Adjusting mechanism of wafer air floating rotary table and wafer processing equipment
By using a reducer and indexing marks on the wafer air-floating turntable, the adjustment stroke of the connecting rod is amplified. Combined with manual or motor drive, the problem of insufficient adjustment accuracy in the prior art is solved, achieving high-precision wafer processing and reducing production costs.
Patent Information
- Application Number
- CN202423216086.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-25
- Publication Date
- 2025-12-16
- Estimated Expiration
- 2034-12-25
AI Technical Summary
The existing adjustment mechanism of the wafer air-bearing turntable is difficult to achieve micron-level precision adjustment, resulting in wafer flatness not meeting the requirements. Furthermore, designing threads with smaller pitch or adding precision micro-adjustment components will increase production costs.
The adjustment stroke of the connecting rod is amplified by a reducer, and precise adjustment is achieved through indexing marks and reference marks. Combined with manual or motor drive components, the debugging process is simplified, and the difficulty of equipment development and debugging is reduced.
It achieves high-precision adjustment of the angle between the wafer axis and the grinding wheel axis, reducing equipment costs and debugging complexity, and improving the intuitiveness and accuracy of adjustment.
Smart Images
Figure CN223680085U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of semiconductor processing, especially to a wafer air float turntable's adjusting mechanism and wafer processing equipment. BACKGROUND
[0002] When the wafer is thinned, it is fixed on a ceramic chuck by vacuum adsorption, and the ceramic chuck is fixed on an air float turntable with controllable rotating speed. The air float turntable has three supporting points, one of which is a height-determined supporting point, and the other two are floating supporting points that can be adjusted up and down. By adjusting the height of the two floating supporting points, the angle between the wafer and the grinding wheel axis can be indirectly adjusted.
[0003] The adjusting mechanism in the prior art usually drives the air float turntable to move up and down by using a screw thread. By operating the adjusting bolt, the number of turns of the screw thread can be precisely controlled, thereby precisely controlling the height of the air float turntable.
[0004] However, because the air float turntable needs to be adjusted by a small amount, which is in the micron level, it is difficult to control the adjustment amount even if a fine thread is used for the adjusting screw thread. The adjustment accuracy cannot be guaranteed, resulting in a wafer flatness that does not meet the requirements. It is also difficult to ensure that a small amount of adjustment and high accuracy can be achieved. Moreover, if a screw thread with a smaller pitch is processed, it is more difficult to process, and the smaller the pitch, the smaller the force that the screw thread can withstand. If the screw thread still cannot meet the requirements, a more precise micro-adjustment component needs to be designed to cooperate with the adjustment, which will increase the production cost. SUMMARY
[0005] The utility model aims at providing a wafer air float turntable's adjusting mechanism and wafer processing equipment, which uses a speed reducer to amplify the adjustment stroke. Without the need to design a more precise micro-adjustment component or use a screw thread with a smaller pitch, a high-precision adjustment amount can be achieved.
[0006] To achieve this purpose, the utility model adopts the following technical solutions:
[0007] A wafer air float turntable's adjusting mechanism, comprising: a speed reducer fixedly connected to an external structure; an adjusting shaft connected to the input end of the speed reducer; a connecting rod having one end connected to the output end of the speed reducer and the other end used for connecting to the air float turntable; a housing fixedly connected to the speed reducer and located at the input end of the speed reducer, the adjusting shaft being installed in the housing with one end extending out of the housing; a plurality of index marks being provided on the end face of the housing away from the speed reducer, the index marks being evenly distributed circumferentially along the housing; and a reference mark being provided on the adjusting shaft and pointing to the index marks, thereby displaying the adjustment stroke.
[0008] As preferred, a driving assembly is further included, which is capable of driving the adjusting shaft to rotate so as to move the connecting rod.
[0009] As preferred, the driving assembly is mounted at one end of the adjusting shaft extending out of the shell and is capable of rotating together with the adjusting shaft; wherein manually operating the driving assembly is capable of driving the adjusting shaft to rotate so as to drive the connecting rod to move relative to the air floating turntable.
[0010] As preferred, the driving assembly comprises a driving block in a strip shape, a through hole is arranged in the middle of the driving block and is capable of being sleeved on the adjusting shaft, one end of the driving block is provided with a gap which is opened to the through hole along the length direction of the driving block; a locking member is arranged on the side of the driving block and is located at one end of the driving block provided with the gap, and is capable of locking the driving block to the adjusting shaft.
[0011] As preferred, a locking member is further arranged on the driving assembly and is capable of locking the driving assembly to the shell.
[0012] As preferred, an anti-falling member is further arranged on the adjusting shaft, which prevents the driving block from falling and positions the driving block.
[0013] As preferred, the driving assembly comprises a motor, the motor is mounted at one end of the adjusting shaft extending out of the shell and is in transmission connection with the adjusting shaft; wherein the motor is capable of driving the adjusting shaft to rotate so as to drive the connecting rod to move relative to the air floating turntable.
[0014] As preferred, a bearing is arranged in the shell, the bearing is sleeved on the adjusting shaft so as to enable the adjusting shaft to rotate around its own axis.
[0015] As preferred, at least two bearings are arranged in the shell and are arranged in interval along the axial direction of the adjusting shaft.
[0016] Another purpose of the utility model is to provide a wafer processing equipment, which can reduce the difficulty of developing and debugging the driving program.
[0017] A wafer processing equipment comprises a suction disc and an air floating turntable for bearing the suction disc, the suction disc is fixedly connected with the air floating turntable, at least three supporting points are arranged on the air floating turntable, and at least two supporting points use the adjusting mechanism of the wafer air floating turntable.
[0018] The utility model has the advantages of:
[0019] The adjusting mechanism of the wafer air floating turntable provided by the utility model comprises a speed reducer, an adjusting shaft, a connecting rod and a shell. The speed reducer is fixedly connected with an external structure, the adjusting shaft is connected with an input end of the speed reducer, one end of the connecting rod is connected with an output end of the speed reducer, and the other end is used for being connected with the air floating turntable. The shell is fixedly connected with the speed reducer and located at the input end of the speed reducer, the adjusting shaft is installed on the shell, one end of the adjusting shaft extends out of the shell, a plurality of index marks are arranged on an end face of the shell away from the speed reducer, and the plurality of index marks are evenly distributed along the circumference of the shell. A reference mark is arranged on the adjusting shaft and points to the index mark, so that the adjusting stroke is displayed. Taking the threaded connection between the connecting rod and the air floating turntable as an example, the utility model amplifies the adjusting stroke of the connecting rod through the speed reducer, so that the thread pitch on the connecting rod does not have to be too small, the structural strength is enhanced, the adjusting stroke unit can be conveniently identified through the index mark and the reference mark, the adjustment is convenient and intuitive, and the accuracy of adjustment is ensured.
[0020] The wafer processing equipment provided by the utility model comprises a suction disc and an air floating turntable for bearing the suction disc, the suction disc is fixedly connected with the air floating turntable, at least three supporting points are arranged on the air floating turntable, and at least two supporting points use the adjusting mechanism of the wafer air floating turntable. Taking the threaded connection between the connecting rod and the air floating turntable as an example, so that the equipment of the utility model reduces the number of times of repeatedly matching and testing the connecting rod stroke when adjusting the angle of the air floating turntable during use, simplifies the driving debugging and driving mode, and thus the difficulty of equipment development and debugging is reduced. BRIEF DESCRIPTION OF DRAWINGS
[0021] Figure 1 is the three-dimensional structure schematic diagram of the adjusting mechanism of the wafer air floating turntable in the utility model embodiment;
[0022] Figure 2 is the local section schematic diagram of the adjusting mechanism of the wafer air floating turntable in the utility model embodiment.
[0023] In the drawings:
[0024] 1, speed reducer; 2, adjusting shaft; 3, connecting rod; 41, driving block; 42, locking piece; 5, shell; 61, bearing; 62, check ring; 7, locking piece; 8, anti-dropping piece. DETAILED DESCRIPTION
[0025] The utility model will be further described in detail in combination with the drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the utility model and are not limited to the utility model. In addition, it should be noted that, in order to facilitate the description, only the parts related to the utility model are shown in the drawings rather than all the structures.
[0026] In the description of the utility model, unless another definite provision and limitation, the term "connect", "connection", "fixed" should be broad sense understanding, for example, can be fixed connection, also can be detachable connection, or be integrated;Can be mechanical connection, also can be electrical connection;Can be directly connected, also can be indirectly connected through the intermediate medium, can be two elements inside the communication or two element interaction relationship.For the ordinary skill in the art, the specific meaning of the above-mentioned terms in the utility model can be understood according to the specific circumstances.
[0027] In the utility model, unless another definite provision and limitation, the first feature is "on" or "under" the second feature can include the first and second features direct contact, also can include the first and second features are not direct contact but contact through the additional features between them.Moreover, the first feature is "on", "above" and "on" the second feature includes the first feature is directly above and obliquely above the second feature, or just indicates that the first feature is higher than the second feature in horizontal height.The first feature is "under", "below" and "under" the second feature includes the first feature is directly below and obliquely below the second feature, or just indicates that the first feature is less than the second feature in horizontal height.
[0028] In the description of the embodiment, the terms "on", "under", "right", etc. Orientation or positional relationship is based on the orientation or positional relationship shown in the drawing, only for the convenience of description and simplification operation, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore cannot be understood as a limitation on the utility model.In addition, the terms "first", "second" are only used to distinguish in the description, and have no special meaning.
[0029] The utility model discloses a wafer processing equipment, and the equipment can be wafer thinning equipment, and the equipment includes chuck and air bearing turntable, and the chuck can be ceramic chuck, and is used for carrying wafer, and the middle of chuck is porous ceramic, and through vacuum, wafer is adsorbed and fixed on ceramic chuck, and the chuck is fixedly connected with air bearing turntable, and the air bearing turntable is used for carrying chuck and drives wafer to rotate in the process of thinning grinding (grinds wafer surface by utilizing grinding wheel to thin wafer thickness).The air bearing turntable in the wafer processing equipment of the utility model is provided with at least three support points, and at least two support points use the adjusting mechanism of a wafer air bearing turntable.In some embodiments, the air bearing turntable support point is provided with three, and at least two use the adjusting mechanism of wafer air bearing turntable as support.
[0030] Because the grinding surface type of wafer, total thickness deviation and the included angle between grinding wheel axis and wafer axis exist quantitative relationship, so by fine tuning the two-axis included angle of grinding wheel axis and wafer axis, the required surface type can be obtained after grinding, and the total thickness deviation of wafer is adjusted to the required range.
[0031] The utility model discloses a wafer air float turntable's adjusting mechanism, including speed reducer 1, adjusting shaft 2, connecting rod 3 and casing 5, speed reducer 1 is fixedly connected with external structure, adjusting shaft 2 is connected with the input of speed reducer 1, one end of connecting rod 3 is connected with the output of speed reducer 1, and the other end is connected with air float turntable. Casing 5 is fixedly connected with speed reducer 1 and is located the input of speed reducer 1, adjusting shaft 2 is installed in casing 5, and one end is out of casing 5, and the other end of adjusting shaft 2 is connected with the input of speed reducer 1. It can be understood that by setting casing 5, not only provides the installation structure foundation of wafer air float turntable's adjusting mechanism, in addition can protect the structure arranged in the inside of casing 5, prolongs the service life. Among them, connecting rod 3 can be directly connected with air float turntable through screw thread, also can be connected through other structures between connecting rod 3 and air float turntable, for example, leveling assembly etc., to realize more accurate adjustment stroke control, and the specific structure of leveling assembly can refer to prior art, and it is not repeated here.
[0032] In some embodiments, the end surface of the casing 5 away from the speed reducer 1 is also provided with a plurality of index marks, the plurality of index marks are evenly distributed along the circumference of the casing 5, and the number of index marks is set according to the speed reduction ratio of the speed reducer 1 and the adjustment stroke requirement. The reference mark is provided on the adjusting shaft 2 and can point to the index mark to display the adjustment stroke. For example, the index mark is set as an index hole, and 20 index holes are evenly distributed around the casing 5 according to the calculation result of the speed reduction ratio. The reference mark is set as a pointer, and the quantitative and accurate adjustment can be realized according to the number of index holes through which the pointer on the adjusting shaft 2 turns during adjustment. Of course, the reference mark can also be set as a groove or a line, which can be used as a reference mark for adjustment, and is not limited here.
[0033] In some embodiments, the adjusting mechanism of the wafer air float turntable of the utility model further comprises a driving assembly, which can drive the adjusting shaft 2 to rotate to move the connecting rod 3. It can be understood that the driving assembly can be a motor drive or a manual operation assembly.
[0034] In some embodiments, the driving assembly is a manually operated assembly, and specifically, the driving assembly is arranged on the adjusting shaft 2 and can rotate with the adjusting shaft 2. By manually operating the driving assembly, the adjusting shaft 2 can be driven to rotate, and the connecting rod 3 can be driven to move relative to the air floating turntable. It can be understood that the adjusting mechanism of the wafer air floating turntable of the utility model can drive the adjusting shaft 2 to rotate by manually operating the driving assembly, and the connecting rod 3 can be driven to move relative to the air floating turntable, so that the angle of the air floating turntable is adjusted, and the fine adjustment of the wafer axis can be realized, so that the wafer axis and the grinding wheel axis can be accurately adjusted to a suitable included angle, and the required wafer grinding surface type and high precision can be obtained. Since the height adjustment frequency of the air floating turntable is low, the use of a motor drive has a high cost, and therefore, mechanical parts are used instead of a motor drive in the embodiment, so that the use demand is met while the equipment cost is reduced. By the adjusting mechanism of the wafer air floating turntable, the angle of the air floating turntable can be manually adjusted, so that the wafer axis and the grinding wheel axis can be accurately adjusted to a suitable included angle before wafer grinding processing. Compared with the motor drive adjustment, mechanical parts are used instead of a motor drive in the embodiment, so that the use demand is met while the equipment cost is reduced, the structure is convenient to install, the installation and cable layout of electrical components are not required, the number of parts is small, and the overall cost is low.
[0035] In the above embodiment, the driving assembly includes a driving block 41 and a locking piece 42. The driving block 41 is in a strip shape and is provided with a through hole in the middle, so that the driving block 41 can be sleeved on the adjusting shaft 2. One end of the driving block 41 is provided with a gap that is opened to the through hole along the length direction of the driving block 41. The locking piece 42 is arranged on the side surface of the driving block 41 and is located at the one end of the driving block 41 that is provided with the gap, so that the driving block 41 can be locked on the adjusting shaft 2. It can be understood that the locking piece 42 can clamp the driving block 41 on the adjusting shaft 2 by compressing the gap. The locking piece 42 can be a locking screw that is arranged at the one end of the driving block 41 that is provided with the gap. Of course, the locking piece 42 can also be other types of locking clamps, which are not specifically limited here.
[0036] In the above embodiment, the adjusting mechanism of the wafer air floating turntable of the utility model further includes a locking piece 7. The locking piece 7 is arranged on the driving assembly, and the locking piece 7 can lock the driving assembly on the housing 5. It can be understood that by arranging the locking piece 7, the driving assembly and the adjusting shaft 2 can be prevented from rotating due to accidental touch, accidental collision and the like, so that the angle of the air floating turntable is prevented from changing. In some specific embodiments, the locking piece 7 can be arranged as a screw. When the locking piece 7 is locked, the screw is inserted into the indexing hole, so that the driving block 41 is prevented from continuing to rotate.
[0037] In the above embodiments, the adjusting mechanism of the wafer air floating turntable of the utility model further comprises an anti-drop piece 8 arranged on the adjusting shaft 2 to prevent displacement of the driving assembly along the axial direction of the adjusting shaft 2, and specifically, the anti-drop piece 8 can prevent the driving block 41 of the driving assembly from falling off and position the driving block 41. In some specific embodiments, the anti-drop piece 8 can be arranged as a lock nut and is threadedly connected with the adjusting shaft 2 and abuts against the driving block 41. It can be understood that the arrangement of the anti-drop piece 8 can further increase the structural stability of the driving assembly, prevent the driving block 41 from being loosened and thrown out due to failure of the locking piece 42 during processing, and damage the wafer and the equipment.
[0038] In other embodiments, the driving assembly comprises a motor mounted at one end of the adjusting shaft 2 extending out of the housing 5 and in transmission connection with the adjusting shaft 2, wherein the motor can drive the adjusting shaft 2 to rotate to drive the connecting rod 3 to move relative to the air floating turntable. It can be understood that even if the utility model adopts the motor driving, the number of debugging of the motor driving program can be greatly reduced by amplifying the pitch stroke of the connecting rod, the requirement for accurate control of the motor is reduced, and the cost of the motor and the difficulty of development and debugging are reduced.
[0039] In some embodiments, the housing 5 is provided with a bearing 61 and a retaining ring 62, the bearing 61 is fixedly arranged in the housing 5 and sleeved on the adjusting shaft 2, which not only realizes the rotary connection of the adjusting shaft 2 in the housing 5, but also reduces the rotating friction and wear of the adjusting shaft 2, makes the rotation smoother, reduces the mechanical load friction coefficient of the adjusting shaft 2 in the rotating process, thereby reduces the rotating resistance, facilitates operation, and can also limit the radial displacement of the adjusting shaft 2; the retaining ring 62 is arranged on the adjusting shaft 2 and can limit the axial displacement of the bearing 61 along the adjusting shaft. It can be understood that by arranging the bearing 61, the structural position stability of the adjusting shaft 2 can be ensured, the adjustment is more accurate, thereby facilitating the adjustment and controlling the adjustment accuracy.
[0040] In some specific embodiments, the bearings 61 are provided with at least two, which are arranged in axial spacing along the adjusting shaft 2. The inner diameter of the retainer ring 62 is smaller than the diameter of the adjusting shaft 2, and the outer diameter of the retainer ring 62 is larger than the diameter of the adjusting shaft 2; the adjusting shaft 2 is provided with a groove in the circumferential direction, and the retainer ring 62 is arranged in the groove. The retainer ring 62 cooperates with the housing 5 to limit the position of the bearing 61, and can also limit the axial displacement of the adjusting shaft 2. Optionally, the retainer ring 62 can also be provided with at least two in axial spacing of the adjusting shaft 2, when provided with two retainer rings 62, all the bearings 61 are arranged between the two retainer rings 62, and the retainer ring 62 cooperates with the end face of the bearing 61 to limit the axial displacement of the adjusting shaft 2. It can be understood that the retainer ring 62 and the inner wall structure of the housing 5 cooperate to fix the position of the bearing 61 in the housing 5, for example, one end of the bearing 61 abuts against the retainer ring 62, and the other end abuts against the limiting protrusion of the housing 5. At the same time, through the interlocking effect of the retainer ring 62 and the bearing 61 after installation, the displacement of the adjusting shaft 2 along the axial direction of itself is limited. In other embodiments, a limiting sleeve is arranged between the two adjacent bearings 61. The retainer ring 62 on the adjusting shaft 2 can also be arranged at only one end, and the other end is replaced by a shaft shoulder.
[0041] The use mode and principle of the adjusting mechanism of the wafer air float turntable are as follows:
[0042] Taking the threaded connection between the connecting rod 3 and the air float turntable as an example, the axial position of the adjusting shaft 2 is fixed, the bearing 61 can be a deep groove ball bearing, and the bearing 61 can ensure that the adjusting shaft 2 rotates around its axis. The speed reducer 1 is provided as a harmonic reducer 1, the upper end of the adjusting shaft 2 is connected to the input end of the harmonic reducer 1, the output end of the harmonic reducer 1 is connected to the connecting rod 3 through a shaft coupling, the axial position of the connecting rod 3 is fixed, and the connecting rod 3 can rotate around its axis, the adjusting shaft 2 can drive the connecting rod 3 to rotate when rotating, the connecting rod nut is fixed below the air float turntable support surface, the connecting rod 3 is threadedly connected with the connecting rod nut, the height of the corresponding air float turntable support point is changed by rotating the connecting rod 3, so as to adjust the included angle between the wafer and the grinding wheel axis. In addition, in an alternative embodiment, the connecting rod 3 can also be arranged to be driven to rise and fall by the output end of the speed reducer 1, and the air float turntable is driven to move by the rise and fall of the connecting rod 3 itself. At the same time, the connection relationship between the connecting rod 3 and the air float turntable can also be adaptively adjusted, so as to realize the adjustment of the angle of the air float turntable.
[0043] Specifically, when adjusting the angle between the wafer and the grinding wheel axis, first record the position of the locking member 7 in the index hole (it can be understood that the shell 5 can be marked with serial numbers on the side to distinguish the position), then loosen the locking member 7, make the locking member 7 completely separate from the shell 5, push the driving block 41 to rotate by hand, the driving block 41 is fixed on the adjusting shaft 2 through the clamping member, and rotates together with the adjusting shaft 2, so that the quantitative and accurate adjustment is realized according to the number of index holes turned during adjustment. For example, 20 index holes are arranged below the shell 5 according to the calculation result of the speed reduction ratio, and are uniformly distributed along the circumference, and the connecting rod 3 at the adjustment position rises (or falls) 1 μm every time an index hole position is turned, and the number of hole positions to be turned is determined according to the distance to be adjusted, and after turning to the position, the locking member 7 is locked in the corresponding index hole of the shell 5, and the driving block 41 is fixed to limit the rotation of the adjusting shaft 2, so that the stability of the angle between the wafer and the grinding wheel axis during subsequent equipment operation is maintained.
[0044] In other embodiments, the motor can also be used to drive the connecting rod 3 to rotate, and the connecting rod 3 can drive the air floating turntable to move up and down. By operating the upper computer to send a certain number of pulses to the motor, the number of turns of the connecting rod 3 can be accurately controlled, so that the height of the air floating turntable can be accurately controlled.
[0045] For example, the connecting rod and the air floating turntable are connected through threads, the adjusting mechanism of the wafer air floating turntable provided by the utility model enlarges the adjusting stroke of the connecting rod, so that the thread pitch on the connecting rod does not have to be too small, the structural strength is enhanced, and the adjustment stroke unit can be conveniently identified through the index mark, so that the adjustment is convenient and intuitive, and the accuracy of the adjustment is guaranteed.
[0046] For example, the connecting rod and the air floating turntable are connected through threads, the wafer processing equipment provided by the utility model can reduce the number of times of repeated matching and testing of the connecting rod pitch stroke when adjusting the adjustment angle of the air floating turntable, simplify the driving debugging and driving mode, and thus reduce the difficulty of equipment development and debugging.
[0047] Furthermore, the utility model can also ensure the accuracy of rotation through the structural design of parts, so as to meet the use requirements of the equipment, and the quantitative and accurate adjustment of microns can be realized through a pure mechanical structure. Therefore, the electrical wiring does not need to be considered during structure assembly, the development and debugging difficulty of the electrical and software parts of the equipment is simplified, and the cost of the equipment is reduced.
[0048] Obviously, the above embodiments of the present application are merely examples for clearly illustrating the present application, and are not intended to limit the implementation modes of the present application. For those skilled in the art, various obvious changes, re-adjustments and replacements can be made without departing from the protection scope of the present application. Here, it is not necessary and also impossible to enumerate all the implementation modes. Any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application claim.
Claims
1. An adjustment mechanism of a wafer air bearing turntable, characterized by, The utility model relates to a kind of adjusting mechanism of wafer air bearing turntable, including: Speed reducer (1) is fixedly connected with external structure; Adjusting shaft (2) is connected with the input end of the speed reducer (1); Connecting rod (3) is connected with the output end of the speed reducer (1) at one end, and the other end is used to be connected with the air bearing turntable; Housing (5) is fixedly connected with the speed reducer (1) and located at the input end of the speed reducer (1), and the adjusting shaft (2) is installed in the housing (5), and one end extends out of the housing (5); Multiple index marks are provided on the end face of the housing (5) away from the speed reducer (1), and multiple index marks are uniformly distributed along the circumference of the housing (5);Reference mark is provided on the adjusting shaft (2), and points to the index mark, so as to display adjustment stroke.
2. The adjustment mechanism of a wafer air bearing turntable according to claim 1, wherein, It further includes a drive assembly capable of driving the adjusting shaft (2) to rotate to move the connecting rod (3).
3. The adjustment mechanism of a wafer air bearing table according to claim 2, wherein, The drive assembly is installed on the end of the adjusting shaft (2) extending out of the housing (5), and can rotate with the adjusting shaft (2); Wherein, manually operating the drive assembly can drive the adjusting shaft (2) to rotate to drive the connecting rod (3) to move relative to the air bearing turntable.
4. The adjustment mechanism of a wafer air bearing table according to claim 3, wherein, The drive assembly includes: Drive block (41) is arranged in long strip shape, and through hole is arranged in the middle to be able to be sleeved on the adjusting shaft (2), and one end of the drive block (41) is provided with gap opened to the through hole along the length direction of the drive block (41); Locking member (42) is arranged on the side surface of the drive block (41) and located at one end of the drive block (41) provided with the gap, and the drive block (41) can be locked to the adjusting shaft (2).
5. The adjustment mechanism of a wafer air bearing table according to claim 3, wherein, Further including: Locking member (7) is arranged on the drive assembly, and the drive assembly can be locked to the housing (5).
6. The adjustment mechanism of a wafer air bearing table according to claim 4, wherein, Further including: Anti-drop member (8) is arranged on the adjusting shaft (2), which prevents the drive block (41) from falling off and positions the drive block (41).
7. The adjustment mechanism of a wafer air bearing table according to claim 2, wherein, The drive assembly includes a motor, and the motor is installed on the end of the adjusting shaft (2) extending out of the housing (5), and is in transmission connection with the adjusting shaft (2); Wherein, the motor can drive the adjusting shaft (2) to rotate to drive the connecting rod (3) to move relative to the air bearing turntable.
8. The adjustment mechanism of a wafer air bearing table according to any one of claims 1-7, wherein, Bearing (61) is arranged in the housing (5), and the bearing (61) is sleeved on the adjusting shaft (2) to enable the adjusting shaft (2) to rotate around its own axis.
9. The adjustment mechanism of a wafer air bearing table according to claim 8, wherein, The bearing (61) is arranged at least two in the housing (5), and is arranged in interval along the axial direction of the adjusting shaft (2).
10. A wafer processing apparatus comprising a chuck and an air bearing turntable for carrying the chuck, the chuck being fixedly connected to the air bearing turntable, characterized in that At least three supporting points are provided on the air bearing turntable, and at least two supporting points use the adjusting mechanism of wafer air bearing turntable according to any one of claims 1-9.