Wafer storage device
By designing internal and external positioning components and magnet connections for the wafer storage device, the problem of Foup wafer cassettes being unable to accommodate small-sized wafers was solved, achieving stable positioning and anti-oxidation protection for wafers of different sizes, and improving the storage quality of the wafers.
Patent Information
- Application Number
- CN202520016775.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-03
- Publication Date
- 2025-12-16
- Estimated Expiration
- 2035-01-03
AI Technical Summary
Existing Foup wafer boxes cannot accommodate wafers smaller than 12 inches and lack antioxidant protection, making the wafers prone to oxidation during storage.
A wafer storage device is designed, comprising a wafer transport box body, a detachable cover, and inner and outer positioning components. The inner positioning component is used to position small-sized wafer carriers, and the outer positioning component is used to position large-sized wafer carriers. The device is connected by magnets to ensure stability and is filled with high-cleanliness gases such as nitrogen to provide anti-oxidation protection.
It achieves stable positioning and anti-oxidation protection for wafer carriers of different sizes, ensuring that the wafers do not oxidize during storage, thereby improving wafer quality and storage efficiency.
Smart Images
Figure CN223673203U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to wafer storage technical field especially is a kind of wafer storage device. BACKGROUND
[0002] Many procedures or steps will occur in the manufacturing process of semiconductor wafers, and wafers will need to be placed in different positions and different machines due to these procedures or steps. Therefore, wafers must be transported from one place to another, and even stored for a period of time to coordinate necessary processes in the process. Among them, the Foup wafer box has the functions of storage and oxidation protection. The Foup wafer box can accommodate 12-inch wafers, but cannot accommodate small-size wafers (such as 6-inch wafers and 8-inch wafers). However, for wafers smaller than 12 inches, a wafer carrier is needed for loading. However, the wafer carrier only has storage function and cannot provide oxidation protection for wafers. Therefore, the defect is obvious, and a solution is urgently needed. SUMMARY
[0003] To solve the above technical problems, the purpose of the utility model is to provide a wafer storage device.
[0004] To achieve the above purpose, the utility model adopts the following technical solutions:
[0005] A wafer storage device includes a wafer transfer box main body, a wafer transfer box cover detachably connected to the opening of the wafer transfer box main body, and an inner positioning assembly and an outer positioning assembly respectively arranged on the inner bottom wall of the wafer transfer box main body. The inner positioning assembly is located inside the outer positioning assembly, the inner positioning assembly is used to position the first wafer carrier, and the outer positioning assembly is used to position the second wafer carrier.
[0006] Further, the inner positioning assembly includes two inner positioning blocks mounted on the inner bottom wall of the wafer transfer box main body, the two inner positioning blocks are symmetrically arranged about the center line L of the wafer transfer box main body, and the inner positioning block is recessed with an inner positioning slot.
[0007] Further, the inner positioning slot is located on the side where the two inner positioning blocks are away from each other.
[0008] Further, the outer positioning assembly includes two outer positioning blocks mounted on the inner bottom wall of the wafer transfer box main body, the two outer positioning blocks are symmetrically arranged about the center line L of the wafer transfer box main body, and the inner positioning assembly is located between the two outer positioning blocks, and the outer positioning block is recessed with an outer positioning slot.
[0009] Further, the outer positioning slot is located on the side where the two outer positioning blocks are close to each other.
[0010] Further, the bottom surface of the inner positioning block is embedded with a first magnet, and the first magnet is magnetically attracted to the wafer transfer box main body.
[0011] Further, the bottom surface of the outer positioning block is embedded with a second magnet, and the second magnet is magnetically attracted to the wafer transfer box body.
[0012] The beneficial effects of the utility model are as follows: in practical application, the first wafer carrier is loaded with wafers of corresponding sizes, and then the first wafer carrier loaded with wafers is placed on the inner positioning assembly of the wafer transfer box body, the inner positioning assembly positions the first wafer carrier, so that the first wafer carrier loaded with wafers is stably placed in the wafer transfer box body, then the wafer transfer box cover is covered on the opening of the wafer transfer box body to package the first wafer carrier loaded with wafers in the wafer transfer box body, and high-purity gas such as nitrogen is filled into the wafer transfer box body, so that the wafers loaded on the first wafer carrier are prevented from being oxidized in the air, the wafers are stored and protected from oxidation, and the quality of the wafers is ensured. Similarly, the second wafer carrier loaded with wafers of corresponding sizes is placed on the outer positioning assembly of the wafer transfer box body, the outer positioning assembly positions the second wafer carrier, so that the second wafer carrier loaded with wafers is stably placed in the wafer transfer box body, and after the wafer transfer box cover is covered, high-purity gas such as nitrogen is filled into the wafer transfer box body, so that the wafers are stored and protected. The utility model has the advantages of simple structure, convenient use, and the ability to selectively position two wafer carriers of different sizes in the wafer transfer box body according to actual processing requirements, so that the wafers loaded on the wafer carriers are stored and protected from oxidation. BRIEF DESCRIPTION OF DRAWINGS
[0013] Fig. 1 It is a decomposition structure schematic view of the utility model.
[0014] Fig. 2 It is a decomposition structure schematic view of the utility model placed with the first wafer carrier.
[0015] Fig. 3 It is a decomposition structure schematic view of the utility model placed with the second wafer carrier.
[0016] BRIEF DESCRIPTION OF DRAWINGS:
[0017] 1, wafer transfer box body;2, wafer transfer box cover;3, inner positioning assembly;4, outer positioning assembly;5, inner positioning block;6, inner positioning slot;7, outer positioning block;8, outer positioning slot;9, first wafer carrier;10, second wafer carrier. DETAILED DESCRIPTION
[0018] In order to facilitate the understanding of those skilled in the art, the utility model is further described below in combination with examples and drawings, and the content mentioned in the implementation manner is not a limitation on the utility model.
[0019] AsFigs. 1 to 3 The utility model provides a wafer storage device, which comprises a wafer transfer box main body 1, a wafer transfer box cover 2 detachably connected with the opening of the wafer transfer box main body 1, and an inner positioning assembly 3 and an outer positioning assembly 4 respectively arranged on the inner bottom wall of the wafer transfer box main body 1, wherein the inner positioning assembly 3 is located in the outer positioning assembly 4, the inner positioning assembly 3 is used for positioning a first wafer carrier 9, and the outer positioning assembly 4 is used for positioning a second wafer carrier 10. Preferably, the first wafer carrier 9 and the second wafer carrier 10 can be 4- to 8-inch wafer carriers, the size of the first wafer carrier 9 is smaller than that of the second wafer carrier 10, the inner positioning assembly 3 is matched with the first wafer carrier 9, and the outer positioning assembly 4 is matched with the second wafer carrier 10; the wafer transfer box main body 1 and the wafer transfer box cover 2 form a Foup wafer box.
[0020] In actual application, the first wafer carrier 9 is loaded with a wafer of corresponding size, the first wafer carrier 9 loaded with the wafer is placed on the inner positioning assembly 3 of the wafer transfer box main body 1, the inner positioning assembly 3 positions the first wafer carrier 9, so that the first wafer carrier 9 loaded with the wafer is stably placed in the wafer transfer box main body 1, then the wafer transfer box cover 2 is closed on the opening of the wafer transfer box main body 1 to encapsulate the first wafer carrier 9 loaded with the wafer in the wafer transfer box main body 1, and high-purity gas such as nitrogen is filled into the wafer transfer box main body 1, so that the wafer loaded on the first wafer carrier 9 is prevented from being oxidized in air, the wafer is stored and protected from oxidation, and the quality of the wafer is ensured. Similarly, the second wafer carrier 10 loaded with a wafer of corresponding size is placed on the outer positioning assembly 4 of the wafer transfer box main body 1, the outer positioning assembly 4 positions the second wafer carrier 10, so that the second wafer carrier 10 loaded with the wafer is stably placed in the wafer transfer box main body 1, after the wafer transfer box cover 2 is closed, high-purity gas such as nitrogen is filled into the wafer transfer box main body 1, so that the wafer is stored and protected. The utility model has the advantages of simple structure, convenient use, and the ability to selectively position two wafer carriers of different sizes in the wafer transfer box main body 1 according to actual processing requirements, so as to store and protect the wafers loaded on the wafer carriers from oxidation.
[0021] In the embodiment, the inner positioning assembly 3 comprises two inner positioning blocks 5 arranged on the inner bottom wall of the wafer transfer box main body 1, the two inner positioning blocks 5 are symmetrically arranged about the center line L of the wafer transfer box main body 1, and the inner positioning block 5 is concavely provided with an inner positioning slot 6. Specifically, the inner positioning slot 6 is located on the side where the two inner positioning blocks 5 are away from each other. In actual application, the two insertion plates at the bottom of the first wafer carrier 9 are respectively inserted into the inner positioning slots 6 of the two inner positioning blocks 5 to position the first wafer carrier 9, so as to ensure the position accuracy and stability of the first wafer carrier 9 in the wafer transfer box main body 1.
[0022] In the embodiment, the outer positioning assembly 4 comprises two outer positioning blocks 7 arranged on the inner bottom wall of the wafer transfer box body 1, the two outer positioning blocks 7 are symmetrically arranged about the center line L of the wafer transfer box body 1, the inner positioning assembly 3 is located between the two outer positioning blocks 7, and the outer positioning block 7 is concavely provided with an outer positioning slot 8; specifically, the outer positioning slot 8 is located on the side where the two outer positioning blocks 7 are close to each other. In actual application, the two insertion plates at the bottom of the second wafer carrier 10 are respectively inserted into the outer positioning slots 8 of the two outer positioning blocks 7, so as to position the second wafer carrier 10 and ensure the position accuracy and stability of the second wafer carrier 10 in the wafer transfer box body 1.
[0023] In the embodiment, the bottom surface of the inner positioning block 5 is embedded with a first magnet, and the first magnet is magnetically attracted to the wafer transfer box body 1. The first magnet is used to magnetically attract the inner positioning block 5 in the wafer transfer box body 1, which not only makes the disassembly and connection of the inner positioning block 5 and the wafer transfer box body 1 firm, but also is beneficial to adjusting the distance between the two inner positioning blocks 5.
[0024] In the embodiment, the bottom surface of the outer positioning block 7 is embedded with a second magnet, and the second magnet is magnetically attracted to the wafer transfer box body 1. The second magnet is used to magnetically attract the outer positioning block 7 in the wafer transfer box body 1, which not only makes the disassembly and connection of the outer positioning block 7 and the wafer transfer box body 1 firm, but also is beneficial to adjusting the distance between the two outer positioning blocks 7.
[0025] All the technical features in the embodiment can be freely combined according to actual needs.
[0026] The above embodiment is a preferred implementation scheme of the utility model, and the utility model can also be implemented in other ways without departing from the technical scheme concept. Any obvious replacement without departing from the technical scheme concept is within the protection scope of the utility model.
Claims
1. A wafer storage device, characterized by: The wafer transfer box includes a wafer transfer box body (1), a wafer transfer box cover (2) detachably connected with an opening of the wafer transfer box body (1), and an inner positioning assembly (3) and an outer positioning assembly (4) respectively arranged at the inner bottom wall of the wafer transfer box body (1), the inner positioning assembly (3) being located in the outer positioning assembly (4), the inner positioning assembly (3) being used for positioning a first wafer carrier (9), and the outer positioning assembly (4) being used for positioning a second wafer carrier (10).
2. The wafer storage device of claim 1, wherein: The inner positioning assembly (3) includes two inner positioning blocks (5) arranged on the inner bottom wall of the wafer transfer box body (1) and symmetrical about the center line L of the wafer transfer box body (1), and the inner positioning blocks (5) are recessed with inner positioning slots (6).
3. The wafer storage device of claim 2, wherein: The inner positioning slots (6) are located on the side where the two inner positioning blocks (5) are away from each other.
4. The wafer storage device of claim 1, wherein: The outer positioning assembly (4) includes two outer positioning blocks (7) arranged on the inner bottom wall of the wafer transfer box body (1) and symmetrical about the center line L of the wafer transfer box body (1), the inner positioning assembly (3) being located between the two outer positioning blocks (7), and the outer positioning blocks (7) being recessed with outer positioning slots (8).
5. The wafer storage device of claim 4, wherein: The outer positioning slots (8) are located on the side where the two outer positioning blocks (7) are close to each other.
6. The wafer storage device of claim 2, wherein: The bottom surface of the inner positioning block (5) is embedded with a first magnet, and the first magnet is magnetically attracted to the wafer transfer box body (1).
7. The wafer storage device of claim 4, wherein: The bottom surface of the outer positioning block (7) is embedded with a second magnet, and the second magnet is magnetically attracted to the wafer transfer box body (1).