Reinforced ESD structure for TFT FPC bending area
By laying a narrow ground line and covering it with an EMI shielding film and conductive double-sided adhesive in the single-layer wiring area of the TFT FPC bending zone, the electrostatic interference problem in the single-layer wiring area is solved, the ESD resistance is improved and the flexibility is maintained.
Patent Information
- Application Number
- CN202520005622.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-02
- Publication Date
- 2025-12-16
- Estimated Expiration
- 2035-01-02
AI Technical Summary
The single-layer trace area in the bending region of TFT FPC is susceptible to ESD interference, has poor anti-static capability, and lacks flexibility.
A narrow ground wire is laid in the single-layer wiring area to connect with the multi-layer wiring area, and an EMI shielding film and conductive double-sided adhesive are covered at the junction to form a protective structure. The ground wire is connected to the main ground of the multi-layer wiring area to enhance electrostatic conductivity.
It improves the ESD resistance of the TFT FPC bending area while maintaining flexibility, and enhances the electrostatic protection effect of the single-layer trace area.
Smart Images
Figure CN223679467U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to TFT technical field, especially, a kind of reinforcing ESD structure for TFT FPC bending area. BACKGROUND
[0002] Color liquid crystal screen is abbreviated as TFT, which means thin film transistor, that is, each liquid crystal pixel point is driven by thin film transistor integrated behind pixel point, so that high speed, high brightness, high contrast display screen information can be achieved, it is one of the best LCD color display devices, and its effect is close to CRT display, and it is the mainstream display device on notebook computer and desktop computer.
[0003] As shown in Figure 9 TFT FPC1-1 is bent to the back and connected with customer's mainboard, and the bending area 1-2 is designed with single-layer wiring, because the single-layer wiring area is relatively thin and soft, it is easy to bend, and the rebound force is small after bending, which is helpful to TFT MURA, but the wiring at this position is not covered by GND (ground) and is easy to be disturbed by ESD, and the anti-static ability is poor, therefore, a reinforcing ESD structure for TFT FPC bending area is proposed. UTILITY MODEL CONTENT
[0004] Therefore, it is necessary to provide a reinforcing ESD structure for TFT FPC bending area, which can increase ground line coverage on power supply wiring that is easy to be disturbed in single-layer wiring area, ensure that power input is not easy to be disturbed by external ESD, and improve the overall anti-interference ability of single-layer wiring area.
[0005] To solve the above technical problems, the utility model adopts the following technical solutions:
[0006] A reinforcing ESD structure for TFT FPC bending area, comprising TFT FPC bound with LCD module, the TFT FPC has a single-layer wiring area near the position of the LCD module, and the TFT FPC has a multi-layer wiring area except the single-layer wiring area;
[0007] Wherein, the single-layer wiring area is provided with a ground line for protecting the easily disturbed power line, the width of the ground line is less than the width of the single-layer wiring area, and the two ends of the ground line are connected with the main ground of the multi-layer wiring area.
[0008] Further, the ground line has a plurality of ground lines, and the plurality of ground lines are equally distributed in the single-layer wiring area.
[0009] Further, the single-layer wiring area and the multi-layer wiring area are covered and pasted with a protection element.
[0010] Further, the protection element comprises an EMI shielding film.
[0011] One side of the EMI shielding film has a pasting surface, and the other side has a protection surface.
[0012] Further, the pasting surface of the EMI shielding film is paved with an adhesive layer, and the EMI shielding film is pasted to the multi-layer wiring area at the edge of the single-layer wiring area through the adhesive layer, so as to cover and protect the position of the single-layer wiring area.
[0013] Further, the protection element further comprises a conductive double-sided adhesive, and the conductive double-sided adhesive is pasted to the surface of the corresponding ground wire.
[0014] The other pasting surface of the conductive double-sided adhesive is pasted to the adhesive layer.
[0015] Further, the conductive double-sided adhesive is in a strip shape, and the conductive double-sided adhesive is pasted to the top of the ground wire.
[0016] Further, the conductive double-sided adhesive is in a square shape, and the conductive double-sided adhesive on the single ground wire is distributed at two ends of the top.
[0017] Further, the adhesive layer is not pasted to the single-layer wiring area except for the conductive double-sided adhesive and the multi-layer wiring area.
[0018] Further, the LCD module has a binding position, one end of the TFT FPC has a binding end, and the TFT FPC is connected to the binding position of the LCD module through the binding end.
[0019] Compared with the prior art, the utility model has the following beneficial effects:
[0020] The reinforcing ESD structure for the bending area of the TFT FPC increases the ground wire coverage on the power supply wiring of the conventional single-layer wiring area which is more susceptible to interference, so as to ensure that the power supply input is not susceptible to external ESD interference, and the ground wire is connected to the main ground of the multi-layer wiring area of the TFT FPC, so that the anti-ESD capability of the bending area of the TFT FPC is improved, and the increased ground wire is relatively narrow, so that the bending flexibility of the TFT FPC is basically not affected.
[0021] Through the design of the protection element, the EMI shielding film can be covered on the single-layer wiring area after the TFT FPC is bent, and the EMI shielding film is pasted to the junction of the multi-layer wiring area and the single-layer wiring area, so as to achieve the protection effect.
[0022] At the same time, since the EMI shielding film is connected with the ground wire through the conductive double-sided adhesive, the static electricity in other non-ground wire covered areas in the single-layer wiring area can be guided to a certain extent, and the static electricity is conducted in the ground wire for transmission and release, thereby further improving the anti-static ability of the single-layer wiring area in the bending area. BRIEF DESCRIPTION OF DRAWINGS
[0023] Figure 1 A structure diagram of the ESD structure for the TFT FPC bending area is provided in the utility model.
[0024] Figure 2 A structure diagram of the ESD structure for the TFT FPC bending area is provided in the utility model.
[0025] Figure 3 A structure diagram of the ESD structure for the TFT FPC bending area is provided in the utility model.
[0026] Figure 4 A structure diagram of the ESD structure for the TFT FPC bending area is provided in the utility model. Figure 3 An enlarged structure diagram of position A in the embodiment three is provided in the utility model.
[0027] Figure 5 An enlarged structure diagram of position A in the embodiment three is provided in the utility model.
[0028] Figure 6 An enlarged structure diagram of position A in the embodiment three is provided in the utility model.
[0029] Figure 7 An enlarged structure diagram of position A in the embodiment three is provided in the utility model. Figure 6 An enlarged structure diagram of position B in the embodiment three is provided in the utility model.
[0030] Figure 8 An enlarged structure diagram of position B in the embodiment three is provided in the utility model.
[0031] Figure 9 A structure diagram of the ESD structure for the TFT FPC bending area is provided in the utility model.
[0032] The mark in the drawing is explained as follows:
[0033] An LCD module 1 and a binding position 11 are provided in the utility model.
[0034] A TFT FPC 2 and a binding end 21 are provided in the utility model.
[0035] Single-layer wiring area 3, ground wire 31;
[0036] Multi-layer wiring area 4;
[0037] Protective element 5, EMI shielding film 51, adhesive surface 52, protective surface 53, adhesive layer 54, conductive double-sided adhesive 55. DETAILED DESCRIPTION
[0038] In order to enable personnel in the technical field to better understand the technical solutions of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative efforts should belong to the scope of protection of the present application.
[0039] As described in the background art, as shown in Figure 9 , the TFT FPC1-1 is to be bent to the back and connected to the customer's mainboard, and the bending area 1-2 is designed with a single-layer wiring. The single-layer wiring area is relatively thin and soft, easy to bend, and has a small rebound force after bending, which is very helpful to the TFT MURA. However, the disadvantage is that the wiring at this position is not covered by GND (ground) and is more susceptible to ESD interference, and has poor anti-static performance.
[0040] In order to solve this technical problem, the present application provides a reinforced ESD structure for a TFT FPC bending area, which is applied to a TFT.
[0041] Specifically, please refer to Figures 1-9 , the reinforced ESD structure for the TFT FPC bending area specifically includes a TFT FPC2 bound with an LCD module 1, the TFT FPC2 has a single-layer wiring area 3 at a position close to the LCD module 1, and the TFT FPC2 is a multi-layer wiring area 4 except for the single-layer wiring area 3.
[0042] Wherein, the single-layer wiring area 3 is provided with a ground wire 31 for protecting the easily disturbed power supply line, the width of the ground wire 31 is less than the width of the single-layer wiring area 3, and the two ends of the ground wire 31 are respectively connected to the main ground of the multi-layer wiring area 4.
[0043] The reinforcing ESD structure for the bending area of the TFT FPC is characterized in that a ground wire 31 is arranged on the power supply wire of the single-layer wire area 3 which is prone to interference, so that the power supply input is not easily interfered by external ESD, and the ground wire and the main ground of the multi-layer wire area 4 of the TFT FPC 2 are connected together, so that the ESD resistance of the bending area of the TFT FPC 2 is improved, and the ground wire 31 is relatively narrow and does not affect the bending flexibility of the TFT FPC 2.
[0044] In order for those skilled in the art to better understand the technical scheme of the present application, the technical scheme in the embodiments of the present application will be described clearly and completely below with reference to the drawings.
[0045] It should be noted that the embodiments in the present application and the features and technical solutions in the embodiments can be combined with each other without conflict.
[0046] It should be noted that: similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.
[0047] Embodiment one
[0048] Please refer to Figures 1-9 A reinforcing ESD structure for a bending area of a TFT FPC, comprising a TFT FPC 2 bound with an LCD module 1, the TFT FPC 2 having a single-layer wire area 3 near the LCD module 1, and the TFT FPC 2 having a multi-layer wire area 4 except the single-layer wire area 3.
[0049] The single-layer wire area 3 is provided with a ground wire 31 for protecting the power supply wire which is prone to interference, the width of the ground wire 31 is less than the width of the single-layer wire area 3, and the two ends of the ground wire 31 are connected with the main ground of the multi-layer wire area 4.
[0050] The ground wire 31 has a plurality of ground wires 31 which are equally distributed in the single-layer wire area 3.
[0051] The position and number of the ground wire 31 in the single-layer wire area 3 are correspondingly distributed according to the actual wire to be protected, and cannot be too many to cause too much stress after bending, and can be adaptively adjusted according to specific conditions.
[0052] Embodiment two
[0053] The reinforcing ESD structure for the bending area of the TFT FPC provided in embodiment one is further optimized, specifically as Figure 3 ,4 And 5, the single layer wiring area 3 and the junction of the multi-layer wiring area 4 are covered and pasted with a protective element 5
[0054] The protective element 5 includes an EMI shielding film 51, wherein one side of the EMI shielding film 51 has a pasting surface 52, and the other side has a protective surface 53;
[0055] The pasting surface 52 of the EMI shielding film 51 is paved with an adhesive layer 54, and the EMI shielding film 51 is pasted to the multi-layer wiring area 4 at the edge of the single-layer wiring area 3 through the adhesive layer 54, for covering and protecting the position of the single-layer wiring area 3;
[0056] Specifically, in the embodiment, the EMI shielding film 51 is attached after the TFT FPC 2 is bent and connected, and the bending area remains relatively stable as a whole. The attachment of the EMI shielding film 51 can cover and protect the junction of the single-layer wiring area 3 and the multi-layer wiring area 4, thereby facilitating further protection of the wire body in the single-layer wiring area 3 and realizing more stable application.
[0057] Embodiment Three
[0058] The ESD structure for reinforcing the bending area of the TFT FPC provided in Embodiment One or Two is further optimized, as shown in Figure 3 、 Figure 4 and Figure 5 The protective element 5 further includes a conductive double-sided adhesive 55, which is pasted to the surface of the corresponding ground wire 31, wherein the other pasting surface of the conductive double-sided adhesive 55 is pasted to the adhesive layer 54;
[0059] The conductive double-sided adhesive 55 in the embodiment is in a long strip shape, which is correspondingly pasted and covered on the top of the ground wire 31;
[0060] In actual application, the conductive double-sided adhesive 55 is first pasted on the surface of the ground wire 31 after the TFT FPC 2 is bent and connected. The conductive double-sided adhesive 55 in the embodiment completely covers the surface of the ground wire 31, and then the external EMI shielding film 51 is attached, so that the EMI shielding film 51 is pasted to the other pasting surface of the conductive double-sided adhesive 55;
[0061] Through the design of the conductive double-sided adhesive 55, the ground wire 31 can be covered and protected, ensuring the stability of its electrostatic protection, and at the same time, it can form a connection with the EMI shielding film 51 (the bonding surface 52 itself has conductivity), and then it can guide the static electricity in the other non-ground wire 31 covered area in the single-layer wiring area 3 to a certain extent, so that it is guided into the ground wire 31 for transmission and release, which is conducive to further improving the anti-static ability of the single-layer wiring area 3.
[0062] Embodiment Four
[0063] The ESD structure for the bending area of the TFT FPC provided in Embodiment Three is further optimized, as shown in Figure 6 、 Figure 7 and Figure 8 , the conductive double-sided adhesive 55 is in a square shape, and the conductive double-sided adhesive 55 on each ground wire 31 is distributed at the top of both ends.
[0064] The adhesive layer 54 is not bonded to the single-layer wiring area 3 except for the conductive double-sided adhesive 55 and the multi-layer wiring area 4.
[0065] The difference between this embodiment and Embodiment Three is that the conductive double-sided adhesive 55 in this embodiment is in a square shape. After the conductive double-sided adhesive 55 is bonded, there is no connection between the conductive double-sided adhesive 55 at both ends of the ground wire 31, so there is no stress generated, which will not affect the flexible bending of the bending area.
[0066] The square-shaped conductive double-sided adhesive 55 can be bonded to the ends of the ground wire 31 after the TFT FPC 2 is bent and connected, and then covered with the corresponding EMI shielding film 51. The specific shape of the conductive double-sided adhesive 55 needs to be adjusted according to the actual situation.
[0067] Embodiment Five
[0068] The ESD structure for the bending area of the TFT FPC provided in Embodiment Four is further optimized, as shown in Figure 1 , the LCD module 1 has a binding position 11, one end of the TFT FPC 2 has a binding end 21, and the TFT FPC 2 is connected to the binding position 11 on the LCD module 1 through the binding end 21. Specifically, the other end of the TFT FPC 2 also has a binding area, which is used to connect to the external mainboard, so that a bending will be generated after the connection.
[0069] In the utility model, unless another definite provision and limitation, the terms "mount", "link", "connect", "fix" and so on terms should do broad sense understanding, for example, can be fixed connection, also can be detachable connection, or be integrated;Can be mechanical connection, also can be electric connection or each other can communicate;Can be direct connection, also can indirectly connect through intermediate medium, can be two element internal communication or two element mutual action relation, unless another definite limitation.For ordinary skilled person in the art, can understand the concrete meaning of above-mentioned terms in the utility model according to specific circumstances.
[0070] Obviously, the above-described embodiments are only a part of the embodiments of the utility model, and not all the embodiments, and the preferred embodiments of the utility model are given in the drawings, but do not limit the patent range of the utility model.The utility model can be realized in many different forms, and contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the utility model more thorough and comprehensive.Although the utility model is described in detail with reference to the foregoing embodiments, for those skilled in the art, the technical scheme recorded in the foregoing each specific embodiment can be modified, or part of the technical features can be replaced equivalently.For equivalent structure made by using the contents of the utility model specification and drawings, direct or indirect use in other related technical fields, are also within the patent protection range of the utility model.
Claims
1. A reinforced ESD structure for a TFT FPC bending area, comprising a TFT FPC (2) bound with an LCD module (1), characterized in that, The TFT FPC (2) has a single-layer wiring area (3) near the LCD module (1), and the TFT FPC (2) is a multi-layer wiring area (4) except the single-layer wiring area (3). The single-layer wiring area (3) is provided with a ground wire (31) for protecting the power line which is easy to be interfered, the width of the ground wire (31) is less than the width of the single-layer wiring area (3), and the two ends of the ground wire (31) are connected with the main ground of the multi-layer wiring area (4).
2. The reinforced ESD structure for TFT FPC bending area according to claim 1, characterized in that, The ground wire (31) has a plurality of ground wires (31) which are equidistantly distributed in the single-layer wiring area (3).
3. The reinforced ESD structure for TFT FPC bending area according to claim 1, characterized in that, The single-layer wiring area (3) and the multi-layer wiring area (4) are covered and pasted with a protection element (5).
4. The reinforced ESD structure for TFT FPC bending area according to claim 3, characterized in that, The protection element (5) includes an EMI shielding film (51). One side of the EMI shielding film (51) has a pasting surface (52), and the other side has a protection surface (53).
5. The reinforced ESD structure for TFT FPC bending area according to claim 4, characterized in that, The pasting surface (52) of the EMI shielding film (51) is provided with an adhesive layer (54), and the EMI shielding film (51) is pasted with the multi-layer wiring area (4) at the edge of the single-layer wiring area (3) through the adhesive layer (54), for covering and protecting the position of the single-layer wiring area (3).
6. The reinforced ESD structure for TFT FPC bending area according to claim 5, characterized in that, The protection element (5) further includes a conductive double-sided adhesive (55), and the conductive double-sided adhesive (55) is pasted on the surface of the corresponding ground wire (31). The other pasting surface of the conductive double-sided adhesive (55) is pasted with the adhesive layer (54).
7. The reinforced ESD structure for TFT FPC bending area according to claim 6, characterized in that, The conductive double-sided adhesive (55) is in a strip shape, and is correspondingly pasted on the top of the ground wire (31).
8. The reinforced ESD structure for TFT FPC bending area according to claim 6, characterized in that, The conductive double-sided adhesive (55) is in a square shape, and the conductive double-sided adhesive (55) on a single ground wire (31) is distributed at both ends of the top.
9. The reinforced ESD structure for TFT FPC bending area according to claim 6, characterized in that, The adhesive layer (54) is not pasted with the conductive double-sided adhesive (55) and the multi-layer wiring area (4) except the area.
10. The reinforced ESD structure for TFT FPC bending area according to claim 1, characterized in that, The LCD module (1) has a binding position (11), one end of the TFT FPC (2) has a binding end (21), and the TFT FPC (2) is connected with the binding position (11) of the LCD module (1) through the binding end (21).