Ultra-low-frequency high-voltage generator boost unit PCB coil
By adopting a four- or eight-layer PCB coil structure, the problems of large weight and size of ultra-low frequency high voltage generators are solved, realizing automated production and improved reliability, and it is suitable for stacked ultra-low frequency high voltage generators.
Patent Information
- Application Number
- CN202423042948.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-10
- Publication Date
- 2025-12-16
- Estimated Expiration
- 2034-12-10
AI Technical Summary
Existing ultra-low frequency high voltage generators are heavy and bulky, and the traditional wire winding process is complex and difficult to automate, making it difficult to meet the requirements of ultra-thin, high frequency and low current.
Employing a four- or eight-layer PCB coil structure, the coils are connected via vias and lead-out pads. Combined with magnetic cores and empty pads, mechanical strength is increased. This design is suitable for multilayer ultra-low frequency high voltage generators, enabling automated production.
The automated production of coils has been achieved, improving reliability and reducing coil thickness and weight. This makes it suitable for high-frequency operation of stacked ultra-low frequency high voltage generators, with significantly reduced size and weight.
Smart Images

Figure CN223679900U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of high voltage electronic measurement, in particular to a kind of super low frequency high voltage generator step-up unit PCB coil. BACKGROUND
[0002] Super low frequency high voltage generator can produce arbitrary high voltage waveform, and this device is mainly developed for the withstand voltage and dielectric loss test of power cable and other large-capacity power equipment, compared with traditional power frequency test equipment, greatly reduce the weight and volume of equipment.
[0003] The existing disclosed super low frequency high voltage generator is based on the method of 0.1Hz modulation based on power frequency power supply, which uses power frequency transformer, and still cannot solve the weight and volume problem of super low frequency high voltage generator.
[0004] A new type of super low frequency high voltage generator based on switching power supply mode using high frequency energy transmission has predictable small volume and small weight, based on high frequency working principle, can be realized by using secondary coil with few turns during energy transmission, for example, a laminated super low frequency high voltage generator is stacked by several high voltage generator step-up units, each step-up unit only needs to generate + / -2kV / 50mA output, when 40 step-up units are stacked, + / -80kV / 50mA output can be generated. The high voltage generator step-up unit is provided with a coil for receiving magnetic field energy. Since the high voltage generator step-up unit needs to maintain a thickness of several mm to prevent the stack from being too thick, it cannot be realized by traditional wire winding process, especially the traditional wire winding process is too complex, difficult to automate production, and difficult to ensure reliability.
[0005] For the requirements of super-thin, high frequency, less turns, small current for high voltage and easy automation production, a new type of coil structure is needed. CONTENT OF UTILITY MODEL
[0006] To solve the above technical problems, the utility model provides a kind of super low frequency high voltage generator step-up unit PCB coil for laminated super low frequency high voltage generator.
[0007] The utility model relates to a kind of superlow frequency high voltage generator voltage boosting unit PCB coil, including PCB, PCB coil, via, outgoing line pad, empty pad and middle opening;Wherein PCB is four-layer structure, each layer is provided with PCB coil, wherein top layer coil inner side and middle 1 layer coil inner side are connected by a group of via, top layer coil outer side and middle 1 layer coil outer side are connected a group of outgoing line pad;Middle layer 2 coil inner side and bottom layer coil inner side are connected by another group of via, middle layer 2 coil outer side and bottom layer coil outer side are connected another group of outgoing line pad;PCB is provided with large middle opening in middle, for installing magnetic core;PCB is also provided with empty pad, PCB is welded on the bottom plate of voltage boosting unit by six pads, wherein right side is four outgoing line pads of two coils, left side is two empty pads for increasing mechanical strength.
[0008] The solder resist layer of the PCB is black, which is used to improve the heat dissipation capacity of the PCB coil.
[0009] When it is necessary to increase the number of turns of the coil or increase the number of coils or reduce the coil resistance, more than 4 layers of PCB circuit boards can be used to set more than 4 layers of coils.
[0010] Compared with the prior art, the utility model has the beneficial effects that:
[0011] The stacked superlow frequency high voltage generator needs to be stacked by several voltage boosting units, and each voltage boosting unit needs several coils. The PCB coil structure is used to enable the coil to be produced automatically, greatly reduces the working strength, and greatly improves the reliability of the coil. Especially for the voltage boosting unit of the stacked superlow frequency high voltage generator working at high frequency, the required number of turns of the coil is not high, and the working current is not large, which is particularly suitable for using the PCB coil to realize high-density wiring. The entire coil structure is extremely compact, with very thin thickness and very light weight, so that the thickness of the voltage boosting unit of the superlow frequency high voltage generator is only a few mm, and the overall height of the stacked several voltage boosting units is only a few tens of cm, thereby greatly reducing the volume and weight of the superlow frequency high voltage generator. BRIEF DESCRIPTION OF DRAWINGS
[0012] Figure 1 is the front view structural schematic diagram of the utility model kind of superlow frequency high voltage generator voltage boosting unit PCB coil;
[0013] Figure 2 is the three-dimensional structural schematic diagram of the utility model kind of superlow frequency high voltage generator voltage boosting unit using four-layer PCB coil;
[0014] Figure 3 is the three-dimensional structural schematic diagram of the utility model kind of superlow frequency high voltage generator voltage boosting unit using eight-layer PCB coil;
[0015] Figure 4It is the practical drawing of the utility model, and the black solder resist is replaced by the green solder resist for visuality;
[0016] In the drawing, marks: 1, PCB; 2, PCB coil; 3, via hole; 4, wire-out pad; 5, empty pad; 6, middle opening. DETAILED DESCRIPTION
[0017] In order to facilitate understanding of the utility model, the utility model will be described more fully below with reference to the relevant drawings. The utility model can be realized in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the utility model more thorough and comprehensive. EMBODIMENT
[0018] The utility model discloses a kind of booster unit PCB coils of ultra-low frequency high-voltage generator, including PCB1, PCB coil 2, via hole 3, wire-out pad 4, empty pad 5 and middle opening 6;
[0019] Wherein PCB1 is four-layer structure, outer copper skin thickness is 35um, inner layer thickness 17.5um, wiring width 0.15mm, line spacing 0.15mm, meet PCB conventional production process;
[0020] PCB1 appearance 96mm*84mm, adopt black solder resist to facilitate heat dissipation;
[0021] As shown in Figure 2 PCB coil 2 is provided with 30 turns of coil per layer, wherein the inner side of the top layer coil is connected with the inner side of middle 1 layer coil through a group of via holes 3, the outer side of the top layer coil is connected with the outer side of middle 1 layer coil through a group of wire-out pads 4, to form a coil;The inner side of middle layer 2 coil is connected with the inner side of bottom layer coil through another group of via holes 3, and the outer side of middle layer 2 coil is connected with the outer side of bottom layer coil through another group of wire-out pads 4, to form another coil;
[0022] PCB1 is welded on the bottom plate of booster unit by six pads, wherein the right side is four wire-out pads 4 of two coils, and the left side is two empty pads 5 for increasing mechanical strength;
[0023] Middle opening 6 diameter 63.5mm, cooperate with the driving magnetic rod assembly of outer diameter 62mm and insert, design output voltage 250V peak value, output current 0.2A, two coil groups each pass through 4 times voltage rectification and finally can obtain 2000V / 50mA output, the direct current resistance of each coil group is about 90Ω, and the power consumption of each coil plate is about 7W under full load work, and the temperature rise is about 30 DEG C when forced air cooling. EMBODIMENT
[0024] The utility model discloses a kind of superlow frequency high-voltage generator voltage boosting unit PCB coil, including PCB1, PCB coil 2, via 3, outgoing line pad 4, empty pad 5 and middle aperture 6;
[0025] Wherein PCB1 is eight-layer structure, outer copper skin thickness is 35um, inner layer thickness 17.5um, wiring width 0.4mm, line spacing 0.2mm, meet PCB conventional production process;
[0026] PCB1 appearance 96mm*84mm, adopt black soldering to facilitate heat dissipation;
[0027] As shown in Figure 3 PCB coil 2 is provided with 15 turns of coil per layer, wherein top layer coil outside connects outgoing line pad, top layer coil inside is connected with middle 1 layer coil inside through a group of vias, middle 1 layer coil outside is connected with middle 2 layer coil outside through a group of vias, middle 2 layer coil inside is connected with middle 3 layer coil inside through a group of vias, middle 3 layer coil outside connects outgoing line pad, to form a coil;Middle 4 layer coil outside connects outgoing line pad, middle 4 layer coil inside is connected with middle 5 layer coil inside through a group of vias, middle 5 layer coil outside is connected with middle 6 layer coil outside through a group of vias, middle 6 layer coil inside is connected with bottom layer coil inside through a group of vias, bottom layer coil outside connects outgoing line pad, to form another group of coils;
[0028] PCB1 is welded on the bottom plate of voltage boosting unit by six pads, wherein right side is four outgoing line pads 4 of two coils, left side is two empty pads 5 for increasing mechanical strength;
[0029] Middle aperture 6 diameter 63.5mm, cooperate with the driving magnetic rod assembly of outer diameter 62mm and insert, design output voltage 250V peak value, output current 0.4A, two coil groups each after 4 times voltage rectification can obtain 2000V / 100mA output, direct current resistance of each coil group is about 50Ω, and power consumption of each coil plate is about 8W under full load work, temperature rise is about 35 DEG C when forced air cooling.
[0030] The above only is preferred implementation mode of the utility model, should point out, for ordinary skilled person in the prior art, on the premise of not departing from the technical principle of the utility model, can make several improvements and variations, these improvements and variations also should be regarded as the protection scope of the utility model.
Claims
1. A PCB coil for a boost unit of an ultra-low frequency high voltage generator, characterized in that, It includes a PCB (1), PCB coil (2), vias (3), lead pads (4), empty pads (5) and a central opening (6); the PCB (1) is a four-layer structure, each layer is equipped with a PCB coil, the inner side of the top layer coil is connected to the inner side of the middle 1 layer coil through a set of vias (3), the outer side of the top layer coil is connected to the outer side of the middle 1 layer coil through a set of lead pads (4); the inner side of the middle layer 2 coil is connected to the inner side of the bottom layer coil through another set of vias (3), the outer side of the middle layer 2 coil is connected to the outer side of the bottom layer coil through another set of lead pads (4); a large central opening (6) is provided in the middle of the PCB (1) for installing the magnetic core; empty pads (5) are also provided on the PCB (1), the PCB (1) is soldered to the base plate of the boost unit by six pads, the right side has four lead pads (4) of the two coils, and the left side has two empty pads (5) to increase mechanical strength.
2. The PCB coil of the ultra-low frequency high voltage generator boost unit as described in claim 1, characterized in that, The solder mask layer of PCB (1) is black, which is used to improve the heat dissipation capacity of the PCB coil.
3. The PCB coil of the ultra-low frequency high voltage generator boost unit as described in claim 1, characterized in that, When it is necessary to increase the number of coil turns, increase the number of coils, or reduce the coil resistance, a PCB board with more than 4 layers can be used to set up coils with more than 4 layers.