CBGA ball mounting tool

Abstract

The utility model discloses a ball grid array (BGA) ball mounting tool, in particular to a CBGA ball mounting welding carrier plate, which is characterized in that a ball mounting welding carrier plate body is provided with a CBGA chip positioning groove, a high lead ball backflow groove and a high lead ball / column positioning groove; a chip positioning groove is formed in the center of the BGA ball mounting welding carrier plate body, and the high lead ball backflow groove is formed in the position, connected with the chip positioning groove, of the CBGA ball mounting welding carrier plate body; the depth of the high shot backflow groove is consistent with that of the chip positioning groove; and a plurality of high shot / column positioning grooves are arranged in a matrix manner and are uniformly arranged below the chip positioning grooves. According to the utility model, a multi-positioning principle is used, the CBGA high shot / column and the CBGA chip are positioned through the grooves designed on the carrier plate, reflow soldering is carried out after positioning, and the high shot / column is soldered on the chip bonding pad, so that the soldering precision of the high shot / column is ensured, and the problem that the high shot / column cannot be soldered on the CBGA chip is solved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a kind of circuit board technology, in particular to a kind of CBGA ball mounting tool. BACKGROUND

[0002] CBGA is the abbreviation of Ceramic Ball Grid Array, it is a kind of integrated circuit packaging technology, it uses high-temperature ceramic material to make shell, and ball pad is laid on its bottom, these pads are arranged in grid, and are connected to printed circuit board PCB by soldering.

[0003] In the circuit board electronic assembly industry, CBGA chip has been widely applied, and the difference between CBGA chip and ordinary BGA chip is that CBGA chip uses high-lead ball / column as soldering pin, and the high-lead ball / column is welded on the CBGA chip pad by lead soldering.

[0004] When the product needs to be repaired, the removed CBGA chip needs to be re-ball / columned before it can be used for soldering again, so the old CBGA chip needs to be ball mounted before it is soldered again. Ordinary BGA chip can be directly ball mounted and heated on the BGA chip using lead or lead-free solder balls, but CBGA chip needs to be placed on the chip pad after brushing lead solder paste, and then high-lead ball / column is heated and soldered. Because the high-lead ball / column will not melt when heated, the ordinary ball mounting method will cause the high-lead ball / column to deviate after soldering, resulting in ball mounting failure. It cannot meet the ball mounting requirements of CBGA chip. In order to efficiently and high-quality complete the ball mounting operation of CBGA. SUMMARY

[0005] In order to solve the above problems, the utility model provides a kind of CBGA ball mounting soldering carrier plate, and CBGA chip and high-lead ball / column are positioned and soldered by CBGA ball mounting soldering carrier plate, to ensure that CBGA chip is successfully ball mounted once, to solve the purpose that CBGA chip is not easy to ball mount.

[0006] In order to achieve the purpose of the above technical problems, the utility model adopts the following technical scheme:

[0007] The utility model relates to a kind of ball mounting tool, specifically a kind of CBGA ball mounting soldering carrier plate, to position and solder CBGA chip and high-lead ball / column, including ball mounting soldering carrier plate body, ball mounting soldering carrier plate body is provided with CBGA chip positioning groove, high-lead ball backflow groove and high-lead ball / column positioning groove;

[0008] Among them, ball mounting soldering carrier plate body is rectangular structure, and the center of ball mounting soldering carrier plate body is provided with chip positioning groove, and the size of chip positioning groove is consistent with the length-width size of CBGA chip;

[0009] The high-lead ball backflow groove is arranged on the ball mount welding carrier plate body at a position connected with the chip positioning groove.

[0010] The high-lead ball / column positioning grooves are multiple and arranged in a matrix mode and uniformly arranged below the chip positioning groove.

[0011] Specifically, the material of the ball mount welding carrier plate body is titanium alloy.

[0012] Specifically, the depth of the chip positioning groove is 1.5 mm.

[0013] Specifically, the groove width of the high-lead ball backflow groove is 5 mm.

[0014] More specifically, the multiple high-lead ball / column positioning grooves are arranged below the chip positioning groove and correspond to the positions of the CGBA chip pads of the required ball / column.

[0015] More specifically, the high-lead ball / column positioning grooves are used for placing the high-lead ball / column and play a positioning role.

[0016] Through the above scheme, the CBGA ball mount tool provided by the utility model can place the moderate excess high-lead ball / column into the high-lead ball / column positioning groove and cover all the high-lead ball / column positioning grooves when working, and the excess high-lead ball is poured out through the high-lead ball backflow groove, and the excess high-lead column needs to be manually taken out. After the CBGA chip pad is printed with lead solder paste, the pad is placed into the chip positioning groove of the carrier plate with the pad downward, and the CBGA chip is closely attached to the high-lead ball / column, and after completion, the CBGA ball mount welding carrier plate is reflow soldered to weld the high-lead ball / column on the CBGA chip pad.

[0017] The utility model uses multiple positioning principles to position the CBGA high-lead ball / column and the CBGA chip through the grooves designed on the carrier plate, reflow solder after positioning, weld the high-lead ball / column on the chip pad, ensure the ball mount precision of the high-lead ball / column, and solve the problem that the CBGA chip cannot ball mount the high-lead ball / column. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 It is a schematic view of the CBGA ball mount tool disclosed by the utility model.

[0019] In the figure, 1-ball-welding carrier board body, 101-chip positioning groove, 102-high lead ball backflow groove, 103-high lead ball / pillar positioning groove. Detailed Implementation

[0020] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings.

[0021] This utility model provides a CBGA ball-mounting fixture, specifically a CBGA ball-mounting and welding carrier plate, such as... Figure 1 As shown, the ball-mounting and welding carrier plate body 1 has a rectangular structure and is made of titanium alloy. The ball-mounting and welding carrier plate body 1 is provided with a CBGA chip positioning groove 101, a high-lead ball backflow groove 102 and a high-lead ball / column positioning groove 103.

[0022] The ball-mounted welding carrier board 1 has a CBGA chip positioning groove 101 at its center, and the size of the CBGA chip positioning groove 101 is the same as the length and width of the CBGA chip.

[0023] The high lead ball backflow groove 102 is located on the ball-mounting and welding carrier plate 1 at a position connected to the chip positioning groove 101; the depth of the high lead ball backflow groove 102 is the same as the depth of the chip positioning groove 101.

[0024] Multiple high lead ball / pillar positioning grooves 103 are arranged in a matrix and are evenly disposed below the chip positioning groove 101. The diameter of the high lead ball / pillar positioning groove 103 is consistent with the diameter of the high lead ball / pillar to be soldered, and the depth of the high lead ball / pillar positioning groove 103 is half the height of the high lead ball / pillar.

[0025] A chip positioning groove 101 and a high-lead ball backflow groove 102 are provided on a rectangular ball-mounting substrate 1. The dimensions of the chip positioning groove 101 are consistent with the length and width dimensions of the CBGA chip. The chip positioning groove 101 and the high-lead ball backflow groove 102 are connected, and the groove depth of the chip positioning groove 101 is 1.5mm. A high-lead ball / pillar positioning groove 103 is designed inside the chip positioning groove 101. The spacing between the high-lead ball / pillar positioning groove 103 and the CBGA chip pads is consistent. The diameter of the high-lead ball / pillar positioning groove 103 is consistent with the diameter of the high-lead ball / pillar, and the depth of the high-lead ball / pillar positioning groove 103 is half the height of the high-lead ball / pillar.

[0026] The bulb planting operation is as follows:

[0027] 1. Place the high lead ball / column into the high lead ball / column positioning groove 103 through the high lead ball / column positioning groove 103 of the carrier plate, and fill all the high lead ball / column positioning grooves 103.

[0028] 2. Pour out the excess high lead balls through the high lead ball backflow groove 102.

[0029] III. After printing lead solder paste on the chip pad, the pad is placed into the chip positioning groove 101 of the CBGA ball mounting and soldering carrier board with the bottom facing up, and the CBGA chip is closely attached to the high-lead ball / column.

[0030] IV. The CBGA ball mounting and soldering carrier board is subjected to reflow soldering, so that the high-lead ball / column is soldered on the CBGA chip pad.

[0031] In summary, the present application uses multiple positioning principles, so that the CBGA high-lead ball / column and the CBGA chip are positioned through the groove designed on the carrier board, and after positioning, reflow soldering is performed to solder the high-lead ball / column on the chip pad, thereby ensuring the mounting and soldering precision of the high-lead ball / column and solving the problem that the CBGA chip cannot mount and solder the high-lead ball / column.

Claims

1. A CBGA ball mounting tool, in particular a CBGA ball mounting welding carrier plate, for positioning and welding a CBGA chip and a high-lead ball / pillar, characterized in that: The application relates to a CBGA chip ball mounting and welding carrier plate body (1) which is provided with a CBGA chip positioning groove (101), a high-lead ball backflow groove (102) and a high-lead ball / post positioning groove (103). ​ The CBGA chip positioning groove (101) is arranged at the center of the CBGA chip ball mounting and welding carrier plate body (1) and has the same size as the length and width of the CBGA chip. The high-lead ball backflow groove (102) is arranged at the position connected with the CBGA chip positioning groove (101) on the CBGA chip ball mounting and welding carrier plate body (1) and has the same depth as the CBGA chip positioning groove (101). The high-lead ball / post positioning groove (103) is arranged below the CBGA chip positioning groove (101) and has the same diameter as the high-lead ball / post.

2. The CBGA ball mounting tool according to claim 1, wherein: The depth of the CBGA chip positioning groove (101) is 1.5 mm.

3. The CBGA ball mounting tool according to claim 1, wherein: The groove width of the high-lead ball backflow groove (102) is 5 mm, and the high-lead ball backflow groove (102) is used for backflow of the excess high-lead ball during ball mounting.

4. The CBGA ball mounting tool according to claim 1, wherein: The high-lead ball / post positioning groove (103) is arranged below the CBGA chip positioning groove (101) and is arranged according to the pad position of the required ball mounting chip.

5. The CBGA ball mounting tool according to claim 1, wherein: The high-lead ball / post positioning groove (103) is used for placing the high-lead ball / post and plays a positioning role.

6. The CBGA ball mounting tool according to claim 1, wherein: The material of the CBGA chip ball mounting and welding carrier plate body (1) is titanium alloy.

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