Corner cutting device of wafer laminator

Abstract

The utility model discloses a wafer laminator corner cutting device which comprises a wafer, a wafer cutter, a V-groove cutter assembly, a lifting assembly and a mounting plate, the wafer is arranged in a laminator, the wafer cutter is movably arranged around the edge of the wafer, the V-groove cutter assembly is arranged on the lifting assembly, the lifting assembly is arranged on the mounting plate, and the wafer cutter is movably arranged around the edge of the wafer. The mounting plate is arranged in the film pressing machine, the lifting assembly drives the V-groove cutter assembly to move up and down to cut off the V-groove in the wafer at a time, the V-groove cutter assembly is arranged to directly cut off the V-groove in the wafer, and the cutter set does not rotate for multiple times to adjust the angle to cut off the V-groove. In one embodiment, the V-shaped groove cutter assembly is arranged, the lifting assembly is arranged to drive the V-shaped groove cutter assembly to conduct cutting, the lifting distance can be set in a targeted mode according to different wafer thicknesses, in another embodiment, the specification of a triangular slice formed by the movable blade is adjusted according to the specification of the V-shaped groove, and therefore cutting of the V-shaped grooves of different specifications is achieved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to wafer cutting angle device technical field, specifically relates to a wafer film press cutting angle device. BACKGROUND

[0002] Wafer refers to the silicon wafer used for making silicon semiconductor integrated circuit, and is called wafer because of its circular shape. Various circuit element structures can be processed on the silicon wafer to become integrated circuit products with specific electrical properties.

[0003] The wafer must be pressed to perform subsequent exposure, development and other processes. In the film pressing process, a single chip is first placed on a substrate treated with temporary bonding material or thermal release tape (TRT), and then an epoxy resin molding compound (EMC) is used for molding and curing, and then the excess film on the edge of the wafer is cut.

[0004] The notch of the silicon wafer is a physical cut for identifying the direction of the wafer, usually V-shaped or U-shaped, located at the bottom of the edge of the silicon wafer, accurate in position and easy to read by the machine. This feature is common in 8, 12 and 18 inch wafers, and is used to replace the flat edge (flat) used on earlier smaller size wafers. After the silicon ingot is made, a flat corner is cut on the silicon ingot below 200mm, called Flat (flat groove). On silicon ingots above 200mm, in order to reduce waste, only a V-shaped small notch is cut, called Notch (V-groove), and the V-groove also needs to be cut off after film pressing.

[0005] The Chinese patent with application number 202220683571.X provides a wafer auxiliary cutting device and a wafer film press. The patent wafer auxiliary cutting device includes a positioning table, a bearing, an inner ring of the bearing capable of accommodating a wafer, a cutter block connected with the inner ring of the bearing, and a cutter assembly connected with the cutter block, the cutter assembly including a cutter head for cutting the edge film of the wafer. The patent wafer auxiliary cutting device can replace the way of cutting the film of the wafer by the operator holding the cutter, improving the cutting accuracy, but it is difficult to cut off the V-groove on the wafer in one cut when cutting the circle, and it is often cut by the cutter of the film cutting machine, and needs to be transferred to the next corner cutting mechanism for corner cutting. UTILITY MODEL CONTENTS

[0006] The utility model aims to provide a wafer film press cutting angle device, and the technical problem to be solved is that the V-groove on the wafer in the prior art is difficult to cut off in one cut when cutting the circle, and it is often cut by the cutter of the film cutting machine, and needs to be transferred to the next corner cutting mechanism for corner cutting.

[0007] To achieve the above-mentioned purpose, the utility model provides the following technical scheme:

[0008] The utility model provides a kind of wafer film press cutting angle device, including wafer, wafer cutter, V groove cutter assembly and lifting assembly and mounting plate, the wafer is arranged in film press, the wafer cutter is movably arranged around the edge of wafer, the V groove cutter assembly is arranged on the lifting assembly, the lifting assembly is arranged on mounting plate, the mounting plate is arranged in film press interior, the lifting assembly drives V groove cutter assembly to move up and down and removes V groove on wafer once.

[0009] V groove cutter assembly is arranged to remove V groove on wafer directly, not knife group multiple rotation angle adjustment removal, and removal is carried out by lifting assembly driving V groove cutter assembly, and lifting distance can also be set according to different wafer thickness.

[0010] Optionally, the lifting assembly includes a lifting cylinder, a lifting slider, and an L-shaped fixed plate. The lifting cylinder is fixedly arranged on the mounting plate. The lifting slider is slidingly arranged on the lifting cylinder. The L-shaped fixed plate is fixed on the lifting slider. The lifting slider is slidingly connected to the lifting cylinder, thereby realizing the up-and-down sliding of the L-shaped fixed plate.

[0011] Optionally, the V groove cutter assembly includes a fixed knife and a moving knife. The fixed knife is fixedly arranged at the end of the mounting plate. The moving knife is fixedly arranged on the L-shaped fixed plate. The mounting plate is L-shaped. The fixed knife is in the projection direction of the moving knife. The wafer is placed between the fixed knife and the moving knife. By arranging the moving knife and the fixed knife, the wafer is placed on the fixed knife. The moving knife is lowered to cut along the fixed knife, thereby removing the V groove of the wafer.

[0012] Optionally, the device further includes a variable-diameter module. The variable-diameter module is fixedly arranged in the film press. The wafer cutter is movably arranged on the variable-diameter module to change the rotation radius of the wafer cutter. By arranging the variable-diameter module, the rotation radius of the wafer cutter is changed, thereby realizing the shearing of wafers of different specifications.

[0013] Optionally, the variable-diameter module includes a variable-diameter cylinder and a variable-diameter slider. The variable-diameter cylinder is fixedly arranged in the film press. The variable-diameter slider is slidingly arranged on the variable-diameter cylinder. The wafer cutter is fixedly connected to the variable-diameter slider through a plate.

[0014] Optionally, the V groove cutter assembly includes a moving blade, a bearing table, and a sliding assembly. The moving blade is movably arranged on the sliding assembly in a V shape. The bearing table is arranged at the end of the mounting plate to support the wafer. The sliding assembly is arranged at the end of the L-shaped fixed plate. The wafer is located between the fixed knife and the moving knife. By arranging the moving blade in a V shape, the caliber of the moving blade is adjustable.

[0015] Optionally, the sliding assembly comprises a pair of screws, a pair of connecting nuts and a plug-in limiting head, the pair of screws are movably embedded in the end of the L-shaped fixing plate, the pair of connecting nuts are threadedly connected on each screw, the V-shaped moving blade is fixed on each connecting nut, and the plug-in limiting head is plug-in inserted into each screw.

[0016] Compared with the prior art, the wafer film press corner cutting device has the following beneficial effects:

[0017] 1. The wafer film press corner cutting device directly cuts the V-groove on the wafer through the V-groove cutter assembly, and the V-groove cutter assembly is driven to cut by the lifting assembly, and the lifting distance can be set according to the thickness of the wafer, and the wafer V-groove is cut by the moving knife and the fixed knife.

[0018] 2. The wafer film press corner cutting device can adjust the triangular cutting piece formed by the moving blade according to the size of the V-groove, so that the V-groove of different sizes can be cut, and the rotating radius of the wafer cutter can be changed through the variable diameter module, so that the wafer of different sizes can be cut. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 It is a side structure schematic view of the utility model;

[0020] Figure 2 It is a front structure schematic view of the utility model;

[0021] Figure 3 It is an enlarged schematic view of the related structure of the lifting assembly of the utility model;

[0022] Figure 4 It is an enlarged schematic view of the related structure of the lifting assembly of another embodiment of the utility model;

[0023] Figure 5 It is a Figure 4 enlarged schematic view of the structure at A of the utility model.

[0024] In the figure: 1-wafer, 2-wafer cutter, 3-v-groove cutter assembly, 31-fixed knife, 32-moving knife, 33-moving blade, 34-carriage, 35-screw, 36-connection nut, 37-insertion limiting head, 4-lifting assembly, 41-lifting cylinder, 42-lifting slider, 43-L-shaped fixed plate, 5-diameter changing module, 51-diameter changing cylinder, 52-diameter changing slider, 6-mounting plate. DETAILED DESCRIPTION

[0025] The utility model will be described further below with reference to the drawings. The following examples are only used to illustrate the technical scheme of the utility model more clearly, and cannot be used to limit the protection scope of the utility model. Example one

[0026] As Figures 1 to 3 shown, a wafer film pressing machine corner cutting device is provided, which comprises a wafer 1, a wafer cutter 2, a V-groove cutter assembly 3 and a mounting plate 6. In this embodiment, the wafer 1 has a notch mark physical cutout, which is preferably a V-shaped groove and is located at the circumferential edge of the wafer 1. The wafer 1 is placed in the film pressing machine 1. The wafer cutter 2 is arranged to fit the edge of the wafer 1. In this embodiment, the mounting plate 6 is fixed inside the film pressing machine and is preferably in an L-shaped structure. The V-groove cutter assembly 3 is fixed on the mounting plate 6.

[0027] In use, the V-groove assembly 3 in this embodiment is preferably located directly above the V-shaped groove on the wafer 1. By controlling the downward movement of the blade in the V-groove assembly 3, the wafer 1 placed below can be cut off.

[0028] As Figure 1 and Figure 2 shown, the diameter changing module 5 is also included in this embodiment. The diameter changing module 5 comprises a diameter changing cylinder 51 and a diameter changing slider 52. The diameter changing cylinder 51 is fixed inside the film pressing machine, and the diameter changing slider 52 is slidingly connected to the diameter changing cylinder 51. The wafer cutter 2 in this embodiment is fixed to the diameter changing slider 52 by means of bolts and plates in the prior art. By adjusting the position of the diameter changing slider 52 under the action of the diameter changing cylinder 51, the turning radius of the wafer cutter 2 can be changed, thereby enabling the wafer 1 of different specifications to be cut off.

[0029] As Figure 1 and Figure 3 shown, the lifting assembly 4 in this embodiment comprises a lifting cylinder 41. The lifting cylinder 41 is fixedly arranged on the mounting plate 6. The lifting cylinder 41 is also slidingly connected to the lifting slider 42 by means of existing cylinder transmission technology. In this embodiment, the lifting slider 42 is fixedly provided with an L-shaped fixed plate 43 towards the outer side end.

[0030] As Figure 1 and Figure 3As shown, the V-groove cutter assembly 3 in this embodiment includes a fixed cutter 31 and a moving cutter 32, wherein the fixed cutter 31 is fixedly arranged on the transverse end of the L-shaped mounting plate 6, the moving cutter 32 is fixedly arranged on the transverse end of the L-shaped fixed plate 43, and the fixed cutter 31 and the moving cutter 32 in this embodiment are always on the same vertical line, and the wafer 1 is placed between the fixed cutter 31 and the moving cutter 32. It should be noted that the fixed cutter 31 in this embodiment is provided with a groove matched with the moving cutter 32.

[0031] In use, the lifting slider 42 drives the L-shaped fixed plate 43 to move up and down, the moving cutter 32 at the end of the L-shaped fixed plate 43 moves downward to cut the V-groove on the wafer placed on the fixed cutter 31, and through the matched groove, only one shearing of the moving cutter 32 corresponding to the fixed cutter 31 is needed to complete the cutting of the V-groove. Embodiment Two

[0032] On the basis of Embodiment One, the V-groove cutter assembly 3 of Embodiment One can be redesigned as follows, referring to Figure 4 and Figure 5 As shown, specifically:

[0033] The V-groove cutter assembly 3 in this embodiment includes a moving cutter blade 33, wherein the moving cutter blade 33 is preferably a metal blade in a V-shaped structure, and the metal blade can be opened and closed along the V-shaped structure connecting surface. In this embodiment, the bearing table 34 is arranged at the end of the mounting plate 6 to support the wafer 1, the cutting edge of the moving cutter blade 33 faces the bearing table 34, and the two ends of the moving cutter blade 33 are slidingly arranged at the ends of the L-shaped fixed plate 43.

[0034] In this embodiment, a pair of screw rods 35 are movably arranged inside the transverse end of the L-shaped fixed plate 43, wherein the end of each screw rod 35 penetrates through the side of the L-shaped fixed plate 43, a connecting nut 36 is threadedly connected to each screw rod 35, the outer side end of each connecting nut 36 extends to the outside of the L-shaped fixed plate 43 and is connected to the two ends of the moving cutter blade 33, and the end of each screw rod 35 is further provided with a plug-in limiting head 37, wherein at least two clamping grooves are formed on each screw rod 35, and a clamping strip matched with the clamping grooves is integrally formed on each plug-in limiting head 37. It should be noted that in this embodiment, a hexagonal groove is formed in the side of the L-shaped fixed plate 43 corresponding to the end of each screw rod 35, and the outer periphery of the plug-in limiting head 37 is provided with a structure matched with the groove.

[0035] Working principle: in use, the operator adjusts the triangular slice specification formed by the moving cutter blade 33 according to the specification of the V-groove to realize cutting of V-grooves of different specifications. It should be noted that the triangular slice formed by the moving cutter blade 33 in this embodiment is always an isosceles triangle, and the side length of the formed isosceles triangle is always greater than the common side length of the V-groove in the prior art.

[0036] In use, the plug-in limiting head 37 is pulled out, the connecting nut 36 is pushed, the size of the moving blade 33 is adjusted, at this time the screw rod 35 rotates in the L-shaped fixing plate 43, until the size is adjusted to the appropriate size, and then the plug-in limiting head 37 is inserted.

[0037] The embodiments of the utility model are described above in combination with the drawings, but the utility model is not limited to the specific embodiments described above, the specific embodiments described above are only illustrative but not restrictive, and the ordinary skilled in the art can make many forms under the inspiration of the utility model without departing from the purpose of the utility model and the scope protected by the claims, and these all belong to the protection of the utility model.

Claims

1. A corner-cutting device for a wafer laminating machine, characterized in that: The device comprises a wafer (1), a wafer cutter (2), a V-groove cutter assembly (3), a lifting assembly (4) and a mounting plate (6), the wafer (1) is arranged in a film press, the wafer cutter (2) is movably arranged around the edge of the wafer (1), the V-groove cutter assembly (3) is arranged on the lifting assembly (4), the lifting assembly (4) is arranged on the mounting plate (6), the mounting plate (6) is arranged inside the film press, and the lifting assembly (4) drives the V-groove cutter assembly (3) to move up and down to cut off the V-groove on the wafer (1) at one time.

2. The dicing device of claim 1, wherein: The lifting assembly (4) comprises a lifting cylinder (41), a lifting slider (42) and an L-shaped fixing plate (43), the lifting cylinder (41) is fixedly arranged on the mounting plate (6), the lifting slider (42) is slidably arranged on the lifting cylinder (41), and the L-shaped fixing plate (43) is fixed on the lifting slider (42). ​ 3. The dicing apparatus of claim 2, wherein: The V-groove cutter assembly (3) comprises a fixed cutter (31) and a movable cutter (32), the fixed cutter (31) is fixedly arranged at the end of the mounting plate (6), the movable cutter (32) is fixedly arranged on the L-shaped fixing plate (43), the mounting plate (6) is L-shaped, the fixed cutter (31) is in the projection direction of the movable cutter (32), and the wafer (1) is placed between the fixed cutter (31) and the movable cutter (32). ​ 4. The dicing apparatus of claim 3, wherein: The device further comprises a variable-diameter module (5), which is fixedly arranged inside the film press, and the wafer cutter (2) is movably arranged on the variable-diameter module (5) to drive the wafer cutter (2) to change the rotating radius. ​ 5. The dicing apparatus of claim 4, wherein: The variable-diameter module (5) comprises a variable-diameter cylinder (51) and a variable-diameter slider (52), the variable-diameter cylinder (51) is fixed inside the film press, the variable-diameter slider (52) is slidably arranged on the variable-diameter cylinder (51), and the wafer cutter (2) is fixed on the variable-diameter slider (52) through a plate connection.

6. The dicing apparatus of claim 3, wherein: The V-groove cutter assembly (3) comprises a movable cutter blade (33), a bearing table (34) and a sliding assembly, the movable cutter blade (33) is movably arranged in a V shape on the sliding assembly, the bearing table (34) is arranged at the end of the mounting plate (6) to support the wafer (1), and the sliding assembly is arranged at the end of the L-shaped fixing plate (43), and the wafer (1) is located between the fixed cutter (31) and the movable cutter (32). ​ 7. The dicing apparatus of claim 6, wherein: The sliding assembly comprises a pair of screw rods (35), a pair of connecting nuts (36) and a plug-in limiting head (37), a pair of the screw rods (35) are movably embedded in the ends of the L-shaped fixing plate (43), a pair of the connecting nuts (36) are threadedly connected to each screw rod (35), the movable cutter blade (33) in a V shape is fixed at the opening end of each connecting nut (36), and the plug-in limiting head (37) is correspondingly arranged in the side edge of the L-shaped fixing plate (43) and is plugged into each screw rod (35).

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