 5a.

[0062] In this embodiment, the units are tightly connected to each other by magnetic elements 51, ensuring the stability of the entire tooling fixture.

[0063] In a preferred embodiment, the second platform 12 is provided with a first frame positioning pin 122, which cooperates with the frame positioning hole 201 provided on the lead frame 200.

[0064] Specifically, in this embodiment, a first frame positioning pin 122 is provided on the second platform 12. The positioning pin cooperates with the frame positioning hole 201 provided on the lead frame 200 to ensure the alignment and positioning of the lead frame 200 on the base unit 1.

[0065] In a preferred embodiment, the frame carrier unit 3 is provided with a second frame positioning pin 32, which cooperates with the frame positioning hole 201 provided on the lead frame 200.

[0066] Similarly, a second frame positioning pin 32 is also provided on the frame carrier unit 3. This positioning pin also cooperates with the frame positioning hole 201 on the lead frame 200 to ensure the alignment and positioning of the lead frame 200 on the frame carrier unit 3.

[0067] The frame positioning hole 201 is a through hole, which facilitates the alignment, insertion, and positioning of the positioning pin.

[0068] Specifically, at least two sets of positioning pins and positioning holes should be formed between the lead frame 200 and the second platform 12 of the base unit 1. Similarly, at least two sets of positioning pins and positioning holes should also be formed between the lead frame 200 and the frame carrier unit 3.

[0069] In a preferred embodiment, the base unit 1 and the substrate carrier unit 2 are respectively provided with positioning components 6a that cooperate with each other.

[0070] Specifically, in order to ensure the positioning and locking between each unit, in this embodiment, the positioning component 6a is used to lock the base unit 1 and the substrate carrier unit 2 in the horizontal direction, so as to prevent the substrate carrier unit 2 from moving horizontally after it is attracted to the base unit 1.

[0071] Specifically, the positioning component 6a includes a positioning pin 61 and a positioning hole 62 that cooperates with the positioning pin 61. The positioning pin 61 is a post protruding from the base unit 1, while the positioning hole 62 is a groove formed on the substrate carrier unit 2 that matches the positioning pin 61. When the positioning pin 61 is inserted into the positioning hole 62, the positioning engagement between the base unit 1 and the substrate carrier unit 2 is achieved through the positioning pin 61 and the positioning hole 62.

[0072] In a preferred embodiment, the substrate carrier unit 2 and the frame carrier unit 3 are respectively provided with positioning components 6b that cooperate with each other.

[0073] In a preferred embodiment, the substrate carrier unit 2 and the cover plate unit 4 are respectively provided with positioning components 6c that cooperate with each other.

[0074] Similarly, positioning components 6b and 6c are respectively provided between the substrate carrier unit 2 and the frame carrier unit 3, and between the substrate carrier unit 2 and the cover plate unit 4. The structure of these positioning components is the same as that of positioning component 6a, ensuring the precise assembly of the entire tooling fixture.

[0075] In a preferred embodiment, the lower surface of the cover plate unit 4 is provided with a pressing element 41, which abuts against the upper surface of the lead frame 200 loaded in the frame carrier unit 3.

[0076] In a preferred embodiment, the pressing element 41 is any one of a rigid element, a flexible element, or a combination of a rigid element and a flexible element.

[0077] Specifically, in this embodiment, the crimping element 41 can be a rigid element, such as a push rod. Alternatively, it can be a flexible element, such as a spring pin, whose flexibility prevents damage to the lead frame 200 when it abuts against the upper surface of the lead frame 200. It can also be a combination of rigid and flexible elements; for example, the flexible element of the combination is located near the frame carrier unit to abut against the upper surface of the lead frame.

[0078] In a preferred embodiment, the upper surface of the insulating substrate 100 mounted in the second slot 21 is coplanar with the upper surface of the lead frame 200 mounted in the first slot 121, so that the insulating substrate 100 and the lead frame 200 are printed using the same printing process.

[0079] Specifically, after the insulating substrate 100 and the lead frame 200 are loaded, their upper surfaces are on the same plane P1 as the upper surface of the substrate carrier unit 2 and the upper surface of the second platform 12, so that the same stencil printing process can be used on the insulating substrate 100 and the lead frame 200.

[0080] In a preferred embodiment, the printing process uses any one of solder paste, silver paste, and copper paste.

[0081] Specifically, in the existing chip mounting process, the lead frame is made of conductive silver paste. However, the thermal conductivity of conductive silver paste is <10W / mk, which has poor thermal conductivity and leads to poor reliability of the packaged semi-finished product.

[0082] In this embodiment, both the insulating substrate 100 and the lead frame 200 contain solder paste as the patch material. The thermal conductivity of the solder paste is >60W / mk. Compared with the thermal conductivity of conductive silver paste, the thermal resistance of the solder paste is smaller and the reliability is better.

[0083] In this embodiment, solder paste is just an example and is not limited to it. It can be changed to silver paste, copper paste, or other metal stencil printing materials as needed.

[0084] Furthermore, a second through hole 22 is provided vertically through the bottom of the second slot 21. A first through hole 111 is also provided vertically through the first platform, with the first through hole 111 and the second through hole 22 corresponding one-to-one. The first through hole 111 and the second through hole 22 are compatible with the vacuum bosses of the stencil printing process equipment and the chip mounting process equipment.

[0085] During the production process, the vacuum bosses of the stencil printing equipment and the chip mounting equipment will lift up and pass through the first through hole 111 and the second through hole 22 in sequence to adsorb the insulating substrate 100 loaded in the second slot 21, so as to ensure that the insulating substrate 100 will not shake during the entire production process.

[0086] The tooling fixture for chip mounting according to this embodiment of the utility model is used as follows:

[0087] First, assemble the substrate carrier unit 2: Based on the base unit 1, the substrate carrier unit 2 is assembled on the first platform 11 of the base unit 1 by positioning pins and positioning holes, and clamped by magnetic element 51.

[0088] After assembly, the upper surface of the substrate carrier unit 2 and the upper surface of the second platform 12 of the base unit 1 are on the same plane.

[0089] Then, the insulating substrate 100 and the lead frame 200 are loaded: the insulating substrate 100 is loaded into the second slot 21 on the substrate carrier unit 2; at the same time, the frame positioning hole 201 of the lead frame 200 is positioned and engaged with the first frame positioning pin 122 on the base unit 1, and the lead frame 200 is mounted on the base unit 1.

[0090] For ease of explanation, this embodiment uses solder paste (solder layer) as an example;

[0091] Then, solder paste printing: On the solder paste printing equipment, the insulating substrate 100 and the lead frame 100 are simultaneously subjected to the solder paste printing process.

[0092] Then, chip mounting: Chip mounting is performed after solder paste printing; the schematic diagram only shows one chip, but in reality, there can be multiple chips.

[0093] Then, the frame carrier unit 3 is assembled: the frame carrier unit 3 is assembled onto the substrate carrier unit 2 by the positioning engagement of the positioning pins and positioning holes between the frame carrier unit 3 and the substrate carrier unit 2.

[0094] The frame carrier unit 3 can be installed manually or automatically, for example, by vacuum adsorption by a robotic arm to install the frame carrier unit 3 onto the substrate carrier unit 2.

[0095] Then, the frame is transferred: the lead frame 200 after chip mounting is installed on the frame carrier unit 3 by the positioning engagement of the second frame positioning pin 32 on the frame carrier unit 3 and the frame positioning hole 201 on the lead frame 200.

[0096] The lead frame 200 after chip mounting is transferred and installed on the frame carrier unit 3 by manual or automated means (such as vacuum adsorption by a robotic arm).

[0097] Then, install the cover plate unit: through the positioning fit between the positioning hole on the substrate carrier unit 2 and the positioning pin of the cover plate unit, install the cover plate unit 4 on the substrate carrier unit 2 by manual or automated means.

[0098] Then, reflow soldering: the assembly (including substrate carrier unit 2 + frame carrier unit 3 + cover plate unit 4) is removed from the base unit 4 and then placed into the reflow oven for reflow soldering; after the reflow soldering is completed, the cover plate unit 4 is removed to obtain the reflow soldered packaged semi-finished product.

[0099] Finally, cleaning: The encapsulated semi-finished product obtained from reflow soldering is cleaned. The structure of the encapsulated semi-finished product is as follows. Figure 6 As shown.

[0100] The tooling fixture proposed in this embodiment can be applied to the packaging process of intelligent power modules (IPMs), currently, but not limited to this application.

[0101] The advantages or beneficial effects of the above technical solution are as follows: This utility model adopts a four-layer separable structure consisting of a base unit, a substrate carrier unit, a frame carrier unit, and a cover plate unit, which can simultaneously accommodate three processes: solder paste printing, chip mounting, and reflow soldering. The entire process does not require transferring the carrier, and the insulating substrate and lead frame are printed simultaneously, which reduces production costs, saves production time, and has a short process time, making it suitable for mass production.

[0102] The above are merely preferred embodiments of the present utility model and are not intended to limit the implementation methods and protection scope of the present utility model. Those skilled in the art should realize that any equivalent substitutions and obvious changes made using the content of this specification and illustrations should be included within the protection scope of the present utility model.

Claims

1. A tooling fixture for chip mounting, characterized in that, include: A base unit, comprising a first platform and a second platform, wherein the second platform has a first slot for mounting a lead frame; A substrate carrier unit is mounted on a first platform of the base unit, and a second slot for loading an insulating substrate is provided on the substrate carrier unit. A frame carrier unit is mounted on the substrate carrier unit, and the frame carrier unit is provided with a plurality of pin vias for lead frame pins to pass through. A cover plate unit that covers the substrate carrier unit to enclose the frame carrier unit.

2. The tooling fixture according to claim 1, characterized in that, The base unit and the substrate carrier unit are respectively provided with paired clamping components; and / or The substrate carrier unit and the frame carrier unit are respectively provided with paired clamping components; and / or The substrate carrier unit and the cover plate unit are respectively provided with a pair of clamping components.

3. The tooling fixture according to claim 2, characterized in that, The clamping assembly includes a magnetic element and a fixing element for fixing the magnetic element in place.

4. The tooling fixture according to claim 3, characterized in that, The second platform is provided with a first frame positioning pin, which cooperates with the frame positioning hole provided on the lead frame; and / or The frame carrier unit is provided with a second frame positioning pin, which cooperates with the frame positioning hole provided on the lead frame.

5. The tooling fixture according to claim 1, characterized in that, The base unit and the substrate carrier unit are respectively provided with mutually cooperating positioning components; and / or The substrate carrier unit and the frame carrier unit are respectively provided with mutually cooperating positioning components; and / or The substrate carrier unit and the cover plate unit are respectively provided with mutually cooperating positioning components.

6. The tooling fixture according to claim 5, characterized in that, The positioning component includes a positioning pin and a positioning hole that cooperates with the positioning pin.

7. The tooling fixture according to claim 1, characterized in that, The lower surface of the cover plate unit is provided with a crimping element, which abuts against the upper surface of the lead frame loaded in the frame carrier unit.

8. The tooling fixture according to claim 7, characterized in that, The pressing element is any one of a rigid element, a flexible element, or a combination of a rigid element and a flexible element.

9. The tooling fixture according to claim 1, characterized in that, The upper surface of the insulating substrate mounted in the second slot is coplanar with the upper surface of the lead frame mounted in the first slot, so that the insulating substrate and the lead frame are printed using the same printing process.

10. The tooling fixture according to claim 9, characterized in that, The printing process uses any one of solder paste, silver paste, and copper paste.

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