Magnetron sputtering wafer sample table

Abstract

The utility model discloses a magnetron sputtering wafer sample table, and particularly relates to the technical field of PVD (Physical Vapor Deposition) thin film deposition, which comprises a mounting flange, a lifting driving table, a sample table main shaft, a wafer rotating table and a heating table, the mounting flange is mounted at the top of the lifting driving table, the sample table main shaft is arranged in the lifting driving table, the wafer rotating table is mounted at the top of the sample table main shaft, the rotating mechanism is arranged between the wafer rotating table and the sample table main shaft, and the bottom of the heating table is mounted on the upper surface of the wafer rotating table. According to the utility model, through arranging the elevating driving bench, the wafer automatic elevating function is provided; by arranging the sample table main shaft, the wafer rotating table and the rotating mechanism, the automatic wafer rotating function is achieved; the heating table is arranged, so that the function of heating the wafer is achieved; the fixed angle of the wafer rotating table relative to the sample table main shaft can be adjusted, so that the relative position of the cathode and the wafer is convenient to adjust.

Description

TECHNICAL FIELD

[0001] The utility model relates to PVD thin film deposition technical field, more specifically, the utility model relates to a magnetron sputtering wafer sample table. BACKGROUND

[0002] It is known that the magnetron sputtering technology as a kind of efficient physical vapor deposition (PVD) equipment is widely used in semiconductor, microelectronics, aerospace, solar energy and other industrial occasions due to its high speed, low temperature and low damage advantages;Among them, the sample table is usually arranged in the magnetron sputtering equipment, for placing the wafer needing to be plated.

[0003] Among them, the sample table in the existing magnetron sputtering equipment is usually fixed on the outer wall of the magnetron sputtering chamber, since the fixed position is not adjustable, the relative position of wafer and magnetron sputtering cathode in the magnetron sputtering process is an important control parameter to obtain high quality deposition thin film, if the relative position of wafer and magnetron sputtering cathode needs to be adjusted, the fixed angle of cathode is generally adjusted;But the connecting flange of fixed sample needs to be located in the center of the cavity, and then a large amount of installation space will be occupied, so a magnetron sputtering wafer sample table is proposed as a further improvement. SUMMARY

[0004] In order to overcome the above-mentioned defects of the prior art, the embodiments of the utility model provide a magnetron sputtering wafer sample table to solve the problems raised in the above background art.

[0005] To achieve the above object, the utility model provides the following technical scheme: a magnetron sputtering wafer sample table, the sample table includes: the installation flange fixed in the outer wall of magnetron sputtering chamber, lifting drive platform, sample table main shaft, wafer rotary table and heating table;

[0006] The top of lifting drive platform is fixedly installed at the bottom of installation flange, the sample table main shaft is arranged in the inside of lifting drive platform, the wafer rotary table is fixedly installed at the top of sample table main shaft penetrating the top of lifting drive platform, the rotation mechanism is arranged between wafer rotary table and sample table main shaft, and the bottom of heating table is installed on the upper surface of wafer rotary table.

[0007] Further, the lifting drive platform includes: frame, drive motor, transmission belt, T-shaped screw rod, screw nut, lifting sliding block, telescopic bellows, guide shaft and positioning sensor,

[0008] The upper surface and the lower surface of one side of the frame are fixedly connected with the bottom of the mounting flange and the top end of the telescopic bellows respectively, the driving motor is fixedly installed at the bottom of the other side of the frame, the T-shaped screw rod is rotationally connected with the middle part of the frame, the two ends of the guide shaft parallel to the T-shaped screw rod are fixedly installed on the frame, the output shaft of the driving motor is in transmission connection with the T-shaped screw rod through a transmission belt, the screw rod nut is in threaded connection with the T-shaped screw rod, the screw rod nut is fixedly connected with the lifting slide block, the lifting slide block is in sliding connection with the guide shaft, and the positioning sensor for positioning is fixedly installed on the frame.

[0009] Further, the sample stage spindle comprises a rotating shaft, a spindle outer cylinder and a clamping fixing seat,

[0010] The bottom of the spindle outer cylinder is fixedly installed at the bottom of the telescopic bellows, the clamping fixing seat is movably sleeved at the top of the spindle outer cylinder, and the rotating shaft is arranged to rotate in the interiors of the telescopic bellows, the mounting flange, the spindle outer cylinder and the clamping fixing seat.

[0011] Further, the wafer rotating table comprises a bracket and a deep groove ball bearing,

[0012] One end of the clamping fixing seat away from the rotating shaft is rotationally connected with the bracket through the deep groove ball bearing.

[0013] Further, the heating table comprises a circular heater, a heat shield, a thermocouple wire and a guide sleeve,

[0014] The bottom of the guide sleeve is inserted into the end of the clamping fixing seat away from the rotating shaft, the bracket and the deep groove ball bearing are movably sleeved on the guide sleeve, the bottom of the heat shield is fixedly installed at the top of the guide sleeve, the circular heater is fixedly installed in the heat shield, and the thermocouple wire for measuring the temperature of the circular heater is fixedly installed at the bottom of the circular heater.

[0015] Further, the rotating mechanism comprises a rotating motor, a shaft coupling, a rotation sensor, a magnetic fluid sealing shaft, a pinion and a gear,

[0016] The output shaft of the rotating motor is fixedly connected with the mandrel of the magnetic fluid sealing shaft through the shaft coupling, the mandrel of the magnetic fluid sealing shaft is also fixedly connected with the rotating shaft, the pinion is fixedly sleeved at the end of the rotating shaft penetrating out of the clamping fixing seat, the gear is fixedly installed at the bottom of the bracket, the gear is movably sleeved on the guide sleeve, and the pinion is in meshing connection with the gear.

[0017] The magnetic fluid sealing shaft is fixedly connected with the telescopic bellows through a connecting flange, the rotating motor is fixedly connected with the magnetic fluid sealing shaft through a fixing frame, the shaft coupling is located in the fixing frame, and the rotation sensor for feeding back the rotation degree of the rotating shaft is fixedly installed in the fixing frame.

[0018] The technical effects and advantages of the utility model are as follows:

[0019] Compared with the prior art, the utility model discloses a lifting drive platform, which has the functions of automatically lifting and rotating the wafer, a heating table, which has the function of heating the wafer, and a rotating shaft center line as the center, and the bracket and the rotating shaft form an eccentric structure, thereby saving the installation space on the chamber, reducing the volume of the magnetron sputtering chamber, and improving the ultimate vacuum degree of the chamber. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 It is a whole structure schematic view of the utility model.

[0021] Figure 2 It is a local explosion schematic view of the utility model.

[0022] Figure 3 It is a local section structure schematic view of the wafer rotating table and the heating table of the utility model.

[0023] Figure 4 It is a local section schematic view of the rotating mechanism and the lifting drive platform of the utility model.

[0024] The signs are as follows:

[0025] 1, mounting flange;

[0026] 2, lifting drive platform;

[0027] 21, frame;22, drive motor;23, transmission belt;24, T type screw;25, screw nut;

[0028] 26, lifting slide;27, telescopic corrugated pipe;28, guide shaft;29, positioning sensor;

[0029] 3, sample table main shaft;31, rotating shaft;32, main shaft outer cylinder;33, clamping fixed base;

[0030] 4, wafer rotating table;41, bracket;42, deep groove ball bearing;

[0031] 5, heating table;51, circular heater;52, heat shield;53, thermocouple wire;54, guide sleeve;

[0032] 6, rotating mechanism;

[0033] 61. Rotary motor; 62. Coupling; 63. Rotary sensor; 64. Magnetohydrodynamic sealed shaft;

[0034] 65. Small gear; 66. Large gear. Detailed Implementation

[0035] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0036] As attached Figures 1-4 The sample stage shown is a magnetron sputtering wafer sample stage, which includes: a mounting flange 1 fixed to the outer wall of the magnetron sputtering chamber, a lifting drive stage 2, a sample stage spindle 3, a wafer rotation stage 4, and a heating stage 5.

[0037] The top of the lifting drive stage 2 is fixedly installed at the bottom of the mounting flange 1. The sample stage spindle 3 is located inside the lifting drive stage 2. The wafer rotary stage 4 is fixedly installed on the top of the sample stage spindle 3 that passes through the top of the lifting drive stage 2. A rotating mechanism 6 is provided between the wafer rotary stage 4 and the sample stage spindle 3. The bottom of the heating stage 5 is installed on the upper surface of the wafer rotary stage 4.

[0038] In a preferred embodiment, as shown in the appendix Figures 1-4 As shown, the lifting drive platform 2 includes: a frame 21, a drive motor 22, a transmission belt 23, a T-shaped lead screw 24, a lead screw nut 25, a lifting slider 26, a telescopic bellows 27, a guide shaft 28, and a positioning sensor 29.

[0039] The upper and lower surfaces of one side of frame 21 are fixedly connected to the bottom of mounting flange 1 and the top of expansion bellows 27, respectively.

[0040] The telescopic bellows 27 is used to isolate the vacuum environment and the atmospheric environment, and can transmit the movement of the lifting drive stage 2 to the vacuum environment in the magnetron sputtering chamber, while the lifting drive stage 2 is located in the atmospheric environment.

[0041] The drive motor 22 is fixedly installed at the bottom of the other side of the frame 21. The T-shaped lead screw 24 is rotatably connected to the middle of the frame 21. The two ends of the guide shaft 28, which is parallel to the T-shaped lead screw 24, are fixedly installed on the frame 21. The output shaft of the drive motor 22 is connected to the T-shaped lead screw 24 through the transmission belt 23. The lead screw nut 25 is threaded onto the T-shaped lead screw 24 and is fixedly connected to the lifting slider 26.

[0042] The bottom of the sample stage spindle 3 is located at the bottom of the telescopic bellows 27; the sample stage spindle 3 moves up and down following the lifting slider 26.

[0043] The lifting slider 26 is in sliding connection with the guide shaft 28, and the positioning sensor 29 for positioning is fixedly installed on the frame 21.

[0044] The driving motor 22 drives the T-shaped screw rod 24 to rotate through the transmission belt 23; the T-shaped screw rod 24 drives the screw nut 25 to move up and down along the T-shaped screw rod 24, thereby driving the lifting slider 26 to move up and down along the guide shaft 28; and finally the lifting driving table 2 drives the wafer rotating table 4 to move up and down.

[0045] In a preferred embodiment, as shown in the accompanying drawings, Figures 1-4 The sample table spindle 3 comprises a rotating shaft 31, a spindle outer cylinder 32 and a clamping fixing seat 33,

[0046] The bottom of the spindle outer cylinder 32 is fixedly installed at the bottom of the telescopic bellows 27, the clamping fixing seat 33 is movably sleeved at the top of the spindle outer cylinder 32, and the rotating shaft 31 is arranged to rotate inside the telescopic bellows 27, the mounting flange 1, the spindle outer cylinder 32 and the clamping fixing seat 33.

[0047] The sample table spindle 3 moves up and down following the lifting slider 26, and then the lifting of the lifting slider 26 drives the spindle outer cylinder 32 to move up and down, thereby driving the clamping fixing seat 33 to move up and down.

[0048] The clamping fixing seat 33 adopts a clamping structure and can rotate around the spindle outer cylinder 32 at any angle, and when the position of the clamping fixing seat 33 is adjusted, the clamping fixing seat 33 is fixed on the spindle outer cylinder 32 by tightening the fixing bolts.

[0049] In a preferred embodiment, as shown in the accompanying drawings, Figures 1-4 The wafer rotating table 4 comprises a bracket 41 and a deep groove ball bearing 42,

[0050] The end of the clamping fixing seat 33 away from the rotating shaft 31 is rotatably connected to the bracket 41 through the deep groove ball bearing 42.

[0051] The inner ring of the deep groove ball bearing 42 is fixed on the clamping fixing seat 33, and the large gear 66 is fixed on the outer ring of the deep groove ball bearing 42, and the large gear 66 is fixedly installed at the bottom of the bracket 41.

[0052] In a preferred embodiment, as shown in the accompanying drawings, Figures 1-4 The heating table 5 comprises a circular heater 51, a heat shield 52, a thermocouple wire 53 and a guide sleeve 54,

[0053] The bottom of the guide sleeve 54 is inserted into the end of the clamping fixing seat 33 away from the rotating shaft 31, the bracket 41 and the deep groove ball bearing 42 are movably sleeved on the guide sleeve 54, the bottom of the heat shield 52 is fixedly installed on the top of the guide sleeve 54, the circular heater 51 is fixedly installed in the heat shield 52, and the thermocouple wire 53 for measuring the temperature of the circular heater 51 is fixedly installed at the bottom of the circular heater 51.

[0054] The heat shield 52 is provided with multiple layers of heat insulation plates, which can effectively prevent the temperature of the circular heater 51 from being radiated to other components in the chamber, and play a role of heat insulation and protection of the circular heater 51.

[0055] The heat shield 52 is connected with the guide sleeve 54, the circular heater 51 is fixed in the heat shield 52, and the thermocouple wire 53 is fixed at the bottom of the circular heater 51 and in contact with the heat shield 52.

[0056] The guide sleeve 54 is inserted into the hole of the clamping fixing seat 33 and can move up and down, so as to adjust the distance between the circular heater 51 on the guide sleeve 54 and the wafer, and the wafer can be heated in the magnetron sputtering film coating process.

[0057] The control system provides power and introduces the circular heater 51 through a cable, the circular heater 51 starts heating work, the thermocouple wire 53 can detect the real-time temperature of the circular heater 51 and feed back to the control system, so as to form a closed loop control, and finally realize the heating of the wafer.

[0058] In a preferred embodiment, as shown in the accompanying drawings, Figures 1-4 The rotating mechanism 6 includes a rotating motor 61, a shaft coupling 62, a rotation sensor 63, a magnetic fluid sealing shaft 64, a pinion 65 and a gear wheel 66.

[0059] The output shaft of the rotating motor 61 is fixedly connected with the core shaft of the magnetic fluid sealing shaft 64 through the shaft coupling 62, the core shaft of the magnetic fluid sealing shaft 64 is also fixedly connected with the rotating shaft 31, the pinion 65 is fixedly sleeved on the end of the rotating shaft 31 penetrating out of the clamping fixing seat 33, the gear wheel 66 is fixedly installed at the bottom of the bracket 41 and movably sleeved on the guide sleeve 54, and the pinion 65 is in meshing connection with the gear wheel 66.

[0060] The magnetic fluid sealing shaft 64 is fixedly connected with the telescopic bellows 27 through a connecting flange, the rotating motor 61 is fixedly connected with the magnetic fluid sealing shaft 64 through a fixed frame, the shaft coupling 62 is located in the fixed frame, and the rotation sensor 63 for feeding back the rotation degree of the rotating shaft 31.

[0061] The rotary motor 61 and the shaft coupling 62 are located in an atmospheric environment, one end of the magnetic fluid sealing shaft 64 is located in the atmospheric environment, and the other end of the magnetic fluid sealing shaft 64 is located in a vacuum environment, so that the rotation provided by the rotary motor 61 in the atmospheric environment can be transmitted to the vacuum environment, and the mandrel of the magnetic fluid sealing shaft 64 is rotated;

[0062] Specific driving process is that the rotary motor 61 drives the mandrel of the magnetic fluid sealing shaft 64 to rotate through the shaft coupling 62, the mandrel of the magnetic fluid sealing shaft 64 drives the rotating shaft 31 to rotate, so that the pinion 65 connected with the rotating shaft 31 is driven to rotate; the pinion 65 is engaged with the gear wheel 66, the gear wheel 66 is driven to rotate by the rotation of the pinion 65, so that the carrier 41 and the wafer placed on the carrier 41 are rotated;

[0063] The carrier 41 is designed as a semi-open structure, and the wafer is conveniently placed into the carrier 41 by a conveying hand.

[0064] The rotary motor 61 feeds back the rotation degree through the rotation sensor 63, and the pinion 65 is rotated to a specified angle, so that the wafer is finally rotated.

[0065] When the sample table is fixed in the chamber, the position of the carrier 41 in the chamber can be adjusted, and a plurality of cathode positions can be adapted, so that the relative position of the cathode and the wafer is conveniently adjusted.

[0066] The utility model discloses a working principle: when using, the mounting flange 1 fixed on the outer wall of the magnetron sputtering chamber, the lifting drive platform 2 and sample table main shaft 3 are located in the atmospheric environment, and the wafer rotary table 4 and heating table 5 are located in the vacuum chamber, and the lifting drive platform 2 can drive the sample table main shaft 3 to move up and down, so as to drive the wafer rotary table 4 and heating table 5 in the vacuum chamber to lift.

[0067] When the conveying hand of the conveying system conveys the wafer to the upper portion of the wafer rotary table 4, the lifting drive platform 2 drives the wafer rotary table 4 to ascend, so that the wafer is separated from the conveying hand and is placed in the wafer rotary table 4, then according to different plating process requirements, the lifting drive platform 2 realizes positioning through the positioning sensor 29, lifts the wafer to a specified position and carries out magnetron sputtering plating, the wafer rotary table 4 drives the wafer to rotate at a system designed rotating speed in the process of plating, so as to improve the uniformity of wafer plating, and the heating table 5 can heat the wafer according to the heating temperature and heating time set by the system, so as to improve the compactness and stability of the film layer.

[0068] It is to be noted that, in the present document, relational terms such as first and second and the like can be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus.

[0069] While the embodiments of the present application have been illustrated and described, it will be understood by those skilled in the art that various changes, modifications, substitutions, and alterations can be made therein without departing from the spirit and scope of the application, which is defined by the appended claims and their equivalents.

Claims

1. A magnetron sputtering wafer sample stage, characterized in that: The sample stage includes: a mounting flange (1) fixed to the outer wall of the magnetron sputtering chamber, a lifting drive stage (2), a sample stage spindle (3), a wafer rotation stage (4), and a heating stage (5); The top of the lifting drive stage (2) is fixedly installed at the bottom of the mounting flange (1). The sample stage spindle (3) is located inside the lifting drive stage (2). The wafer rotary stage (4) is fixedly installed on the top of the sample stage spindle (3) that passes through the top of the lifting drive stage (2). A rotating mechanism (6) is provided between the wafer rotary stage (4) and the sample stage spindle (3). The bottom of the heating stage (5) is installed on the upper surface of the wafer rotary stage (4).

2. The magnetron sputtering wafer sample stage according to claim 1, characterized in that: The lifting drive platform (2) includes: a frame (21), a drive motor (22), a transmission belt (23), a T-shaped lead screw (24), a lead screw nut (25), a lifting slider (26), a telescopic bellows (27), a guide shaft (28), and a positioning sensor (29). The upper and lower surfaces of one side of the frame (21) are fixedly connected to the bottom of the mounting flange (1) and the top of the telescopic bellows (27), respectively. The drive motor (22) is fixedly installed at the bottom of the other side of the frame (21). The T-shaped lead screw (24) is rotatably connected to the middle of the frame (21). The two ends of the guide shaft (28) parallel to the T-shaped lead screw (24) are fixedly installed on the frame (21). The output shaft of the drive motor (22) is connected to the T-shaped lead screw (24) via a transmission belt (23). The lead screw nut (25) is threaded onto the T-shaped lead screw (24). The lead screw nut (25) is fixedly connected to the lifting slider (26). The bottom of the sample stage spindle (3) is fixedly installed on the lifting slider (26). The lifting slider (26) is slidably connected to the guide shaft (28). The positioning sensor (29) for positioning is fixedly installed on the frame (21).

3. The magnetron sputtering wafer sample stage according to claim 2, characterized in that: The sample stage spindle (3) includes: a rotating shaft (31), a spindle outer cylinder (32), and a clamping and fixing seat (33). The bottom of the main shaft outer cylinder (32) is fixedly installed at the bottom of the telescopic bellows (27), the clamping fixing seat (33) is movably sleeved on the top of the main shaft outer cylinder (32), and the rotating shaft (31) is arranged to rotate inside the telescopic bellows (27), the mounting flange (1), the main shaft outer cylinder (32) and the clamping fixing seat (33).

4. The magnetron sputtering wafer sample stage according to claim 3, characterized in that: The wafer rotary table (4) includes: a support (41) and a deep groove ball bearing (42). The end of the clamping and fixing seat (33) away from the rotating shaft (31) is rotatably connected to the bracket (41) via a deep groove ball bearing (42).

5. A magnetron sputtering wafer sample stage according to claim 4, characterized in that: The heating platform (5) includes: a circular heater (51), a heat insulation cover (52), a thermocouple wire (53), and a guide sleeve (54). The bottom of the guide sleeve (54) is inserted into the end of the clamping and fixing seat (33) away from the rotating shaft (31). The bracket (41) and the deep groove ball bearing (42) are both movably sleeved on the guide sleeve (54). The bottom of the heat insulation cover (52) is fixedly installed on the top of the guide sleeve (54). The circular heater (51) is fixedly installed inside the heat insulation cover (52). The thermocouple wire (53) used to measure the temperature of the circular heater (51) is fixedly installed at the bottom of the circular heater (51).

6. A magnetron sputtering wafer sample stage according to claim 4, characterized in that: The rotating mechanism (6) includes: a rotary motor (61), a coupling (62), a rotation sensor (63), a magnetohydrodynamic sealing shaft (64), a pinion (65), and a large gear (66). The output shaft of the rotary motor (61) is fixedly connected to the spindle of the magnetic fluid sealing shaft (64) via a coupling (62). The spindle of the magnetic fluid sealing shaft (64) is also fixedly connected to the rotating shaft (31). The small gear (65) is fixedly sleeved on one end of the rotating shaft (31) through the clamping fixing seat (33). The large gear (66) is fixedly installed on the bottom of the bracket (41) and is movably sleeved on the guide sleeve (54). The small gear (65) and the large gear (66) are meshed together. The magnetic fluid sealing shaft (64) is fixedly connected to the telescopic bellows (27) via a connecting flange. The rotary motor (61) is fixedly connected to the magnetic fluid sealing shaft (64) via a fixed frame. The coupling (62) is located inside the fixed frame. The rotation sensor (63) used to feedback the rotation degree of the rotating shaft (31) is fixedly installed inside the fixed frame.

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