Heat exchange equipment and server system
By using a heat exchange device that combines air cooling and liquid cooling, the deployment and maintenance challenges of liquid-cooled servers in data centers have been solved, enabling online operation and maintenance, ensuring reliable server operation, and making it suitable for large model training and inference scenarios.
Patent Information
- Application Number
- CN202520295080.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-24
- Publication Date
- 2025-12-16
- Estimated Expiration
- 2035-02-24
AI Technical Summary
In existing technologies, the increased power consumption of servers leads to increased heat dissipation requirements, limiting the deployment of liquid-cooled servers in data centers. Furthermore, component failures in heat exchange equipment require downtime for repairs and cannot be maintained online, affecting the reliable operation of servers.
A heat exchange device is provided that uses air cooling to cool the coolant and liquid cooling to cool the server. The fan and power supply are pluggable, and the sensors are detachable, enabling online operation and maintenance and avoiding downtime caused by equipment failure.
It enables the direct deployment of liquid-cooled servers in air-cooled data centers, improving the convenience of equipment maintenance, ensuring the reliable operation of servers, avoiding downtime caused by heat exchange equipment failure, and is suitable for large model training and inference scenarios.
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Figure CN223679612U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of artificial intelligence, in particular to the technical field of server heat dissipation, and more specifically, the utility model provides a heat exchange equipment and server system. BACKGROUND
[0002] With the development of artificial intelligence, the demand for data and computing power in various fields is increasing, and the power consumption of servers for processing data also increases. In actual use, heat exchange equipment needs to be used to dissipate heat from the server to ensure normal operation of the server. UTILITY MODEL CONTENT
[0003] The utility model provides a heat exchange equipment and server system.
[0004] According to an aspect of the utility model, a heat exchange equipment is provided, which comprises: a box body and a fan, the surface of the box body is formed with a fan mounting groove; the inside of the box body is provided with a first pipeline, the first pipeline is used for being communicated with a second pipeline in the inside of a server to be cooled and forming a circulating loop of cooling liquid; the fan is plug-inly arranged in the fan mounting groove, and the fan is used for sending air to the first pipeline to reduce the temperature of the cooling liquid in the first pipeline.
[0005] According to another aspect of the utility model, a server system is provided, which comprises a server and a heat exchange equipment.
[0006] It should be understood that the contents described in this part are not intended to identify the key or important features of the embodiments of the utility model, nor are they used to limit the scope of the utility model. Other features of the utility model will become easy to understand through the following description. BRIEF DESCRIPTION OF DRAWINGS
[0007] The accompanying drawings are used to better understand the scheme and do not constitute a limitation on the utility model. Among them:
[0008] Figure 1 is a schematic structural diagram of the heat exchange equipment according to the embodiment of the utility model;
[0009] Figure 2 is a schematic structural diagram of the heat exchange equipment according to the embodiment of the utility model; and
[0010] Figure 3 is a schematic structural diagram of the server system according to the embodiment of the utility model. DETAILED DESCRIPTION
[0011] The exemplary embodiments of the present application will be described hereinafter with reference to the accompanying drawings, in which, the drawings constitute a part of this application. Various details of the application embodiments of the present application are described to assist in understanding thereof, and they should be considered as merely exemplary. It will thus be appreciated that those skilled in the art will be able to devise various embodiments that, although different from the ones described, will fall within the scope and spirit of the present application. In the following description, same reference numerals are used to denote same elements.
[0012] The terms used herein are merely used to describe specific embodiments, and are not intended to limit the present application. The terms "include", "comprise" and the like used herein indicate the presence of the described features, steps, operations and / or components, but do not exclude the presence or addition of one or more other features, steps, operations or components.
[0013] All terms used herein (including technical and scientific terms) have the meanings commonly understood by one of ordinary skill in the art, unless otherwise defined. It should be noted that the terms used herein should be interpreted in a manner consistent with the context of the specification, and should not be interpreted in an idealized or overly formal manner.
[0014] With the development of artificial intelligence, the demand for data and computing power in various fields is increasing, and the power consumption of servers for processing data is also increasing. First, servers are gradually liquid-cooled, and the current data center has insufficient liquid-cooled rack positions, and the construction period of new liquid-cooled rooms is too long to meet the deployment needs of liquid-cooled servers. Second, the heat exchange equipment used for cooling the server includes a plurality of components, such as power supply, pump, pipeline, sensor, filter element, etc., and each component is packaged inside the box, and after the components of the heat exchange equipment fail, it needs to be stopped for maintenance, and cannot be maintained online.
[0015] The present application provides a heat exchange equipment, which can deploy liquid-cooled servers in air-cooled data centers, thereby meeting the demand for directly deploying liquid-cooled servers in air-cooled data centers and edge scenarios lacking primary side cooling water. In addition, the convenience of equipment maintenance is improved, online operation and maintenance of the heat exchange equipment is realized, server downtime operation and maintenance caused by heat exchange equipment failure is avoided, and reliable operation of the server is ensured.
[0016] The technical solutions provided by the present application will be described in detail below with reference to the drawings and specific embodiments.
[0017] Figure 1 is a schematic structural diagram of the heat exchange equipment according to the embodiments of the present application.
[0018] As Figure 1As shown, the heat exchange device 100 in this embodiment adopts air cooling to radiate the cooling liquid (i.e. heat exchange medium), and then uses the low-temperature cooling liquid to radiate the server 200. The heat exchange device 100 includes a box 101 and a fan 102.
[0019] The box 101 is provided with a fan mounting groove. For example, the outer surface of the box 101 is inwardly recessed to form the fan mounting groove, or the surface of the box 101 is provided with a hole structure which extends into the box 101 by a distance to form the fan mounting groove.
[0020] The box 101 is provided with a first pipeline which is used to communicate with a second pipeline inside the server 200 to be radiated and form a circulation loop of the cooling liquid. For example, the outlet of the first pipeline inside the box 101 communicates with the inlet of the second pipeline inside the server 200, and the inlet of the first pipeline inside the box 101 communicates with the outlet of the second pipeline inside the server 200, so as to form the circulation loop. The cooling liquid can flow in the circulation loop by driving a pump, so as to achieve the cooling effect of the server 200.
[0021] It should be noted that the shape of the first pipeline and the second pipeline is not limited in this embodiment. For example, the server 200 can include a server shell and components to be radiated. Each component to be radiated is arranged in the server shell, and the space in the server shell can be used as the second pipeline of the server 200. In this way, the cooling liquid flowing through the server shell can cool each component to be radiated in the server 200.
[0022] The fan 102 is plug-in arranged in the fan mounting groove. When the fan 102 needs to be maintained or replaced, the fan 102 can be directly pulled out from the outside of the box 101. When the fan 102 needs to be installed, the fan 102 can be directly inserted into the fan mounting groove from the outside of the box 101. In addition, the fan 102 is used to send air to the first pipeline. For example, the air sending direction of the fan 102 is towards the first pipeline. The fan 102 flows the gas near the first pipeline by suction or suction, so as to reduce the temperature of the cooling liquid in the first pipeline.
[0023] The heat exchange equipment 100 provided by the embodiment adopts a wind cooling mode to cool the cooling liquid, and simultaneously cools the server 200 through a liquid cooling mode. The heat exchange equipment 100 can be used to deploy the liquid cooling server 200 in a wind cooling data center, thereby meeting the demand of directly deploying the liquid cooling server 200 in the wind cooling data center and the edge scene under the condition of lacking primary side cooling water. In addition, the fan 102 is arranged in the fan mounting groove of the box body 101. In this way, when the fan 102 needs to be repaired or replaced, the box body 101 does not need to be opened, and the fan 102 can be conveniently taken out and replaced from the outside of the box body 101 through the pulling mode, thereby improving the convenience of equipment maintenance, realizing online operation and maintenance of the heat exchange equipment 100, avoiding the shutdown operation and maintenance of the server 200 due to the failure of the heat exchange equipment 100, and guaranteeing the reliable operation of the server 200. The heat exchange equipment 100 can be applied to a large model scene. For example, when the server 200 is deployed with a large model, the heat exchange equipment 100 can avoid the interruption of large model training and reasoning.
[0024] Figure 2 is a schematic structural view of the heat exchange equipment according to the embodiment of the utility model.
[0025] As Figure 2 shown, in the embodiment, the heat exchange equipment 100 is used to cool the server 200. The heat exchange equipment 100 can include a box body 101. The surface of the box body 101 can be formed with a fan mounting groove and a power supply mounting groove. The heat exchange equipment 100 includes a fan 102 and a power supply 103. The fan 102 can refer to the above. The embodiment will not be described again. The power supply 103 is plug-inly arranged in the power supply mounting groove. The power supply 103 is electrically connected with the fan 102 and supplies power to the fan 102. For example, the mounting groove is similar to the fan mounting groove. The power supply 103 and the fan 102 can be connected through a transmission line. Alternatively, a power transmission structure for transmitting power can be arranged in the box body 101. The power supply 103 is inserted into the power supply mounting groove. The power supply end of the power supply 103 is electrically connected with the power receiving end of the power transmission structure. The fan 102 is inserted into the fan mounting groove. The power receiving end of the fan 102 is electrically connected with the power supply end of the power transmission structure. In the embodiment, the power supply 103 is arranged in the power supply mounting groove of the box body 101. In this way, when the power supply 103 needs to be repaired or replaced, the box body 101 does not need to be opened. The power supply 103 can be conveniently taken out and replaced from the outside of the box body 101 through the pulling mode. Therefore, the convenience of equipment maintenance is improved, and the online operation and maintenance of the heat exchange equipment 100 is realized.
[0026] According to another embodiment of the present application, the heat exchange device 100 further comprises a communication pipeline and a sensor. One end of the communication pipeline is connected with the first pipeline inside the box 101, and the other end of the communication pipeline is connected with the second pipeline of the server 200, so that the first pipeline and the second pipeline are kept in communication through the communication pipeline. In addition, the communication pipeline is arranged outside the box 101, the sensor is arranged on the communication pipeline and detachably connected with the communication pipeline, and the sensor is used for detecting the parameters of the cooling liquid. The sensor may, for example, be a temperature sensor 106, a pressure sensor 107, a flow sensor 108, etc., and the type of the sensor is not limited in the present embodiment.
[0027] As shown in Figure 2 The communication pipeline may, for example, comprise at least one of a liquid supply pipeline 104 and a liquid return pipeline 105. The inlet of the liquid supply pipeline 104 is connected with the outlet of the first pipeline, and the outlet of the liquid supply pipeline 104 is used for being connected with the inlet of the second pipeline. The inlet of the liquid return pipeline 105 is used for being connected with the outlet of the second pipeline, and the outlet of the liquid return pipeline 105 is connected with the inlet of the first pipeline. In the heat exchange process, the high-temperature cooling liquid inside the server 200 enters the first pipeline of the box 101 through the liquid return pipeline 105, the fan 102 cools the first pipeline to convert the high-temperature cooling liquid into low-temperature cooling liquid, and then the low-temperature cooling liquid enters the server 200 through the liquid supply pipeline 104 to dissipate heat for the server 200.
[0028] In actual application, the liquid supply pipeline 104 and the liquid return pipeline 105 may both be arranged outside the box 101, and the sensor may be arranged in the liquid supply pipeline 104 and the liquid return pipeline 105, for example, the temperature sensor 106, the pressure sensor 107 and the flow sensor 108 may be arranged in the liquid supply pipeline 104, or the temperature sensor 106, the pressure sensor 107 and the flow sensor 108 may be arranged in the liquid return pipeline 105. In addition, a filter element 109 may be arranged in the liquid supply pipeline 104 to filter the cooling liquid.
[0029] In actual application, the detachable connection between the sensor and the communication pipeline may be realized in various ways.
[0030] In one example, the sensor may be a temperature sensor 106, which is clamped to the outer sidewall of the communication pipeline to collect temperature. For example, the temperature sensor 106 comprises a chuck, which is clamped to the outer sidewall of the communication pipeline. The communication pipeline comprises at least one of the liquid supply pipeline 104 and the liquid return pipeline 105, so that the part of the temperature sensor 106 for collecting temperature is attached to the outer sidewall of the communication pipeline, and the temperature of the outer sidewall of the communication pipeline can be collected. Since the temperature difference between the inside and outside of the communication pipeline is small, the temperature can be taken as the temperature of the cooling liquid. Alternatively, the temperature collected by the sensor is adjusted based on an algorithm or experience to determine the temperature of the cooling liquid.
[0031] In another example, the sensor can be any one of the temperature sensor 106, the pressure sensor 107, and the flow sensor 108, the communication pipeline is formed with a sensor mounting hole, the sensor is pluggably arranged in the sensor mounting hole, and the outer surface of the sensor is in sealing connection with the sensor mounting hole. In addition, the heat exchange device 100 further comprises a liquid leakage prevention element, which is arranged in the sensor mounting hole of the communication pipeline and is used for sealing the sensor mounting hole after the sensor is detached from the sensor mounting hole.
[0032] For example, the liquid leakage prevention element can be made of a material with elasticity, is mounted in the sensor mounting hole and in sealing connection with the sensor mounting hole, is provided with a through hole, and the probe of the sensor for detecting the parameters such as the flow and pressure of the cooling liquid passes through the through hole of the liquid leakage prevention element and contacts the cooling liquid, so as to realize the detection of the relevant parameters. When the sensor needs to be replaced, the sensor can be pulled out. At this time, since the liquid leakage prevention element has elasticity, when the sensor is pulled out, the liquid leakage prevention element stretches towards the position of the through hole under the action of its own elasticity, so as to seal the through hole and realize the liquid leakage prevention function. When the sensor needs to be installed, the sensor is inserted into the through hole of the liquid leakage prevention element. At this time, the outer side wall of the sensor compresses the liquid leakage prevention element.
[0033] In this embodiment, the sensor is detachably connected with the communication pipeline, and both the communication pipeline and the sensor are arranged outside the cabinet 101. In this way, when the sensor needs to be replaced, the cabinet 101 does not need to be opened, and the disassembly and assembly can be more convenient, thereby improving the convenience of device maintenance.
[0034] As shown in Figure 2 Some parts that need to be disassembled can be arranged on the same side of the cabinet 101. For example, the fan mounting groove, the power supply mounting groove, the liquid supply pipeline 104, and the liquid return pipeline 105 can be arranged on the same side of the cabinet 101. In this way, the fan 102, the power supply 103, the various sensors, and the filter element 109 are all on the same side of the cabinet 101, which is more convenient for the staff to maintain the various parts.
[0035] As shown in Figure 2As shown, according to another embodiment of the present utility model, the number of each component in the heat exchange equipment 100 can adopt multiple. For example, two power supplies 103 can be adopted, one of which is used as a backup, so that when a fault occurs, the backup power supply 103 is directly used. For another example, four fans 102 can be adopted, three of which are running, and one is a backup, and when a fault occurs, the backup fan 102 is directly used. For another example, two drive pumps can be adopted, one of which is a backup, and when a fault occurs, the backup drive pump is directly used. When actually arranged, the two drive pumps are connected in parallel, and the drive pump outlet and inlet can be controlled by a control valve.
[0036] In addition, when actually controlled, the power supply 103, the fan 102 and the drive pump can adopt a hot standby mode. Taking the drive pump as an example, the hot standby model means that the drive pump is enabled in a cycle, so that two are switched once every period of time. By adopting the hot standby mode, the temperature and the fluctuation of the liquid supply can be reduced, and the stability of the server 200 can be improved.
[0037] According to another embodiment of the present utility model, the heat exchange equipment 100 can include a bypass pipeline, a bypass pipeline control valve and a filter element 109.
[0038] The filter element 109 is used to filter impurities or other substances in the cooling liquid, and the filter element 109 is arranged on the liquid supply pipeline 104. The inlet and outlet of the bypass pipeline are connected with the liquid supply pipeline 104, and along the cooling liquid flow direction of the liquid supply pipeline 104, the filter element 109 is between the inlet of the bypass pipeline and the outlet of the bypass pipeline, so that the bypass pipeline is connected in parallel with the section of the liquid supply pipeline 104 provided with the filter element 109. The bypass pipeline is provided with a bypass pipeline control valve, and the bypass pipeline control valve is arranged on the bypass pipeline and controls the connection and disconnection of the bypass pipeline.
[0039] When the filter element 109 needs to be used, the bypass pipeline control valve can be closed to disconnect the bypass pipeline, so that the cooling liquid in the liquid supply pipeline 104 flows through the filter element 109, thereby realizing the filtration of the cooling liquid. When the filter element 109 needs to be disassembled, the bypass pipeline control valve can be opened to open the bypass pipeline, and a section of the pipeline provided with the filter element 109 can also be closed by the bypass pipeline control valve or other valves, so that the cooling liquid can flow out of the liquid supply pipeline 104 and return to the liquid supply pipeline 104 through the bypass pipeline.
[0040] The filter element 109 of the present embodiment is arranged on the liquid supply pipeline 104, and when the filter element 109 needs to be replaced, the filter element 109 can be directly replaced, thereby improving the maintenance efficiency. In addition, by means of the bypass pipeline and the bypass pipeline control valve, the filter element 109 can be replaced without affecting the normal operation of the heat exchange equipment 100.
[0041] Figure 3 This is a schematic structural diagram of a server system according to an embodiment of the present utility model.
[0042] This application also provides a server system, which includes a server 200 and a heat exchange device 100.
[0043] Server 200 can be a GPU (Graphics Processing Unit) server or other servers. This embodiment does not limit the type of server 200.
[0044] The heat exchanger 100 can be used as a cooling distribution unit (CDU). The structure of the heat exchanger 100 is described above and will not be repeated in this embodiment. In practical applications, the heat exchanger 100 is suitable for both distributed and centralized cooling distribution units (CDUs). A distributed CDU uses one heat exchanger 100 to cool the coolant used by one server 200, while a centralized CDU uses one heat exchanger 100 to cool the coolant used by multiple servers 200.
[0045] like Figure 3 As shown, the heat exchanger 100 includes a housing 101, the surface of which can be formed with a tray mounting groove. The heat exchanger 100 also includes a tray 111 and a drive pump 110. The tray 111 is detachably mounted in the tray mounting groove. The tray 111 adopts a drawer-like detachable structure, allowing the tray 111 to be pulled out of the tray mounting groove or inserted into it. A slide rail can be provided in the tray mounting groove to facilitate the movement of the tray 111. The drive pump 110 is mounted in the tray 111 and is connected to the first pipeline, driving the coolant to flow in the circulation loop. In this embodiment, the drive pump 110 is mounted in the tray 111. When maintenance or replacement of the drive pump 110 is required, the tray 111 can be pulled out to remove the drive pump 110 for maintenance or replacement, improving the convenience of equipment maintenance and enabling online operation and maintenance of the heat exchanger 100.
[0046] like Figure 3As shown, the server system comprises a server 200 and a heat exchange device 100, the heat exchange device 100 can comprise a controller and electric control elements, each electric control element can be electrically connected with the controller, so as to realize transmission of collected data and transmission of control instructions. The electric control elements can comprise sensors, fans, power supplies, a driving pump 110 and the like, and the embodiment is not limited to the electric control elements. In addition, a first port 112 can be arranged on the cabinet 101, a second port 201 is arranged on the server 200, the controller is electrically connected with the first port 112, the first port 112 and the second port 201 can be electrically connected through a transmission line, and the first port 112 and the second port 201 can be RS485 ports. In this way, the related data of the heat exchange device 100 can be transmitted to the server 200 through the controller, the first port 112 and the second port 201. In addition, the control logic of the heat exchange device 100 is deployed on the server 200, so that when it is necessary to control the heat exchange device 100, for example, it is necessary to control the working states of each fan, power supply, driving pump 110 and control valve, an instruction can be sent to the controller through the server 200, and then the controller controls each electric control element. By using the above scheme, it is not necessary to equip the heat exchange device 100 with an upper computer, but the computing resources of the server 200 are used to realize control of the heat exchange device 100, so as to reduce the deployment cost and occupied space of the heat exchange device 100.
[0047] The above specific embodiments do not constitute a limitation on the protection scope of the present application. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims
1. A heat exchange apparatus, characterized by, The heat exchange device comprises: a box, a surface of the box being formed with a fan mounting groove; an inside of the box being provided with a first pipeline, the first pipeline being used for communicating with a second pipeline inside a server to be cooled and forming a circulating loop of cooling liquid; a fan, the fan being plug-inly arranged in the fan mounting groove, the fan being used for sending air to the first pipeline to reduce the temperature of the cooling liquid in the first pipeline.
2. The heat exchange apparatus according to claim 1, wherein The surface of the box is further formed with a power supply mounting groove, and the heat exchange device further comprises: a power supply, the power supply being plug-inly arranged in the power supply mounting groove, the power supply being electrically connected with the fan and supplying power to the fan.
3. The heat exchange apparatus according to claim 1, wherein The surface of the box is further formed with a tray mounting groove; the heat exchange device further comprises: a tray, the tray being pullably arranged in the tray mounting groove; a drive pump, the drive pump being arranged in the tray, the drive pump being connected with the first pipeline and driving the cooling liquid to flow in the circulating loop.
4. The heat exchanging apparatus according to any one of claims 1 to 3, characterized by The heat exchange device further comprises: a communication pipeline, one end of the communication pipeline being connected with the first pipeline, the other end of the communication pipeline being used for being connected with the second pipeline of the server; the communication pipeline being arranged outside the box; a sensor, the sensor being arranged in the communication pipeline and being detachably connected with the communication pipeline, the sensor being used for detecting parameters of the cooling liquid.
5. The heat exchange apparatus according to claim 4, wherein The communication pipeline is formed with a sensor mounting hole, the sensor being plug-inly arranged in the sensor mounting hole, and an outer surface of the sensor being sealingly connected with the sensor mounting hole; The heat exchange device further comprises: a liquid leakage prevention element, the liquid leakage prevention element being arranged in the sensor mounting hole of the communication pipeline, the liquid leakage prevention element being used for sealing the sensor mounting hole after the sensor is detached from the sensor mounting hole.
6. The heat exchange apparatus according to claim 4, wherein The sensor comprises a temperature sensor, the temperature sensor being clamped to an outer sidewall of the communication pipeline to collect temperature.
7. The heat exchange apparatus according to claim 4, wherein The communication pipeline comprises: a liquid supply pipeline, an inlet of the liquid supply pipeline being connected with an outlet of the first pipeline, an outlet of the liquid supply pipeline being used for being connected with an inlet of the second pipeline; a liquid return pipeline, an inlet of the liquid return pipeline being used for being connected with an outlet of the second pipeline, an outlet of the liquid return pipeline being connected with an inlet of the first pipeline; wherein, the liquid supply pipeline and the liquid return pipeline are both arranged outside the box.
8. The heat exchange apparatus according to claim 7, wherein The heat exchange device further comprises: a bypass pipeline, an inlet and an outlet of the bypass pipeline being connected with the liquid supply pipeline respectively; a bypass pipeline control valve, the bypass pipeline control valve being arranged in the bypass pipeline and controlling communication and disconnection of the bypass pipeline; a filter element, the filter element being arranged in the liquid supply pipeline; in a cooling liquid flow direction along the liquid supply pipeline, the filter element is between the inlet of the bypass pipeline and the outlet of the bypass pipeline.
9. The heat exchange apparatus according to claim 7, wherein The fan mounting groove, the liquid supply pipeline and the liquid return pipeline are on the same side of the box.
10. A server system, characterized by The heat exchange device comprises: a server; and any one of claims 1 to 9.