Control chip of integrated communication bus driving circuit, circuit board and electric equipment

Abstract

The utility model discloses a control chip of an integrated communication bus driving circuit, a circuit board and electric equipment, a controller module and a signal receiving and transmitting module are borne and packaged in the control chip through a packaging frame, and the controller module and the signal receiving and transmitting module communicate through a TX signal line and an RX signal line. A bus signal end of the signal receiving and transmitting module is connected to a bus signal pin of the packaging frame, that is to say, the control chip packages the controller and the communication bus driving circuit into an integral chip, and the integral chip is externally connected with an external circuit through the bus signal pin. According to the communication bus driving circuit, the circuit integration level can be improved, repeated design of a PCB circuit is avoided, and the universality and reliability of the communication bus driving circuit are improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic circuit, in particular to a control chip integrated with a communication bus driving circuit, a circuit board and an electrical equipment. BACKGROUND

[0002] A bus is a common communication trunk for transmitting information between various devices or modules. Multiple communication subjects are connected through the bus so that they can interact with each other. In long bus communication, there are advantages of line simplification, reliable communication and multiple nodes. At present, the bus circuit is realized by discrete components for communication driving. Each PCB design needs to re-layout these components. Although the circuit schematic diagrams are the same, the layout positions of the discrete components on different PCBs are different, so the generality is low, the difference is large, and the reliability is low. CONTENT OF THE INVENTION

[0003] The control chip integrated with a communication bus driving circuit, the circuit board and the electrical equipment provided by the embodiments of the present application can simplify the circuit design process of the communication bus and improve the generality and reliability of the circuit.

[0004] In a first aspect, the embodiments of the present application provide a control chip integrated with a communication bus driving circuit, comprising:

[0005] A packaging frame is provided with a bus signal pin;

[0006] A controller module is arranged on a substrate of the packaging frame;

[0007] A signal transceiver module is arranged on the substrate and comprises a bus signal end;

[0008] The controller module and the signal transceiver module are connected through a TX signal line and an RX signal line, and the bus signal end is coupled to the bus signal pin.

[0009] In some embodiments, the controller module comprises a first signal end and a second signal end, and the signal transceiver module comprises a third signal end and a fourth signal end; the first signal end is connected to the third signal end through a TX signal line, and the second signal end is connected to the fourth signal end through an RX signal line.

[0010] In some embodiments, the signal transceiver module comprises a TX circuit and an RX circuit; the third signal end is coupled to the bus signal end through the TX circuit, and the fourth signal end is coupled to the bus signal end through the RX circuit.

[0011] In some embodiments, the TX circuit includes a first switch tube and a second switch tube, the third signal terminal is connected to a control terminal of the first switch tube, one switch terminal of the first switch tube is connected to a first voltage source and a control terminal of the second switch tube, another switch terminal of the first switch tube is grounded, one switch terminal of the second switch tube is connected to the bus signal terminal and a second voltage source, and another switch terminal of the second switch tube is grounded.

[0012] In some embodiments, the RX circuit includes a third switch tube and a fourth switch tube, the bus signal terminal is connected to a control terminal of the third switch tube, one switch terminal of the third switch tube is connected to a control terminal of the fourth switch tube and a third voltage source, another switch terminal of the third switch tube is grounded, one switch terminal of the fourth switch tube is connected to a fourth signal terminal and a fourth voltage source, and another switch terminal of the fourth switch tube is grounded.

[0013] In some embodiments, the package frame is further provided with a VDD power supply pin and a VCC power supply pin, the controller module includes a first VCC power supply terminal, and the signal transceiver module includes a second VDD power supply terminal and a second VCC power supply terminal; the second VDD power supply terminal is connected to the VDD power supply pin, and the first VCC power supply terminal and the second VCC power supply terminal are both connected to the VCC power supply pin.

[0014] In some embodiments, the package frame is further provided with a VSS reference level pin, the controller module includes a first VSS reference level terminal, and the signal transceiver module includes a second VSS reference level terminal; the first VSS reference level terminal and the second VSS reference level terminal are both connected to the VSS reference level pin.

[0015] In some embodiments, the voltage of the VCC power supply pin relative to the VSS reference level pin is 12V, and the voltage of the VDD power supply pin relative to the VSS reference level pin is 1.8V, 3.3V or 5V.

[0016] In some embodiments, the bus signal pin, the VDD power supply pin, the VCC power supply pin and the reference level pin are located on the same side of the package frame.

[0017] In some embodiments, the signal transceiver module is arranged on the substrate close to the bus signal pin.

[0018] In a second aspect, the embodiments of the present application further provide a circuit board including the control chip of the first aspect.

[0019] In a third aspect, the embodiments of the present application further provide a power consumption device.

[0020] The control chip, the circuit board and the electrical equipment of the integrated communication bus driving circuit have at least the following beneficial effects: the controller module and the signal transceiver module are carried and packaged in the control chip through the packaging frame, the controller module and the signal transceiver module communicate through the TX signal line and the RX signal line, and the bus signal end of the signal transceiver module is connected to the bus signal pin of the packaging frame, that is, the control chip packages the controller and the communication bus driving circuit into an integrated chip, and connects with external circuits through the bus signal pin. Compared with the scheme of realizing the communication bus driving circuit through discrete components, the embodiment of the application can improve the circuit integration, avoid repeated design of the PCB circuit, and improve the universality and reliability of the communication bus driving circuit.

[0021] Other features and advantages of the present application will be set forth in the following description, and in part will become apparent from the description, or can be learned by practice of the present application. The objects and other advantages of the present application can be achieved and obtained by the structure particularly pointed out in the specification and drawings. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 is a circuit diagram of a communication bus driving circuit provided by an embodiment of the application;

[0023] Figure 2 is a schematic diagram of the internal packaging structure of the control chip provided by an embodiment of the application;

[0024] Figure 3 is a schematic diagram of the internal packaging structure of the control chip provided by an embodiment of the application.

[0025] LIST OF ELEMENTS

[0026] Packaging frame 100, controller module 200, signal transceiver module 300, TX circuit 310, RX circuit 320, bus signal pin 400, VDD power supply pin 500, VSS reference level pin 600, VCC power supply pin 700, TX signal line 800, RX signal line 900 DETAILED DESCRIPTION

[0027] For the purpose, technical solutions and advantages of the present application to be clearer, the present application is further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and not to limit the present application. In addition, the features, operations or characteristics described in the specification can be combined in any appropriate manner to form various embodiments. At the same time, the steps or actions in the method description can also be sequentially changed or adjusted in a manner obvious to those skilled in the art. Therefore, the various sequences in the specification and drawings are only for the purpose of clearly describing a certain embodiment and do not mean that the sequence is necessary, unless otherwise stated that a certain sequence must be followed.

[0028] In the description of the present application, the meaning of one or more is one or more, the meaning of multiple is two or more, greater than, less than, more than, etc. are understood as not including the number, above, below, etc. are understood as including the number. If it is described as first, second, it is only used to distinguish the technical features for the purpose, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of indicated technical features or implicitly indicating the sequence of indicated technical features.

[0029] The serial numbers of components in this paper, such as "first", "second", etc., are only used to distinguish the described objects, and do not have any sequence or technical meaning. The "connection" and "coupling" in the present application include direct and indirect connection (coupling) unless otherwise specified.

[0030] The communication bus usually has a corresponding driving circuit, and the controller or microprocessor is connected to the communication bus through the driving circuit, so that the driving circuit can be used for signal transceiving. For example, the bus driving circuit of half-duplex communication mode includes receiving circuit and sending circuit, only one of receiving circuit and sending circuit works at the same time, when receiving circuit works, driving circuit receives level signal from communication bus and converts level signal into signal that can be received by controller, when sending circuit works, driving circuit converts signal sent by controller into level signal and transmits to communication bus. Although the circuit schematic of driving circuit of communication bus is generally similar, the layout of components and circuit wiring need to be considered when designing driving circuit on PCB, so different PCBs need to be redesigned position layout, the universality of driving circuit is low, the difference of PCB is large, and the reliability is affected.

[0031] Based on this, embodiments of this application provide a control chip, circuit board, and electrical device that integrates a communication bus driver circuit. The control chip carries and encapsulates a controller module and a signal transceiver module within a packaging frame. The controller module and the signal transceiver module communicate with each other via TX and RX signal lines. The bus signal terminal of the signal transceiver module is connected to the bus signal pin of the packaging frame. In other words, the control chip encapsulates the controller and the bus driver circuit into a single chip, connecting to external circuits via bus signal pins. Compared to solutions that implement the communication bus driver circuit using discrete components, embodiments of this application can improve circuit integration, avoid redundant PCB circuit design, and enhance the versatility and reliability of the communication bus driver circuit.

[0032] The control chip, circuit board, and electrical equipment of the integrated communication bus driver circuit are described below with reference to the accompanying drawings:

[0033] Reference Figure 1 The diagram shown is a circuit diagram of a communication bus driver circuit. (Refer to...) Figure 2 The diagram shown is a schematic of the controller's layout and connection structure. The control chip of the integrated communication bus driver circuit in this embodiment includes:

[0034] The package frame 100 is provided with bus signal pins 400;

[0035] Controller module 200, the controller module 200 is disposed on the substrate of the packaging frame 100;

[0036] The signal transceiver module 300 includes a bus signal terminal; the signal transceiver module 300 is disposed on the substrate;

[0037] The controller module 200 and the signal transceiver module 300 are connected via the TX signal line 800 and the RX signal line 900, and the bus signal terminal is coupled to the bus signal pin of the substrate.

[0038] The edge of the packaging frame 100 is provided with a plurality of pins, one or more dies are arranged inside the packaging frame 100, and the contacts of the dies are connected to the corresponding pins by a jumper or the like, and then the shell of the packaging frame 100 is formed by glue pouring or the like, so that the internal die is solidified in the control chip. In this way, the control chip can communicate the circuit of the internal die with the external circuit in the form of pins. For example, the controller module 200 and the signal transceiver module 300 are two independent dies, the controller module 200 and the signal transceiver module 300 are carried by a substrate inside the packaging frame 100, and the controller module 200 (die) and the signal transceiver module 300 (die) are connected by the TX signal line 800 and the RX signal line 900. For another example, the controller module 200 and the signal transceiver module 300 are integrated in one die, and the controller module 200 and the signal transceiver module 300 are connected by the TX signal line 800 and the RX signal line 900 inside the die. Overall, in the embodiment of the present application, the controller module 200 and the signal transceiver module 300 of the communication bus driving circuit are integrated in one packaging chip, the bus signal end of the signal transceiver module 300 is connected to the bus signal pin 400, and the bus signal pin 400 is connected to the external circuit as a bus port. It can be understood that the packaging method of the control chip is different according to the actual application, for example, a double in-line package (DIP, Double In-line Package) is used, the bus signal pin 400 is a pin corresponding to the soldering hole of the PCB under the DIP packaging scheme, and for another example, a ball grid array package (BGA, Ball Grid Array Package) is used, and the bus signal pin 400 is a spherical contact corresponding to the contact of the PCB under the BGA packaging scheme.

[0039] It can be understood that the communication bus driving circuit of the embodiment of the present application has been integrated in the signal transceiver module 300, that is, the circuit of the discrete component described above Figure 1 , or the communication bus driving circuit with equivalent function is formed into an integrated circuit by means of semiconductor wafer production, and is processed into a die form from the wafer. Therefore, the embodiment of the present application does not limit the specific form of the circuit in the signal transceiver module 300, but according to the characteristics of the communication bus driving circuit, the signal transceiver module 300 needs to be provided with corresponding external contacts, that is, the bus signal end connected to the bus signal pin 400, and the TX and RX contacts connected to the controller module 200. In this way, the controller module 200 can be connected to the communication bus through the signal transceiver module 300 to realize signal transceiving.

[0040] By integrating the controller module 200 and the signal transceiver module 300 in the control chip, the PCB board which needs to realize the function of communication on the bus can use the control chip, and does not need to use discrete components to design the communication bus driving circuit, which can simplify the communication bus driving circuit design of the PCB and improve the universality and reliability of the circuit.

[0041] In some embodiments, the controller module 200 includes a first signal end and a second signal end, and the signal transceiver module 300 includes a third signal end and a fourth signal end; the first signal end is connected to the third signal end through the TX signal line 800, and the second signal end is connected to the fourth signal end through the RX signal line 900.

[0042] Since there is signal interaction between the controller module 200 and the signal transceiver module 300 and the bus is in half-duplex mode, the two signal ends of the controller module 200 are connected to the two signal ends of the signal transceiver module 300 through the TX signal line 800 and the RX signal line 900. Specifically, the two signal ends of the controller module 200 are the first signal end and the second signal end, and the two signal ends of the signal transceiver module 300 are the third signal end and the fourth signal end. On the TX connection line, the controller module 200 sends signals to the signal transceiver module 300, and the signal transceiver module 300 sends data to the outside through the bus signal end. On the RX connection line, the signal transceiver module 300 receives external data through the bus signal end, and then transmits the data to the controller module 200 through the RX connection line.

[0043] In some embodiments, the signal transceiver module 300 includes a TX circuit 310 and an RX circuit 320, the third signal end is coupled to the bus signal end through the TX circuit 310, and the fourth signal end is coupled to the bus signal end through the RX circuit 320.

[0044] From the foregoing Figure 1 circuit, it can be known that the circuit module of the communication bus driving circuit includes a TX circuit 310 part and an RX circuit 320 part, the TX circuit 310 part is provided with a TX port and is connected to the third signal end of the signal transceiver module 300, the RX circuit 320 part is provided with an RX port and is connected to the fourth signal end of the signal transceiver module 300, and the TX circuit 310 part and the RX circuit 320 part are connected to the bus signal end of the signal transceiver module 300 through the port of the communication bus.

[0045] Specifically, referring to Figure 1The TX circuit 310 includes a first switch Q1 and a second switch Q2. The control terminal of the first switch Q1 is connected to the third signal terminal (via the TX port). One switch terminal of the first switch Q1 is connected to the first voltage source and the control terminal of the second switch Q2. The other switch terminal of the first switch Q1 is grounded. One switch terminal of the second switch Q2 is connected to the bus signal terminal and the second voltage source. The other switch terminal of the second switch Q2 is grounded.

[0046] The RX circuit 320 includes a third switch Q3 and a fourth switch Q4. The control terminal of the third switch Q3 is connected to the bus signal terminal. One switch terminal of the third switch Q3 is connected to the control terminal of the fourth switch Q4 and the third voltage source. The other switch terminal of the third switch Q3 is grounded. One switch terminal of the fourth switch Q4 is connected to the fourth voltage source and the fourth signal terminal (via the RX port). The other switch terminal of the fourth switch Q4 is grounded.

[0047] The above Figure 1 When the controller module 200 needs to transmit data, a series of level signals are outputted at the third signal terminal. When the level signal is high, the first switch Q1 is turned on, the voltage at the control terminal of the second switch Q2 is pulled down to ground, and thus the second switch Q2 is turned off. At this time, the 12V voltage is applied to the bus signal terminal after being divided by the resistor, and a high level signal is transmitted on the bus. When the level signal is low, the first switch Q1 is turned off, and thus the 5V voltage is applied to the control terminal of the second switch Q2 after being divided by the resistor, and the second switch Q2 is turned on. The voltage at the bus signal terminal is pulled down to ground, and a low level signal is transmitted on the bus. That is, the level signal of the data transmitted by the controller module 200 is the same as the level signal on the bus.

[0048] When the controller module 200 needs to receive data on the bus, when a high level signal is transmitted on the bus, the third switch Q3 is turned on, the voltage at the control terminal of the fourth switch Q4 is pulled down to ground, and thus the fourth switch Q3 is turned off. The 5V voltage is applied to the fourth signal terminal after being divided by the resistor, and the controller module 200 receives a high level signal. When a low level signal is transmitted on the bus, the third switch Q3 is turned off, and thus the 12V voltage is applied to the control terminal of the fourth switch Q4 after being divided by the resistor, and the fourth switch Q4 is turned on. The voltage at the fourth signal terminal is pulled down to ground, and the controller module 200 receives a low level signal.

[0049] It can be understood that, in addition to the above arrangement, the TX circuit 310 and the RX circuit 320 can also be other level signal conversion circuits, as long as they can realize the signal transmitting and receiving function of the controller module 200.

[0050] The first voltage source and the fourth voltage source are connected to the ground via the first resistor and the second resistor, respectively. Figure 1The second voltage source and the third voltage source are represented by 5V and 12V respectively Figure 2 The second voltage source and the third voltage source are represented by 5V and 12V respectively Figure 1 The reason for using 12V and 5V is that the output voltage of the switching power supply commonly used is 12V and 5V, which is convenient for power supply, and the voltage after voltage division of 12V is the voltage of the high level signal on the bus, which is larger than the working voltage of the components on the PCB, and can facilitate the module on the bus to read clear high level signal and distinguish from low level voltage.

[0051] Referring to Figure 1 As shown in the figure, the signal transceiver circuit 300 further comprises a clamping circuit, which can comprise a clamping diode, one end of the clamping circuit is connected to the bus signal end, and the other end is grounded, and the voltage of the bus signal end is limited within a certain range, for example, between 0-12V (at this time the clamping voltage of the clamping circuit is 12V).

[0052] The RX circuit 320 further comprises a synchronization signal end, in Figure 1 In the figure, RXD-CHECK represents a signal synchronization function for a controller without signal synchronization function.

[0053] In some embodiments, the packaging frame 100 is further provided with a VDD power supply pin 500 and a VCC power supply pin 700, the controller module 200 comprises a first VCC power supply end, and the signal transceiver module 300 comprises a second VDD power supply end and a second VCC power supply end; the second VDD power supply end is connected to the VDD power supply pin 500, and the first VCC power supply end and the second VCC power supply end are both connected to the VCC power supply pin 700.

[0054] The packaging frame 100 is provided with corresponding power supply pins for providing appropriate voltages, including VDD voltage and VCC voltage, for the controller module 200 and the signal transceiver module 300, the VDD power supply pin 500 of the control chip is connected to the controller module 200 and the signal transceiver module 300 internally, and is connected to the VDD power supply externally, and the VCC power supply pin 700 of the control chip is connected to the controller module 200 and the signal transceiver module 300 internally, and is connected to the VCC power supply externally. In the connection mode inside the packaging frame 100, the VDD power supply pin 500 is connected to the second VDD power supply end of the signal transceiver module 300 through a jumper, and the VCC power supply pin 700 is connected to the first VCC power supply end of the controller module 200 and the second VCC power supply end of the signal transceiver module 300 through two jumpers respectively.

[0055] In some embodiments, the package frame 100 is also provided with a VSS reference level pin 600, the controller module 200 includes a first VSS reference level end, the signal transceiver module 300 includes a second VSS reference level end, and the first VSS reference level end and the second VSS reference level end are both connected to the VSS reference level pin 600.

[0056] The VSS reference level pin 600 is used to provide a reference level for the control chip, and the voltage of both the VDD power supply pin 500 and the VCC power supply pin 700 relative to the VSS reference level is obtained. For the transistor (or mos tube) of the signal transceiver module 300, the emitter is connected to the VSS reference level pin 600, and the collector is connected to the VCC power supply pin 700 or the VDD power supply pin 500, so that the signal transceiver module 300 outputs the corresponding voltage / level. For example, by designing the resistance of the internal circuit of the signal transceiver module 300, the voltage of the VDD power supply pin 500 relative to the VSS reference level pin 600 is 12V, and the voltage of the VCC power supply pin 700 relative to the VSS reference level pin 600 is 5V (it can also be designed as 1.8V or 3.3V).

[0057] In some embodiments, the bus signal pin 400, the VDD power supply pin 500, the VCC power supply pin 700, and the reference level pin are located on the same side of the package frame 100.

[0058] Referring to Figure 2 The VDD power supply pin 500, the VCC power supply pin 700, and the reference level pin are arranged on the right side of the package frame 100. It can be understood that, although Figure 2 The VDD power supply pin 500, the VCC power supply pin 700, and the reference level pin are arranged on the right side of the package frame 100. It can be understood that, although

[0059] In some embodiments, the signal transceiver module 300 is arranged on the substrate close to the bus signal pin 400. Referring to Figure 2 The VDD power supply pin 500, the VCC power supply pin 700, and the reference level pin are arranged on the right side of the package frame 100. It can be understood that, although At this time, the distance between the bus signal end of the signal transceiver module 300 and the bus signal pin 400 is relatively short, which can reduce the length of the internal jumper of the control chip and also improve the signal quality to a certain extent,

[0060] In summary, the controller module 200 and the signal transceiver module 300 are carried and packaged by the packaging frame 100 in the control chip, the controller module 200 and the signal transceiver module 300 communicate through the TX signal line 800 and the RX signal line 900, and the bus signal end of the signal transceiver module 300 is connected to the bus signal pin 400 of the packaging frame 100, that is, the control chip packages the controller and the communication bus driving circuit into an integrated chip, and connects with external circuits through the bus signal pin 400, compared with the scheme of realizing the communication bus driving circuit through discrete components, the embodiment of the application can improve the circuit integration, avoid repeated design of the PCB circuit, and improve the versatility and reliability of the communication bus driving circuit.

[0061] The embodiment of the application further provides a circuit board comprising the control chip of any of the above embodiments.

[0062] The embodiment of the application further provides a power consumption device comprising the circuit board of any of the above embodiments.

[0063] The integrated communication bus driving circuit control chip of the embodiment of the application is described in detail below through a specific example.

[0064] Referring to Figure 3 the structure schematic diagram of the unpackaged control chip, wherein:

[0065] ① is a packaging frame;

[0066] ② is a controller module, installed on the packaging frame ①;

[0067] ③ is a signal transceiver module, installed on the packaging frame ①;

[0068] ④ is a bus signal pin of the control chip, used for transmitting signals on the bus;

[0069] ⑤ is a VDD power supply pin of the control chip, used for providing a voltage relative to the VSS reference level, generally 12V;

[0070] ⑥ is a VSS reference level pin of the control chip, used for providing a reference level VSS;

[0071] ⑦ is a VCC power supply pin of the control chip, used for providing a voltage relative to the VSS reference level, which can be 1.8V, 3.3V or 5V;

[0072] ⑧ is an internal binding line of the control chip, used for connecting the controller module ② and the signal transceiver module ③ and transmitting TX signals;

[0073] 9 is an internal binding line of the control chip, used for connecting the controller module 2 and the signal transceiver module 3 and transmitting the RX signal;

[0074] 10 is an internal binding line of the control chip, used for connecting the signal transceiver module 3 and the bus signal pin 4 and transmitting the bus s signal;

[0075] 11 is an internal binding line of the control chip, used for connecting the signal transceiver module 3 and the VDD power supply pin 5 and transmitting the VDD voltage current;

[0076] 12 is an internal binding line of the control chip, used for connecting the signal transceiver module 3 and the VSS reference level pin 6, and providing a reference level for the chip;

[0077] 13 is an internal binding line of the control chip, used for connecting the signal transceiver module 3 and the VCC power supply pin 7 and transmitting the VCC voltage current;

[0078] 14 is an internal binding line of the control chip, used for connecting the controller module 2 and the VSS reference level pin 6, and providing a reference level for the chip;

[0079] 15 is an internal binding line of the control chip, used for connecting the controller module 2 and the VCC power supply pin 7 and transmitting the VCC voltage current.

[0080] The signal transceiver module 3 is powered by 12V to realize level conversion. The level signal of the packaging frame 1 can be 1.8V, 3.3V or 5V. Since the internal signal voltage demand of the chip is low, the voltage is converted to a voltage between 7V and 12V by the signal transceiver module 3 to be a “high level” signal. The level signal 0V of the packaging frame 1 is converted to 0V by the controller module 2 to be a “low level” signal, realizing the function of keeping the signals in phase.

[0081] It should be understood that in the present application, “at least one” means one or more, and “multiple” means two or more. “And / or” is used to describe the association relationship of the associated objects, which means that there can be three kinds of relationships, for example, “A and / or B” can represent three cases of only A, only B and A and B existing at the same time, where A and B can be singular or plural. The character “ / ” generally represents an “or” relationship between the front and rear associated objects. “At least one of the following” or similar expressions means any combination of these items, including single item or any combination of multiple items. For example, at least one of a, b or c can mean a, b, c, “a and b”, “a and c”, “b and c”, or “a and b and c”, where a, b, and c can be single or multiple.

[0082] In several embodiments provided in the present application, it should be understood that the disclosed system, apparatus and method can be implemented in other manners. For example, the apparatus embodiments described above are merely illustrative, and for example, the division of units can be changed, and for example, a plurality of units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the displayed or discussed mutual couplings or direct couplings or communication connections can be indirect couplings or communication connections through some interfaces, apparatuses or units, and can be in electrical, mechanical or other forms. The units shown or discussed as separate components can or can not be physically separate, and the components shown as units can or can not be physical units, i.e., can be located in one place or distributed on a plurality of network units. In actual implementation, some or all of the units can be selected according to actual needs to achieve the purposes of the embodiments.

[0083] It should also be understood that the various embodiments provided in the embodiments of the present application can be combined in any manner to achieve different technical effects.

[0084] The above is a specific description of the preferred embodiments of the present application, but the present application is not limited to the above embodiments. Those skilled in the art can make various equivalent modifications or replacements without departing from the spirit of the present application, and these equivalent modifications or replacements are all included in the scope defined by the claims of the present application.

Claims

1. A control chip integrating a communication bus driver circuit, characterized by comprising: include: The package frame is equipped with bus signal pins; A controller module, wherein the controller module is disposed on the substrate of the packaging frame; A signal transceiver module, including a bus signal terminal; the signal transceiver module is disposed on the substrate; The controller module and the signal transceiver module are connected via TX and RX signal lines, and the bus signal terminal is coupled to the bus signal pin.

2. The control chip according to claim 1, characterized in that, The controller module includes a first signal terminal and a second signal terminal, and the signal transceiver module includes a third signal terminal and a fourth signal terminal; the first signal terminal is connected to the third signal terminal via a TX signal line, and the second signal terminal is connected to the fourth signal terminal via an RX signal line.

3. The control chip of claim 2, wherein, The signal transceiver module includes a TX circuit and an RX circuit. The third signal terminal is coupled to the bus signal terminal through the TX circuit, and the fourth signal terminal is coupled to the bus signal terminal through the RX circuit.

4. The control chip according to claim 3, characterized in that, The TX circuit includes a first switching transistor and a second switching transistor. The third signal terminal is connected to the control terminal of the first switching transistor. One switching terminal of the first switching transistor is connected to a first voltage source and the control terminal of the second switching transistor. The other switching terminal of the first switching transistor is grounded. One switching terminal of the second switching transistor is connected to the bus signal terminal and the second voltage source. The other switching terminal of the second switching transistor is grounded.

5. The control chip of claim 3, wherein, The RX circuit includes a third switch and a fourth switch. The bus signal terminal is connected to the control terminal of the third switch. One switch terminal of the third switch is connected to the control terminal of the fourth switch and a third voltage source. The other switch terminal of the third switch is grounded. One switch terminal of the fourth switch is connected to a fourth signal terminal and a fourth voltage source. The other switch terminal of the fourth switch is grounded.

6. The control chip of claim 1, wherein, The packaging frame is also provided with a VDD power supply pin and a VCC power supply pin. The controller module includes a first VCC power supply terminal, and the signal transceiver module includes a second VDD power supply terminal and a second VCC power supply terminal. The second VDD power supply terminal is connected to the VDD power supply pin, and both the first VCC power supply terminal and the second VCC power supply terminal are connected to the VCC power supply pin.

7. The control chip of claim 6, wherein, The packaging frame is also provided with a VSS reference level pin. The controller module includes a first VSS reference level terminal, and the signal transceiver module includes a second VSS reference level terminal. Both the first VSS reference level terminal and the second VSS reference level terminal are connected to the VSS reference level pin.

8. The control chip of claim 7, wherein, The bus signal pin, the VDD power supply pin, the VCC power supply pin, and the reference level pin are located on the same side of the package frame.

9. A circuit board, characterized by Includes the control chip as described in any one of claims 1 to 8.

10. An electric device, characterized by Includes the circuit board as described in claim 9.

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