Welding-free iron stand for liquid crystal display module
By designing through-grooves and stepped grooves in the LCD module, combined with conductive double-sided adhesive, solderless fixing of the iron frame to the PCB board is achieved, solving the problems of soldering cost and void design, and improving the stability and strength of the connection.
Patent Information
- Application Number
- CN202520040828.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-08
- Publication Date
- 2025-12-16
- Estimated Expiration
- 2035-01-08
AI Technical Summary
In existing LCD display modules, soldering the iron frame to the PCB board requires the use of solder, which increases labor and material costs. Furthermore, the soldered pins protrude from the PCB board surface, requiring additional clearance design.
Through slots and stepped slots are designed on the PCB board. The pins can be bent and placed into the stepped slots to achieve solderless fixation. At the same time, the ends of the pins do not protrude from the PCB board, and conductive double-sided adhesive is used to enhance the connection strength.
It achieves a secure connection between the iron frame and the PCB board without welding, avoiding welding costs and the need for clearance design, and enhancing the stability and strength of the connection.
Smart Images

Figure CN223679468U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to liquid crystal module technical field especially relates to a kind of exempt from welding iron stand for liquid crystal display module. BACKGROUND
[0002] Liquid crystal module is simply screen+backlight assembly.Liquid crystal television display component is liquid crystal module, its position is equivalent to CRT in kinescope.Other parts include power supply circuit, signal processing circuit etc., of course, also have shell and the like.Module is mainly divided into screen and backlight assembly.Two parts are assembled together, but when working, it is independent (i.e.
[0003] As shown in Figure 10 And Figure 11 Liquid crystal display module, it is mainly composed of iron stand 1-1, LCD, backlight and PCB1-2, wherein LCD and backlight are clamped between iron stand 1-1 and PCB1-2, iron stand 1-1 is through pin 1-3 to pass through PCB1-2, pass through the pin 1-3 on the back of PCB1-2 and adopt welding to be fixed, this scheme not only needs to use soldering to weld, increases artificial material cost, and the pin 1-3 on the iron stand 1-1 after welding will protrude PCB1-2 surface, terminal use also needs additional empty design, therefore, a kind of exempt from welding iron stand for liquid crystal display module is presented. UTILITY MODEL CONTENT
[0004] Based on this, it is necessary to aim at the above technical problems, provide a kind of exempt from welding iron stand for liquid crystal display module, the position of pin on the surface of PCB board is designed to be inserted into groove and step groove, so that the pin after insertion can be fixed by bending in step groove, realize exempt from welding.
[0005] In order to solve the above technical problems, the utility model adopts the technical scheme as follows:
[0006] A kind of exempt from welding iron stand for liquid crystal display module, including: iron stand;
[0007] PCB board, it is located at one side of the iron stand, and installation space is formed between the iron stand and PCB board, backlight module and LCD module are assembled in the installation space;
[0008] The edge of the iron stand has pin, the position of pin on the PCB board is designed to be inserted into groove, and the end of pin can pass through the back of PCB board along the inserted groove;
[0009] Wherein, the back of the PCB board has copper-exposed window area, step groove is set in the copper-exposed window area, and the end of pin can be buckled in step groove by turning over pin.
[0010] Further, the penetration slot and the step slot are designed at 90 degrees to each other and are communicated with each other.
[0011] Further, the connection part of the penetration slot and the step slot has a bending inflection point.
[0012] Further, the pin comprises a penetration segment and a buckling segment.
[0013] Wherein, the buckling segment is placed into the step slot by turning the pin along the bending inflection point.
[0014] Further, a first avoiding gap is left between the surface of the penetration segment and the edge of the PCB.
[0015] Further, a second avoiding gap is left between the outer side of the buckling segment after turning and the back of the PCB.
[0016] Further, the buckling segment is in the shape of a mushroom, and the step slot corresponding to the buckling segment is also in the shape of a mushroom.
[0017] Further, the pin has a plurality of pins which are equidistantly distributed along the edge of the iron stand.
[0018] Further, an embedding slot is formed in the inner side of the buckling segment, and a conductive double-sided adhesive is embedded and pasted in the embedding slot.
[0019] Wherein, the inner side of the conductive double-sided adhesive is pasted to the inner part of the step slot.
[0020] Further, the LCD module comprises upper glass and lower glass which are pasted to each other, the outer side of the upper glass is pasted with an upper polarizer, and the outer side of the lower glass is pasted with a lower polarizer.
[0021] Wherein, a driving IC is further arranged at the bottom of the lower glass, and an FPC is bound at the position close to the driving IC on the surface of the lower glass.
[0022] Compared with the prior art, the utility model has the following beneficial effects:
[0023] The welding-free iron stand for the liquid crystal display module is designed with a penetration slot and a step slot at the position corresponding to the pin on the PCB, so that after the pin is penetrated, the pin can be bent to make the end part of the pin placed into the step slot, the fastening between the iron stand and the PCB is realized, the welding-free operation is realized, meanwhile, the end part of the pin does not protrude from the back of the PCB, so that the terminal does not need to be additionally designed to avoid the space.
[0024] By designing the shapes of the buckling section and the stepped groove as "mushroom-shaped", when the buckling section at the end of the pin is buckled, a larger area can be formed with the stepped groove in the PCB to be in a clamping state, thereby ensuring the strength of the connection between the iron stand and the PCB after assembly, and further preventing the problem of shaking and falling off;
[0025] By designing the conductive double-sided adhesive, after the buckling end of the pin is turned and placed in the stepped groove, the conductive double-sided adhesive can be pasted with the stepped groove, thereby providing effective bonding strength to the end of the pin, avoiding the problem of warping after bending and affecting the connection and fastening between the iron stand and the PCB. BRIEF DESCRIPTION OF DRAWINGS
[0026] Figure 1 A structure schematic view of the welding-free iron stand for the liquid crystal display module is provided in the utility model;
[0027] Figure 2 An iron stand side view structure schematic view of the welding-free iron stand for the liquid crystal display module is provided in the utility model;
[0028] Figure 3 A pin structure schematic view of the welding-free iron stand for the liquid crystal display module is provided in the utility model;
[0029] Figure 4 A PCB back structure schematic view of the welding-free iron stand for the liquid crystal display module is provided in the utility model;
[0030] Figure 5 A penetrating slot structure schematic view of the welding-free iron stand for the liquid crystal display module is provided in the utility model;
[0031] Figure 6 A copper exposure windowing area structure schematic view of the welding-free iron stand for the liquid crystal display module is provided in the utility model;
[0032] Figure 7 An LCD module front structure schematic view of the welding-free iron stand for the liquid crystal display module is provided in the utility model;
[0033] Figure 8 An LCD module side view structure schematic view of the welding-free iron stand for the liquid crystal display module is provided in the utility model;
[0034] Figure 9 A conductive double-sided adhesive structure schematic view of the welding-free iron stand for the liquid crystal display module is provided in the utility model;
[0035] Figure 10 A structure schematic view of one of the conventional iron stands for the liquid crystal display module in the background technology is provided in the utility model;
[0036] Figure 11The utility model provides a background technology of conventional liquid crystal display module's iron stand structure two schematic diagram.
[0037] The figure mark explanation is as follows:
[0038] Iron stand 1, pin 11;
[0039] Pierce section 110, buckle section 111, embed slot 112, conductive double-sided adhesive 113;
[0040] PCB board 2, installation space 21, backlight module 22, LCD module 23, pierce slot 24, copper exposure window area 25, step slot 26, bending inflection point 27;
[0041] Upper piece glass 230, lower piece glass 231, upper polaroid 232, lower polaroid 233, drive IC 234, FPC 235. Specific implementation
[0042] In order to make the personnel in the technical field better understand the utility model scheme, below will combine the drawing in the embodiment of the utility model, the technical scheme in the embodiment of the utility model is clearly and completely described, obviously, the described embodiment only is a part of the embodiment of the utility model, but not all the embodiment. Based on the embodiment in the utility model, all other embodiments that the person skilled in the art obtains without making the creative labor should belong to the scope of the utility model protection.
[0043] As described in the background art, as shown in Figure 10 And Figure 11 The liquid crystal display module mainly comprises an iron stand 1-1, an LCD, a backlight and a PCB 1-2, wherein the LCD and the backlight are clamped between the iron stand 1-1 and the PCB 1-2, the iron stand 1-1 is fixed by welding the pin 1-3 penetrating through the PCB 1-2, the pin 1-3 on the iron stand 1-1 after welding protrudes from the surface of the PCB 1-2, and additional space-avoiding design is required in terminal use.
[0044] In order to solve the technical problem, the utility model provides a welding-free iron stand for a liquid crystal display module, which is applied to the liquid crystal display module.
[0045] Specifically, please refer to Figures 1-11 The welding-free iron stand for the liquid crystal display module specifically comprises an iron stand 1.
[0046] PCB board 2, which is arranged on one side of the iron stand 1, and the iron stand 1 and the PCB board 2 form an installation space 21, and the backlight module 22 and the LCD module 23 are assembled in the installation space 21;
[0047] The iron stand 1 has a pin 11 at the edge, and the PCB board 2 is provided with a through slot 24 corresponding to the position of the pin 11, and the end of the pin 11 can pass through the back of the PCB board 2 along the through slot 24;
[0048] The back of the PCB board 2 has a copper exposure window area 25, and a stepped groove 26 is formed in the copper exposure window area 25, and the end of the pin 11 can be buckled in the stepped groove 26.
[0049] The iron stand for the liquid crystal display module provided by the utility model is designed with the through slot 24 and the stepped groove 26 corresponding to the position of the pin 11 on the PCB board 2, so that after the pin 11 passes through, the pin 11 can be bent to make the end thereof enter the stepped groove 26, thereby realizing the fastening between the iron stand 1 and the PCB board 2, realizing the welding-free operation, and meanwhile, the end of the pin 11 cannot protrude from the back of the PCB board 2, so that the terminal does not need to be additionally designed to avoid space.
[0050] In order for those skilled in the art to better understand the utility model scheme, the technical scheme in the utility model embodiment will be clearly and completely described below in combination with the drawings.
[0051] It should be noted that the embodiments in the utility model and the features and technical schemes in the embodiments can be combined with each other without conflict.
[0052] It should be noted that: similar signs and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.
[0053] Embodiment one
[0054] Please refer to Figures 1-9 An iron stand for a liquid crystal display module is shown in the figure, the iron stand 1; the PCB board 2 is arranged on one side of the iron stand 1, and the iron stand 1 and the PCB board 2 form an installation space 21, and the backlight module 22 and the LCD module 23 are assembled in the installation space 21;
[0055] The iron stand 1 has a pin 11 at the edge, and the PCB board 2 is provided with a through slot 24 corresponding to the position of the pin 11, and the end of the pin 11 can pass through the back of the PCB board 2 along the through slot 24;
[0056] The back of the PCB 2 has a copper-exposed window area 25 connected to the ground, and a stepped groove 26 is formed in the copper-exposed window area 25. The end of the reversed pin 11 is buckled in the stepped groove 26.
[0057] As shown in the figure, the penetration groove 24 and the stepped groove 26 are designed at 90 degrees and are in communication with each other. The connection between the penetration groove 24 and the stepped groove 26 has a bending inflection point 27. The pin 11 is buckled at the bending inflection point 27, so that the buckled part is aligned in the stepped groove 26. Figure 3
[0058] The pin 11 includes a penetration section 110 and a buckling section 111. The buckling section 111 is placed in the stepped groove 26 after the pin 11 is reversed at the bending inflection point 27.
[0059] As shown in the figure, the pin 11 has a plurality of pins 11 which are equidistantly distributed along the edge of the iron stand 1. Figure 4 The iron stand 1 with the pin 11 is placed on one side of the PCB 2. Then the pin 11 on the iron stand 1 is aligned with the corresponding penetration groove 24 on the PCB 2. After the iron stand 1 is moved to have the minimum distance with the PCB 2, the pin 11 is buckled at the bending inflection point 27. The buckling section 111 of the buckled pin 11 is placed in the stepped groove 26, and the penetration end 110 is placed in the penetration groove 24, as shown in the figure.
[0060] Figure 3 The pin 11 in this state does not exceed the end of the PCB 2, so there is no need to design an avoidance at the end. Since the pin 111 is buckled, the iron stand 1 and the PCB 2 are buckled and connected, so there is no need for welding operation to complete the assembly. Since the iron stand 1 and the PCB 2 are in the minimum distance state, they will not approach each other due to the action of other structures in the assembly. Since the iron stand 1 and the PCB 2 are buckled by the pin 11, they will not move away from each other, so a stable assembly relationship between the iron stand 1 and the PCB 2 is formed.
[0061] Embodiment Two
[0062] The welding-free iron stand for liquid crystal display module provided in Embodiment One is further optimized. As shown in the figure, the surface of the penetration section 110 has a first avoidance gap from the edge of the PCB 2. The outer side of the buckling section 111 has a second avoidance gap from the back of the PCB 2 after being reversed.
[0063] Figure 4
[0064] Through the design of the first and second avoiding gaps in the embodiment, the bent pin 11 will not exceed the outer side of the PCB 2, so as not to affect the subsequent assembly after the assembly of the stand 1 and the PCB 2.
[0065] Embodiment three
[0066] The welding-free stand for the liquid crystal display module provided in Embodiment One or Two is further optimized, as shown in Figure 4 The shape of the step groove 26 corresponding to the buckle end 111 is also "mushroom-shaped". By designing the shapes of the buckle end 111 and the step groove 26 as "mushroom-shaped", the buckle end 111 at the end of the pin 11 can have a larger area to form a clamping state with the step groove 26 in the PCB 2 when the buckle end 111 is buckled, so as to ensure the strength of the connection between the stand 1 and the PCB 2 after assembly, and thus prevent the problem of shaking and falling.
[0067] Embodiment four
[0068] The welding-free stand for the liquid crystal display module provided in Embodiment Three is further optimized, as shown in Figure 9 The inner side of the buckle end 111 is provided with an embedded groove 112, and the conductive double-sided adhesive 113 is embedded and pasted in the embedded groove 112, wherein the inner side of the conductive double-sided adhesive 113 is pasted to the inner side of the step groove 26.
[0069] Specifically, the conductive double-sided adhesive 113 needs to be pasted in the embedded groove 112 first, and then the stand 1 and the PCB 2 are aligned, and the pin 11 is inserted into the insertion groove 24, and then the buckle end 111 on the pin 11 is turned over and placed into the step groove 26, and at the same time, the conductive double-sided adhesive 113 is pasted to the inner wall of the step groove 26. In this way, the stability of the buckle end 111 in the step groove 26 is improved, so as to prevent the buckle end 111 from being raised, and thus the assembly stability between the stand 1 and the PCB 2 is improved.
[0070] Embodiment five
[0071] The welding-free stand for the liquid crystal display module provided in Embodiment Four is further optimized, as shown in Figure 8 The LCD module 23 includes an upper glass sheet 230 and a lower glass sheet 231 arranged in close contact with each other, and an upper polarizing sheet 232 is arranged on the outer side of the upper glass sheet 230, and a lower polarizing sheet 233 is arranged on the outer side of the lower glass sheet 231.
[0072] The lower glass sheet 231 is further provided with a drive IC 234 at the bottom, and an FPC 235 is bound to the surface of the lower glass sheet 231 near the drive IC 234.
[0073] The LCD module 23 and the backlight module 22 in the embodiment are assembled in the mounting space 21 formed between the iron stand 1 and the PCB 1, and the specific mounting mode is mature and perfect prior art, thus the embodiment is not further described.
[0074] The use process of the welding-free iron stand for the liquid crystal display module is as follows: after the pin 11 on the iron stand 1 is aligned with the penetrating slot 24 on the PCB 2, the pin 11 is bent along the bending inflection point 27, so that the buckling section 111 on the pin 11 is placed into the corresponding step slot 26, thereby realizing the connection between the iron stand 1 and the PCB 2, and the pin 11 after assembly does not protrude outside the PCB 2, and the terminal device does not need to be designed to avoid space.
[0075] In the utility model, unless another definite provision and limitation, the terms "mounting", "connecting", "connecting", "fixing" and the like terms should be understood in broad sense, for example, can be fixed connection, also can be detachable connection, or be integrated; can be mechanical connection, also can be electrical connection or can communicate with each other; can be directly connected, also can be indirectly connected through intermediate medium, can be the communication or the interaction of two elements of two elements, unless another definite limitation. For ordinary skilled in the art, the above-mentioned terms can be understood according to the specific meaning of the utility model in the specific circumstances.
[0076] Obviously, the above-described embodiments are only part of the embodiments of the utility model, and not all embodiments, and the preferred embodiments of the utility model are given in the drawings, but do not limit the patent range of the utility model. The utility model can be realized in many different forms, and conversely, the purpose of providing these embodiments is to make the understanding of the disclosure of the utility model more thorough and comprehensive. Although the utility model is described in detail with reference to the foregoing embodiments, for those skilled in the art, the technical solutions recorded in the foregoing specific embodiments can be modified, or some technical features can be replaced equivalently. Any equivalent structure made by using the contents of the utility model specification and drawings, directly or indirectly used in other related technical fields, is also within the patent protection range of the utility model.
Claims
1. A solderless iron frame for a liquid crystal display module, characterized in that, It includes: Iron frame (1); PCB board (2) is arranged on one side of the iron frame (1), and the iron frame (1) and the PCB board (2) are enclosed to form a mounting space (21), and the backlight module (22) and the LCD module (23) are assembled in the mounting space (21); The edge of the iron frame (1) has a pin (11), and the PCB board (2) is provided with a through slot (24) corresponding to the position of the pin (11), and the end of the pin (11) can pass through the back of the PCB board (2) along the through slot (24); Wherein, the back of the PCB board (2) has a copper exposure window area (25), and a stepped groove (26) is formed in the copper exposure window area (25), and the end of the pin (11) can be buckled in the stepped groove (26) by turning over.
2. The solderless stand for liquid crystal display module according to claim 1, wherein The through slot (24) and the stepped groove (26) are designed at 90 degrees and are connected with each other.
3. The solderless stand for liquid crystal display module according to claim 2, wherein The connecting part of the through slot (24) and the stepped groove (26) has a bending inflection point (27).
4. The solderless stand for liquid crystal display module according to claim 1, wherein The pin (11) includes a through section (110) and a buckling section (111); Wherein, the buckling section (111) is inserted into the stepped groove (26) by turning over along the bending inflection point (27).
5. The solderless stand for liquid crystal display module according to claim 4, wherein The surface of the through section (110) is away from the edge of the PCB board (2) by a first avoiding gap.
6. The solderless stand for liquid crystal display module according to claim 5, wherein The outer side of the buckling section (111) after turning over is away from the back of the PCB board (2) by a second avoiding gap.
7. The solderless stand for liquid crystal display module according to claim 5, wherein The buckling section (111) is "mushroom-shaped", and the shape of the corresponding stepped groove (26) is also "mushroom-shaped".
8. The solderless stand for liquid crystal display module according to claim 1, wherein The pin (11) has a plurality of pins (11) which are equidistantly distributed along the edge of the iron frame (1).
9. The solderless stand of claim 4, wherein the solderless stand is made of a material selected from the group consisting of aluminum, stainless steel, and copper. 5 The inner side of the buckling section (111) is provided with an embedded slot (112), and the embedded slot (112) is embedded with conductive double-sided adhesive (113); Wherein, the inner side of the conductive double-sided adhesive (113) is pasted in the inner part of the stepped groove (26).
10. The solderless stand for liquid crystal display module according to claim 1, wherein The LCD module (23) includes upper glass (230) and lower glass (231) arranged in close contact, upper polaroid (232) is arranged on the outer side of the upper glass (230), and lower polaroid (233) is arranged on the outer side of the lower glass (231); Wherein, the driving IC (234) is further arranged at the bottom of the lower glass (231), and the FPC (235) is bound on the surface of the lower glass (231) close to the driving IC (234).