Silicon crystal bar slicing and transferring equipment

Abstract

The utility model discloses silicon crystal bar slicing and transferring equipment, which belongs to the technical field of silicon crystal bars and comprises a first conveying line body, a second conveying line body, a third conveying line body and a fourth conveying line body, the second conveying line body is provided with a material frame so as to convey the sliced silicon crystal bars; the conveying track is located between the first conveying line body and the second conveying line body, a mechanical arm is arranged on the conveying track, and the mechanical arm moves in the length direction of the conveying track and takes and places silicon crystal bars; and the slicing machines are distributed in the length direction of the conveying track and are used for slicing the silicon crystal bars. According to the silicon crystal bar slicing and transferring equipment, slicing treatment and transferring treatment of the silicon crystal bar are achieved, manual operation is not needed in the process, the slicing and transferring efficiency of the silicon crystal bar can be effectively improved, and potential safety hazards are reduced.

Description

Technical Field

[0001] This utility model belongs to the field of silicon crystal rod technology, and in particular relates to a silicon crystal rod slicing and transfer device. Background Technology

[0002] Silicon crystal photovoltaic (PV) technology is currently the most widely used photovoltaic technology. Its cells use silicon as the main material and are made of monocrystalline or polycrystalline silicon. Silicon crystal PV offers advantages such as high efficiency, stability, and reliability, but its production cost is high. Thin-film solar cells mainly use materials such as amorphous silicon, copper indium gallium selenide (CIGS), and organic materials, and are characterized by light weight, low production cost, and high flexibility, but their efficiency is relatively lower than that of silicon crystal PV. Polycrystalline silicon PV uses high-purity silicon microcrystalline crystals, comparable to ordinary silicon crystal cells, but its manufacturing process is more advanced than that of silicon crystal PV technology. Silicon ingots are a commonly used type of silicon crystal.

[0003] With the development of the photovoltaic industry, the slicing of silicon crystal rods has entered an era of automation replacing manual labor. However, the loading and unloading of silicon crystal rods is still done manually, which is inefficient and poses certain safety hazards. Utility Model Content

[0004] This invention overcomes the shortcomings of the prior art by providing a silicon crystal rod slicing and transfer device to solve the problems existing in the prior art.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is: a silicon crystal rod slicing and transfer device, comprising...

[0006] The first conveyor line conveys silicon crystal rods;

[0007] The second conveyor line is equipped with a material frame to convey the sliced ​​silicon ingots.

[0008] A transfer track is located between the first conveyor line and the second conveyor line. A robotic arm is installed on the transfer track. The robotic arm moves along the length of the transfer track and picks up and places silicon ingots.

[0009] A slicing machine, wherein there are multiple slicing machines distributed along the length of the transport track, is used to slice silicon crystal rods.

[0010] In a preferred embodiment of this utility model, the first conveyor line and the second conveyor line are arranged opposite to each other, and a support is provided between the first conveyor line and the second conveyor line. The support is provided with a loading transfer machine and a unloading transfer machine to transfer the silicon crystal rod.

[0011] The upper feeding transfer machine is located at the tail end of the first conveying line body, so as to overturn and position the silicon crystal bar before slicing, and the lower feeding transfer machine is located at the tail end of the second conveying line, so as to overturn and position the silicon crystal bar after slicing.

[0012] In a preferred embodiment of the utility model, a plurality of buffer tables are arranged on both sides of the transmission track, a part of the buffer tables buffer the silicon crystal bar before slicing, and another part of the buffer tables buffer the silicon crystal bar after slicing.

[0013] The utility model solves the defects in the background art, and has the following beneficial effects:

[0014] 1. The silicon crystal bar slicing transfer equipment realizes slicing and transfer of the silicon crystal bar, and does not need manual operation in the process, so that the slicing and transfer efficiency of the silicon crystal bar is improved, and the safety hazard is reduced.

[0015] 2. The first conveying line body, the second conveying line body and the transmission track are distributed in a staggered manner, so that the safety hazard is effectively reduced, and the operation safety of the operator is improved. BRIEF DESCRIPTION OF DRAWINGS

[0016] The utility model will be further described below in combination with the drawings and embodiments;

[0017] Fig. 1 It is a whole structure schematic view of the preferred embodiment of the utility model;

[0018] Fig. 2 It is a local structure schematic view of the preferred embodiment of the utility model;

[0019] Fig. 3 It is another local structure schematic view of the preferred embodiment of the utility model;

[0020] In the drawing: 10, first conveying line body; 20, second conveying line body; 30, transmission track; 31, mechanical arm; 40, slicing machine; 50, support; 51, upper feeding transfer machine; 52, lower feeding transfer machine; 60, buffer table. DETAILED DESCRIPTION

[0021] In the following, a plurality of embodiments of the utility model will be disclosed by means of drawings, and many details on the actual object will be described in the following description. However, it should be understood that these details on the actual object should not be used to limit the utility model. That is, in some embodiments of the utility model, these details on the actual object are unnecessary. In addition, for the purpose of simplifying the drawings, some conventional structures and components will be shown in a simple schematic manner in the drawings.

[0022] In addition, the description of "first", "second" and the like in the present application is only for the purpose of description, and does not mean to particularly indicate the order or sequence, nor to limit the present application, which is only to distinguish the components or operations described by the same technical terms, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first" and "second" can be explicitly or implicitly included at least one of the features. In addition, the technical solutions of each embodiment can be combined with each other, but it must be based on the realization of the ordinary skilled in the art, when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, nor in the protection scope required by the present application.

[0023] The present application provides a silicon crystal bar slicing and transferring device, which realizes slicing and transferring of silicon crystal bar, without manual operation, effectively improving the slicing and transferring efficiency of silicon crystal bar and reducing safety hazards.

[0024] In combination Figs. 1-3 As shown in the drawings, the silicon crystal bar slicing and transferring device of the present application comprises a first conveying line body 10, a second conveying line body 20, a transmission track 30 and a slicing machine 40. The first conveying line body 10 conveys the silicon crystal bar before slicing, the second conveying line body 20 conveys the material frame 21, the transmission track 30 is provided with a mechanical arm 31, the mechanical arm 31 can grab and transfer the silicon crystal bar before and after slicing, and the slicing machine 40 can slice the silicon crystal bar.

[0025] In the present application, the transmission track 30 is located between the first conveying line body 10 and the second conveying line body 20, the mechanical arm 31 is located on the transmission track 30, and the mechanical arm 31 moves along the length direction of the transmission track 30 and takes and places the silicon crystal bar. The mechanical arm 31 moves on the transmission track 30, realizing the transferring of the silicon crystal bar for slicing and transferring operation.

[0026] Further, the first conveying line body 10 and the second conveying line body 20 of the present application are oppositely distributed, a support 50 is arranged between the first conveying line body 10 and the second conveying line body 20, an upper feeding transfer machine 51 and a lower discharging transfer machine 52 are arranged on the support 50 to transfer the silicon crystal bar. The upper feeding transfer machine 51 transfers the silicon crystal bar before slicing to facilitate subsequent slicing, and the lower discharging transfer machine 52 transfers the silicon crystal bar after slicing to facilitate discharging of the silicon crystal bar after slicing.

[0027] In the embodiment, the loading transfer machine 51 is located at the end of the first conveying line body 10 to overturn and position the silicon wafer rod before slicing, which is beneficial to the slicing of the silicon wafer rod. The unloading transfer machine 52 is located at the end of the second conveying line to overturn and position the silicon wafer rod after slicing, so that the mechanical arm 31 can grasp and transfer the sliced silicon wafer rod, improving the efficiency.

[0028] As shown in Fig. 1 the embodiment, the slicing machine 40 is multiple and is distributed along the length direction of the transmission track 30 to slice the silicon wafer rod. The slicing machines 40 in the embodiment are uniformly distributed on both sides of the transmission track 30. After the mechanical arm 31 grasps the silicon wafer rod, it moves along the length direction of the transmission track 30 and places the silicon wafer rod in the corresponding slicing machine 40 for slicing. The existence of multiple slicing machines 40 can effectively improve the slicing efficiency of the silicon wafer rod.

[0029] In the embodiment, a plurality of buffer tables 60 are arranged on both sides of the transmission track 30. Some of the buffer tables 60 buffer the silicon wafer rod before slicing, and the other buffer tables 60 buffer the silicon wafer rod after slicing. After the slicing machine 40 slices the silicon wafer rod, the mechanical arm 31 places the sliced silicon wafer rod on the buffer table 60 for buffering. When all the slicing machines 40 are loaded with silicon wafer rods, the mechanical arm 31 places the unsliced silicon wafer rod on the buffer table 60 for buffering.

[0030] In actual use of the silicon wafer rod slicing and transfer equipment in the embodiment, the silicon wafer rod is conveyed and loaded by the first conveying line body 10, the material frame 21 is conveyed and loaded by the second conveying line body 20, the silicon wafer rod is overturned and positioned by the loading transfer machine 51, the mechanical arm 31 grasps and transfers it to the slicing machine 40 for slicing, the mechanical arm 31 takes out the sliced silicon wafer rod and transfers it to the unloading transfer machine 52, and the unloading transfer machine 52 conveys the sliced silicon wafer rod to the second conveying line body 20 for output.

[0031] Although the present application has been described above with reference to various embodiments, it will be understood that many changes and modifications can be made without departing from the scope of the present application. That is, the methods, systems or devices discussed above are examples. Various configurations can omit, substitute, or add various procedures or components as appropriate. For instance, the methods described can be performed in an order different from that described, and / or various stages can be added, omitted, and / or combined. Also, features described with respect to certain configurations can be combined in various other configurations. Different aspects and elements of configurations can be combined in similar ways. Also, a number of the elements described above can be implemented in one or more processing devices, software modules or components, and various ones of the elements can be implemented differently (e.g., as one or more software modules, each of which includes at least one non-transitory software storage medium). Similarly, all or part of various functional operations described above can be performed by one or more processors that produce a processed output rather than performing the operations described. The methods can also be at least partially performed by one or more apparatuses each including one or more processing devices.

[0032] In the description specific details are set forth in order to provide a thorough understanding of the exemplary configurations including implementations. However, configurations can be practiced without these specific details, e.g., without the specific

[0033] Furthermore, although each operation can be described as a sequential process, many of the operations can be performed in parallel, or concurrently, rather than sequentially. In addition, the order of operations can be rearranged. A process might have other steps not included in the figure. Furthermore, examples of the methods can be implemented by hardware, software, firmware, middleware, code, hardware description languages, or any combination thereof. When implemented in software, the program code, or code segments, for performing the necessary tasks can be stored in a non-transitory computer-readable medium such as a storage medium and executed by a processor.

[0034] In view of the above detailed description of embodiments of the application, it can be appreciated that the detailed description is considered to be illustrative of the application and not restrictive. It should be understood that the claims, including all equivalents, are intended to define the scope of the application. These embodiments are to be understood as merely illustrative of the application and not restrictive thereof. Various changes and modifications can be made to the application by those skilled in the art, once armed with the knowledge provided by the disclosure. Such equivalent changes and modifications are intended to be included within the scope of the claims.

Claims

1. A silicon crystal ingot slicing transfer apparatus, characterized by, Comprising A first conveying line body (10) for conveying silicon ingots; A second conveying line body (20) provided with a material frame (21) for conveying sliced silicon ingots; A transmission track (30) between the first conveying line body (10) and the second conveying line body (20), provided with a mechanical arm (31) moving along the length direction of the transmission track (30) and taking and placing silicon ingots; A plurality of slicing machines (40) distributed along the length direction of the transmission track (30) for slicing silicon ingots.

2. The silicon ingot slicing and transferring apparatus according to claim 1, wherein The first conveying line body (10) and the second conveying line body (20) are oppositely distributed, and a support (50) is arranged between the first conveying line body (10) and the second conveying line body (20), provided with an upper feeding transfer machine (51) and a lower discharging transfer machine (52) for transferring silicon ingots.

3. The silicon ingot slicing transfer apparatus according to claim 2, wherein The upper feeding transfer machine (51) is located at the end of the first conveying line body (10) to overturn and position the silicon ingots before slicing, and the lower discharging transfer machine (52) is located at the end of the second conveying line to overturn and position the sliced silicon ingots.

4. The silicon ingot slicing transfer apparatus according to claim 1, wherein A plurality of buffer tables (60) are arranged on both sides of the transmission track (30), a part of the buffer tables (60) buffer the silicon ingots before slicing, and the other part of the buffer tables (60) buffer the sliced silicon ingots.

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