Wafer box operating platform and wafer loading system

Abstract

The utility model discloses a wafer box operating platform and a wafer loading system, comprising a wafer transmission box, the bottom of which is provided with a clamping groove, and the wafer transmission box is provided with a clamping block on the inner wall of the notch close to the clamping groove; the substrate is provided with a sliding plate used for placing the wafer conveying box, the sliding plate is provided with an opening, the substrate is provided with a driving part, and the driving part is used for driving the sliding plate to move in the length direction of the substrate; the fixing assembly comprises a moving part and a fixing part, the moving part is installed on the base plate, the fixing part is installed on the moving part, and the moving part is used for driving the fixing part to move in the length direction of the opening. Through the design of the fixing assembly, the wafer conveying box fixing device can adapt to wafer conveying boxes of various sizes, and meanwhile the fixing effect on the wafer conveying boxes is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor equipment especially relates to a wafer box operation platform and wafer loading system. BACKGROUND

[0002] In the semiconductor production process, the wafer needs to be frequently converted between clean and super-clean environment, and in the conversion process, in order to ensure that the wafer is not attached to the particle, the wafer loading device is used as the input and output of the environment conversion, which can be said that the wafer loading device is the external equipment of the wafer, which is installed in front of the front end module and used as the window of the wafer into and out of the wafer transmission equipment, realizing the wafer carrying between the track of the production workshop and the processing equipment. The loading port is the medium between the front end module and the internal wharf, and the operation of the automatic material handling system in the semiconductor factory is to assist the wafer to shuttle between different operation areas according to its processing path, and after the wafer operation is completed in a certain operation area, the wafer is transmitted to the internal wharf handling system through the loading port in front of the front end module, and then the transmission destination is determined according to the next operation area. If the destination is in different operation area, the wafer box is stored in the storage, then transmitted to the storage of the destination through the intermediate wharf system, and finally the internal wharf system of the destination transmits the wafer box to the loading port of the front end module of the semiconductor equipment, so that the wafer can smoothly enter the process cavity for processing.

[0003] The wafer loading port is used for loading, and the front opening wafer transfer box is a front opening wafer transfer box. The specific working steps of the wafer box loading and unloading of the loading port are as follows: the automatic handling system or manual handling wafer box to the loading platform, the clamping mechanism on the loading platform locks the wafer box, the box opening device adsorbs or clamps the wafer box door, the wafer box door is separated from the wafer box, the detection mechanism moves along the vertical direction and scans and detects the wafer in the box, the wafer is handled by the transport manipulator, the wafer in the box is handled, the box opening device merges the wafer box door and the wafer box, the clamping mechanism unlocks the wafer box, and the automatic handling system or manual handling wafer box.

[0004] However, in the prior art, the wafer loading system has small compatible range for different sizes of wafer boxes, and the fixing effect is not good.

[0005] Therefore, it is necessary to provide a wafer box operation platform and wafer loading system to solve the above problems existing in the prior art. UTILITY MODEL CONTENTS

[0006] The utility model aims at providing a wafer box operation platform and wafer loading system, which is suitable for fixing wafer transfer boxes of various sizes.

[0007] In order to achieve the above purpose, the technical scheme of the utility model is as follows:

[0008] A wafer box operation platform loads a wafer transfer box, the wafer transfer box is provided with a clamping groove in the bottom, a clamping block is arranged on the inner wall of the slot near the clamping groove, and the wafer operation platform comprises:

[0009] A base plate is provided with a sliding plate, the sliding plate is provided with an opening, the base plate is provided with a driving member, and the driving member is used for driving the sliding plate to move along the length direction of the base plate.

[0010] A fixing assembly comprises a moving part and a fixing part, the moving part is installed on the base plate, the fixing part is installed on the moving part, the moving part is used for driving the fixing part to move along the length direction of the opening, and the fixing part comprises a fixing end.

[0011] The clamping block has a buffer inclined surface, the fixing end is provided with a buffer slope surface, the wafer transfer box is placed on the sliding plate, the clamping groove corresponds to the position of the opening, when the fixing part drives the fixing end to move along the thickness direction of the base plate to the fixing end and the clamping block are partially or completely overlapped in the vertical direction, the buffer slope surface is in abutting fit with the buffer inclined surface.

[0012] The utility model discloses a wafer box operation platform, which has the following beneficial effects: the driving member is used for driving the relative movement between the sliding plate and the base plate, thereby driving the wafer transfer box on the sliding plate to move. When it is necessary to fix wafer transfer boxes of different sizes, first, the moving part drives the fixing part to move in the direction close to the opening to correspond to the position of the clamping groove, then the fixing part drives the fixing end to rise in the thickness direction of the base plate into the clamping groove, then the moving part drives the fixing part to move in the length direction of the opening to gradually approach the clamping block, when the fixing end and the clamping block are partially or completely overlapped in the vertical direction, the fixing part is controlled to retract, thereby pressing the fixing end in the clamping block, and the wafer transfer box is locked. Due to the design of the long strip-shaped opening and the moving part and the fixing part, the stroke range of the fixing part is expanded, thereby being suitable for wafer transfer boxes of various sizes, and the fixing effect of the wafer transfer box is improved. In addition, the buffer slope surface and the buffer inclined surface are matched, which can buffer during the movement and compaction of the fixing end in the clamping block, and rigid impact is avoided.

[0013] Further, the moving part comprises a first air cylinder, the fixing part comprises a second air cylinder and a fixing plate, the telescopic end of the first air cylinder is fixedly connected with the second air cylinder, the fixing end is located on the fixing plate, the fixing plate is installed on the telescopic end of the second air cylinder, and the fixing plate can be clamped between the clamping block and the bottom wall of the clamping groove.

[0014] Further, two slide rails are arranged in parallel along the two sides of the slide plate, and a sliding block is slidably connected to each of the slide rails, and the sliding block is fixedly connected to the base plate on the side away from the slide rail.

[0015] Further, the driving member comprises a servo motor, a coupling, a fixed seat, a screw rod, a nut seat, and a support seat, the fixed seat and the support seat are fixedly connected to the base plate, the nut seat is fixedly connected to the slide plate, the driving end of the servo motor is synchronously connected to the screw rod through the coupling, the nut seat is threadedly connected to the screw rod, and the optical axes of the two ends of the screw rod are rotatably connected to the support seat and the fixed seat, respectively.

[0016] Further, the device further comprises a baffle and at least two pairs of sensors, the pairs of sensors have detection grooves, the pairs of sensors have emitting ends and receiving ends located on the two sides of the detection grooves, the baffle is arranged on the fixed seat, and the baffle can move between the at least two pairs of sensors along with the movement of the nut seat.

[0017] Further, the baffle comprises:

[0018] a first plate, which is mounted on the fixed seat;

[0019] a turning plate, which is fixedly connected to the first plate and arranged perpendicularly to each other, and a shielding part is arranged on the side of the turning plate close to the pairs of sensors, and the shielding part is used for shielding the light signals emitted by the emitting ends to the receiving ends.

[0020] Further, the driving member can drive the slide plate to move to a first position and a second position, and the device further comprises an anti-collision member, the anti-collision member is arranged on the first position and the second position, respectively, and the anti-collision member is used for slowing down the impact.

[0021] Further, the anti-collision member comprises a limiting seat, an anti-collision bolt, and an anti-collision block, the limiting seat is mounted on the slide plate, the anti-collision bolt is threadedly connected to the limiting seat, and the anti-collision block is arranged on the side of the anti-collision bolt.

[0022] Further, the device further comprises a positioning column, a sensing column, and a recessed photoelectric sensor, the positioning column is arranged on the slide plate, the bottom of the wafer transfer box is provided with a positioning hole, the positioning column is insertedly matched with the positioning hole, the slide plate is provided with a sensing hole, the sensing column is movably connected in the sensing hole, the recessed photoelectric sensor is arranged in the sensing hole, and when the sensing column moves to the direction close to the hole opening, the sensing column can block the signal of the recessed photoelectric sensor.

[0023] A wafer loading system comprises a wafer cassette handler as described above, and further comprises a main body and a frame, the frame having a transfer port for wafer transfer cassettes to pass through, the frame being mounted on the main body, and the wafer cassette handler being arranged on the main body. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 A structure sectional view of a wafer transfer cassette of an embodiment of the present application;

[0025] Figure 2 A schematic view of a wafer loading system of an embodiment of the present application

[0026] Figure 3 A schematic view of a transfer port of an embodiment of the present application;

[0027] Figure 4 A schematic view of a slide plate in a first position of an embodiment of the present application;

[0028] Figure 5 A schematic view of a fixing plate of an embodiment of the present application;

[0029] Figure 6 A structure top view of a handler of an embodiment of the present application;

[0030] Figure 7 A schematic view of a slide plate in a second position of an embodiment of the present application;

[0031] Figure 8 A top view of a base of an embodiment of the present application;

[0032] Figure 9 A schematic view of a bump stop of an embodiment of the present application;

[0033] Figure 10 A schematic view of a baffle of an embodiment of the present application;

[0034] Figure 11 A working schematic view of a light-receiving groove type photoelectric sensor.

[0035] Mark: 1, wafer transfer box; 11, card slot; 12, card block; 121, buffer slope; 2, base plate; 21, base; 211, side plate; 3, sliding plate; 31, opening; 32, positioning column; 33, induction column; 34, sliding rail; 35, sliding block; 4, fixing assembly; 41, moving part; 42, fixed part; 421, fixed plate; 422, buffer slope; 5, driving piece; 51, servo motor; 52, shaft coupling; 53, fixed seat; 54, screw rod; 55, nut seat; 56, support seat; 6, baffle; 61, first plate; 62, turning plate; 63, shielding part; 64, first position; 65, second position; 7, anti-collision bolt; 71, limiting seat; 72, anti-collision block; 8, main body; 9, frame; 91, conveying port; 92, movable door; 93, through-beam sensor; 931, transmitting end; 932, receiving end; 94, through-beam slot photoelectric sensor. DETAILED DESCRIPTION

[0036] In order to make the purpose, technical scheme and advantages of the embodiments of the present application more clear, the technical scheme in the embodiments of the present application will be clearly and completely described below. Obviously, the described embodiments are some embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application. Unless otherwise defined, the technical terms or scientific terms used herein should be understood as the usual meanings understood by those skilled in the art to which the present application belongs. The words such as "comprise" and the like used herein mean that the elements or objects before the words cover the elements or objects listed after the words and their equivalents, without excluding other elements or objects.

[0037] The accompanying drawings will be described below in conjunction with the Figure 1 - the accompanying drawings Figure 11 The specific embodiments of the present application will be further described in detail.

[0038] In a first aspect, the present application provides a wafer box operation table, comprising a wafer transfer box 1, a base plate 2 and a fixing assembly 4. Referring to Figure 1 The wafer transfer box 1 is a front opening wafer transfer box 1, and a card slot 11 is formed in the bottom thereof. The wafer transfer box 1 is provided with a wafer box door which can be detachably connected. The wafer transfer box 1 is provided with a card block 12 on the inner wall of the slot opening close to the card slot 11. The card block 12 and the inner wall of the wafer transfer box 1 form a first slot position and a second slot position which are sequentially communicated and distributed in the up-down direction, and the first slot position and the second slot position form the card slot 11. The first slot position and the second slot position gradually decrease in size in the direction close to the card block 12.

[0039] Referring to Figures 4-8The bottom of the substrate 2 is provided with a base 21, the substrate 2 is placed on the base 21, and the base 21 is composed of a side plate 211. The substrate 2 is provided with a sliding plate 3 for placing a wafer transfer box 1, the sliding plate 3 is provided with an opening 31, the substrate 2 is provided with a driving piece 5, and the driving piece 5 is used to drive the sliding plate 3 to move back and forth along the length direction of the substrate 2. Specifically, in some embodiments of the utility model, two slide rails 34 are arranged in parallel on both sides of the sliding plate 3, a sliding block 35 is slidably connected to each slide rail 34, and the side, away from the slide rail 34, of the sliding block 35 is fixedly connected with the substrate 2. The driving piece 5 can drive the sliding plate 3 to move back and forth along the length direction of the slide rail 34, thereby driving the relative movement between the sliding plate 3 and the substrate 2, and further driving the wafer transfer box 1 on the sliding plate 3 to move. Specifically, the sliding plate 3 is moved to a first position 64 and a second position 65. When the sliding plate 3 is at the first position 64, the wafer transfer box 1 is connected with the wafer box door, and the two are not separated. When the sliding plate 3 is at the second position 65, the wafer transfer box 1 is separated from the wafer box door by driving the door opening piece.

[0040] The fixing assembly 4 comprises a moving part 41 and a fixed part 42, the moving part 41 is installed on the substrate 2, the fixed part 42 is installed on the moving part 41, the moving part 41 is used to drive the fixed part 42 to move back and forth along the length direction of the opening 31, and the fixed part 42 comprises a fixed end and is used to drive the fixed end to move in the thickness direction of the substrate 2, that is, to move up and down, until the fixed end is coincident with the vertical projection part of the clamping block 12 or completely coincident. When it is necessary to fix wafer transfer boxes 1 of different sizes, first, the fixed part 42 is driven by the moving part 41 to move to the position corresponding to the clamping groove 11 in the direction close to the opening 31, then the fixed end is controlled to rise in the thickness direction of the substrate 2 into the clamping groove 11, then the moving part 41 is controlled to drive the fixed part 42 to move along the length direction of the opening 31 to gradually approach the clamping block 12, when the fixed end is coincident with the vertical projection part of the clamping block 12 or completely coincident, the fixed part 42 is controlled to retract, thereby pressing the fixed end in the clamping block 12, and the wafer transfer box 1 is locked. Due to the design of the long strip-shaped opening 31 and the moving part 41 and the fixed part 42, the stroke range of the fixed part 42 is expanded, thereby being suitable for wafer transfer boxes 1 of various sizes, and the fixing effect of the wafer transfer box 1 is improved, and the position is prevented from deviating during movement.

[0041] Referring to Figure 5In some other embodiments of the utility model, the buffer slope 121 is arranged between the first slot and the second slot of the clamping block 12. The fixed end is provided with a buffer slope 422. When the fixed part 42 drives the fixed end to move along the thickness direction of the base plate 2 to the fixed end and the vertical projection part of the clamping block 12 are coincident or completely coincident, the buffer slope 422 is abutted with the buffer slope 121. The buffer slope 422 and the buffer slope 121 are matched, which can buffer during the movement of the fixed end and compaction of the clamping block 12, and rigid impact is avoided.

[0042] With reference to Figure 9 In some other embodiments of the utility model, the moving part 41 comprises a first air cylinder, the fixed part 42 comprises a second air cylinder and a fixed plate 421, the telescopic end of the first air cylinder is fixedly connected with the second air cylinder, the fixed end is located on the fixed plate 421, the fixed plate 421 is installed on the telescopic end of the second air cylinder, and the fixed plate 421 can be clamped between the clamping block 12 and the bottom wall of the clamping groove 11. The moving directions of the first air cylinder and the second air cylinder are perpendicular to each other.

[0043] With reference to Figure 4 In some other embodiments of the utility model, the positioning column 32, the sensing column 33 and the groove type photoelectric sensor are further included, and the positioning column 32 is fixedly connected on the sliding plate 3. In the embodiment, the positioning column 32 is three, and the three positioning columns 32 are arranged in an isosceles triangle. The bottom of the wafer conveying box 1 is provided with a positioning hole, the positioning column 32 is inserted and matched with the positioning hole, the sensing hole is arranged on the sliding plate 3, the sensing column 33 is movably connected in the sensing hole, the groove type photoelectric sensor is arranged in the sensing hole, and when the sensing column 33 moves to the direction of the hole opening, the sensing column 33 can block the signal of the groove type photoelectric sensor. The number of the sensing column 33 is same with that of the positioning column 32, and specifically, the elastic element such as spring or elastic band is connected between the sensing column 33 and the inner wall of the sensing hole. When the wafer conveying box 1 is not placed on the sliding plate 3 or the positioning column 32 is completely matched with the positioning hole, at this time, the sensing column 33 partially extends out of the sensing hole due to the action of the elastic element. When the wafer conveying box 1 is placed in place, the three sensing columns 33 detect that the wafer conveying box 1 is placed in place, the sensing column 33 is used in cooperation with the groove type photoelectric sensor, the sensing column 33 moves downward to the groove type photoelectric sensor to block the signal, the signal disappears, and it is proved that the wafer conveying box 1 is in place.

[0044] When it is needed to fix the wafer transport box 1 of different sizes, first, the wafer transport box 1 is placed on the slide plate 3, the initial position, the first air cylinder and the second air cylinder are in the retracted state, the slide plate 3 is located at the first position 64, and is positioned by the three positioning columns 32, and then the three sensing columns 33 are triggered to detect that the wafer transport box 1 is placed in position, the sensing column 33 is matched with the groove type photoelectric sensor to prove that the wafer transport box 1 is in position. After proving that it is in position, the driving end of the first air cylinder extends the driving fixed part 42 to translate forward, and then the second air cylinder is controlled to drive the fixed plate 421 to rise to correspond to the position of the clamping groove 11. Then, the driving end of the first air cylinder is controlled to retract the driving fixed part 42 to translate backward, that is, to move along the length direction of the opening 31, and when the fixed plate 421 and the clamping groove 11 are partially or completely overlapped in the vertical direction, the driving end of the second air cylinder is controlled to retract, so that the fixed plate 421 is pressed in the clamping groove 11 of the wafer transport box 1, and the wafer transport box 1 is locked.

[0045] With reference to Figure 6 In some other embodiments of the utility model, the driving part 5 includes servo motor 51, shaft coupling 52, fixed seat 53, screw rod 54, nut seat 55, support seat 56. Fixed seat 53 and support seat 56 are fixedly connected with base plate 2, and nut seat 55 is fixedly connected with slide plate 3. The driving end of servo motor 51 is synchronously connected with screw rod 54 through shaft coupling 52, nut seat 55 is threadedly connected with screw rod 54, and the optical axis parts at both ends of screw rod 54 are rotatably connected with support seat 56 and fixed seat 53 respectively. When working: the driving end of servo motor 51 drives screw rod 54 to rotate through shaft coupling 52, and nut seat 55 moves back and forth along the length direction of screw rod 54 under the action of threadedly connecting with screw rod 54. Nut seat 55 moves to drive slide plate 3 connected therewith to move.

[0046] With reference to Figures 9-11 In some other embodiments of the utility model, it further includes baffle 6 and at least two pairs of sensors 93, the pairs of sensors 93 have detection groove, the pairs of sensors 93 have emitting end 931 and receiving end 932 located at both sides of the detection groove, and the baffle 6 is arranged on the fixed seat 53. The baffle 6 can move between the at least two pairs of sensors 93 along with the movement of nut seat 55. The baffle 6 includes first plate 61 and turning plate 62, and the first plate 61 is installed on the fixed seat 53. The turning plate 62 is fixedly connected with the first plate 61 and is arranged perpendicularly, and the side close to the pairs of sensors 93 of the turning plate 62 is provided with shielding part 63, and the shielding part 63 is used for shielding the light signal emitted by the emitting end 931 to the receiving end 932.

[0047] Further, an anti-collision member is further included, which is arranged on the first position 64 and the second position 65 respectively, and is used for slowing down the impact and preventing rigid collision to cause damage to parts. The anti-collision member includes a limiting seat 71, an anti-collision bolt 7 and an anti-collision block 72, the limiting seat 71 is installed on the slide plate 3, the anti-collision bolt 7 is threadedly connected with the limiting seat 71, and the anti-collision block 72 is arranged on one side of the anti-collision bolt 7.

[0048] In a second aspect, referring to Figures 2-3 The utility model provides still a wafer loading system, including a wafer box operation platform above, still include main part 8 and frame 9, frame 9 has the transmission port 91 that wafer transmission box 1 in can pass through wafer, frame 9 is installed on main part 8, a wafer box operation platform is set up on main part 8, pedestal 21 is installed on main part 8.

[0049] In summary, the utility model through flexible adjustable fixed assembly 4 and accurate drive system, effectively solved the problem that the existing operation platform cannot adapt to the fixation of wafer transmission box 1 of different sizes, improved the versatility of equipment. Its design realizes the accurate fixation of wafer transmission box 1 of different sizes through the synergistic effect of moving part 41 and fixed part 42, avoids deviation and improves operation efficiency. At the same time, the automatic positioning and sensing detection function reduces manual intervention, ensures the correct placement of wafer transmission box 1, and the anti-collision design further protects the equipment from damage.

[0050] Although the embodiments of the utility model are described in detail above, it is obvious for those skilled in the art that various modifications and changes can be made to these embodiments. However, it should be understood that such modifications and changes all belong to the scope and spirit of the utility model described in the claims. Moreover, the utility model described herein can have other embodiments, and can be implemented or realized in various ways.

Claims

1. A wafer box operation platform, which is used for loading a wafer transfer box (1), the bottom of the wafer transfer box (1) is provided with a clamping groove (11), and a clamping block (12) is arranged on the inner wall of the slot opening close to the clamping groove (11), characterized in that, The wafer operation platform comprises: A substrate (2) is provided with a sliding plate (3) on which an opening (31) is formed, and a driving member (5) is arranged on the substrate (2) and used to drive the sliding plate (3) to move along the length direction of the substrate (2); A fixing assembly (4) comprises a moving part (41) and a fixing part (42), the moving part (41) is mounted on the substrate (2), the fixing part (42) is mounted on the moving part (41), the moving part (41) is used to drive the fixing part (42) to move along the length direction of the opening (31), and the fixing part (42) comprises a fixing end; The fixing end is provided with a buffer slope (422), the wafer transfer box (1) is placed on the sliding plate (3), the clamping groove (11) corresponds to the position of the opening (31), when the fixing part (42) drives the fixing end to move along the thickness direction of the substrate (2) to the position where the fixing end is coincident or completely coincident with the vertical projection part of the clamping block (12), the buffer slope (422) is in abutting connection with the buffer slope (121).

2. The FOUP handler of claim 1, wherein, The moving part (41) comprises a first air cylinder, the fixing part (42) comprises a second air cylinder and a fixing plate (421), the extension end of the first air cylinder is fixedly connected with the second air cylinder, the fixing end is located on the fixing plate (421), the fixing plate (421) is mounted on the extension end of the second air cylinder, and the fixing plate (421) can be clamped between the clamping block (12) and the bottom wall of the clamping groove (11).

3. The FOUP handler of claim 1, wherein, Two slide rails (34) are arranged in parallel along the two sides of the sliding plate (3), a sliding block (35) is slidably connected to each slide rail (34), and one side of the sliding block (35) away from the slide rail (34) is fixedly connected with the substrate (2).

4. The FOUP handler of claim 1, wherein, The driving member (5) comprises a servo motor (51), a coupling (52), a fixing seat (53), a lead screw (54), a nut seat (55), and a support seat (56), the fixing seat (53) and the support seat (56) are fixedly connected with the substrate (2), the nut seat (55) is fixedly connected with the sliding plate (3), the driving end of the servo motor (51) is synchronously connected with the lead screw (54) through the coupling (52), the nut seat (55) is threadedly connected with the lead screw (54), and the optical axes of the two ends of the lead screw (54) are rotationally connected with the support seat (56) and the fixing seat (53) respectively.

5. A FOUP handler as claimed in claim 4, wherein, The blocking piece (6) and at least two pairs of photoelectric sensors (93) are further included, the pairs of photoelectric sensors (93) have detection grooves, the pairs of photoelectric sensors (93) have emitting ends (931) and receiving ends (932) located on the two sides of the detection grooves, the blocking piece (6) is arranged on the fixing seat (53), and the blocking piece (6) can move between the at least two pairs of photoelectric sensors (93) along with the movement of the nut seat (55).

6. A FOUP handler as recited in claim 5, wherein, The baffle (6) comprises: A first plate (61) is mounted on the fixed seat (53); A turning plate (62) is fixedly connected with the first plate (61) and arranged perpendicularly to each other, and a shielding part (63) is arranged on the side of the turning plate (62) close to the opposite sensor (93), and the shielding part (63) is used for shielding the light signal emitted by the emitting end (931) to the receiving end (932).

7. The FOUP handler of claim 1, wherein, The driving member (5) can drive the sliding plate (3) to move to a first position (64) and a second position (65), and further comprises an anti-collision member arranged on the first position (64) and the second position (65) respectively, and the anti-collision member is used for slowing down the impact.

8. The FOUP handler of claim 7, wherein, The anti-collision member comprises a limiting seat (71), an anti-collision bolt (7) and an anti-collision block (72), the limiting seat (71) is mounted on the sliding plate (3), the anti-collision bolt (7) is threadedly connected with the limiting seat (71), and the anti-collision block (72) is arranged on one side of the anti-collision bolt (7).

9. The FOUP handler of claim 1, wherein, Further comprising a positioning column (32), an induction column (33) and a groove type photoelectric sensor, the positioning column (32) is arranged on the sliding plate (3), the bottom of the wafer transfer box (1) is provided with a positioning hole, the positioning column (32) is inserted and matched with the positioning hole, the sliding plate (3) is provided with an induction hole, the induction column (33) is movably connected in the induction hole, the groove type photoelectric sensor is arranged in the induction hole, and when the induction column (33) moves to the direction close to the hole, the induction column (33) can block the signal of the groove type photoelectric sensor.

10. A wafer loading system comprising a FOUP handling station according to any one of claims 1 to 9, characterized in that, Comprise a main body (8) and a frame (9), the frame (9) has a transmission port (91) for the wafer in the wafer transfer box (1) to pass through, the frame (9) is mounted on the main body (8), and the wafer box operation platform is arranged on the main body (8).

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