Atomic layer deposition device

Abstract

The utility model discloses an atomic layer deposition device, and belongs to the technical field of atomic layer deposition. The atomic layer deposition device comprises an outer cavity, a reaction cavity, a ventilation unit and a heating unit, the heating unit and the reaction cavity are both arranged in the outer cavity, the reaction cavity is used for coating a to-be-coated part, the ventilation unit comprises an air inlet part and an air outlet part, and the air inlet part and the air outlet part both penetrate through the outer cavity; one ends of the gas outlet piece and the gas inlet piece are communicated with the reaction cavity, and the other ends are communicated with the outside. According to the atomic layer deposition device disclosed by the utility model, the thermal insulation effect of the reaction cavity is improved, dust generated by reaction is prevented from covering the heating device, and the heating efficiency is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to atomic layer deposition technical field especially relates to a kind of atomic layer deposition devices. BACKGROUND

[0002] Atomic layer deposition device is used to carry out vacuum plating film to plating film piece such as silicon wafer, and it is widely used in semiconductor and photovoltaic field. By gaseous precursor and reactant pulse alternately into reaction cavity and occur surface chemical reaction on plating film piece to form thin film, reaction cavity is vacuum cavity and has certain temperature, to ensure plating film effect. In the related art, plating film piece is sent into reaction cavity before plating film, and is taken out from reaction cavity after plating film, on the one hand, the prior art discloses that the application number is 202010886205.X, and the invention name is atomic layer deposition equipment, and a single reaction chamber is used to carry out atomic layer deposition reaction to plating film piece, since plating film piece needs to be repeatedly taken and sent in reaction chamber in production process, a large amount of heat will be lost, process time is increased, and production efficiency is reduced. On the other hand, the prior art discloses that the application number is CN200810055628.6, and the invention name is atomic layer deposition device and atomic layer deposition method of multiple reaction cavities, the atomic layer deposition device of multiple reaction cavities includes A-phase reaction cavity, B-phase reaction cavity and transition cavity for connecting the two, although multiple reaction cavities are provided, each reaction cavity cannot be separated and independently processed, and needs to be opened and closed together, and the efficiency is too low, and the process rhythm is not smooth enough. SUMMARY

[0003] The utility model aims at providing a kind of atomic layer deposition device, improve the heat preservation effect of reaction cavity, improve heating efficiency each reaction cavity can be separated and independently processed, improve production efficiency.

[0004] To achieve this purpose, the utility model adopts the following technical solutions:

[0005] An atomic layer deposition device, comprising an outer cavity, a gas passage unit and a heating unit, the outer cavity is provided with at least two phase-separated sub-cavities, each of the sub-cavities is provided with an inner cavity; the gas passage unit is provided with at least two, one end of the gas passage unit is connected to the inner cavity one by one, and the other end is connected to the outside; the heating unit is provided with at least two, each of the sub-cavities and the inner cavities is provided with one of the heating units, and each of the heating units is independent of each other.

[0006] In some possible embodiments, the inner cavity and the sub-cavity are provided with inlets and outlets on the same side, and one end of the inner cavity provided with the inlet and outlet is connected to the sub-cavity.

[0007] In some possible implementation manners, the ventilation unit comprises at least one air inlet member and at least one air outlet member, one end of the air outlet member and the air inlet member is communicated with the inner cavity, and the other end is communicated with the outside, and the air inlet member and the air outlet member are arranged at the upper end and the lower end of the outer cavity body respectively.

[0008] In some possible implementation manners, the inner cavity is communicated with a plurality of air inlet members and a plurality of air outlet members, and the plurality of air inlet members and the plurality of air outlet members are uniformly arranged along the direction perpendicular to the distribution direction of the sub-cavity.

[0009] In some possible implementation manners, the atomic layer deposition device comprises at least two furnace doors corresponding to the inner cavity.

[0010] In some possible implementation manners, the inner cavity is provided with an air inlet uniform flow plate, and the air inlet uniform flow plate is arranged at the upper end of the inner cavity, and the air inlet member introduces air into the inner cavity through the air inlet uniform flow plate.

[0011] In some possible implementation manners, the air inlet uniform flow plate comprises an air inlet flat plate, one side of the air inlet flat plate is provided with a plurality of surrounding spaces, a plurality of air inlet through holes are uniformly formed in the air inlet flat plate, the air inlet member is communicated with the inside of the inner cavity through the air inlet through hole, the opening of the surrounding space is towards the inside of the inner cavity, and the plurality of surrounding spaces correspond to the plurality of air inlet members one by one.

[0012] In some possible implementation manners, the inner cavity is provided with an air outlet uniform flow plate, and the air outlet uniform flow plate is located at the lower end of the inner cavity.

[0013] In some possible implementation manners, the air outlet uniform flow plate comprises an air outlet flat plate, the air outlet flat plate is provided with a first region and a second region, a plurality of first air outlet through holes are formed in the first region, a plurality of second air outlet through holes are formed in the second region, the density of the first air outlet through hole is greater than that of the second air outlet through hole, and the distance between the second region and the air outlet member is less than the distance between the first region and the air outlet member.

[0014] In some possible implementation manners, the air outlet uniform flow plate comprises a vertical plate arranged around the air outlet flat plate, the vertical plate is provided with an exhaust hole with a center line perpendicular to the vertical plate, and the vertical plate is close to the bottom wall of the inner cavity.

[0015] The utility model discloses the beneficial effects of:

[0016] The utility model provides a kind of atomic layer deposition device, ventilation unit is used to connect inner cavity and outside, for providing precursor and inert gas for inner cavity, and for discharging gas.Inner cavity is used to cut off the environment of outer cavity, it is vacuum cavity, for placing to be coated piece such as silicon wafer, and provides reaction space for process reaction.Outer cavity is divided into at least two phase-separated sub-cavities, sub-cavity and inner cavity constitute double-cavity structure, so that one atomic layer deposition equipment has two independent reaction chambers, since heating unit of each sub-cavity and inner cavity is independent of other heating unit, so the atomic layer deposition equipment can carry out at least two different deposition processes, and only one chamber can work according to demand, can improve the working efficiency and utilization of equipment. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 It is the front view of the atomic layer deposition device provided by the embodiment of the utility model and equipped with boat body;

[0018] Figure 2 It is the sectional view of the inner cavity provided by the embodiment of the utility model and equipped with boat body;

[0019] Figure 3 It is the schematic diagram of outer cavity provided by the embodiment of the utility model;

[0020] Figure 4 It is the schematic diagram of inlet flow uniform plate provided by the embodiment of the utility model;

[0021] Figure 5 It is the schematic diagram of outlet flow uniform plate provided by the embodiment of the utility model.

[0022] In the figure:

[0023] 1, outer cavity;11, inner cavity;12, partition;2, boat body;3, ventilation unit;31, inlet;32, outlet;5, inlet flow uniform plate;51, inlet flat plate;511, inlet through hole;52, enclosure space;53, enclosure;54, barrier;55, folded edge;6, outlet flow uniform plate;61, outlet flat plate;611, first area;6111, first outlet through hole;612, second area;6121, second outlet through hole;62, vertical plate;621, exhaust hole;200, to be coated piece. DETAILED DESCRIPTION

[0024] In order to make the technical problems solved by the utility model, the technical scheme adopted and the technical effects reached more clear, the technical scheme of the utility model embodiment will be further described in detail below with reference to the drawings. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the person skilled in the art without creative labor belong to the protection scope of the utility model.

[0025] In the description of the utility model, unless explicitly defined and limited, the terms "connected", "connected", "fixed" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements or the interaction relationship between two elements. For the person skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0026] In the utility model, unless explicitly defined and limited, the first feature "on" or "below" the second feature can include that the first and second features are in direct contact, or the first and second features are not in direct contact but are in contact through another feature between them. Moreover, the first feature "on", "above" and "on" the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature includes that the first feature is directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0027] As shown in Figures 1-3 The embodiment provides an atomic layer deposition device, which comprises an outer cavity 1, a ventilation unit 3 and a heating unit (not shown in the figure), the outer cavity 1 is provided with at least two phase-separated sub-cavities, and one inner cavity 11 is arranged in each sub-cavity; the ventilation unit 3 is provided with at least two, one end of the ventilation unit 3 is connected to the inner cavity 11 one by one, and the other end is connected to the outside; the heating unit is provided with at least two, and one heating unit is arranged between each sub-cavity and the inner cavity 11, and each heating unit is independent of each other.

[0028] The ventilation unit 3 is used to communicate the inner cavity 11 with the outside world, to provide precursors and inert gases for the inner cavity 11, and to discharge the gases. The inner cavity 11 is used to isolate the environment of the outer cavity 1, which is a vacuum cavity, to place the pieces to be coated 200 such as silicon wafers, and to provide a reaction space for the process reaction. The outer cavity 1 is divided into at least two phase-separated sub-cavities, and the sub-cavities and the inner cavity 11 form a double-cavity structure, so that one atomic layer deposition device has two independent reaction chambers. Since the heating units provided in each sub-cavity and the inner cavity 11 are independent of other heating units, the atomic layer deposition device can perform at least two different deposition processes at different times, or only one chamber can work according to the needs, which can improve the working efficiency and utilization rate of the device.

[0029] Further, the inner cavity 11 and the sub-cavity are provided with inlets and outlets on the same side, and one end of the inner cavity 11 provided with the inlets and outlets is connected with the sub-cavity. In this way, the inner cavity 11 and the gap between the inner cavity 11 and the sub-cavity are separated, so as to prevent the dust generated by deposition in the inner cavity 11 from entering the gap between the inner cavity 11 and the sub-cavity.

[0030] The atomic layer deposition device includes at least two furnace doors, and the two furnace doors correspond to block the inner cavity 11 respectively. The at least two furnace doors can be independently opened and closed, that is, different sub-cavities can be opened individually, and each inner cavity 11 is independently ventilated through the corresponding ventilation unit 3, so that different boat bodies 2 placed in the inner cavity 11 can independently perform process reactions, thereby improving the beat efficiency. Exemplarily, a partition plate 12 is arranged in the outer cavity 1, so that the outer cavity 1 is divided into two sub-cavities which are independent of each other and do not interfere with each other along the X direction, and two boat bodies 2 are arranged in the two sub-cavities respectively.

[0031] Exemplarily, the ventilation unit 3 includes at least one gas inlet member 31 and at least one gas outlet member 32, and one end of the gas outlet member 32 and the gas inlet member 31 is communicated with the inner cavity 11, and the other end is communicated with the outside world. The gas inlet member 31 is used to connect with the gas supply device of the outside world to provide precursors and inert gases, and the gas outlet member 32 is used to discharge the gases.

[0032] In one embodiment, the gas inlet member 31 and the gas outlet member 32 each include a support seat (not shown in the figure) and a joint, the support seat is sealingly supported between the outer cavity 1 and the inner cavity 11, the outer cavity 1, the support seat and the inner cavity 11 form a through hole, and the joint is connected to the outside of the outer cavity 1 and communicated with the through hole, and the joint is used to connect with the conduit of the outside world. Exemplarily, the outer cavity 1 and the inner cavity 11 are each provided with a limiting groove, and the support seat is connected in the limiting groove through fasteners to ensure the installation accuracy. The two ends of the support seat are respectively provided with sealing grooves, and the sealing rings are arranged in the sealing grooves, so as to realize the sealing connection of the support seat in the limiting groove and ensure the sealing effect. The gas inlet member 31 and the gas outlet member 32 not only play the role of communicating ventilation, but also play the role of supporting and connecting the outer cavity 1 and the inner cavity 11, thereby simplifying the structure.

[0033] In another embodiment, the gas inlet member 31 is a gas inlet pipe, the gas outlet member 32 is a gas outlet pipe, the outer cavity 1 is provided with a through hole, and the gas inlet pipe and the gas outlet pipe pass through the through hole and are sealingly connected with the through hole to avoid heat loss. One end of the gas inlet pipe and the gas outlet pipe are connected to the inner cavity 11 through pipe joints, the other end of the gas inlet pipe is connected to the gas supply device through a pipe joint, and the gas outlet pipe is connected to the tail gas treatment device through a pipe joint. The outer cavity 1 and the inner cavity 11 are supported and connected by a support structure. Optionally, the outside of the outer cavity 1 is provided with a cooling unit such as a cold water pipe to ensure safety.

[0034] One inner cavity 11 is communicated with a plurality of gas inlet members 31 and a plurality of gas outlet members 32, and the plurality of gas inlet members 31 and the plurality of gas outlet members 32 are uniformly spaced along a direction perpendicular to the distribution of the sub-cavities, so that the gas flow inlet and outlet are uniformly distributed, improving the uniformity and density of the coating. The number of gas inlet members 31 is not less than the number of gas outlet members 32, so as to avoid the gas flow outlet speed being greater than the gas inlet speed, and to ensure that the reaction proceeds fully. Exemplarily, three gas inlet members 31 are arranged along the length direction of the inner cavity 11.

[0035] Optionally, the gas inlet member 31 is provided with two along the width direction of the inner cavity 11, i.e. the X direction, to improve the uniformity of the gas flow inlet in the X direction. In this embodiment, one inner cavity 11 is provided with six gas inlet members 31 and two gas outlet members 32, and the six gas inlet members 31 are divided into three groups, each group having two gas inlet members 31. The two gas inlet members 31 in the same group are arranged along the width direction of the inner cavity 11, and the three groups of gas inlet members 31 are arranged along the length direction of the inner cavity 11.

[0036] In the related art, the to-be-coated member 200 such as a silicon wafer adopts a larger and thinner structure to facilitate coating to reduce the production cost of battery pieces, but when the size of the to-be-coated member 200 becomes larger and thinner, the existing forward and backward gas inlet mode has a longer gas flow path, a larger difference in uniformity between the front and back, and a larger gas consumption, which cannot make the coating effect of the to-be-coated member 200 optimal, and easily leads to poor film uniformity. Exemplarily, the coating surface of the to-be-coated member 200 faces the X direction of the inner cavity 11, a plurality of boat bodies 2 carrying the to-be-coated member 200 are arranged along the X direction, and the boat bodies 2 extend along the Y direction. The gas inlet member 31 is arranged at the top of the inner cavity 11, and the gas outlet member 32 is arranged at the bottom of the inner cavity 11. The upper gas inlet and lower gas outlet mode is used, the gas flow passes through along the vertical direction, i.e. the Z direction, and acts on the side surface of the to-be-coated member 200. The distance of the gas flow to the plurality of to-be-coated members 200 arranged in the horizontal direction is consistent. Due to the small vertical size of the inner cavity 11, the gas inlet stroke in the inner cavity 11 is short, the gas is affected by gravity and flows along the vertical direction, the gas flow speed is fast, the attenuation degree is low, the gas inlet uniformity is ensured, i.e. the coating uniformity is improved; and the gas inlet time and gas inlet amount can be effectively shortened, the equipment productivity is increased, and the production cost is reduced.

[0037] Optionally, the inner cavity 11 is provided with two boat bodies 2 in the vertical direction, and each boat body 2 is provided with two carriers in the vertical direction, and the carriers are provided with the pieces to be plated 200, so as to carry the pieces to be plated 200 in the vertical direction, thereby ensuring the single-cavity production capacity.

[0038] As shown in Figure 2 and Figure 4 , the inner cavity 11 is provided with an air inlet flow uniformizing plate 5, which is arranged at the upper end of the inner cavity 11. The air inlet member 31 introduces air into the inner cavity 11 through the air inlet flow uniformizing plate 5. The air inlet flow uniformizing plate 5 can ensure that the process gas entering the inner cavity 11 can pass through the pieces to be plated 200 more uniformly.

[0039] The air inlet flow uniformizing plate 5 includes an air inlet flat plate 51, which is provided with a plurality of surrounding spaces 52 on one side. The air inlet flat plate 51 is uniformly provided with a plurality of air inlet through holes 511. The air inlet member 31 is communicated with the inside of the inner cavity 11 through the air inlet through holes 511. The opening of the surrounding space 52 faces the inside of the inner cavity 11. The plurality of surrounding spaces 52 correspond to the plurality of air inlet members 31 one by one. The surrounding space 52 is correspondingly arranged with the air inlet member 31, which can further ensure that the different air inlet members 31 flow to the pieces to be plated 200 through the different surrounding spaces 52, so that the entering airflow flows in the preset direction, and the uniform flow effect is further improved. Optionally, the air inlet flat plate 51 is surrounded by a surrounding wall 53, and the middle position of the air inlet flat plate 51 is provided with a partition 54, thereby forming a plurality of surrounding spaces 52 with one side opening. The structure is simple and convenient to install. Exemplarily, two partitions 54 are arranged, and three surrounding spaces 52 are formed in the Y direction, which correspond to the three groups of air inlet members 31 one by one. Further, the surrounding wall 53 is outwardly provided with a folding edge 55, which is connected to the top wall of the inner cavity 11 by a screw.

[0040] As shown in Figure 2 and Figure 5 , the inner cavity 11 is provided with an air outlet flow uniformizing plate 6, which is located at the lower end of the inner cavity 11. The air outlet flow uniformizing plate 6 can ensure the flow rate of the airflow flowing out of the inner cavity 11, ensure that the process gas fully reacts in the inner cavity 11, and pass through the pieces to be plated 200 more uniformly.

[0041] The air outlet flow uniformizing plate 6 includes an air outlet flat plate 61, which is provided with a first region 611 and a second region 612. The first region 611 is provided with a plurality of first air outlet through holes 6111, and the second region 612 is provided with a plurality of second air outlet through holes 6121. The density of the first air outlet through holes 6111 is greater than that of the second air outlet through holes 6121. The distance between the second region 612 and the air outlet member 32 is less than that between the first region 611 and the air outlet member 32, so as to ensure that the air outlet velocities of the first region 611 and the second region 612 are the same, and further improve the uniform flow effect. Further, the diameter of the first air outlet through hole 6111 is greater than that of the second air outlet through hole 6121, which also improves the uniform flow effect.

[0042] The gas outlet uniform flow plate 6 comprises a vertical plate 62 arranged around the gas outlet flat plate 61, the vertical plate 62 is provided with exhaust holes 621 whose center lines are perpendicular to the vertical plate 62, the vertical plate 62 is close to the bottom wall of the inner cavity 11, and a plurality of exhaust holes 621 are distributed around the gas outlet flat plate 61, so that the dust is discharged together with the reaction gas to the outer tail gas treatment device through the gas outlet part 32, the accumulation of the dust in the inner cavity 11 is reduced, and the relative cleanness in the cavity is ensured. Through the structure of the gas outlet flat plate 61 and the vertical plate 62, the dust not discharged can be conveniently cleaned. Further, the gas outlet flat plate 61 is connected with the bottom wall of the inner cavity 11 through screws.

[0043] Obviously, the above embodiments of the present application are merely illustrative and not intended to limit the embodiments of the present application. For those skilled in the art, other different forms of changes or variations can be made on the basis of the above description. Here, it is not necessary and impossible to enumerate all the embodiments. Any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the claims of the present application.

Claims

1. An atomic layer deposition apparatus, characterized by, The application relates to an external cavity (1) provided with at least two phase-separated sub-cavities, each of which is provided with an inner cavity (11); the ventilation unit (3) is provided with at least two ventilation units (3), one end of each ventilation unit (3) is connected to the inner cavity (11) in a one-to-one correspondence, and the other end is connected to the outside; the heating unit is provided with at least two heating units, each of which is arranged between the sub-cavity and the inner cavity (11), and each of the heating units is independent of each other.

2. The atomic layer deposition apparatus according to claim 1, characterized by The inner cavity (11) and the sub-cavity are provided with inlets and outlets on the same side, and one end of the inner cavity (11) is connected to the sub-cavity.

3. The atomic layer deposition apparatus according to claim 1, characterized by The ventilation unit (3) comprises at least one air inlet member (31) and at least one air outlet member (32), one end of the air outlet member (32) and the air inlet member (31) is connected to the inner cavity (11), and the other end is connected to the outside, and the air inlet member (31) and the air outlet member (32) are arranged at the upper end and the lower end of the external cavity (1) respectively.

4. The atomic layer deposition apparatus according to claim 3, characterized by A plurality of air inlet members (31) and a plurality of air outlet members (32) are connected to the inner cavity (11), and the plurality of air inlet members (31) and the plurality of air outlet members (32) are uniformly and spacedly arranged along the direction perpendicular to the sub-cavity.

5. The atomic layer deposition apparatus according to claim 1, wherein The atomic layer deposition device comprises at least two furnace doors corresponding to the inner cavity (11).

6. An atomic layer deposition apparatus according to claim 3 or 4, characterised in that The inner cavity (11) is provided with an air inlet uniform flow plate (5) arranged at the upper end of the inner cavity (11), and the air inlet member (31) is connected to the inner cavity (11) through the air inlet uniform flow plate (5).

7. The atomic layer deposition apparatus according to claim 6, characterized by The air inlet uniform flow plate (5) comprises an air inlet flat plate (51), one side of the air inlet flat plate (51) is provided with a plurality of surrounding spaces (52), a plurality of air inlet through holes (511) are uniformly arranged in the air inlet flat plate (51), the air inlet member (31) is connected to the inner cavity (11) through the air inlet through hole (511), the opening of the surrounding space (52) faces the inner cavity (11), and the plurality of surrounding spaces (52) one-to-one correspond to the plurality of air inlet members (31).

8. An atomic layer deposition apparatus according to claim 3 or 4, characterised in that The inner cavity (11) is provided with an air outlet uniform flow plate (6) arranged at the lower end of the inner cavity (11).

9. The atomic layer deposition apparatus according to claim 8, characterized by The air outlet uniform flow plate (6) comprises an air outlet flat plate (61) provided with a first region (611) and a second region (612), a plurality of first air outlet through holes (6111) are arranged in the first region (611), a plurality of second air outlet through holes (6121) are arranged in the second region (612), the density of the first air outlet through hole (6111) is greater than that of the second air outlet through hole (6121), and the distance between the second region (612) and the air outlet member (32) is less than that between the first region (611) and the air outlet member (32).

10. The atomic layer deposition apparatus according to claim 9, characterized by The air outlet uniform flow plate (6) comprises a vertical plate (62) arranged around the air outlet flat plate (61), the vertical plate (62) is provided with an exhaust hole (621) with a center line perpendicular to the vertical plate (62), and the vertical plate (62) is close to the bottom wall of the inner cavity (11).

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