Support plate and coating device for vacuum film deposition equipment

Abstract

The utility model discloses a support plate for vacuum thin film deposition equipment, and discloses a coating device with the support plate for the vacuum thin film deposition equipment, the support plate for the vacuum thin film deposition equipment comprises a frame, a tray and a limiting assembly, the frame is provided with a first through hole and a second through hole, the axis of the first through hole and the axis of the second through hole are arranged in a staggered mode, the tray is used for bearing silicon wafers, arranged on the frame and provided with a third through hole, the limiting assembly comprises a connecting piece and a limiting piece, the connecting piece comprises a connecting shaft and an abutting portion arranged on the connecting shaft, and the connecting shaft penetrates through the first through hole and the third through hole. The abutting part abuts against the periphery of the side, away from the frame, of the third through hole, the limiting piece penetrates through the through hole, a limiting structure is arranged between the limiting piece and the connecting shaft and used for limiting the connecting piece to move in the axis direction of the first through hole, the thickness of the tray and the thickness of the frame are uniform, the silicon wafer is heated uniformly, and the coating quality of the silicon wafer can be improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of silicon wafer coating equipment, especially to a carrier plate for vacuum thin film deposition equipment and a coating device. BACKGROUND

[0002] PECVD (Plasma Enhanced Chemical Vapor Deposition) is one of the commonly used coating methods in solar cell production, and a corresponding PECVD device is usually used to coat silicon wafers. In the existing PECVD device, a carrier plate is used to transport silicon wafers during the coating process.

[0003] The carrier plate includes a frame and a tray arranged on the frame. The front surface of the tray is provided with a bearing position for bearing the silicon wafer. The tray is fixed to the frame by a fixing structure to form an integral whole, thereby ensuring the flatness of the tray and increasing the strength. To ensure that the tray and the frame are tightly attached, a clamping groove is designed on the back of the tray, and an aluminum fixing block is installed on the frame. The clamping groove of the tray is hooked by the fixing block, so that the tray is fixed to the tray. This design causes the clamping groove designed on the back of the tray to be 1mm to 1.5mm thicker than other positions, and also increases the thickness of the aluminum fixing block on the lower part of the frame.

[0004] Since the carrier plate is used in a vacuum environment, the carrier plate is heated by the upper and lower heating plates. The heating method in the vacuum cavity mainly relies on heat radiation and heat convection. Due to the increased thickness of the clamping groove of the tray and the thick aluminum fixing block on the lower part of the frame, the radiation heating is blocked, resulting in a lower temperature at this position compared to the position without the fixing block and the clamping groove, which affects the temperature uniformity of the silicon wafer and reduces the coating quality of the silicon wafer. SUMMARY

[0005] The utility model aims at at least solves one of the technical problems existing in the prior art. To this end, the utility model provides a carrier plate for vacuum thin film deposition equipment, which can realize tight attachment of the tray and the frame without affecting the heating efficiency and uniformity of the carrier plate.

[0006] The utility model further provides a coating device with the above-mentioned carrier plate for vacuum thin film deposition equipment.

[0007] The carrier plate for vacuum thin film deposition equipment according to the first aspect of the utility model comprises:

[0008] The frame is provided with at least one first through hole and at least one second through hole communicating with the first through hole, and the at least one first through hole and the at least one second through hole are arranged in an alternating communication mode;

[0009] A tray for carrying silicon wafers is provided on the frame and is provided with at least one third through hole corresponding to the first through hole;

[0010] A limiting assembly includes a connecting piece and a limiting piece, the connecting piece includes a connecting shaft and an abutting portion provided on the connecting shaft, the connecting shaft is provided through the first through hole and the third through hole, the abutting portion abuts with the periphery of the side of the third through hole away from the frame, the limiting piece is provided through the second through hole, a limiting structure is provided between the limiting piece and the connecting shaft, and the limiting structure is used for limiting the movement of the connecting piece along the axis direction of the first through hole.

[0011] According to the first aspect of the utility model, the carrier plate for the vacuum thin film deposition equipment has at least the following beneficial effects:

[0012] When the tray is assembled on the frame, the first through hole is aligned with the third through hole, then the connecting shaft is provided through the first through hole and the third through hole, the connecting piece makes the abutting portion abut with the periphery of the side of the third through hole away from the frame, at this time, the limiting piece partially extends into the second through hole, the limiting piece is moved along the axis of the second through hole, so that the limiting piece can be clamped and matched between the limiting structure and the connecting shaft, the tray and the frame can be tightly attached, the heating efficiency and uniformity of the carrier plate can be not affected, and the film coating quality of the silicon wafer can be improved.

[0013] According to some embodiments of the utility model, the limiting structure includes a clamping groove provided on the connecting shaft and a clamping portion provided on the limiting piece, the clamping portion is accommodated in the clamping groove and abuts with the side wall of the clamping groove.

[0014] According to some embodiments of the utility model, the clamping groove is arranged around the axis direction of the connecting shaft, the limiting piece is provided with two clamping portions, the two clamping portions are oppositely arranged, and the second through hole is correspondingly provided with two.

[0015] According to some embodiments of the utility model, a limiting groove is provided on the clamping portion, the bottom wall of the clamping groove abuts with the side wall of the limiting groove, so as to prevent the limiting piece from being separated along the axis direction of the second through hole.

[0016] According to some embodiments of the utility model, the limiting assembly further includes a nut, the clamping portion is provided with an external thread, and the nut is threadedly matched with the external thread, so as to prevent the limiting piece from being separated along the axis direction of the second through hole.

[0017] According to some embodiments of the utility model, the third through hole includes a first hole diameter and a second hole diameter, the abutting portion is at least partially accommodated in the first hole diameter, and the connecting shaft is provided through the second hole diameter.

[0018] According to some embodiments of the present application, the axis of the first through hole is perpendicular to the axis of the second through hole.

[0019] According to some embodiments of the present application, the cross section of the first through hole is circular or rectangular; or,

[0020] the cross section of the second through hole is circular or rectangular; or,

[0021] the cross section of the third through hole is circular or rectangular.

[0022] According to some embodiments of the present application, the connecting member and the limiting member are made of a material with a fluorine atom composite loss rate of the surface composition ≤5×10 -3 .

[0023] According to the coating device of the second aspect of the embodiments of the present application, the carrier plate for the vacuum thin film deposition equipment is described above.

[0024] According to the coating device of the second aspect of the embodiments of the present application, at least the following beneficial effects are achieved:

[0025] When assembling the tray on the frame, align the first through hole with the third through hole, then pass the connecting shaft through the first through hole and the third through hole, the connecting member, so that the abutting portion abuts against the circumference of the side of the third through hole away from the frame, at this time, the limiting member partially extends into the second through hole, and the limiting member is moved along the axis of the second through hole to enable the limiting member to be clamped and matched between the limiting structure and the connecting shaft, the tray and the frame are firmly fixed and attached, and the uniform heating of the silicon wafer is ensured, thereby improving the coating quality of the silicon wafer.

[0026] Additional aspects and advantages of the present application will be given in part in the following description, and will become apparent from the following description, or will be learned by practice of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0027] The above and / or additional aspects and advantages of the present application will become apparent and more readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings, in which:

[0028] Figure 1 is a structural schematic view of the carrier plate for the vacuum thin film deposition equipment of the embodiments of the present application;

[0029] Figure 2 is a partial exploded schematic view of the carrier plate for the vacuum thin film deposition equipment of the embodiments of the present application;

[0030] Figure 3 is an assembly schematic view of the limiting assembly of the embodiments of the present application;

[0031] Figure 4 Assembling view of the connecting piece, the frame and the tray of the embodiment of the utility model;

[0032] Figure 5 Assembling view of the connecting piece, the frame and the tray of the embodiment of the utility model;

[0033] Reference signs:

[0034] Frame 100, first through hole 110, second through hole 120, tray 200, third through hole 210, first aperture 211, second aperture 212, connecting piece 300, clamping groove 301, connecting shaft 310, abutting portion 320, limiting piece 400, limiting groove 401, clamping portion 410, end portion 420, nut 500. DETAILED DESCRIPTION

[0035] The embodiments of the utility model are described in detail below, examples of the embodiments are shown in the drawings, wherein the same or similar reference signs represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary, only for explaining the utility model, and cannot be understood as limiting the utility model.

[0036] In the description of the utility model, it is understood that the orientation description, such as the orientation or position relationship of the indication of up, down, front, back, left, right and the like, is based on the orientation or position relationship shown in the drawings, only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the indicated device or element must have a specific orientation, be constructed and operated in a specific orientation, therefore, it cannot be understood as limiting the utility model.

[0037] In the description of the utility model, the meaning of several is one or more, the meaning of multiple is two or more, greater than, less than, more than and the like are understood as not including the number, above, below, within and the like are understood as including the number. If the first, the second is described, it is only for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features or the sequence of indicated technical features.

[0038] In the description of the utility model, unless otherwise explicitly limited, the words of setting, installing, connecting and the like should be broadly understood, and the technical personnel in the technical field can reasonably determine the specific meaning of the above words in the utility model according to the specific content of the technical scheme.

[0039] In the related art, the carrier plate includes a frame and a tray provided on the frame, the front of the tray is provided with a bearing position for bearing a silicon wafer, and the tray is fixed to the frame through a fixing structure to form an integral whole, thereby ensuring the flatness of the tray and increasing the strength. The fixing structure is a clamping groove designed on the back of the tray, and an aluminum fixing block is installed on the frame, the clamping groove of the tray is hooked by the fixing block, and the tray is fixed to the tray. This design will cause the clamping groove designed on the back of the tray to be 1-1.5 mm thicker than other positions, and at the same time, the aluminum fixing block is increased on the frame below the clamping groove.

[0040] Since the environment in which the carrier plate is used is vacuum, the carrier plate is heated by the upper and lower heating plates. The heating mode in the vacuum cavity mainly relies on heat radiation and heat convection. Since the clamping groove of the tray increases the thickness and the aluminum fixing block of the lower frame is relatively thick, the radiation heating is blocked, and their heat capacity is relatively large, which causes the temperature of this position to be relatively low compared with the position without the fixing block and the clamping groove, thereby affecting the temperature uniformity of the silicon wafer and reducing the film coating quality of the silicon wafer.

[0041] Reference Figures 1 to 3 According to the carrier plate for a vacuum thin film deposition device provided by the first aspect of the present application, the carrier plate includes a frame 100, a tray 200, and a limiting assembly. The frame 100 is provided with a first through hole 110 and a second through hole 120. Each first through hole 110 is in communication with two second through holes 120. The axis of the first through hole 110 and the axis of the second through hole 120 are arranged alternately. The tray 200 is used for bearing a silicon wafer. The tray 200 is arranged on the frame 100 and is provided with a third through hole 210. The limiting assembly includes a connecting piece 300 and a limiting piece 400. The connecting piece 300 includes a connecting shaft 310 and an abutting portion 320 arranged on the connecting shaft 310. The connecting shaft 320 is arranged through the first through hole 110 and the third through hole 210. The abutting portion 320 abuts with the periphery of the side of the third through hole 210 away from the frame 100. The limiting piece 400 is arranged through the through hole. A limiting structure is arranged between the limiting piece 400 and the connecting shaft 310. The limiting structure is used for limiting the movement of the connecting piece 300 along the axis direction of the first through hole 110. In this way, the tray 200 and the frame 100 can be tightly attached, and the heating efficiency and uniformity of the carrier plate are not affected, and the film coating quality of the silicon wafer can be improved.

[0042] For example, when assembling the tray 200 on the frame 100, the first through hole 110 is aligned with the third through hole 210, then the connecting shaft 310 is arranged in the first through hole 110 and the third through hole 210, the connecting piece 300 is arranged so that the abutting portion 320 abuts against the periphery of the side of the third through hole 210 away from the frame 100, at this time, part of the limiting piece 400 extends into the second through hole 120, and the limiting piece 400 is moved along the axis of the second through hole 120 so that the limiting piece 400 can be connected with the connecting shaft 310 through the limiting structure, the tray 200 and the frame 100 can be tightly attached, the heating efficiency and uniformity of the carrier plate are not affected, and the film coating quality of the silicon wafer can be improved.

[0043] In some embodiments of the utility model, the limiting structure comprises a clamping groove 301 arranged on the connecting shaft 310 and a clamping portion 410 arranged on the limiting piece 400, the clamping portion 410 is accommodated in the clamping groove 301 and abuts against the side wall of the clamping groove 301, and the connecting piece 300 and the tray 200 can be connected and fixed.

[0044] For example, when the connecting piece 300 moves in the direction of exiting the third through hole 210, the clamping portion 410 can abut against the side wall of the clamping groove 301 to limit the movement of the connecting piece 300 in the direction of exiting the third through hole 210, and the separation of the frame 100 and the tray 200 can be prevented; when the frame 100 and the tray 200 are separated, the limiting piece 400 can be moved in the direction of exiting the second through hole 120, so that the clamping portion 410 exits the clamping groove 301, and the connecting piece 300 can be taken out of the third through hole 210, and the frame 100 and the tray 200 can be conveniently disassembled.

[0045] It should be noted that the positions of the clamping groove 301 and the clamping portion 410 can also be interchanged, that is, the clamping portion 410 is arranged on the connecting shaft 310, and the clamping groove 301 is arranged on the limiting piece 400, and the movement of the connecting piece 300 in the direction of exiting the third through hole 210 can also be limited, which is not limited herein.

[0046] It should be noted that the clamping groove 301 can also be arranged on the side wall of the first through hole 110, and the clamping portion 410 is a clamping hook, the hook portion of the clamping hook is accommodated in the clamping groove 301 and can abut against the side wall of the clamping groove 301, and the movement of the connecting piece 300 in the direction of exiting the third through hole 210 can also be limited, which is not limited herein.

[0047] It should be noted that the limiting structure can also be a fourth through hole (not shown in the figure) arranged on the connecting shaft 310, and the limiting piece 400 is arranged in the fourth through hole and connected with the frame 100 through threaded connection, and the movement of the connecting piece 300 in the direction of exiting the third through hole 210 can also be limited, which is not described in detail herein.

[0048] In some embodiments of the utility model, the clamping groove 301 is arranged around the axis direction of the connecting piece 300, the clamping part 410 is provided with two, the two clamping parts 410 are oppositely arranged, and the second through hole 120 is correspondingly provided with two, so that the connecting stability of the connecting piece 300 and the limiting piece 400 can be improved, and the use reliability of the carrier plate can be improved.

[0049] For example, the clamping groove 301 is annular structure, the clamping groove 301 is arranged around the axis direction of the connecting piece 300, when assembling the limiting assembly, one of the two clamping parts 410 is accommodated in one side of the clamping groove 301, and the other is accommodated in the other side of the clamping groove 301, so that the connecting piece 300 is uniformly stressed, the connecting stability of the connecting piece 300 and the limiting piece 400 can be improved, and the use reliability of the carrier plate can be improved.

[0050] In some embodiments of the utility model, the connecting shaft 310 and the abutting part 320 are integrated structure, the number of moulds can be reduced, the production cost of mould is reduced, and the production cost of carrier plate is reduced.

[0051] For example, by setting the connecting shaft 310 and the abutting part 320 as integrated structure, the number of moulds can be reduced, the production cost of mould is reduced, and the production cost of carrier plate is reduced.Certainly, in some other specific embodiments, the connecting shaft 310 and the abutting part 320 can also be connected by welding, wherein the welding mode includes but is not limited to resistance welding, laser welding or ultrasonic welding.

[0052] In some embodiments of the utility model, the limiting piece 400 further includes an end part 420, one end of the end part 420 is connected with the clamping part 410, and the other end of the end part 420 extends out of the second through hole 120, so that the user can conveniently pull out the limiting piece 400 from the second through hole 120, and the tray 200 can be disassembled.

[0053] In some embodiments of the utility model, the end part 420 and the clamping part 410 are integrated structure, the number of moulds can be reduced, the production cost of mould is reduced, and the production cost of carrier plate is reduced.

[0054] For example, the limiting piece 400 is a clasp spring structure, one end of the two clamping parts 410 is connected with the end part 420, the limiting piece 400 can be effectively clamped with the connecting shaft 310, on the one hand, the connecting stability of the tray 200 and the frame 100 can be improved, and on the other hand, the number of moulds can be reduced, the production cost of mould is reduced, and the production cost of carrier plate is reduced.

[0055] In some embodiments of the utility model, the clamping part 410 is provided with a limiting groove 401, the bottom wall of the clamping groove 301 and the side wall of the limiting groove 401 abut, to prevent the limiting piece 400 from separating along the axis direction of the second through hole 120, and the connection reliability of the limiting assembly can be improved.

[0056] With reference to Figure 5 In some embodiments of the utility model, the limiting assembly further comprises a nut 500, the clamping part 410 is provided with external threads, and the nut 500 is threadedly matched with the external threads, to prevent the limiting piece 400 from separating along the axis direction of the second through hole 120, and the connection reliability of the limiting assembly can be improved.

[0057] With reference to Figure 4 In some embodiments of the utility model, the third through hole 210 comprises a first aperture 211 and a second aperture 212, the connecting shaft 310 is arranged in the second aperture 212, and the abutting part 320 is completely accommodated in the first aperture 211, so that the surface fixing part of the carrier plate is relatively flat, and abnormal discharge in the plasma field area during the process is avoided.

[0058] It should be noted that the abutting part 320 can also partially extend out of the first aperture 211, which is not limited herein.

[0059] In some embodiments of the utility model, the axis of the first through hole 110 and the axis of the second through hole 120 are arranged perpendicularly, so that the first through hole 110 and the second through hole 120 are respectively located on different sides of the frame 100, which can facilitate the production of the frame 100 and improve the connection stability of the frame 100 and the tray 200.

[0060] It should be noted that the included angle between the axis of the first through hole 110 and the axis of the second through hole 120 can also be an acute angle or an obtuse angle, which is not limited herein.

[0061] In some embodiments of the utility model, the limiting assembly is provided with two groups, and the two groups of limiting assemblies are diagonally arranged, which can reduce the number of limiting assemblies and reduce the production cost of the carrier plate.

[0062] In some embodiments of the utility model, the cross section of the first through hole 110, the cross section of the second through hole 120 and the cross section of the third through hole 210 are all circular, which is simple in structure and convenient for forming, can facilitate the machining of the first through hole 110 and the second through hole 120 on the frame 100, and facilitate the machining of the third through hole 210 on the tray 200.

[0063] It should be noted that the cross section of the first through hole 110, the cross section of the second through hole 120 and the cross section of the third through hole 210 can also be rectangular, which is not limited herein.

[0064] In some embodiments of the utility model, the connecting piece 300 and the limiting piece 400 are both made of a material with a fluorine atom composite loss rate of the surface composition ≤5×10 -3 The material can be aluminum, stainless steel, Monel alloy, Invar alloy or alumina ceramic, etc.

[0065] According to the coating device of the second aspect of the utility model, the carrier plate for the vacuum thin film deposition equipment of the first aspect of the utility model is included.

[0066] When the tray 200 is assembled on the frame 100, the first through hole 110 is aligned with the third through hole 210, then the connecting shaft 310 of the connecting piece 300 is arranged in the first through hole 110 and the third through hole 210, the connecting piece 300 is moved so that the abutting portion 320 of the connecting piece 300 abuts against the circumference of the side of the third through hole 210 away from the frame 100, at this time, part of the connecting shaft 310 extends into the second through hole 120, the limiting piece 400 is moved along the axis of the second through hole 120 so that the limiting piece 400 can be clamped and matched between the limiting structure and the connecting shaft 310, the tray 200 and the frame 100 are not fixed by the structure matched by the clamping groove 301 and the fixed block, the tray 200 and the frame 100 can be tightly attached, the heating efficiency and uniformity of the carrier plate are not affected, and the coating quality of the silicon wafer can be improved.

[0067] The technical features of the above-described embodiments can be combined arbitrarily, and to make the description concise, all possible combinations of the technical features in the above-described embodiments are not described, however, as long as the combinations of the technical features do not exist contradictory, they should be considered as the scope of the present disclosure.

[0068] The above embodiments are described in detail in combination with the drawings, but the utility model is not limited to the above-described embodiments, and within the knowledge range of ordinary skilled persons in the technical field, various changes can be made without departing from the purpose of the utility model.

Claims

1. A carrier plate for a vacuum thin film deposition apparatus, characterized in that, The utility model relates to a frame, at least one first through hole and the intercommunication of at least one second through hole are equipped with, at least one first through hole and at least one second through hole staggered intercommunication arrangement are provided with; The tray for carrying silicon wafer, the tray is located on the frame and is equipped with at least one third through hole, and the third through hole is arranged corresponding to the first through hole; The limiting component includes a connecting piece and a limiting piece, the connecting piece includes a connecting shaft and an abutting portion provided on the connecting shaft, the connecting shaft is provided in the first through hole and the third through hole, the abutting portion abuts with the periphery of the side of the third through hole away from the frame, the limiting piece is provided in the second through hole, and a limiting structure is arranged between the limiting piece and the connecting shaft, the limiting structure is used for limiting the movement of the connecting piece along the axial direction of the first through hole. The limiting structure includes a clamping groove provided on the connecting shaft and a clamping portion provided on the limiting piece, the clamping portion is accommodated in the clamping groove and abuts with the side wall of the clamping groove.

2. A carrier plate for a vacuum thin film deposition apparatus according to claim 1, wherein, The clamping groove is arranged around the axial direction of the connecting shaft, the limiting piece is provided with two clamping portions, the two clamping portions are oppositely arranged, and the second through hole is correspondingly provided with two clamping portions.

3. A carrier plate for a vacuum thin film deposition apparatus according to claim 2, wherein, A limiting groove is formed on the clamping portion, the bottom wall of the clamping groove abuts with the side wall of the limiting groove to prevent the limiting piece from being separated along the axial direction of the second through hole.

4. The carrier plate for a vacuum thin film deposition apparatus according to claim 2, wherein, The limiting component further includes a nut, the clamping portion is provided with an external thread, and the nut is threadedly connected with the external thread to prevent the limiting piece from being separated along the axial direction of the second through hole.

5. The carrier plate for a vacuum thin film deposition apparatus according to claim 2, wherein, The third through hole includes a first aperture and a second aperture, the abutting portion is at least partially accommodated in the first aperture, and the connecting shaft is provided in the second aperture.

6. The carrier plate for a vacuum thin film deposition apparatus according to claim 1, wherein, The axis of the first through hole is perpendicular to the axis of the second through hole.

7. The carrier plate for a vacuum thin film deposition apparatus according to claim 1, wherein The cross section of the first through hole is circular or rectangular.

8. The carrier plate for a vacuum thin film deposition apparatus according to claim 1, wherein, The cross section of the second through hole is circular or rectangular. The cross section of the third through hole is circular or rectangular. The utility model relates to a frame, at least one first through hole and the intercommunication of at least one second through hole are equipped with, at least one first through hole and at least one second through hole staggered intercommunication arrangement are provided with; 9. The carrier plate for a vacuum thin film deposition apparatus of claim 1, wherein, The connecting piece and the limiting piece are made of a material with a complex loss rate of fluorine atoms on the surface ≤5×10 -3 .

10. A coating apparatus, characterized by comprising: The tray for carrying silicon wafer, the tray is located on the frame and is equipped with at least one third through hole, and the third through hole is arranged corresponding to the first through hole; The limiting component includes a connecting piece and a limiting piece, the connecting piece includes a connecting shaft and an abutting portion provided on the connecting shaft, the connecting shaft is provided in the first through hole and the third through hole, the abutting portion abuts with the periphery of the side of the third through hole away from the frame, the limiting piece is provided in the second through hole, and a limiting structure is arranged between the limiting piece and the connecting shaft, the limiting structure is used for limiting the movement of the connecting piece along the axial direction of the first through hole. The limiting structure includes a clamping groove provided on the connecting shaft and a clamping portion provided on the limiting piece, the clamping portion is accommodated in the clamping groove and abuts with the side wall of the clamping groove. The clamping groove is arranged around the axial direction of the connecting shaft, the limiting piece is provided with two clamping portions, the two clamping portions are oppositely arranged, and the second through hole is correspondingly provided with two clamping portions. A limiting groove is formed on the clamping portion, the bottom wall of the clamping groove abuts with the side wall of the limiting groove to prevent the limiting piece from being separated along the axial direction of the second through hole. The limiting component further includes a nut, the clamping portion is provided with an external thread, and the nut is threadedly connected with the external thread to prevent the limiting piece from being separated along the axial direction of the second through hole. The third through hole includes a first aperture and a second aperture, the abutting portion is at least partially accommodated in the first aperture, and the connecting shaft is provided in the second aperture. The axis of the first through hole is perpendicular to the axis of the second through hole. The cross section of the first through hole is circular or rectangular. The cross section of the second through hole is circular or rectangular. The cross section of the third through hole is circular or rectangular. The utility model relates to a frame, at least one first through hole and the intercommunication of at least one second through hole are equipped with, at least one first through hole and at least one second through hole staggered intercommunication arrangement are provided with; The tray for carrying silicon wafer, the tray is located on the frame and is equipped with at least one third through hole, and the third through hole is arranged corresponding to the first through hole; The limiting component includes a connecting piece and a limiting piece, the connecting piece includes a connecting shaft and an abutting portion provided on the connecting shaft, the connecting shaft is provided in the first through hole and the third through hole, the abutting portion abuts with the periphery of the side of the third through hole away from the frame, the limiting piece is provided in the second through hole, and a limiting structure is arranged between the limiting piece and the connecting shaft, the limiting structure is used for limiting the movement of the connecting piece along the axial direction of the first through hole.

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