Compact heat dissipation mechanism and PC equipment

Abstract

The utility model provides a compact heat dissipation mechanism and PC equipment. The compact heat dissipation mechanism comprises a heat dissipation copper plate, heat dissipation fins arranged on the heat dissipation copper plate, and a heat pipe fitting in butt joint with the heat dissipation copper plate. The heat pipe fitting extends and is arranged along a path from a heat source area to a non-heat source area, and a first heat conducting plate and a second heat conducting plate are correspondingly arranged on the heat pipe fitting; the first heat-conducting plate and the second heat-conducting plate are respectively arranged on the heat source area and are respectively used for guiding heat radiated by a chip in the heat source area to the non-heat source area through the heat pipe fitting and further conducting the heat to the heat dissipation copper plate and the heat dissipation fins; the heat pipe fitting, the heat conduction plate, the heat dissipation copper plate and the heat dissipation fins are compactly arranged, a traditional south bridge and an independent aluminum extrusion heat dissipation device are omitted, the occupied space of the heat dissipation assembly is greatly reduced, the heat dissipation assembly is particularly suitable for computer equipment with high internal layout requirements, and the overall structural layout is optimized.

Description

TECHNICAL FIELD

[0001] The utility model relates to whole machine equipment technical field, specifically, relate to a compact heat abstractor and PC equipment. BACKGROUND

[0002] At present, the computer equipment on market usually adopts traditional south bridge chip to match independent aluminum extrusion radiator to carry out heat dissipation. However, this heat dissipation form not only occupies larger space, but also is not favorable to the efficient heat dissipation of CPU.

[0003] With the improvement of hardware demand, split type radiator is gradually popularized and applied, but these heat dissipation elements are in dispersed state, and the structure is complex, so that practicality and aesthetic property are difficult to give consideration to. Meanwhile, with the increase of the power consumption of CPU, plus the configuration of south bridge chip, the design of traditional split type radiator not only occupies limited space, but also cannot effectively optimize the heat dissipation structure, influences overall space utilization and structure simplification, and the difficulty of batch manufacturing also increases, so that the heat dissipation performance effect is greatly reduced, and the core competitiveness of product is greatly weakened. SUMMARY

[0004] Therefore, the utility model aims at providing a compact heat abstractor and PC equipment to solve the above problems.

[0005] The utility model adopts the following scheme:

[0006] The application provides a compact heat abstractor, which comprises a heat dissipation copper plate, heat dissipation fins arranged on the heat dissipation copper plate, and a heat pipe component connected to the heat dissipation copper plate.

[0007] As a further improvement, the heat pipe component is in a U-shaped structure, one end of which is connected to the heat dissipation copper plate, and the other end is connected to the heat dissipation copper plate through a fan support.

[0008] As a further improvement, the heat pipe component and the heat dissipation copper plate are in the same plane position.

[0009] As a further improvement, the first heat conduction plate is used to install a south bridge chip, and the second heat conduction plate is used to install a CPU. The first heat conduction plate and the second heat conduction plate are arranged on both sides of the bottom of the U-shaped structure to correspond to the formation of the heat source area.

[0010] As a further improvement, the first heat-conducting plate is arranged at the joint position of the fan support and the heat pipe, and the south bridge chip and the heat-dissipating copper plate are in mutual surface contact by filling the heat-conducting material.

[0011] As a further improvement, the end surface of the second heat-conducting plate is provided with heat-conducting silica gel, and the two sides of the second heat-conducting plate are correspondingly provided with the elastic sheet mounting ears.

[0012] As a further improvement, the fan support is used for mounting a heat-dissipating fan, and the heat-dissipating fan is adjacent to the heat-dissipating copper plate and the heat-dissipating fins to correspondingly form the non-heat source area.

[0013] As a further improvement, the heat-dissipating copper plate is a rectangular plate, the heat-dissipating fins are arranged on the end surface of the heat-dissipating copper plate, and the heat-dissipating fins are covered with a layer of Mylar.

[0014] As a further improvement, the heat-dissipating mechanism is a square plane, and the side length is between 100 mm and 120 mm.

[0015] The application further provides a PC device, which comprises a body, a south bridge chip, a CPU chip, a heat-dissipating fan and the compact heat-dissipating mechanism.

[0016] By adopting the above technical scheme, the following technical effects can be achieved.

[0017] 1. The compact heat-dissipating mechanism can cancel the traditional south bridge plus independent aluminum extrusion radiator, greatly reduce the occupied space of the heat-dissipating assembly, and is particularly suitable for computer devices with high internal layout requirements, and the overall structure layout is optimized.

[0018] 2. The first heat-conducting plate and the second heat-conducting plate are arranged on the heat pipe, heat can be quickly transferred from the heat source area to the non-heat source area, guided to the heat-dissipating copper plate and the heat-dissipating fins for diffusion, the speed and efficiency of heat conduction can be significantly improved, the accumulation of heat in the heat source area is avoided, and the stable operation of the device is ensured.

[0019] 3. The cooperation of the heat-dissipating copper plate and the heat-dissipating fins further enlarges the heat-dissipating area and enhances the heat diffusion effect, heat is guided from the heat source area to the non-heat source area and then transferred to the fins, the natural air convection and radiation effect are fully utilized, and the heat-dissipating efficiency is improved.

[0020] 4. The heat-dissipating mechanism reduces the complexity of the heat-dissipating elements, reduces the assembly difficulty, the combination of the heat pipe and the heat-conducting plate can be more convenient in mass production, reduces the manufacturing cost, and improves the production efficiency.

[0021] 5. By optimizing the heat dissipation path and improving the efficiency of heat export, the operating temperature of the chip and the overall system can be effectively reduced, the service life of the equipment is prolonged, the stability and reliability of the system are improved, and the performance is particularly significant in high-power application scenarios. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 is a structure schematic view of the compact heat dissipation mechanism in a reverse state according to an embodiment of the present application;

[0023] Figure 2 is a structure schematic view of the compact heat dissipation mechanism in a front state according to an embodiment of the present application;

[0024] Figure 3 is a disassembly schematic view of the compact heat dissipation mechanism according to an embodiment of the present application. Figure 2

[0025] Icon:

[0026] 1-heat dissipation copper plate; 2-heat dissipation fin; 3-heat pipe; 4-first heat conduction plate; 5-second heat conduction plate; 6-fan support; 7-heat conduction silica gel; 8-elastic sheet mounting ear. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme in the embodiments of the present application will be described clearly and completely below in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only to represent selected embodiments of the present application.

[0028] EMBODIMENT

[0029] In combination with Figures 1 to 3 , the present embodiment provides a compact heat dissipation mechanism, which comprises a heat dissipation copper plate 1, heat dissipation fins 2 arranged on the heat dissipation copper plate 1, and a heat pipe 3 connected to the heat dissipation copper plate 1. The heat pipe 3 is arranged along the path from the heat source area to the non-heat source area, and a first heat conduction plate 4 and a second heat conduction plate 5 are arranged on the heat pipe 3. The first heat conduction plate 4 and the second heat conduction plate 5 are respectively arranged on the heat source area, and are respectively used to guide the heat emitted by the chip in the heat source area to the non-heat source area through the heat pipe 3, and further conduct the heat to the heat dissipation copper plate 1 and the heat dissipation fins 2.

[0030] ​The compact heat dissipation mechanism cancels the traditional south bridge plus independent aluminum extrusion radiator, greatly reduces the occupied space of the heat dissipation assembly, is particularly suitable for computer equipment with high internal layout requirements, and optimizes the overall structural layout.

[0031] By configuring the heat pipe 3 with the first heat conduction plate 4 and the second heat conduction plate 5, heat can be quickly transferred from the heat source area to the non-heat source area, guided to the heat dissipation copper plate 1 and the heat dissipation fin 2 through the heat pipe 3 for diffusion, which can significantly improve the speed and efficiency of heat conduction, avoid the accumulation of heat in the heat source area, and ensure the stable operation of the equipment.

[0032] The cooperation of the heat dissipation copper plate 1 and the heat dissipation fin 2 further expands the heat dissipation area and enhances the heat diffusion effect. By guiding heat from the heat source area to the non-heat source area and then to the fin, the natural air convection and radiation effect is fully utilized, and the heat dissipation efficiency is improved.

[0033] The heat dissipation mechanism reduces the complexity of the heat dissipation elements and reduces the assembly difficulty. The combination of the heat pipe 3 and the heat conduction plate can be more convenient in mass production, reduce the manufacturing cost, and improve the production efficiency.

[0034] By optimizing the heat dissipation path and improving the efficiency of heat export, the operating temperature of the chip and the whole system can be effectively reduced, the service life of the equipment can be prolonged, and the stability and reliability of the system can be improved, especially in high-power application scenarios.

[0035] As shown in Figure 2 and Figure 3 , in the present embodiment, the heat pipe 3 is in a U-shaped structure, one end thereof is connected to the heat dissipation copper plate 1, and the other end thereof is connected to the heat dissipation copper plate 1 through the fan bracket 6. The U-shaped heat pipe 3 can realize a longer heat transfer path in a limited space, effectively improving the coverage of heat conduction. At the same time, the two ends of the heat pipe 3 are connected to the heat dissipation copper plate 1 and the fan bracket 6 respectively, forming a stable heat dissipation channel. With the assistance of the heat dissipation fan, heat can be quickly exported from the heat source area through the heat pipe 3, and then transferred to the heat dissipation copper plate 1, and then accelerated by the fan to dissipate to the outside, further improving the overall heat dissipation efficiency. Not only can the heat conduction and dissipation be optimized, but also has good stability and operability, which is suitable for high-efficiency heat dissipation requirements.

[0036] Specifically, the heat pipe 3 is in the same plane position with the heat dissipation copper plate 1. Thus, the plane layout can effectively reduce the height difference generated in the heat transfer process, reduce the thermal resistance, and improve the heat conduction efficiency. Moreover, since the heat pipe 3 and the heat dissipation copper plate 1 are closely attached in the same plane, the path of heat transfer from the heat source area to the heat dissipation copper plate 1 through the heat pipe 3 is more direct, which helps to quickly dissipate heat. In addition, the same plane structure simplifies the design and installation process of the overall assembly, improves the compactness of the heat dissipation structure, and is conducive to batch manufacturing and assembly, so that the entire heat dissipation system has higher consistency and reliability.

[0037] It should be noted that the first heat conduction plate 4 is used to install the south bridge chip, and the second heat conduction plate 5 is used to install the CPU. The first heat conduction plate 4 and the second heat conduction plate 5 are opposite on both sides of the bottom of the U-shaped structure to correspond to form the heat source area. Among them, the heat of the south bridge chip and the CPU can be directly conducted to the heat pipe 3 through the corresponding heat conduction plate, so that the heat pipe 3 collects and guides the heat from the two different heat sources to the heat dissipation copper plate 1 and the heat dissipation fin 2, and further diffuses and dissipates heat.

[0038] In this embodiment, the first heat conduction plate 4 is arranged at the joint position of the fan bracket 6 and the heat pipe 3, and the south bridge chip and the heat dissipation copper plate 1 are in mutual surface contact by filling the heat conductive material (not shown in the figure). In this way, it is ensured that the heat generated by the south bridge chip can be efficiently transferred to the heat dissipation copper plate 1 and further dissipated through the heat pipe 3 and the fan. Moreover, the filling of the heat conductive material not only can eliminate the possible small gap between the south bridge chip, the heat conduction plate and the heat dissipation copper plate 1, but also can significantly improve the heat conduction efficiency, reduce the thermal resistance in the heat conduction process, and ensure smooth heat transfer.

[0039] Further, the end surface of the second heat conduction plate 5 is provided with heat conductive silica gel 7, and the two sides of the second heat conduction plate 5 are correspondingly provided with elastic sheet mounting ears 8. On the one hand, the heat conductive silica gel 7 is used to enhance the heat conduction effect between the CPU and the second heat conduction plate 5, and the heat conductive silica gel 7 can fill the small unevenness on the contact surface of the CPU and the heat conduction plate, reduce the thermal resistance, so that the heat of the CPU is more efficiently transferred to the second heat conduction plate 5, ensuring rapid heat dissipation. On the other hand, the elastic sheet mounting ears 8 help to stably install the heat conduction plate. Through the connection of the elastic sheet mounting ears 8 and other components, the heat conduction plate can be firmly attached to the surface of the CPU, ensuring that the heat conduction plate will not shift or loosen during operation, thereby further improving the stability of heat conduction and the reliability of the overall heat dissipation structure.

[0040] It should be noted that the fan bracket 6 is used to install the cooling fan adjacent to the heat dissipation copper plate 1 and the heat dissipation fin 2 to form the non-heat source area. Among them, the cooling fan can be directly aligned with the heat dissipation copper plate 1 and the heat dissipation fin 2, and the air flow is concentrated in these areas, and the heat conducted from the heat pipe 3 and the heat conduction plate is quickly taken away, and the heat dissipation efficiency is improved.

[0041] In the embodiment, the heat dissipation copper plate 1 is a rectangular plate, the heat dissipation fin 2 is arranged on the end surface of the heat dissipation copper plate 1, and the heat dissipation fin 2 is covered with a layer of Mylar sheet. The Mylar sheet has excellent insulation and heat resistance, which can not only prevent the heat dissipation fin 2 from being short-circuited with other components, but also protect the heat dissipation fin 2 from being damaged by the external environment.

[0042] As shown in Figure 1 and Figure 2 In the embodiment, the heat dissipation mechanism is a square plane with a side length of 100-120mm. The overall structure of the square plane can effectively disperse heat in limited space, and the range of side length provides flexible adaptation ability. The appropriate size can be selected according to the actual demand to ensure the compatibility with different devices.

[0043] In addition, the embodiment also provides a PC device, which comprises a body, a south bridge chip, a CPU chip, a cooling fan and the compact heat dissipation mechanism. The PC device can be, but is not limited to, a desktop computer, a notebook computer, a communication terminal device and the like.

[0044] The above is only the preferred embodiment of the present application, and the protection scope of the present application is not limited to the above-mentioned embodiments. Any technical solution falling within the scope of the present application is within the protection scope of the present application.

Claims

1. A compact heat dissipating mechanism, characterized by comprising: The heat pipe is arranged along a path from the heat source area to the non-heat source area, and a first heat-conducting plate and a second heat-conducting plate are arranged on the heat pipe; the first and second heat-conducting plates are arranged on the heat source area respectively, and are used to guide the heat generated by the chips in the heat source area to the non-heat source area through the heat pipe, and further to the heat-dissipating copper plate and the heat-dissipating fins. The heat pipe is arranged along a path from the heat source area to the non-heat source area, and a first heat-conducting plate and a second heat-conducting plate are arranged on the heat pipe; the first and second heat-conducting plates are arranged on the heat source area respectively, and are used to guide the heat generated by the chips in the heat source area to the non-heat source area through the heat pipe, and further to the heat-dissipating copper plate and the heat-dissipating fins.

2. The compact heat dissipating mechanism according to claim 1, wherein The heat pipe is arranged along a path from the heat source area to the non-heat source area, and a first heat-conducting plate and a second heat-conducting plate are arranged on the heat pipe; the first and second heat-conducting plates are arranged on the heat source area respectively, and are used to guide the heat generated by the chips in the heat source area to the non-heat source area through the heat pipe, and further to the heat-dissipating copper plate and the heat-dissipating fins.

3. The compact heat dissipating mechanism according to claim 2, wherein The heat pipe is arranged along a path from the heat source area to the non-heat source area, and a first heat-conducting plate and a second heat-conducting plate are arranged on the heat pipe; the first and second heat-conducting plates are arranged on the heat source area respectively, and are used to guide the heat generated by the chips in the heat source area to the non-heat source area through the heat pipe, and further to the heat-dissipating copper plate and the heat-dissipating fins.

4. The compact heat dissipating mechanism according to claim 2, wherein The heat pipe is arranged along a path from the heat source area to the non-heat source area, and a first heat-conducting plate and a second heat-conducting plate are arranged on the heat pipe; the first and second heat-conducting plates are arranged on the heat source area respectively, and are used to guide the heat generated by the chips in the heat source area to the non-heat source area through the heat pipe, and further to the heat-dissipating copper plate and the heat-dissipating fins.

5. The compact heat dissipating mechanism according to claim 4, wherein The heat pipe is arranged along a path from the heat source area to the non-heat source area, and a first heat-conducting plate and a second heat-conducting plate are arranged on the heat pipe; the first and second heat-conducting plates are arranged on the heat source area respectively, and are used to guide the heat generated by the chips in the heat source area to the non-heat source area through the heat pipe, and further to the heat-dissipating copper plate and the heat-dissipating fins.

6. The compact heat dissipating mechanism according to claim 4, wherein The heat pipe is arranged along a path from the heat source area to the non-heat source area, and a first heat-conducting plate and a second heat-conducting plate are arranged on the heat pipe; the first and second heat-conducting plates are arranged on the heat source area respectively, and are used to guide the heat generated by the chips in the heat source area to the non-heat source area through the heat pipe, and further to the heat-dissipating copper plate and the heat-dissipating fins.

7. The compact heat dissipating mechanism according to claim 2, wherein The heat pipe is arranged along a path from the heat source area to the non-heat source area, and a first heat-conducting plate and a second heat-conducting plate are arranged on the heat pipe; the first and second heat-conducting plates are arranged on the heat source area respectively, and are used to guide the heat generated by the chips in the heat source area to the non-heat source area through the heat pipe, and further to the heat-dissipating copper plate and the heat-dissipating fins.

8. The compact heat dissipating mechanism according to claim 1, wherein ​ 9. The compact heat dissipating mechanism according to claim 1, wherein ​ 10. A PC device, characterized by ​

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